KR100973317B1 - 스티렌, 신나밀 또는 말레이미드 작용기를 함유하는지환식 에폭시 화합물 - Google Patents
스티렌, 신나밀 또는 말레이미드 작용기를 함유하는지환식 에폭시 화합물 Download PDFInfo
- Publication number
- KR100973317B1 KR100973317B1 KR1020030050139A KR20030050139A KR100973317B1 KR 100973317 B1 KR100973317 B1 KR 100973317B1 KR 1020030050139 A KR1020030050139 A KR 1020030050139A KR 20030050139 A KR20030050139 A KR 20030050139A KR 100973317 B1 KR100973317 B1 KR 100973317B1
- Authority
- KR
- South Korea
- Prior art keywords
- ring
- group
- carbon atoms
- independently
- compounds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 0 CC(*)N(C(C1C2CCC3OC3CC1)=O)C2=O Chemical compound CC(*)N(C(C1C2CCC3OC3CC1)=O)C2=O 0.000 description 4
- HCHIULZJOVZCRR-VCWRXUFXSA-N CC(C)(c1cc(C(C)=C)ccc1)NC(OCCCN(C([C@H]1[C@@H]2CC3OC3C1)=O)C2=O)=O Chemical compound CC(C)(c1cc(C(C)=C)ccc1)NC(OCCCN(C([C@H]1[C@@H]2CC3OC3C1)=O)C2=O)=O HCHIULZJOVZCRR-VCWRXUFXSA-N 0.000 description 1
- VSGFJIDEDKDAMZ-MDZDMXLPSA-N CCC(C)/C=C/c1ccccc1 Chemical compound CCC(C)/C=C/c1ccccc1 VSGFJIDEDKDAMZ-MDZDMXLPSA-N 0.000 description 1
- MGJKQDOBUOMPEZ-UHFFFAOYSA-N CNC(NC)=O Chemical compound CNC(NC)=O MGJKQDOBUOMPEZ-UHFFFAOYSA-N 0.000 description 1
- NYXHSRNBKJIQQG-UHFFFAOYSA-N CNC(OC)=O Chemical compound CNC(OC)=O NYXHSRNBKJIQQG-UHFFFAOYSA-N 0.000 description 1
- MBFXKQNDKGMHIY-UHFFFAOYSA-N CNC(OC)=S Chemical compound CNC(OC)=S MBFXKQNDKGMHIY-UHFFFAOYSA-N 0.000 description 1
- LLUJQOBTVYRNQW-UHFFFAOYSA-N CNC(OCCSC(NC)=O)=S Chemical compound CNC(OCCSC(NC)=O)=S LLUJQOBTVYRNQW-UHFFFAOYSA-N 0.000 description 1
- YUWWOMKVPZHPQI-UHFFFAOYSA-N CNC(SC)=O Chemical compound CNC(SC)=O YUWWOMKVPZHPQI-UHFFFAOYSA-N 0.000 description 1
- WJYLKQXDRVERCW-UHFFFAOYSA-N C[NH+](C(OC)=O)[NH-] Chemical compound C[NH+](C(OC)=O)[NH-] WJYLKQXDRVERCW-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D491/00—Heterocyclic compounds containing in the condensed ring system both one or more rings having oxygen atoms as the only ring hetero atoms and one or more rings having nitrogen atoms as the only ring hetero atoms, not provided for by groups C07D451/00 - C07D459/00, C07D463/00, C07D477/00 or C07D489/00
- C07D491/02—Heterocyclic compounds containing in the condensed ring system both one or more rings having oxygen atoms as the only ring hetero atoms and one or more rings having nitrogen atoms as the only ring hetero atoms, not provided for by groups C07D451/00 - C07D459/00, C07D463/00, C07D477/00 or C07D489/00 in which the condensed system contains two hetero rings
- C07D491/04—Ortho-condensed systems
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
- C07D303/02—Compounds containing oxirane rings
- C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
- C07D303/16—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by esterified hydroxyl radicals
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D405/00—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom
- C07D405/02—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom containing two hetero rings
- C07D405/12—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom containing two hetero rings linked by a chain containing hetero atoms as chain links
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D405/00—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom
- C07D405/14—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom containing three or more hetero rings
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0834—Compounds having one or more O-Si linkage
- C07F7/0838—Compounds with one or more Si-O-Si sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/2805—Compounds having only one group containing active hydrogen
- C08G18/2815—Monohydroxy compounds
- C08G18/2845—Monohydroxy epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/81—Unsaturated isocyanates or isothiocyanates
- C08G18/8108—Unsaturated isocyanates or isothiocyanates having only one isocyanate or isothiocyanate group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/26—Di-epoxy compounds heterocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3236—Heterocylic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Plural Heterocyclic Compounds (AREA)
- Epoxy Resins (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Pyrrole Compounds (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Epoxy Compounds (AREA)
- Nitrogen Condensed Heterocyclic Rings (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/201,373 US6716992B2 (en) | 2002-07-22 | 2002-07-22 | Cycloaliphatic epoxy compounds containing styrenic, cinnamyl, or maleimide functionality |
| US10/201,373 | 2002-07-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20040010310A KR20040010310A (ko) | 2004-01-31 |
| KR100973317B1 true KR100973317B1 (ko) | 2010-07-30 |
Family
ID=30000085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020030050139A Expired - Fee Related KR100973317B1 (ko) | 2002-07-22 | 2003-07-22 | 스티렌, 신나밀 또는 말레이미드 작용기를 함유하는지환식 에폭시 화합물 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6716992B2 (https=) |
| EP (2) | EP1384737B1 (https=) |
| JP (1) | JP2004149512A (https=) |
| KR (1) | KR100973317B1 (https=) |
| CN (1) | CN100430400C (https=) |
| DE (2) | DE60324633D1 (https=) |
| MY (1) | MY133626A (https=) |
| SG (1) | SG109521A1 (https=) |
| TW (1) | TWI276633B (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060284141A1 (en) * | 2005-06-21 | 2006-12-21 | Musa Osama M | Metal salts of maleimide compounds as conductivity promoters |
| EP2148894B1 (en) * | 2007-05-16 | 2012-02-29 | Dow Global Technologies LLC | Flame retardant composition |
| AU2008286759B2 (en) | 2007-08-15 | 2014-05-08 | Isp Investments Inc. | Polyvinylamide polymers containing polymerizable functionalities |
| US8242224B2 (en) * | 2007-08-15 | 2012-08-14 | Isp Investments Inc. | Polyvinylamide polymers containing polymerizable functionalities |
| US8604150B2 (en) * | 2007-11-07 | 2013-12-10 | Showa Denko K.K. | Epoxy group-containing organosiloxane compound, curable composition for transfer materials and method for forming micropattern using the composition |
| US8324319B2 (en) * | 2007-11-20 | 2012-12-04 | Sridhar Laxmisha M | Redox-induced cationically polymerizable compositions with low cure temperature |
| WO2009070172A1 (en) * | 2007-11-30 | 2009-06-04 | Henkel Ag & Co. Kgaa | Curable resins containing acetal, ketal, acetal ester, or ketal ester linkages |
| JP7093150B2 (ja) * | 2018-12-06 | 2022-06-29 | 日本化薬株式会社 | 硬化性樹脂組成物及びその硬化物 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0735066A2 (en) * | 1995-03-30 | 1996-10-02 | Dow Corning Toray Silicone Company, Limited | Radiation curable silicone release coating composition |
| KR100314931B1 (ko) * | 1999-09-21 | 2001-11-30 | 박호군 | 인발다이용 다이아몬드 단결정의 양면 평행 연마방법 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU513033A1 (ru) * | 1974-12-09 | 1976-05-05 | Предприятие П/Я В-2304 | -(2",3"-Эпоксипропилоксифенил)-4,5 эпоксигексагидрофталимиды, как мономеры дл получени термостойких полимерных материалов |
| SU702021A1 (ru) * | 1976-12-27 | 1979-12-05 | Предприятие П/Я В-2304 | 3,4-Эпоксигексагидробензил-/4,5эпоксигексагидро- -фталимидо/ бензоат как мономер дл синтеза теплостойких полимеров |
| JPH02132106A (ja) * | 1988-11-11 | 1990-05-21 | Hitachi Ltd | 不飽和イミド系化合物、組成物及びその用途 |
| JPH0641114A (ja) * | 1992-05-25 | 1994-02-15 | Nissan Chem Ind Ltd | 新規メバロノラクトン類とその製法 |
| ES2150977T3 (es) * | 1993-08-09 | 2000-12-16 | Vantico Ag | Nuevos (met)acrilatos conteniendo grupos uretano. |
| ES2147777T3 (es) * | 1993-09-16 | 2000-10-01 | Ciba Sc Holding Ag | Compuestos vinileter con grupos funcionales adicionales, distintos de vinileter, y su utilizacion en la formulacion de compuestos reticulables. |
| US5539132A (en) * | 1994-01-24 | 1996-07-23 | Johns Hopkins University | Cerulenin compounds for fatty acid synthesis inhibition |
| JPH0853430A (ja) * | 1994-08-10 | 1996-02-27 | Amuko Enterp Kk | フッ素含有ジシクロペンタジエン誘導体のエポキシ化物 |
| US5863970A (en) * | 1995-12-06 | 1999-01-26 | Polyset Company, Inc. | Epoxy resin composition with cycloaliphatic epoxy-functional siloxane |
| DE19608313C2 (de) * | 1996-02-22 | 2000-08-31 | Ivoclar Ag Schaan | Polymerisierbare Hybridmonomere, Verfahren zu deren Herstellung und deren Verwendung |
| US6080872A (en) * | 1997-12-16 | 2000-06-27 | Lonza S.P.A. | Cycloaliphatic epoxy compounds |
| US6075155A (en) * | 1998-06-22 | 2000-06-13 | Rensselaer Polytechnic Institute | Radiation-curable cycloaliphatic epoxy compounds, uses thereof, and compositions containing them |
| WO2000010974A2 (en) | 1998-08-20 | 2000-03-02 | Dsm N.V. | Process for the preparation of a maleimide compound, maleimide compound, radiation-curable compositions comprising said compound and coated products |
| US6150479A (en) * | 1998-11-23 | 2000-11-21 | Loctite Corporation | Radical-curable adhesive compositions, reaction products of which demonstrate superior resistance to thermal degradation |
| JP4350832B2 (ja) * | 1999-04-19 | 2009-10-21 | Jsr株式会社 | 立体造形用光硬化性樹脂組成物およびこれを硬化してなる造形物 |
| GB9913627D0 (en) * | 1999-06-12 | 1999-08-11 | Ciba Geigy Ag | Process for the preparation of reaction products of cycloaliphatic epoxides with multifunctional hydroxy compounds |
| US6498260B2 (en) | 2000-03-29 | 2002-12-24 | Georgia Tech Research Corp. | Thermally degradable epoxy underfills for flip-chip applications |
| TWI282811B (en) * | 2000-04-10 | 2007-06-21 | Sumitomo Bakelite Co | Die-attaching paste and semiconductor device |
-
2002
- 2002-07-22 US US10/201,373 patent/US6716992B2/en not_active Expired - Lifetime
-
2003
- 2003-07-18 TW TW092119896A patent/TWI276633B/zh not_active IP Right Cessation
- 2003-07-18 JP JP2003199169A patent/JP2004149512A/ja active Pending
- 2003-07-21 MY MYPI20032729A patent/MY133626A/en unknown
- 2003-07-22 EP EP03016521A patent/EP1384737B1/en not_active Expired - Lifetime
- 2003-07-22 DE DE60324633T patent/DE60324633D1/de not_active Expired - Lifetime
- 2003-07-22 DE DE60329604T patent/DE60329604D1/de not_active Expired - Lifetime
- 2003-07-22 KR KR1020030050139A patent/KR100973317B1/ko not_active Expired - Fee Related
- 2003-07-22 EP EP04029057A patent/EP1531166B1/en not_active Expired - Lifetime
- 2003-07-22 CN CNB031580211A patent/CN100430400C/zh not_active Expired - Fee Related
- 2003-07-22 SG SG200304356A patent/SG109521A1/en unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0735066A2 (en) * | 1995-03-30 | 1996-10-02 | Dow Corning Toray Silicone Company, Limited | Radiation curable silicone release coating composition |
| KR100314931B1 (ko) * | 1999-09-21 | 2001-11-30 | 박호군 | 인발다이용 다이아몬드 단결정의 양면 평행 연마방법 |
Non-Patent Citations (2)
| Title |
|---|
| journal of organnic chemistry vol 45.no 16,1980 pages 3149-3155 |
| tetrahedron 56(2000)9633-9640 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20040014890A1 (en) | 2004-01-22 |
| EP1384737A3 (en) | 2004-04-14 |
| US6716992B2 (en) | 2004-04-06 |
| DE60324633D1 (de) | 2008-12-24 |
| TWI276633B (en) | 2007-03-21 |
| TW200420551A (en) | 2004-10-16 |
| EP1384737B1 (en) | 2008-11-12 |
| KR20040010310A (ko) | 2004-01-31 |
| JP2004149512A (ja) | 2004-05-27 |
| EP1531166A2 (en) | 2005-05-18 |
| CN1488631A (zh) | 2004-04-14 |
| SG109521A1 (en) | 2005-03-30 |
| EP1384737A2 (en) | 2004-01-28 |
| DE60329604D1 (de) | 2009-11-19 |
| EP1531166B1 (en) | 2009-10-07 |
| CN100430400C (zh) | 2008-11-05 |
| MY133626A (en) | 2007-11-30 |
| EP1531166A3 (en) | 2005-08-31 |
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