KR100986830B1 - 기판 판넬 - Google Patents
기판 판넬 Download PDFInfo
- Publication number
- KR100986830B1 KR100986830B1 KR1020070123935A KR20070123935A KR100986830B1 KR 100986830 B1 KR100986830 B1 KR 100986830B1 KR 1020070123935 A KR1020070123935 A KR 1020070123935A KR 20070123935 A KR20070123935 A KR 20070123935A KR 100986830 B1 KR100986830 B1 KR 100986830B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- bus line
- clamp
- current
- substrate panel
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
- H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0969—Apertured conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (2)
- 클램프 접점과;상기 클램프 접점과 이격된 거리에서 형성된 버스 라인과;상기 버스 라인을 통로로 전해도금에 필요한 전류를 공급받는 복수의 기판 유닛을 포함하는 기판 판넬에 있어서,전해도금 시에 상기 기판 판넬에 고른 전류분포가 나타나도록, 상기 클램프 접점과 상기 버스 라인 사이에는 상기 클램프에서 상기 버스 라인으로 향하는 전류를 우회시키는 절연부가 형성된 것을 특징으로 하는 기판 판넬.
- 제1항에 있어서,상기 절연부는 관통홀인 것을 특징으로 하는 기판 판넬.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070123935A KR100986830B1 (ko) | 2007-11-30 | 2007-11-30 | 기판 판넬 |
US12/213,701 US8153904B2 (en) | 2007-11-30 | 2008-06-23 | Substrate panel including insulation parts and bus line |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070123935A KR100986830B1 (ko) | 2007-11-30 | 2007-11-30 | 기판 판넬 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20090056684A KR20090056684A (ko) | 2009-06-03 |
KR100986830B1 true KR100986830B1 (ko) | 2010-10-12 |
Family
ID=40674580
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070123935A KR100986830B1 (ko) | 2007-11-30 | 2007-11-30 | 기판 판넬 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8153904B2 (ko) |
KR (1) | KR100986830B1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8053676B2 (en) * | 2008-08-14 | 2011-11-08 | Powertech Technology Inc. | Substrate panel having a plurality of substrate strips for semiconductor packages |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0982420A (ja) * | 1995-09-12 | 1997-03-28 | Hitachi Ltd | コネクタ |
JP2000165004A (ja) | 1998-11-27 | 2000-06-16 | Kyocera Corp | 多数個取り配線基板 |
JP2004103811A (ja) * | 2002-09-09 | 2004-04-02 | Kyocera Corp | 多数個取り配線基板 |
JP2005209761A (ja) | 2004-01-21 | 2005-08-04 | Sumitomo Metal Electronics Devices Inc | 多数個取り配線基板 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5776824A (en) * | 1995-12-22 | 1998-07-07 | Micron Technology, Inc. | Method for producing laminated film/metal structures for known good die ("KG") applications |
US6628523B2 (en) * | 2001-02-08 | 2003-09-30 | Denso Corporation | Casing for electronic control unit |
CN100455161C (zh) * | 2004-12-07 | 2009-01-21 | 鸿富锦精密工业(深圳)有限公司 | 一种印刷电路板设计方法及印刷电路板 |
US20060232948A1 (en) * | 2005-04-15 | 2006-10-19 | Haager James A | Case for stackable PCBs |
KR100945952B1 (ko) * | 2007-11-30 | 2010-03-05 | 삼성전기주식회사 | 기판 판넬 |
TWI365523B (en) * | 2008-01-08 | 2012-06-01 | Powertech Technology Inc | Wiring board ready to slot |
-
2007
- 2007-11-30 KR KR1020070123935A patent/KR100986830B1/ko active IP Right Grant
-
2008
- 2008-06-23 US US12/213,701 patent/US8153904B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0982420A (ja) * | 1995-09-12 | 1997-03-28 | Hitachi Ltd | コネクタ |
JP2000165004A (ja) | 1998-11-27 | 2000-06-16 | Kyocera Corp | 多数個取り配線基板 |
JP2004103811A (ja) * | 2002-09-09 | 2004-04-02 | Kyocera Corp | 多数個取り配線基板 |
JP2005209761A (ja) | 2004-01-21 | 2005-08-04 | Sumitomo Metal Electronics Devices Inc | 多数個取り配線基板 |
Also Published As
Publication number | Publication date |
---|---|
US20090139746A1 (en) | 2009-06-04 |
US8153904B2 (en) | 2012-04-10 |
KR20090056684A (ko) | 2009-06-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2010138483A (ja) | 遮蔽板及び電解メッキ装置 | |
CN104661438A (zh) | 线路板焊盘三次干膜法镀金工艺 | |
KR20220154067A (ko) | 회로기판 | |
JP2008088522A (ja) | パターンめっき方法 | |
KR100986830B1 (ko) | 기판 판넬 | |
KR100945952B1 (ko) | 기판 판넬 | |
CN205510551U (zh) | 印制线路板阻焊塞孔的导气装置 | |
KR20140137162A (ko) | 기판 도금용 지그 | |
KR101198005B1 (ko) | 전해 도금장치 | |
JP2007281138A (ja) | 配線基板 | |
CN110677988A (zh) | 一种防止焊盘堵孔的电路板 | |
JP2017175085A (ja) | 両面配線フレキシブル基板 | |
CN110996494B (zh) | 电路板和具有其的服务器 | |
CN206879217U (zh) | 移动终端及其电路板组件 | |
KR101118891B1 (ko) | 도금용 랙 | |
JP4443649B2 (ja) | 電気めっきパターン | |
KR101153537B1 (ko) | 인쇄회로기판 도금 장치 | |
KR200390905Y1 (ko) | 도금설비의 인쇄회로기판 마스크 구조 | |
KR100665287B1 (ko) | 열평형이 균일한 랜드를 갖는 연성기판 | |
KR20170090090A (ko) | 솔더링 부위가 개량되는 기판 갭 서포터 및 그 제조방법 | |
JP2006310546A (ja) | プリント基板および電子機器 | |
KR20170061501A (ko) | 인쇄회로기판 패널 | |
KR101903554B1 (ko) | 인쇄회로기판 | |
JP2002271007A (ja) | 両面プリント配線基板 | |
JP2007173442A (ja) | はんだ付けパレット |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E90F | Notification of reason for final refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20130916 Year of fee payment: 4 |
|
FPAY | Annual fee payment |
Payment date: 20141001 Year of fee payment: 5 |
|
FPAY | Annual fee payment |
Payment date: 20150930 Year of fee payment: 6 |
|
FPAY | Annual fee payment |
Payment date: 20161004 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20171011 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20181001 Year of fee payment: 9 |