200916423 九、發明說明： 【發明所屬之技術領域】 本發明是關於用於使基板薄型化之裝置以及方法，且 更特定言之，是關於藉由將大的基板浸潰於蝕刻腔室中且 向蝕刻腔室中喷射蝕刻劑以同時蝕刻大的基板之兩個表面 而使基板薄型化之裝置以及方法。 【先前技術】200916423 IX. Description of the Invention: [Technical Field] The present invention relates to an apparatus and method for thinning a substrate, and more particularly to immersing a large substrate in an etching chamber and An apparatus and method for ejecting an etchant into an etching chamber to simultaneously etch both surfaces of a large substrate to thin the substrate. [Prior Art]
一般而言，要求用於顯示器之背光或玻璃基板較薄以 實現輕型且較薄之顯示器。在開發包括玻璃基板之行動電 話的最初階段中，行動電話具有約45毫米之厚度以及 千克之重量，然而現在，行動電話具有約6 9毫米之厚 度以及約63公克之重量。最近已開發出具有Q.82毫来厚 度’玻璃基板的液晶顯示器（LCD )(為最薄之顯示器）， 且G進㈣究以藉自將防撞_片直接㈣至lcd玻填上 而製作較薄且輕型之LCD。 可藉由使用各種方法來蝕刻/薄型化玻璃基板。此等方 ^之實例包括：浸潰方法’其巾藉由將玻璃基板豎直地浸 &於洛槽中祕刻玻璃基板；喷霧方法，其中藉由使用多 :射出喷嘴以歡的健壓力而在豎立之_基板之兩個 ^面上噴上朗劑來#刻登立的玻璃基板；以及向下變薄 刀離 ^ 法（downward thin-separation method )，其中藉由伯 鞋刻劑在豎立的破璃基板之兩個表面上自豎立的玻^基^ 之上部部分流動而蝕刻豎立的玻璃基板。 圖1為用於藉由使用浸潰方法而侧玻縣板之習知 200916423 裝置的側視橫截面圖。 > &在’又’貝方法中，將濃度由昂貴的混合系統所控制之氫 一· （ );谷液用作儀刻玻璃基板之飯刻劑。將喷射氮之 板（bubbleplate) 50 以及穿孔板（punchingplate) 60 女衣於®姓刻浴槽（etching bath) 1之下部部分中，將蓋 子30安裳於HF蝕刻浴槽1之上部端上，且使用水穴（water P〇Ck=) 40來藉由移除HF蝕刻浴槽1與蓋子30之間的間 f j 隙而诒封該蝕刻浴槽1。超純水41收集於水穴40中以 防止有毒的HF氣體洩漏至HF蝕刻浴槽1之外部。 —亦於快速傾卸沖洗（QDR)浴槽（未圖示）之下部端 ^安，泡罩板50以及穿孔板6〇，以在清洗破璃基板之清 ，過程中噴射氮。不僅使用超純水而亦使用氮來在QDR 〜軋中執行滑洗過程。藉由將來自溶液供應槽之濃度 Xk的Hr溶液收納於hf姓刻浴槽1中.將裝載著玻璃 基板之匣浸潰至填充有HF溶液的HF蝕刻浴槽1中且自 , 位於1蝕刻洛槽1之下部部分中的泡罩板50以及穿孔板 60噴射氮而執行對於玻璃基板之蝕刻過程。 上藉由經由安裝於QDR浴槽中之簇射(sii〇wer)設備來喷 射超純水以清洗HF溶液及附著至玻璃基板之表面的蝕刻 材料，且輔助地自安裝於QDR浴槽之下部端上之泡罩板 5。0以及穿孔板60來喷射氮而在QDR浴槽中執行清洗過 程。 然而，浸潰方法具有以下劣勢，即，難以精確地控制 所蝕刻之玻璃基板的厚度。亦即，蝕刻過程為不精確的。 200916423 ，水，因此侧之再用率較低，且氣泡產生 加應二，=刻之姆板的品獅刻之 上，因：二ΐ之情況下’由於將蝕刻劑噴至玻璃基板In general, backlights or glass substrates for displays are required to be thin to achieve a lightweight and thin display. In the initial phase of developing a mobile phone including a glass substrate, the mobile phone has a thickness of about 45 mm and a weight of kilograms. However, the mobile phone now has a thickness of about 69 mm and a weight of about 63 grams. Recently, a liquid crystal display (LCD) having a Q.82 millimeter thickness 'glass substrate (which is the thinnest display) has been developed, and the G-in (four) research has been made by filling the collision-proof film directly (four) to the lcd glass. Thinner and lighter LCD. The glass substrate can be etched/thinned by using various methods. Examples of such a method include: an impregnation method 'the towel by vertically immersing the glass substrate & a secret glass substrate in the Luo trough; and a spraying method, wherein by using a plurality of injection nozzles Pressure on the two sides of the erected substrate, sprayed with a glazing agent to erect the glass substrate; and a downward thin-separation method, in which a shoe polish is applied The erected glass substrate is etched from the upper portion of the erected glass substrate on both surfaces of the erected glass substrate. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a side cross-sectional view of a conventional 200916423 apparatus for a side glass plate by using an impregnation method. >&&> In the '''''''''''''''''''''''' A jet plate 50 and a punching plate 60 are placed in the lower portion of the etching bath 1 and the cover 30 is placed on the upper end of the HF etching bath 1 and used. The water hole (water P〇Ck=) 40 is used to seal the etching bath 1 by removing the inter-fj gap between the HF etching bath 1 and the lid 30. Ultrapure water 41 is collected in the water pocket 40 to prevent toxic HF gas from leaking to the outside of the HF etching bath 1. - Also in the lower end of the fast dumping rinse (QDR) bath (not shown), the blister board 50 and the perforated sheet 6〇 to spray nitrogen during the cleaning of the glass substrate. Not only ultrapure water but also nitrogen is used to perform the slipping process in the QDR~roll. The Hr solution of the concentration Xk from the solution supply tank is stored in the bath 1 of the hf name. The crucible loaded with the glass substrate is immersed in the HF etching bath 1 filled with the HF solution and is located in the 1 etching tank. The blister sheet 50 in the lower portion and the perforated plate 60 spray nitrogen to perform an etching process for the glass substrate. Ultra-pure water is sprayed through the sii〇wer apparatus installed in the QDR bath to clean the HF solution and the etching material attached to the surface of the glass substrate, and is additionally self-mounted on the lower end of the QDR bath The blister sheet 5.0 and the perforated plate 60 are used to spray nitrogen to perform a cleaning process in the QDR bath. However, the impregnation method has the disadvantage that it is difficult to precisely control the thickness of the etched glass substrate. That is, the etching process is inaccurate. 200916423, water, so the side reuse rate is lower, and the bubble generation plus two, = the lion of the engraved plate, because: in the case of the second ’, due to the etchant sprayed to the glass substrate
之嗔嘴㈣离基板施加大的應力。X ’由於豎直地橫越 趟之^ 祕造成㈣劑躲化反應之副產物的各種 ^攪動，因此蝕刻劑之再用率非常低。 【發明内容】 一 本發明提供驗使基板薄型化之裝置以及方法，其中 &成之兩個表面可同時受到蝕刻。 本^亦提供狀使基板薄型化之裝置以及方法，其 肀基板可受到猜难蝕刻。 本發明亦提供用於使基板薄型化之裝置以及方法，其 中蝕刻劑之再用率可增加。 本餐明亦提供用於使基板薄型化之緊密裝置。 加本裔明亦提供用於使基板薄型化之組件，所述組件包 括單面蝕刻型基板薄化裝置以及雙面飯刻型基板薄化裝 置。 根據本發明之實施例，提供用於使基板薄蜜化之裝 置所述裴置包含：可容納待蝕刻之基板的腔室；在腔室 ，的彼此間隔開之餘刻劑入口與姓刻劑出口；以及與姓刻 4入口以及蝕刻劑出口連通之蝕刻劑儲存槽，其中待蝕刻 200916423 之基板經浸潰於供應至腔室之蝕刻劑中且由蝕刻劑蝕刻。 可同時蝕刻基板之兩個表面。 基板可豎直地安裝於腔室中。 裝置可更包含支撐並移動基板之移動單元。 裝置可更包含環繞基板之邊緣的框架。 蝕刻劑入口可形成於腔室之上部部分中，且蝕刻劑出 口可形成於腔室之下部部分中。 钱刻劑可在腔室中向下游流動。 蝕刻劑入U可形成於腔室之下部部分中，且#刻劑出 口可形成於腔室之上部部分中。 钱刻劑可在腔室中向上游流動。 钱刻劑可在腔室中以穩定狀態流動。 根據本發明之另一態樣，提供使基板薄型化么方法， 所逆乃次包含：將待钱刻之基板浸潰於供應至腔爹之钱刻 劑中；以及使蝕刻劑在腔室中流動。 腔室可包括入口以及出口，蝕刻劑經由入口以及出口 而在腔室中向下游流動。 腔室可包括入口以及出口，蝕刻劑經由入U以及出口 而在腔室中向上游流動。 根據本發明之另一態樣，提供用於使基板薄型化之組 件，所述組件包含：雙面餘刻型基板薄型化裝置，其包含 二::蝕刻之第一基板的第一腔室、在腔室中的彼此二 丨閉開，蝕刻劑入口與蝕刻劑出口，以及與蝕刻劑入口 蝕刻劑出口連通之蝕刻劑儲存槽，其中將待蝕刻之第一美 200916423 = 腔室之峨_导第-基板峨 巧，刻之第二基板的支禮板，可容納 ς = 了：：ίί 表面由供應至腔室之蝕刻劑所蝕刻。 L只施方式】 、現將參看隨附的圖式較為詳細地描述本發明，在該等 圖式中展示本發明之例示性實施例。 Λ、 ρ圖2說明根據本發明之實施例，用於使基板薄型化之 衣直】00的侧視横截面圖。 包括：支樓件118，其支撐著包括環繞待蝕 d之基板m之框架的基板單元115，其中將基板m置 放^板單元115上；以及腔室單元！]〇,其包括㈣該 支撐件118以及基板單元115之腔f 112以及飯刻劑入口 126與钱刻劍出口 122,分別經由姓刻劑入口 126與姓刻劑 出口 122 +而引入以及排出用以蝕刻基板114之蝕刻劑。 基板涛化裝置（substrate slimming apparatus) 1〇〇 包 括向腔室單το 110供應蝕刻劑且收集來自腔室單元H〇的 I虫刻劑之侧劑儲存槽14〇。钱刻劑儲存槽14〇由第一流 徑150以及第二流徑160連接至形成於腔室112中的多個 餘刻劑入口 126以及钱刻劑出口 122。 在蝕刻劑需要被強制地循環時，可分別在第一流徑 150以及第二流徑160中於蝕刻劑儲存槽14〇與腔室單元 200916423 110之間安裝第1152以及第二果162。 ，=二124安置於腔室單元110之腔室112之 上，且多個則劑入口 m形成於喷嘴單元m中。可使 韻刻劑入口 126排列為兩列以對應於基板m之兩個表面。 〆 秒勃基板早兀115之移動單元120安置 t 7G 110 t ^ t H Af ^robot arm structure ) 之移動單凡，支擇該基板單元115之框架ιΐ6。 將基板f元115浸潰於供應至腔室m之餘刻劑中。 至少使基板單兀lb之基板114完全浸沒於餘刻劑中。在 腔室m t豎直地登立該基板單元m。將基板單元仍 安置於支撐件m上，且可將用於登直地登立基板單元115 之各種肢裝置安置於支料118上。舉例而言，V形凹 槽（未圖示）可形成於支撐件118中以便可將基板單元115 固定地插入V形凹槽中。 噴嘴單元124由第-流徑⑼連接至仙劑儲存槽 140。噴嘴單元124足夠大以在其中儲存預定量之蝕刻劑。 經由形成於喷嘴單元124之下部部分中的蝕刻劑入口 126 將儲存於喷嘴單元124中之蝕刻劑引入至腔室112中。 將I虫刻劑入〇 126引導至腔室112之内部。因此，钱 刻劑入口 126可形成於噴嘴單元124之下部部分中或腔室 112之内壁中。使蝕刻劑入口 126與蝕刻劑出口 122彼此 間搞開’使得腔室]】2中之钱刻劑可流過钱刻剩入口 126 以及钱刻劑出口 122。 多個蝕刻劑出口 122由蝕刻劑收集管12g速接至第二The mouth (4) exerts a large stress on the substrate. The reuse rate of the etchant is very low because X ’ causes the various agitation of the by-product of the (four) agent doping reaction due to the vertical traverse. SUMMARY OF THE INVENTION The present invention provides an apparatus and method for verifying the thickness of a substrate in which both surfaces can be simultaneously etched. The apparatus and method for thinning a substrate are also provided, and the substrate can be subjected to guessing etching. The present invention also provides an apparatus and method for thinning a substrate in which the reuse rate of the etchant can be increased. This meal also provides a compact device for thinning the substrate. The present invention also provides an assembly for thinning a substrate, which includes a single-sided etching type substrate thinning device and a double-sided rice-type substrate thinning device. According to an embodiment of the present invention, there is provided a device for thinning a substrate, the device comprising: a chamber capable of accommodating a substrate to be etched; and a chamber filler and a surrogate agent spaced apart from each other in the chamber An outlet; and an etchant storage tank in communication with the last 4 inlet and the etchant outlet, wherein the substrate to be etched 200916423 is immersed in an etchant supplied to the chamber and etched by an etchant. Both surfaces of the substrate can be etched simultaneously. The substrate can be mounted vertically in the chamber. The device may further comprise a mobile unit that supports and moves the substrate. The device may further comprise a frame surrounding the edge of the substrate. An etchant inlet may be formed in the upper portion of the chamber, and an etchant outlet may be formed in the lower portion of the chamber. Money engraving can flow downstream in the chamber. An etchant U may be formed in the lower portion of the chamber, and a #刻出出口 may be formed in the upper portion of the chamber. Money engraving can flow upstream in the chamber. The money engraving agent can flow in a stable state in the chamber. According to another aspect of the present invention, there is provided a method of thinning a substrate, the method comprising: immersing the substrate to be etched into a money engraving agent supplied to the cavity; and allowing the etchant to be in the chamber flow. The chamber may include an inlet and an outlet, and the etchant flows downstream in the chamber via the inlet and the outlet. The chamber may include an inlet and an outlet, and the etchant flows upstream in the chamber via the inlet U and the outlet. According to another aspect of the present invention, there is provided an assembly for thinning a substrate, the assembly comprising: a double-sided remnant type substrate thinning device comprising: a first chamber of an etched first substrate, The two openings in the chamber are closed, the etchant inlet and the etchant outlet, and the etchant storage tank communicating with the etchant inlet etchant outlet, wherein the first US200916423 to be etched is 腔The first substrate is compact, and the engraved plate of the second substrate can accommodate ς = :: ίί The surface is etched by an etchant supplied to the chamber. The invention will now be described in more detail with reference to the accompanying drawings in which exemplary embodiments of the invention are illustrated. ρ, ρ Figure 2 illustrates a side cross-sectional view of a garment for thinning a substrate in accordance with an embodiment of the present invention. Included is a branch member 118 that supports a substrate unit 115 including a frame surrounding a substrate m to be etched d, wherein the substrate m is placed on the plate unit 115; and a chamber unit! The crucible includes (4) the support member 118 and the cavity f 112 of the substrate unit 115, and the meal engraving inlet 126 and the money engraving outlet 122, which are introduced and discharged via the surname inlet 126 and the surname outlet 122+, respectively. The etchant of the substrate 114 is etched. A substrate slimming apparatus 1 供应 includes supplying an etchant to the chamber unit το 110 and collecting the side agent storage tank 14〇 from the chamber unit H〇. The money encapsulation reservoir 14 is coupled by a first flow path 150 and a second flow path 160 to a plurality of residual agent inlets 126 and a money entrainment outlet 122 formed in the chamber 112. When the etchant needs to be forcibly circulated, the 1152 and the second fruit 162 may be installed between the etchant storage tank 14A and the chamber unit 200916423 110 in the first flow path 150 and the second flow path 160, respectively. , = two 124 are disposed above the chamber 112 of the chamber unit 110, and a plurality of agent inlets m are formed in the nozzle unit m. The engraving agent inlets 126 can be arranged in two columns to correspond to the two surfaces of the substrate m.移动 The movement unit 120 of the second substrate 115 is placed to move the frame of the substrate unit 115 to the movement of the substrate unit 115. The substrate f-element 115 is immersed in the remainder of the supply to the chamber m. At least the substrate 114 of the substrate unit lb is completely immersed in the residual agent. The substrate unit m is vertically erected in the chamber m t . The substrate unit is still placed on the support member m, and various limb devices for vertically erecting the substrate unit 115 can be placed on the support 118. For example, a V-shaped groove (not shown) may be formed in the support member 118 so that the substrate unit 115 can be fixedly inserted into the V-shaped groove. The nozzle unit 124 is connected to the fairy storage tank 140 by a first flow path (9). The nozzle unit 124 is large enough to store a predetermined amount of etchant therein. The etchant stored in the nozzle unit 124 is introduced into the chamber 112 via an etchant inlet 126 formed in a lower portion of the nozzle unit 124. The insect engraving agent is introduced into the interior of the chamber 112 into the crucible 112. Therefore, the money enrollment inlet 126 may be formed in the lower portion of the nozzle unit 124 or in the inner wall of the chamber 112. The etchant inlet 126 and the etchant outlet 122 are brought apart from each other such that the money engraving agent in the chamber can flow through the money inlet 126 and the money engraving outlet 122. A plurality of etchant outlets 122 are spliced to the second by the etchant collection tube 12g
W c 200916423 流徑160。 圖3為圖2之裝置之腔室單元110的放大分解透視圖。 參看圖3，腔室1]2可具有各種形狀，只要腔室可將 基板單元Π5容納於其中即可。將具有中央孔之罩蓋 安置於腔室112之上，喷嘴單元124安裝於中央孔中。 贺嘴單元124具有倒轉的稜柱形狀，且為空的以儲存 預定置之蝕刻劑。如上文所述，引入蝕刻劑所經由之多個 蝕刻劑入口 126形成於噴嘴單元124之下部部分中3 中雖然蝕刻劑入口 126形成於喷嘴單元124之下部部^的 ，點中，值本發明之實施例不限於此，且蝕刻劑入D刀126 可形成於可經由蝕刻劑入口 126將蝕刻劑引入 6 的任何位置。 王胺至112 & 在罩篕13〇之侧面中形成開口，移動單元120 $、 外，Z通過所述開口。移動單元12。支#基板單元延二 t =部分且由位於腔室單& 11〇外部之移動控:之 170所控制。 t甽叙置 恥基板114以及環繞基板1H之框架116安¥ Mi 件11R t 文罝於 ^ 上，且可將輪119安置於支撐件118上以 早兀115之移動。 、基板 圖4為連接至蝕刻劑儲存槽14〇 視橫戴面圖。 早7° 110的側 $看圖4 ,藉由第一泵152經由第一流經丨5f) !由形成於腔室112之上部部分中的蝕刻劑入口 126 槽⑽中的蝕刻劑泵送至噴嘴單元1:儲 而將 200916423 c i、應至喷噶單元]24之餘刻劑供應至腔室]】2。 將基板單元H5浸潰於填充於腔室m中之飯刻劑 ^由位於腔室]】2外部之移動單元控制裝置170來控制 支撐且备動上述基板單元]】5用之移動單元〗的操作。 將經引入至腔室】】2中之蝕刻劑自腔室112排出 亦的蝕刻劑出口 122形成於腔室112之下部部分中。蝕刻 劑出口 122由第二流徑16〇連接至蝕刻劑儲存槽14〇,蕤 此使蝕刻劑循環。 曰 圖）為說明在圖4之裝置之腔室單元11〇中向下游流 動的蝕刻劑之側視横截面圖。 爪 …圖^，以蝕刻劑180填充腔室112且將基板單元 15 /又’貝於姓刻劑中。在此狀態中，經由喷嘴單元 二，於腔室112之上部部分中的蝕刻劑入口 i26而將 Μ腔室m中’且接著經由形成於腔室n2之 P戶刀中的餘刻劑出口 122而將钱刻劑自腔室112排 出。因此，蝕刻劑在腔室112中向下游流動。 —圖6為5兄明本發明之另一實施例的基板薄化裝置之腔 至早元中蝕刻劑向上游流動的侧視橫截面圖。 =看圖6，蝕刻劑入口 222形成於基板薄化裝置2〇〇 室的下部部分中’且侧劑出口 290形成於腔室之上 因此，經由形成於腔室之下部部分中的蝕刻劑 =口 222而引入蝕刻劑，且接著經由形成於腔室之上部部 二中之餘刎劑出口 290而將|虫刻劑自腔室排放至外部。姓 刻劑出口 290形成於钱刻劑之表面以下。亦即，_劑在 12 200916423 腔室中向上游流動。 在圖5以及圖6 φ，&十，★, Τ方法 型化芽置之為分別祝明包括多個雙面侧型基板薄 化裝置與雙面_基板薄型化 侧視橫截面圖。 低付玉化''且仵的 雔而為ί圖7 ’基板缚型化组件3〇0包括並行排列的多個 :=則魏㈣型化裝置。組件之多錄板薄型化 =η Τ、母—者包括在腔室中彼此間隔開的蝕刻劑入口 90以及糊㈣α奶，以及安置於腔室巾㈣侧 扳 315。 上在圖8中，基板薄型化組件400包括平行排列的雙面 钱刻型基板_化裝置以及單面㈣型基板薄型化裝置。 =看圖8，組件400之雙面蝕刻型基板薄型化裝置包 容納待蝕刻之第一基板415的第一腔室412、在第一 腔至412中的彼此間隔開之蝕刻劑入口 49〇與蝕刻劑出口 以及與蝕刻劑入口 49〇以及蝕刻劑出口 422連通之蝕 ^翁存槽（未圖示），其中將第-基板415浸潰於供應至 第—腔室412之蝕刻劑中以使得第一基板415之兩個表面 ]3 200916423 均被制。基板薄化裝置組件彻之單面 裝置包括支撐著待钱刻之第二基板42 =土反薄化 容納該支據板4]0之第二腔室432以及將可 二基板420之射出喷嘴娜其中該支擇板至第 ^由該錢板所支撐之第二基板伽亦為的’ 二弟二基板420之單—表面由供應至第 = 劑所蝕刻。 主之蝕刎W c 200916423 Flow path 160. Figure 3 is an enlarged exploded perspective view of the chamber unit 110 of the apparatus of Figure 2. Referring to Fig. 3, the chamber 1] 2 may have various shapes as long as the chamber can accommodate the substrate unit Π 5 therein. A cover having a central aperture is placed over the chamber 112, and the nozzle unit 124 is mounted in the central aperture. The mouthpiece unit 124 has an inverted prism shape and is empty to store a predetermined etchant. As described above, a plurality of etchant inlets 126 through which the etchant is introduced are formed in the lower portion 3 of the nozzle unit 124. Although the etchant inlet 126 is formed in the lower portion of the nozzle unit 124, the value is the present invention. Embodiments are not limited thereto, and etchant into D-knife 126 may be formed at any location where etchant may be introduced 6 via etchant inlet 126. An amine to 112 & an opening is formed in the side of the cover 13, through which the mobile unit 120$, outside, Z passes. Mobile unit 12. The #substrate unit is extended by two parts and is controlled by a mobile control: 170 located outside the chamber single & The shaving substrate 114 and the frame 116 surrounding the substrate 1H are placed on the support member 118, and the wheel 119 can be placed on the support member 118 to move forward 115. Substrate Figure 4 is a cross-sectional view of the etchant storage tank 14 as viewed. The side of the early 7° 110 looks at FIG. 4, and is pumped to the nozzle by the first pump 152 via the first flow through the crucible 5f) by the etchant formed in the etchant inlet 126 groove (10) in the upper portion of the chamber 112. Unit 1: Store and supply the remainder of the 200916423 ci, to the sneezing unit]24 to the chamber]]2. The substrate unit H5 is immersed in the rice filling agent filled in the chamber m, and the mobile unit control device 170 located outside the chamber 2 controls the support and prepares the substrate unit. operating. An etchant outlet 122, which is introduced into the chamber, is discharged from the chamber 112, and an etchant outlet 122 is formed in the lower portion of the chamber 112. The etchant outlet 122 is connected to the etchant storage tank 14A by a second flow path 16A, thereby circulating the etchant. Fig. 4 is a side cross-sectional view showing the etchant flowing downstream in the chamber unit 11 of the apparatus of Fig. 4. The claws are filled with the etchant 180 and the substrate unit 15 is again placed in the surname. In this state, via the nozzle unit 2, the etchant inlet i26 in the upper portion of the chamber 112 will be in the chamber m and then via the residual agent outlet 122 in the P-knife formed in the chamber n2. The money engraving agent is discharged from the chamber 112. Therefore, the etchant flows downstream in the chamber 112. - Figure 6 is a side cross-sectional view of the etchant flowing upstream from the cavity of the substrate thinning device of another embodiment of the present invention. = looking at Figure 6, an etchant inlet 222 is formed in the lower portion of the chamber of the substrate thinning device 2 and the side agent outlet 290 is formed over the chamber, thus via an etchant formed in the lower portion of the chamber = The etchant is introduced into the port 222, and then the insecticide is discharged from the chamber to the outside via the ember supply outlet 290 formed in the upper portion 2 of the chamber. The surname engraving outlet 290 is formed below the surface of the money engraving agent. That is, the agent flows upstream in the 12 200916423 chamber. In Fig. 5 and Fig. 6, φ, & 10, ★, Τ method is used to define a plurality of double-sided side substrate thinning devices and a double-sided substrate thinning side cross-sectional view, respectively. The low-paying jade'' and the 仵'''''''''''''''' The multiple sheets of the assembly are thinned = η Τ, mother - including the etchant inlet 90 and the paste (iv) alpha milk spaced apart from each other in the chamber, and the side panel 315 disposed on the chamber (4). As shown above in Fig. 8, the substrate thinning unit 400 includes a double-sided money engraving type substrate-integrated device and a single-sided (four) type substrate thinning device. Referring to Figure 8, the double-sided etched substrate thinning apparatus of assembly 400 houses a first chamber 412 of a first substrate 415 to be etched, and an etchant inlet 49 间隔 spaced apart from each other in the first chamber to 412 An etchant outlet and an etchant (not shown) communicating with the etchant inlet 49A and the etchant outlet 422, wherein the first substrate 415 is immersed in the etchant supplied to the first chamber 412 to Both surfaces of the first substrate 415]3 200916423 are fabricated. The substrate thinning device assembly comprises a single-sided device comprising a second substrate 42 supporting the money to be engraved = a second chamber 432 which is thinned to accommodate the support plate 4]0 and a nozzle for the second substrate 420. The second substrate of the second substrate, which is supported by the money board, is also etched by the supply of the second agent. Lord's eclipse
_因此，圖8之組件働可同時執行雙面軸以及單面 如上文所描述，基板薄型化裝置盥 化組件具#以下優勢。 〃、方如及基板缚型 表面第―’基㈣型化裝置與方法可同―基板之兩個 ，基板薄型化裝置與方法可精確地蝕刻基板。 第二，基板薄型化裝置可增加蝕刻劑之再用率。 ，四，可使基板薄型化裝置為緊密的(compact)。 肝第五，基板溥型化組件可包括單面蝕刻型基板薄型化 裝置以及雙面钮刻型基板薄型化裝置。 本發明可用於基板蝕刻以及薄型化之領域中。 雖然本發明已以較佳實施例揭露如上，然其並非用以 限疋本發明，任何熟習此技藝者，在不脫離本發明之精神 和範圍内，當可作些許之更動與潤飾，因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 200916423 本發明之以上以及其他特徵與優勢將藉由參看所附圖 式來詳細描述本發明之例示性實施例而變得較為顯而易 見，在圖式中： 圖1為用於蝕刻玻璃基板之習知裝置的側視横截面 圖。 圖2為根據本發明之實施例，用於使基板薄型化之裝 置的側視橫截面圖。 圖3為圖2之裝置之蝕刻腔室的放大分解透視圖。 圖4為圖3之蝕刻腔室之側視橫截面圖。 圖5為用於闡述本發明之實施例，用於使基板薄型化 之裝置之银刻過程的側視橫截面圖。 圖6為用於闡述本發明之另一實施例，用於使基板薄 型化之裝置之钮刻過程的側視橫截面圖。 圖7為周於使基板薄型化之組件之側視橫戴面圖，組 件包括根據本發明之實施例的雙面蝕刻型基板薄型化裝 置。 圖8為用於使基板薄型化之組件之侧視橫截面圖，組 件包括習知單面蝕刻型基板·薄型化裝置以及根據本發明之 另一實施例的雙面蝕刻型基板薄型化裝置。 【主要元件符號說明】 1 : HF钱刻浴槽 30 :蓋子 40 :水穴 41 :超純水 200916423 50 :泡罩板 60 :穿孔板 100 :基板薄化裝置 110 ··腔室單元 112 :腔室 114 :基板 115 :基板單元 116 :框架 118 :支撐件 119 :輪 120 :移動單元 122 :蝕刻劑出口 124 :喷嘴單元 126 :蝕刻劑入口 128 :蝕刻劑收集管 130 :罩蓋 140 :蝕刻劑儲存槽 150 :第一流徑 152 :第一泵 160 :第二流徑 162 :第二泵 170 :移動單元控制裝置 180 :蝕刻劑 200 :基板薄化裝置 200916423 222 :蝕刻劑入口 290 Ί虫刻劑出口 300 基板薄型化組件 315 基板 322 蝕刻劑出口 390 蝕刻劑入口 400 基板薄型化組件 410 支撐板 412 第一腔室 415 第一基板 420 第二基板 422 1虫刻劑出口 432 第二腔室 440 射出喷嘴 490 钱刻劑入口_ Therefore, the component of Fig. 8 can simultaneously perform the double-sided shaft and the single-sided as described above, and the substrate thinning device has the following advantages. 〃, 方如, and substrate-bonded surface The ―' base (four) type device and method can be the same as the two substrates, and the substrate thinning device and method can accurately etch the substrate. Second, the substrate thinning device can increase the reuse rate of the etchant. Fourth, the substrate thinning device can be made compact. In the fifth aspect of the liver, the substrate splicing unit may include a single-sided etching type substrate thinning device and a double-sided button type substrate thinning device. The invention can be used in the field of substrate etching and thinning. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and it is to be understood that those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS The above and other features and advantages of the present invention will become more apparent from the detailed description of the exemplary embodiments of the invention. A side cross-sectional view of a conventional device for etching a glass substrate. Figure 2 is a side cross-sectional view of a device for thinning a substrate in accordance with an embodiment of the present invention. Figure 3 is an enlarged exploded perspective view of the etching chamber of the apparatus of Figure 2. 4 is a side cross-sectional view of the etch chamber of FIG. 3. Figure 5 is a side cross-sectional view showing a silver engraving process of a device for thinning a substrate in accordance with an embodiment of the present invention. Figure 6 is a side cross-sectional view showing a buttoning process of a device for thinning a substrate in accordance with another embodiment of the present invention. Fig. 7 is a side cross-sectional view of a module for thinning a substrate, the assembly including a double-sided etching type substrate thinning device according to an embodiment of the present invention. Fig. 8 is a side cross-sectional view showing an assembly for thinning a substrate, which comprises a conventional single-sided etching type substrate and thinning device, and a double-sided etching type substrate thinning device according to another embodiment of the present invention. [Description of main component symbols] 1 : HF money bathing bath 30 : Cover 40 : Water hole 41 : Ultrapure water 200916423 50 : Blister plate 60 : Perforated plate 100 : Substrate thinning device 110 · · Chamber unit 112 : Chamber 114: substrate 115: substrate unit 116: frame 118: support 119: wheel 120: moving unit 122: etchant outlet 124: nozzle unit 126: etchant inlet 128: etchant collection tube 130: cover 140: etchant storage Tank 150: first flow path 152: first pump 160: second flow path 162: second pump 170: mobile unit control device 180: etchant 200: substrate thinning device 200916423 222: etchant inlet 290 mites engraving agent outlet 300 substrate thinning component 315 substrate 322 etchant outlet 390 etchant inlet 400 substrate thinning component 410 support plate 412 first chamber 415 first substrate 420 second substrate 422 1 insect engraving outlet 432 second chamber 440 injection nozzle 490 money engraving entrance