MY133626A - Cycloaliphatic epoxy compounds containing styrenic, cinnamyl, or maleimide functionality - Google Patents

Cycloaliphatic epoxy compounds containing styrenic, cinnamyl, or maleimide functionality

Info

Publication number
MY133626A
MY133626A MYPI20032729A MYPI20032729A MY133626A MY 133626 A MY133626 A MY 133626A MY PI20032729 A MYPI20032729 A MY PI20032729A MY PI20032729 A MYPI20032729 A MY PI20032729A MY 133626 A MY133626 A MY 133626A
Authority
MY
Malaysia
Prior art keywords
cinnamyl
compounds containing
epoxy compounds
cycloaliphatic epoxy
containing styrenic
Prior art date
Application number
MYPI20032729A
Other languages
English (en)
Inventor
Osama M Musa
Original Assignee
Nat Starch Chem Invest
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Starch Chem Invest filed Critical Nat Starch Chem Invest
Publication of MY133626A publication Critical patent/MY133626A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D491/00—Heterocyclic compounds containing in the condensed ring system both one or more rings having oxygen atoms as the only ring hetero atoms and one or more rings having nitrogen atoms as the only ring hetero atoms, not provided for by groups C07D451/00 - C07D459/00, C07D463/00, C07D477/00 or C07D489/00
    • C07D491/02—Heterocyclic compounds containing in the condensed ring system both one or more rings having oxygen atoms as the only ring hetero atoms and one or more rings having nitrogen atoms as the only ring hetero atoms, not provided for by groups C07D451/00 - C07D459/00, C07D463/00, C07D477/00 or C07D489/00 in which the condensed system contains two hetero rings
    • C07D491/04—Ortho-condensed systems
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
    • C07D303/16—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by esterified hydroxyl radicals
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D405/00—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom
    • C07D405/02—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom containing two hetero rings
    • C07D405/12—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom containing two hetero rings linked by a chain containing hetero atoms as chain links
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D405/00—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom
    • C07D405/14—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom containing three or more hetero rings
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/0834—Compounds having one or more O-Si linkage
    • C07F7/0838—Compounds with one or more Si-O-Si sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/2805—Compounds having only one group containing active hydrogen
    • C08G18/2815—Monohydroxy compounds
    • C08G18/2845—Monohydroxy epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/81—Unsaturated isocyanates or isothiocyanates
    • C08G18/8108—Unsaturated isocyanates or isothiocyanates having only one isocyanate or isothiocyanate group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/26—Di-epoxy compounds heterocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3236—Heterocylic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Plural Heterocyclic Compounds (AREA)
  • Epoxy Resins (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Pyrrole Compounds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Epoxy Compounds (AREA)
  • Nitrogen Condensed Heterocyclic Rings (AREA)
MYPI20032729A 2002-07-22 2003-07-21 Cycloaliphatic epoxy compounds containing styrenic, cinnamyl, or maleimide functionality MY133626A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/201,373 US6716992B2 (en) 2002-07-22 2002-07-22 Cycloaliphatic epoxy compounds containing styrenic, cinnamyl, or maleimide functionality

Publications (1)

Publication Number Publication Date
MY133626A true MY133626A (en) 2007-11-30

Family

ID=30000085

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20032729A MY133626A (en) 2002-07-22 2003-07-21 Cycloaliphatic epoxy compounds containing styrenic, cinnamyl, or maleimide functionality

Country Status (9)

Country Link
US (1) US6716992B2 (https=)
EP (2) EP1384737B1 (https=)
JP (1) JP2004149512A (https=)
KR (1) KR100973317B1 (https=)
CN (1) CN100430400C (https=)
DE (2) DE60324633D1 (https=)
MY (1) MY133626A (https=)
SG (1) SG109521A1 (https=)
TW (1) TWI276633B (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060284141A1 (en) * 2005-06-21 2006-12-21 Musa Osama M Metal salts of maleimide compounds as conductivity promoters
EP2148894B1 (en) * 2007-05-16 2012-02-29 Dow Global Technologies LLC Flame retardant composition
AU2008286759B2 (en) 2007-08-15 2014-05-08 Isp Investments Inc. Polyvinylamide polymers containing polymerizable functionalities
US8242224B2 (en) * 2007-08-15 2012-08-14 Isp Investments Inc. Polyvinylamide polymers containing polymerizable functionalities
US8604150B2 (en) * 2007-11-07 2013-12-10 Showa Denko K.K. Epoxy group-containing organosiloxane compound, curable composition for transfer materials and method for forming micropattern using the composition
US8324319B2 (en) * 2007-11-20 2012-12-04 Sridhar Laxmisha M Redox-induced cationically polymerizable compositions with low cure temperature
WO2009070172A1 (en) * 2007-11-30 2009-06-04 Henkel Ag & Co. Kgaa Curable resins containing acetal, ketal, acetal ester, or ketal ester linkages
JP7093150B2 (ja) * 2018-12-06 2022-06-29 日本化薬株式会社 硬化性樹脂組成物及びその硬化物

Family Cites Families (20)

* Cited by examiner, † Cited by third party
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SU513033A1 (ru) * 1974-12-09 1976-05-05 Предприятие П/Я В-2304 -(2",3"-Эпоксипропилоксифенил)-4,5 эпоксигексагидрофталимиды, как мономеры дл получени термостойких полимерных материалов
SU702021A1 (ru) * 1976-12-27 1979-12-05 Предприятие П/Я В-2304 3,4-Эпоксигексагидробензил-/4,5эпоксигексагидро- -фталимидо/ бензоат как мономер дл синтеза теплостойких полимеров
JPH02132106A (ja) * 1988-11-11 1990-05-21 Hitachi Ltd 不飽和イミド系化合物、組成物及びその用途
JPH0641114A (ja) * 1992-05-25 1994-02-15 Nissan Chem Ind Ltd 新規メバロノラクトン類とその製法
ES2150977T3 (es) * 1993-08-09 2000-12-16 Vantico Ag Nuevos (met)acrilatos conteniendo grupos uretano.
ES2147777T3 (es) * 1993-09-16 2000-10-01 Ciba Sc Holding Ag Compuestos vinileter con grupos funcionales adicionales, distintos de vinileter, y su utilizacion en la formulacion de compuestos reticulables.
US5539132A (en) * 1994-01-24 1996-07-23 Johns Hopkins University Cerulenin compounds for fatty acid synthesis inhibition
JPH0853430A (ja) * 1994-08-10 1996-02-27 Amuko Enterp Kk フッ素含有ジシクロペンタジエン誘導体のエポキシ化物
JPH08269293A (ja) * 1995-03-30 1996-10-15 Toray Dow Corning Silicone Co Ltd 硬化性剥離剤組成物
US5863970A (en) * 1995-12-06 1999-01-26 Polyset Company, Inc. Epoxy resin composition with cycloaliphatic epoxy-functional siloxane
DE19608313C2 (de) * 1996-02-22 2000-08-31 Ivoclar Ag Schaan Polymerisierbare Hybridmonomere, Verfahren zu deren Herstellung und deren Verwendung
US6080872A (en) * 1997-12-16 2000-06-27 Lonza S.P.A. Cycloaliphatic epoxy compounds
US6075155A (en) * 1998-06-22 2000-06-13 Rensselaer Polytechnic Institute Radiation-curable cycloaliphatic epoxy compounds, uses thereof, and compositions containing them
WO2000010974A2 (en) 1998-08-20 2000-03-02 Dsm N.V. Process for the preparation of a maleimide compound, maleimide compound, radiation-curable compositions comprising said compound and coated products
US6150479A (en) * 1998-11-23 2000-11-21 Loctite Corporation Radical-curable adhesive compositions, reaction products of which demonstrate superior resistance to thermal degradation
JP4350832B2 (ja) * 1999-04-19 2009-10-21 Ｊｓｒ株式会社 立体造形用光硬化性樹脂組成物およびこれを硬化してなる造形物
GB9913627D0 (en) * 1999-06-12 1999-08-11 Ciba Geigy Ag Process for the preparation of reaction products of cycloaliphatic epoxides with multifunctional hydroxy compounds
KR100314931B1 (ko) * 1999-09-21 2001-11-30 박호군 인발다이용 다이아몬드 단결정의 양면 평행 연마방법
US6498260B2 (en) 2000-03-29 2002-12-24 Georgia Tech Research Corp. Thermally degradable epoxy underfills for flip-chip applications
TWI282811B (en) * 2000-04-10 2007-06-21 Sumitomo Bakelite Co Die-attaching paste and semiconductor device

Also Published As

Publication number Publication date
US20040014890A1 (en) 2004-01-22
EP1384737A3 (en) 2004-04-14
US6716992B2 (en) 2004-04-06
DE60324633D1 (de) 2008-12-24
TWI276633B (en) 2007-03-21
TW200420551A (en) 2004-10-16
EP1384737B1 (en) 2008-11-12
KR20040010310A (ko) 2004-01-31
JP2004149512A (ja) 2004-05-27
EP1531166A2 (en) 2005-05-18
CN1488631A (zh) 2004-04-14
SG109521A1 (en) 2005-03-30
EP1384737A2 (en) 2004-01-28
DE60329604D1 (de) 2009-11-19
EP1531166B1 (en) 2009-10-07
KR100973317B1 (ko) 2010-07-30
CN100430400C (zh) 2008-11-05
EP1531166A3 (en) 2005-08-31

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