KR100949778B1 - 반도체 제조설비용 전자밸브 - Google Patents
반도체 제조설비용 전자밸브 Download PDFInfo
- Publication number
- KR100949778B1 KR100949778B1 KR1020080007271A KR20080007271A KR100949778B1 KR 100949778 B1 KR100949778 B1 KR 100949778B1 KR 1020080007271 A KR1020080007271 A KR 1020080007271A KR 20080007271 A KR20080007271 A KR 20080007271A KR 100949778 B1 KR100949778 B1 KR 100949778B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K27/00—Construction of housing; Use of materials therefor
- F16K27/04—Construction of housing; Use of materials therefor of sliding valves
- F16K27/048—Electromagnetically actuated valves
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Electromagnetism (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (5)
- 트렌스퍼 챔버의 개구부를 열고 닫을 수 있도록 움직이는 개폐 플레이트,상기 개페 플레이트와 간격을 두고 배치되고 상하방향으로 승강되는 승강 플레이트,상기 승강 플레이트에 고정되는 복수의 개폐1전자석, 상기 개폐1전자석과 대향되게 배치되고 개폐 플레이트에 고정되는 복수의 개폐2전자석를 포함하여 상기 개폐 플레이트를 수평방향으로 이동시키는 개폐 자력부,상기 트렌스 챔버의 일측에 설치되고 상기 승강 플레이트와 연결되어 인가되는 전원에 따라 극성이 변화되어 상기 승강 플레이트를 상하방향으로 직선 이동시키는 복수의 승강 전자석을 포함하고,상기 승강 전자석은 상기 트렌스 챔버에 형성되는 승강 하우징의 내부에 일정 간격을 두고 복수로 설치되어 직선 이동하는반도체 제조설비용 전자밸브.
- 삭제
- 제1항에서,상기 개폐 플레이트가 마주하는 상기 승강 플레이트의 일면에 장착되어 있으며, 그 내부에 상기 개폐1전자석과 상기 개폐2전자석의 일측이 삽입되어 상기 개폐2전자석이 평행이동 하도록 가이드해주는 복수의 개폐 하우징을 포함하며,상기 개폐 하우징은일측이 개방되어 있고 내부에 상기 개폐2전자석과 상기 개폐1전자석의 일부분이 수용되는 개폐공간부가 형성되고, 상기 개방된 일측에 상기 개폐2전자석이 이탈하는 것을 방지하도록 상기 개폐2전자석이 걸리는 걸림턱이 형성되어 있는반도체 제조설비용 전자밸브.
- 제3항에서,상기 개폐 하우징과 마주하는 상기 개폐 플레이트의 면에는 상기 개구부에서 상기 개폐 플레이트가 떨어질 때 상기 개폐 하우징의 일부분이 삽입되는 결합공간부가 형성되어 있는 반도체 제조설비용 전자밸브.
- 제1항에서,상기 트렌스챔버의 개구부와 마주하는 상기 개폐 플레이트의 면에 장착되어 있는 패킹 부재를 포함하는 반도체 제조설비용 전자밸브.
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Application Number | Priority Date | Filing Date | Title |
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KR1020080007271A KR100949778B1 (ko) | 2008-01-23 | 2008-01-23 | 반도체 제조설비용 전자밸브 |
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KR1020080007271A KR100949778B1 (ko) | 2008-01-23 | 2008-01-23 | 반도체 제조설비용 전자밸브 |
Publications (2)
Publication Number | Publication Date |
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KR20090081285A KR20090081285A (ko) | 2009-07-28 |
KR100949778B1 true KR100949778B1 (ko) | 2010-03-30 |
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KR1020080007271A KR100949778B1 (ko) | 2008-01-23 | 2008-01-23 | 반도체 제조설비용 전자밸브 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120222614A1 (en) * | 2011-03-03 | 2012-09-06 | Sheu Dongliang Daniel | Self-closing embedded slit valve |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09100936A (ja) * | 1995-10-05 | 1997-04-15 | Hitachi Ltd | ゲートバルブおよびそれを用いて構成された半導体製造装置 |
JP2001015571A (ja) * | 1999-07-02 | 2001-01-19 | Tokyo Electron Ltd | ゲートバルブ |
KR100596332B1 (ko) | 2004-01-05 | 2006-07-06 | 주식회사 에이디피엔지니어링 | 게이트 밸브 |
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- 2008-01-23 KR KR1020080007271A patent/KR100949778B1/ko active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09100936A (ja) * | 1995-10-05 | 1997-04-15 | Hitachi Ltd | ゲートバルブおよびそれを用いて構成された半導体製造装置 |
JP2001015571A (ja) * | 1999-07-02 | 2001-01-19 | Tokyo Electron Ltd | ゲートバルブ |
KR100596332B1 (ko) | 2004-01-05 | 2006-07-06 | 주식회사 에이디피엔지니어링 | 게이트 밸브 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120222614A1 (en) * | 2011-03-03 | 2012-09-06 | Sheu Dongliang Daniel | Self-closing embedded slit valve |
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KR20090081285A (ko) | 2009-07-28 |
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