KR100973317B1 - 스티렌, 신나밀 또는 말레이미드 작용기를 함유하는지환식 에폭시 화합물 - Google Patents

스티렌, 신나밀 또는 말레이미드 작용기를 함유하는지환식 에폭시 화합물 Download PDF

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KR100973317B1
KR100973317B1 KR1020030050139A KR20030050139A KR100973317B1 KR 100973317 B1 KR100973317 B1 KR 100973317B1 KR 1020030050139 A KR1020030050139 A KR 1020030050139A KR 20030050139 A KR20030050139 A KR 20030050139A KR 100973317 B1 KR100973317 B1 KR 100973317B1
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South Korea
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ring
group
carbon atoms
independently
compounds
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Korean (ko)
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KR20040010310A (ko
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무사오사마엠.
Original Assignee
내쇼날 스타치 앤드 케미칼 인베스트멘트 홀딩 코포레이션
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Publication of KR100973317B1 publication Critical patent/KR100973317B1/ko
Assigned to 헨켈 코포레이션 reassignment 헨켈 코포레이션 권리의 전부이전등록 Assignors: 내쇼날 스타치 앤드 케미칼 인베스트멘트 홀딩 코포레이션
Assigned to 헨켈 아게 운트 코. 카게아아 reassignment 헨켈 아게 운트 코. 카게아아 권리의 전부이전등록 Assignors: 헨켈 코포레이션
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    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D491/00Heterocyclic compounds containing in the condensed ring system both one or more rings having oxygen atoms as the only ring hetero atoms and one or more rings having nitrogen atoms as the only ring hetero atoms, not provided for by groups C07D451/00 - C07D459/00, C07D463/00, C07D477/00 or C07D489/00
    • C07D491/02Heterocyclic compounds containing in the condensed ring system both one or more rings having oxygen atoms as the only ring hetero atoms and one or more rings having nitrogen atoms as the only ring hetero atoms, not provided for by groups C07D451/00 - C07D459/00, C07D463/00, C07D477/00 or C07D489/00 in which the condensed system contains two hetero rings
    • C07D491/04Ortho-condensed systems
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D303/00Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02Compounds containing oxirane rings
    • C07D303/12Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
    • C07D303/16Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by esterified hydroxyl radicals
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D405/00Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom
    • C07D405/02Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom containing two hetero rings
    • C07D405/12Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom containing two hetero rings linked by a chain containing hetero atoms as chain links
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D405/00Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom
    • C07D405/14Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom containing three or more hetero rings
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02Silicon compounds
    • C07F7/08Compounds having one or more C—Si linkages
    • C07F7/0834Compounds having one or more O-Si linkage
    • C07F7/0838Compounds with one or more Si-O-Si sequences
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/2805Compounds having only one group containing active hydrogen
    • C08G18/2815Monohydroxy compounds
    • C08G18/2845Monohydroxy epoxy compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/81Unsaturated isocyanates or isothiocyanates
    • C08G18/8108Unsaturated isocyanates or isothiocyanates having only one isocyanate or isothiocyanate group
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/24Di-epoxy compounds carbocyclic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/26Di-epoxy compounds heterocyclic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32Epoxy compounds containing three or more epoxy groups
    • C08G59/3218Carbocyclic compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32Epoxy compounds containing three or more epoxy groups
    • C08G59/3236Heterocylic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Plural Heterocyclic Compounds (AREA)
  • Epoxy Resins (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Pyrrole Compounds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Epoxy Compounds (AREA)
  • Nitrogen Condensed Heterocyclic Rings (AREA)
KR1020030050139A 2002-07-22 2003-07-22 스티렌, 신나밀 또는 말레이미드 작용기를 함유하는지환식 에폭시 화합물 Expired - Fee Related KR100973317B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/201,373 US6716992B2 (en) 2002-07-22 2002-07-22 Cycloaliphatic epoxy compounds containing styrenic, cinnamyl, or maleimide functionality
US10/201,373 2002-07-22

Publications (2)

Publication Number Publication Date
KR20040010310A KR20040010310A (ko) 2004-01-31
KR100973317B1 true KR100973317B1 (ko) 2010-07-30

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KR1020030050139A Expired - Fee Related KR100973317B1 (ko) 2002-07-22 2003-07-22 스티렌, 신나밀 또는 말레이미드 작용기를 함유하는지환식 에폭시 화합물

Country Status (9)

Country Link
US (1) US6716992B2 (https=)
EP (2) EP1384737B1 (https=)
JP (1) JP2004149512A (https=)
KR (1) KR100973317B1 (https=)
CN (1) CN100430400C (https=)
DE (2) DE60324633D1 (https=)
MY (1) MY133626A (https=)
SG (1) SG109521A1 (https=)
TW (1) TWI276633B (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060284141A1 (en) * 2005-06-21 2006-12-21 Musa Osama M Metal salts of maleimide compounds as conductivity promoters
EP2148894B1 (en) * 2007-05-16 2012-02-29 Dow Global Technologies LLC Flame retardant composition
AU2008286759B2 (en) 2007-08-15 2014-05-08 Isp Investments Inc. Polyvinylamide polymers containing polymerizable functionalities
US8242224B2 (en) * 2007-08-15 2012-08-14 Isp Investments Inc. Polyvinylamide polymers containing polymerizable functionalities
US8604150B2 (en) * 2007-11-07 2013-12-10 Showa Denko K.K. Epoxy group-containing organosiloxane compound, curable composition for transfer materials and method for forming micropattern using the composition
US8324319B2 (en) * 2007-11-20 2012-12-04 Sridhar Laxmisha M Redox-induced cationically polymerizable compositions with low cure temperature
WO2009070172A1 (en) * 2007-11-30 2009-06-04 Henkel Ag & Co. Kgaa Curable resins containing acetal, ketal, acetal ester, or ketal ester linkages
JP7093150B2 (ja) * 2018-12-06 2022-06-29 日本化薬株式会社 硬化性樹脂組成物及びその硬化物

Citations (2)

* Cited by examiner, † Cited by third party
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EP0735066A2 (en) * 1995-03-30 1996-10-02 Dow Corning Toray Silicone Company, Limited Radiation curable silicone release coating composition
KR100314931B1 (ko) * 1999-09-21 2001-11-30 박호군 인발다이용 다이아몬드 단결정의 양면 평행 연마방법

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SU702021A1 (ru) * 1976-12-27 1979-12-05 Предприятие П/Я В-2304 3,4-Эпоксигексагидробензил-/4,5эпоксигексагидро- -фталимидо/ бензоат как мономер дл синтеза теплостойких полимеров
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Publication number Priority date Publication date Assignee Title
EP0735066A2 (en) * 1995-03-30 1996-10-02 Dow Corning Toray Silicone Company, Limited Radiation curable silicone release coating composition
KR100314931B1 (ko) * 1999-09-21 2001-11-30 박호군 인발다이용 다이아몬드 단결정의 양면 평행 연마방법

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Also Published As

Publication number Publication date
US20040014890A1 (en) 2004-01-22
EP1384737A3 (en) 2004-04-14
US6716992B2 (en) 2004-04-06
DE60324633D1 (de) 2008-12-24
TWI276633B (en) 2007-03-21
TW200420551A (en) 2004-10-16
EP1384737B1 (en) 2008-11-12
KR20040010310A (ko) 2004-01-31
JP2004149512A (ja) 2004-05-27
EP1531166A2 (en) 2005-05-18
CN1488631A (zh) 2004-04-14
SG109521A1 (en) 2005-03-30
EP1384737A2 (en) 2004-01-28
DE60329604D1 (de) 2009-11-19
EP1531166B1 (en) 2009-10-07
CN100430400C (zh) 2008-11-05
MY133626A (en) 2007-11-30
EP1531166A3 (en) 2005-08-31

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