KR100943756B1 - 기판 슬림화 장치 - Google Patents

기판 슬림화 장치 Download PDF

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Publication number
KR100943756B1
KR100943756B1 KR1020070103694A KR20070103694A KR100943756B1 KR 100943756 B1 KR100943756 B1 KR 100943756B1 KR 1020070103694 A KR1020070103694 A KR 1020070103694A KR 20070103694 A KR20070103694 A KR 20070103694A KR 100943756 B1 KR100943756 B1 KR 100943756B1
Authority
KR
South Korea
Prior art keywords
substrate
etchant
chamber
delete delete
etching
Prior art date
Application number
KR1020070103694A
Other languages
English (en)
Korean (ko)
Other versions
KR20090038279A (ko
Inventor
이승욱
이의옥
Original Assignee
우진선행기술 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 우진선행기술 주식회사 filed Critical 우진선행기술 주식회사
Priority to KR1020070103694A priority Critical patent/KR100943756B1/ko
Priority to TW096141584A priority patent/TWI391349B/zh
Priority to CN2008100087692A priority patent/CN101412587B/zh
Publication of KR20090038279A publication Critical patent/KR20090038279A/ko
Application granted granted Critical
Publication of KR100943756B1 publication Critical patent/KR100943756B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Weting (AREA)
  • Surface Treatment Of Glass (AREA)
  • ing And Chemical Polishing (AREA)
KR1020070103694A 2007-10-15 2007-10-15 기판 슬림화 장치 KR100943756B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020070103694A KR100943756B1 (ko) 2007-10-15 2007-10-15 기판 슬림화 장치
TW096141584A TWI391349B (zh) 2007-10-15 2007-11-02 基板薄型化裝置，基板薄型化方法以及基板薄型化組件
CN2008100087692A CN101412587B (zh) 2007-10-15 2008-01-29 衬底薄化设备、方法和组件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070103694A KR100943756B1 (ko) 2007-10-15 2007-10-15 기판 슬림화 장치

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020090094682A Division KR20090122894A (ko) 2009-10-06 2009-10-06 기판 슬림화 장치 및 기판 슬림화 장치 조립체

Publications (2)

Publication Number Publication Date
KR20090038279A KR20090038279A (ko) 2009-04-20
KR100943756B1 true KR100943756B1 (ko) 2010-02-23

Family

ID=40593357

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070103694A KR100943756B1 (ko) 2007-10-15 2007-10-15 기판 슬림화 장치

Country Status (3)

Country Link
KR (1) KR100943756B1 (zh)
CN (1) CN101412587B (zh)
TW (1) TWI391349B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101088432B1 (ko) 2011-08-12 2011-12-01 씨앤지하이테크 주식회사 유리패널 코팅장치
KR101105331B1 (ko) * 2011-08-12 2012-01-16 씨앤지하이테크 주식회사 유리패널의 코팅방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1070103A (ja) 1996-07-18 1998-03-10 Lg Semicon Co Ltd 半導体ウェーハウェットエッチング処理装置
KR100267085B1 (ko) 1998-03-31 2000-11-01 김충환 배스
KR20010077385A (ko) * 2000-02-02 2001-08-17 윤종용 습식 식각 장치 및 이를 이용한 습식 식각 방법
KR20050068239A (ko) * 2003-12-29 2005-07-05 엘지.필립스 엘시디 주식회사 식각장비

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0180850B1 (ko) * 1996-06-26 1999-03-20 구자홍 유리기판 에칭장치
TW513388B (en) * 2001-04-04 2002-12-11 Ind Tech Res Inst Apparatus and method for etching glass panels
TWI304502B (en) * 2003-02-20 2008-12-21 Toppoly Optoelectronics Corp Method of forming a liquid crystal panel
JP4071220B2 (ja) * 2004-03-17 2008-04-02 西山ステンレスケミカル株式会社 ガラス基板の製造方法
US7497754B2 (en) * 2004-04-30 2009-03-03 Kabushiki Kaisha Toyota Jidoshokki Method for thinning substrate of EL device
KR100751805B1 (ko) * 2006-04-27 2007-08-23 (주)이노루트 기판의 박판화 장치 및 이를 포함하는 기판의 박판화시스템

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1070103A (ja) 1996-07-18 1998-03-10 Lg Semicon Co Ltd 半導体ウェーハウェットエッチング処理装置
KR100267085B1 (ko) 1998-03-31 2000-11-01 김충환 배스
KR20010077385A (ko) * 2000-02-02 2001-08-17 윤종용 습식 식각 장치 및 이를 이용한 습식 식각 방법
KR20050068239A (ko) * 2003-12-29 2005-07-05 엘지.필립스 엘시디 주식회사 식각장비

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101088432B1 (ko) 2011-08-12 2011-12-01 씨앤지하이테크 주식회사 유리패널 코팅장치
KR101105331B1 (ko) * 2011-08-12 2012-01-16 씨앤지하이테크 주식회사 유리패널의 코팅방법

Also Published As

Publication number Publication date
TW200916423A (en) 2009-04-16
TWI391349B (zh) 2013-04-01
KR20090038279A (ko) 2009-04-20
CN101412587B (zh) 2012-05-23
CN101412587A (zh) 2009-04-22

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