KR101009327B1 - 반도체 공정 환경에서 사용되는 접합 구조체 - Google Patents

반도체 공정 환경에서 사용되는 접합 구조체 Download PDF

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Publication number
KR101009327B1
KR101009327B1 KR1020057002722A KR20057002722A KR101009327B1 KR 101009327 B1 KR101009327 B1 KR 101009327B1 KR 1020057002722 A KR1020057002722 A KR 1020057002722A KR 20057002722 A KR20057002722 A KR 20057002722A KR 101009327 B1 KR101009327 B1 KR 101009327B1
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KR
South Korea
Prior art keywords
plate
outer end
head portion
inner edge
arm portion
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Expired - Lifetime
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KR1020057002722A
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English (en)
Korean (ko)
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KR20050058341A (ko
Inventor
마이클 더블유. 할핀
Original Assignee
에이에스엠 아메리카, 인코포레이티드
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Publication of KR20050058341A publication Critical patent/KR20050058341A/ko
Application granted granted Critical
Publication of KR101009327B1 publication Critical patent/KR101009327B1/ko
Assigned to 에이에스엠 아이피 홀딩 비.브이. reassignment 에이에스엠 아이피 홀딩 비.브이. 권리의 전부이전등록 Assignors: 에이에스엠 아메리카, 인코포레이티드
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H10P72/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020057002722A 2002-08-20 2003-07-24 반도체 공정 환경에서 사용되는 접합 구조체 Expired - Lifetime KR101009327B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/225,545 US6929299B2 (en) 2002-08-20 2002-08-20 Bonded structures for use in semiconductor processing environments
US10/225,545 2002-08-20

Publications (2)

Publication Number Publication Date
KR20050058341A KR20050058341A (ko) 2005-06-16
KR101009327B1 true KR101009327B1 (ko) 2011-01-18

Family

ID=31946304

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057002722A Expired - Lifetime KR101009327B1 (ko) 2002-08-20 2003-07-24 반도체 공정 환경에서 사용되는 접합 구조체

Country Status (4)

Country Link
US (1) US6929299B2 (https=)
JP (1) JP4575773B2 (https=)
KR (1) KR101009327B1 (https=)
WO (1) WO2004019375A2 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4302557B2 (ja) * 2004-03-15 2009-07-29 大日本スクリーン製造株式会社 熱処理装置および基板処理装置
US20080129064A1 (en) * 2006-12-01 2008-06-05 Asm America, Inc. Bernoulli wand
JP2010278408A (ja) * 2009-04-30 2010-12-09 Fluoro Mechanic Kk ベルヌーイチャック
US20110148128A1 (en) * 2009-12-23 2011-06-23 Memc Electronic Materials, Inc. Semiconductor Wafer Transport System
JP6496919B2 (ja) * 2013-02-05 2019-04-10 サムコ株式会社 ベルヌーイハンド及び半導体製造装置
US20150290815A1 (en) * 2014-04-11 2015-10-15 Varian Semiconductor Equipment Associates, Inc. Planar end effector and method of making a planar end effector
JP6128050B2 (ja) * 2014-04-25 2017-05-17 トヨタ自動車株式会社 非接触型搬送ハンド
US10515834B2 (en) * 2015-10-12 2019-12-24 Lam Research Corporation Multi-station tool with wafer transfer microclimate systems
US10566230B2 (en) * 2016-04-01 2020-02-18 Sunpower Corporation Gripper for semiconductor devices
CN108346607B (zh) * 2017-01-25 2020-11-03 上海新昇半导体科技有限公司 竖直插入式阻挡脚及伯努利吸盘

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6183183B1 (en) * 1997-01-16 2001-02-06 Asm America, Inc. Dual arm linear hand-off wafer transfer assembly
US6499777B1 (en) * 1999-05-11 2002-12-31 Matrix Integrated Systems, Inc. End-effector with integrated cooling mechanism

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Publication number Priority date Publication date Assignee Title
US821847A (en) * 1905-12-27 1906-05-29 Luis Arnavat Shovel.
US1211655A (en) * 1916-05-23 1917-01-09 Joseph W Adams Root-cutter.
US4911743A (en) 1986-05-29 1990-03-27 Hughes Aircraft Company Glass structure strengthening by etching
US5080549A (en) * 1987-05-11 1992-01-14 Epsilon Technology, Inc. Wafer handling system with Bernoulli pick-up
US5746460A (en) 1995-12-08 1998-05-05 Applied Materials, Inc. End effector for semiconductor wafer transfer device and method of moving a wafer with an end effector
US6116848A (en) 1997-11-26 2000-09-12 Brooks Automation, Inc. Apparatus and method for high-speed transfer and centering of wafer substrates
JPH11180554A (ja) * 1997-12-22 1999-07-06 Canon Inc 基板搬送用ハンド及び基板搬送装置
JP3807074B2 (ja) * 1998-01-27 2006-08-09 石川島播磨重工業株式会社 Ｃｆｒｐ補強長尺構造物
US6260894B1 (en) * 1999-05-28 2001-07-17 Applied Materials, Inc. Assembly for wafer handling system
JP4189093B2 (ja) * 1999-08-31 2008-12-03 京セラ株式会社 セラミック製搬送アーム及びその製造方法
US6244641B1 (en) * 1999-12-02 2001-06-12 M.E.C. Technology, Inc. Wafer transfer arm
KR100989012B1 (ko) * 2002-07-29 2010-10-20 신닛뽄 세끼유 가부시끼가이샤 반사 표면을 갖는 탄소섬유 복합물 전달 부재

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6183183B1 (en) * 1997-01-16 2001-02-06 Asm America, Inc. Dual arm linear hand-off wafer transfer assembly
US6499777B1 (en) * 1999-05-11 2002-12-31 Matrix Integrated Systems, Inc. End-effector with integrated cooling mechanism

Also Published As

Publication number Publication date
KR20050058341A (ko) 2005-06-16
WO2004019375A2 (en) 2004-03-04
US6929299B2 (en) 2005-08-16
JP2005536889A (ja) 2005-12-02
US20050088003A1 (en) 2005-04-28
JP4575773B2 (ja) 2010-11-04
WO2004019375A3 (en) 2004-04-22

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