KR101028329B1 - 발광 소자 패키지 및 그 제조방법 - Google Patents

발광 소자 패키지 및 그 제조방법 Download PDF

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Publication number
KR101028329B1
KR101028329B1 KR1020100039396A KR20100039396A KR101028329B1 KR 101028329 B1 KR101028329 B1 KR 101028329B1 KR 1020100039396 A KR1020100039396 A KR 1020100039396A KR 20100039396 A KR20100039396 A KR 20100039396A KR 101028329 B1 KR101028329 B1 KR 101028329B1
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KR
South Korea
Prior art keywords
layer
light emitting
emitting device
package
heat diffusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020100039396A
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English (en)
Korean (ko)
Inventor
조범철
Original Assignee
엘지이노텍 주식회사
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Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020100039396A priority Critical patent/KR101028329B1/ko
Application granted granted Critical
Publication of KR101028329B1 publication Critical patent/KR101028329B1/ko
Priority to TW100114432A priority patent/TWI580083B/zh
Priority to JP2011098371A priority patent/JP5864126B2/ja
Priority to US13/095,595 priority patent/US8680552B2/en
Priority to CN201110113724.3A priority patent/CN102237479B/zh
Priority to EP11164003.3A priority patent/EP2383805B1/en
Assigned to 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 reassignment 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 권리의 전부이전등록 Assignors: 엘지이노텍 주식회사
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional [2D] array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020100039396A 2010-04-28 2010-04-28 발광 소자 패키지 및 그 제조방법 Expired - Fee Related KR101028329B1 (ko)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020100039396A KR101028329B1 (ko) 2010-04-28 2010-04-28 발광 소자 패키지 및 그 제조방법
TW100114432A TWI580083B (zh) 2010-04-28 2011-04-26 發光裝置封裝件
JP2011098371A JP5864126B2 (ja) 2010-04-28 2011-04-26 発光素子パッケージ
US13/095,595 US8680552B2 (en) 2010-04-28 2011-04-27 Light emitting device package including light emitting diode, and lighting system having the same
CN201110113724.3A CN102237479B (zh) 2010-04-28 2011-04-28 发光器件封装和具有发光器件封装的发光系统
EP11164003.3A EP2383805B1 (en) 2010-04-28 2011-04-28 Light emitting device package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100039396A KR101028329B1 (ko) 2010-04-28 2010-04-28 발광 소자 패키지 및 그 제조방법

Publications (1)

Publication Number Publication Date
KR101028329B1 true KR101028329B1 (ko) 2011-04-12

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100039396A Expired - Fee Related KR101028329B1 (ko) 2010-04-28 2010-04-28 발광 소자 패키지 및 그 제조방법

Country Status (6)

Country Link
US (1) US8680552B2 (https=)
EP (1) EP2383805B1 (https=)
JP (1) JP5864126B2 (https=)
KR (1) KR101028329B1 (https=)
CN (1) CN102237479B (https=)
TW (1) TWI580083B (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
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KR20140145412A (ko) * 2013-06-13 2014-12-23 엘지이노텍 주식회사 광원모듈 및 이를 구비한 조명 시스템
KR101786089B1 (ko) * 2011-04-29 2017-11-15 엘지이노텍 주식회사 자외선 발광 다이오드를 이용한 발광소자 패키지 및 발광 모듈

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KR100880638B1 (ko) * 2007-07-06 2009-01-30 엘지전자 주식회사 발광 소자 패키지
KR100999699B1 (ko) * 2008-09-01 2010-12-08 엘지이노텍 주식회사 발광 소자 패키지
US20120314419A1 (en) * 2011-06-08 2012-12-13 Wen-Kung Sung Heat dissipation structure of light-emitting diode
US20130032828A1 (en) * 2011-08-02 2013-02-07 Hsu Takeho Led light strip module structure
TW201318221A (zh) * 2011-10-26 2013-05-01 漢磊科技股份有限公司 發光二極體之矽支架及其製造方法
WO2013094755A1 (ja) 2011-12-22 2013-06-27 京セラ株式会社 配線基板および電子装置
TW201338219A (zh) * 2012-03-12 2013-09-16 隆達電子股份有限公司 發光二極體元件
TWI469194B (zh) 2012-05-16 2015-01-11 友達光電股份有限公司 有機電致發光裝置之畫素結構
CN104425694A (zh) * 2013-08-29 2015-03-18 展晶科技(深圳)有限公司 发光二极管封装结构及其制造方法
US9406654B2 (en) * 2014-01-27 2016-08-02 Ledengin, Inc. Package for high-power LED devices
JP6318004B2 (ja) * 2014-05-27 2018-04-25 ローム株式会社 Ｌｅｄモジュール、ｌｅｄモジュールの実装構造
TW201614345A (en) * 2014-10-15 2016-04-16 Taiwan Green Point Entpr Co A method for manufacturing a light emitting assembly, the light emitting assembly and a backlight module comprising the light emitting assembly
CN107004677B (zh) 2014-11-26 2020-08-25 硅谷光擎 用于温暖调光的且颜色可调谐的灯的紧凑型发射器
JP6424738B2 (ja) * 2015-05-26 2018-11-21 日亜化学工業株式会社 発光装置および発光装置の製造方法
CN114725264B (zh) * 2016-11-03 2025-03-25 苏州立琻半导体有限公司 半导体器件和包括该半导体器件的半导体器件封装
US11916096B2 (en) * 2017-02-09 2024-02-27 Vuereal Inc. Circuit and system integration onto a micro-device substrate
US12322732B2 (en) 2017-02-09 2025-06-03 Vuereal Inc. Circuit and system integration onto a microdevice substrate
US11391899B2 (en) * 2018-02-07 2022-07-19 Lumentum Operations Llc Thermal interface for riding heatsink
US10575374B2 (en) 2018-03-09 2020-02-25 Ledengin, Inc. Package for flip-chip LEDs with close spacing of LED chips
US11271143B2 (en) 2019-01-29 2022-03-08 Osram Opto Semiconductors Gmbh μ-LED, μ-LED device, display and method for the same
US12471413B2 (en) 2019-04-23 2025-11-11 Osram Opto Semiconductors Gmbh LED module, LED display module and method of manufacturing the same
US11538852B2 (en) 2019-04-23 2022-12-27 Osram Opto Semiconductors Gmbh μ-LED, μ-LED device, display and method for the same
KR20220060007A (ko) * 2020-11-02 2022-05-11 삼성디스플레이 주식회사 발광 소자 잉크, 표시 장치 및 그 제조 방법
CN116995170B (zh) * 2023-05-24 2024-11-15 佛山大学 一种电极封装结构和发光模组

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KR101786089B1 (ko) * 2011-04-29 2017-11-15 엘지이노텍 주식회사 자외선 발광 다이오드를 이용한 발광소자 패키지 및 발광 모듈
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Also Published As

Publication number Publication date
EP2383805A2 (en) 2011-11-02
US8680552B2 (en) 2014-03-25
CN102237479A (zh) 2011-11-09
TWI580083B (zh) 2017-04-21
EP2383805B1 (en) 2016-02-17
CN102237479B (zh) 2014-09-24
US20110198653A1 (en) 2011-08-18
TW201203637A (en) 2012-01-16
JP5864126B2 (ja) 2016-02-17
EP2383805A3 (en) 2012-07-04
JP2011233899A (ja) 2011-11-17

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