KR100942620B1 - 캐리어 헤드용 가요성 막 - Google Patents

캐리어 헤드용 가요성 막 Download PDF

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Publication number
KR100942620B1
KR100942620B1 KR1020070108357A KR20070108357A KR100942620B1 KR 100942620 B1 KR100942620 B1 KR 100942620B1 KR 1020070108357 A KR1020070108357 A KR 1020070108357A KR 20070108357 A KR20070108357 A KR 20070108357A KR 100942620 B1 KR100942620 B1 KR 100942620B1
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KR
South Korea
Prior art keywords
annular
flexible membrane
flap
concentric
main portion
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KR1020070108357A
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English (en)
Korean (ko)
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KR20080046557A (ko
Inventor
스티븐 엠. 주니가
앤드류 제이. 나겐가스트
정훈 오
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어플라이드 머티어리얼스, 인코포레이티드
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Publication of KR20080046557A publication Critical patent/KR20080046557A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24174—Structurally defined web or sheet [e.g., overall dimension, etc.] including sheet or component perpendicular to plane of web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24174—Structurally defined web or sheet [e.g., overall dimension, etc.] including sheet or component perpendicular to plane of web or sheet
    • Y10T428/24182—Inward from edge of web or sheet

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Packages (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
KR1020070108357A 2006-11-22 2007-10-26 캐리어 헤드용 가요성 막 Active KR100942620B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US86709006P 2006-11-22 2006-11-22
US60/867,090 2006-11-22
US89170507P 2007-02-26 2007-02-26
US60/891,705 2007-02-26
US11/741,692 US7727055B2 (en) 2006-11-22 2007-04-27 Flexible membrane for carrier head
US11/741,692 2007-04-27

Publications (2)

Publication Number Publication Date
KR20080046557A KR20080046557A (ko) 2008-05-27
KR100942620B1 true KR100942620B1 (ko) 2010-02-17

Family

ID=38996609

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070108357A Active KR100942620B1 (ko) 2006-11-22 2007-10-26 캐리어 헤드용 가요성 막

Country Status (8)

Country Link
US (3) US7727055B2 (enExample)
EP (1) EP1925399B1 (enExample)
JP (2) JP5250243B2 (enExample)
KR (1) KR100942620B1 (enExample)
CN (1) CN101293334B (enExample)
AT (1) ATE529220T1 (enExample)
SG (2) SG175554A1 (enExample)
TW (2) TWI433753B (enExample)

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US10160093B2 (en) * 2008-12-12 2018-12-25 Applied Materials, Inc. Carrier head membrane roughness to control polishing rate
JP5392483B2 (ja) * 2009-08-31 2014-01-22 不二越機械工業株式会社 研磨装置
JP6073222B2 (ja) * 2010-08-06 2017-02-01 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 保定リングを用いた基板縁部調整
US8591286B2 (en) 2010-08-11 2013-11-26 Applied Materials, Inc. Apparatus and method for temperature control during polishing
USD711330S1 (en) * 2010-12-28 2014-08-19 Ebara Corporation Elastic membrane for semiconductor wafer polishing
US9050700B2 (en) * 2012-01-27 2015-06-09 Applied Materials, Inc. Methods and apparatus for an improved polishing head retaining ring
JP5807580B2 (ja) 2012-02-15 2015-11-10 信越半導体株式会社 研磨ヘッド及び研磨装置
US9604339B2 (en) 2012-10-29 2017-03-28 Wayne O. Duescher Vacuum-grooved membrane wafer polishing workholder
US9233452B2 (en) 2012-10-29 2016-01-12 Wayne O. Duescher Vacuum-grooved membrane abrasive polishing wafer workholder
US9011207B2 (en) 2012-10-29 2015-04-21 Wayne O. Duescher Flexible diaphragm combination floating and rigid abrading workholder
US8845394B2 (en) 2012-10-29 2014-09-30 Wayne O. Duescher Bellows driven air floatation abrading workholder
US9039488B2 (en) 2012-10-29 2015-05-26 Wayne O. Duescher Pin driven flexible chamber abrading workholder
US9199354B2 (en) 2012-10-29 2015-12-01 Wayne O. Duescher Flexible diaphragm post-type floating and rigid abrading workholder
US8998678B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Spider arm driven flexible chamber abrading workholder
US8998677B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Bellows driven floatation-type abrading workholder
US10532441B2 (en) * 2012-11-30 2020-01-14 Applied Materials, Inc. Three-zone carrier head and flexible membrane
US9381613B2 (en) * 2013-03-13 2016-07-05 Applied Materials, Inc. Reinforcement ring for carrier head
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD808349S1 (en) 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD770990S1 (en) * 2013-05-15 2016-11-08 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
TWI643967B (zh) * 2013-10-04 2018-12-11 美商應用材料股份有限公司 經塗佈的固定環
TWI628043B (zh) * 2014-03-27 2018-07-01 日商荏原製作所股份有限公司 彈性膜、基板保持裝置、及研磨裝置
CN104308736A (zh) * 2014-08-27 2015-01-28 上海华力微电子有限公司 研磨头膜片的缺陷检测方法
KR101673140B1 (ko) * 2014-12-22 2016-11-08 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드의 멤브레인 및 이를 구비한 캐리어 헤드
KR102264785B1 (ko) * 2015-02-16 2021-06-14 삼성전자주식회사 연마 헤드 및 이를 갖는 연마 캐리어 장치
USD839224S1 (en) 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
JP7021863B2 (ja) * 2017-03-30 2022-02-17 富士紡ホールディングス株式会社 保持具
JP7141222B2 (ja) * 2017-04-12 2022-09-22 株式会社荏原製作所 弾性膜、基板保持装置、及び研磨装置
KR102498118B1 (ko) * 2017-04-12 2023-02-09 가부시키가이샤 에바라 세이사꾸쇼 탄성막, 기판 보유 지지 장치 및 연마 장치
USD859332S1 (en) * 2017-06-29 2019-09-10 Ebara Corporation Elastic membrane for semiconductor wafer polishing
US10926378B2 (en) 2017-07-08 2021-02-23 Wayne O. Duescher Abrasive coated disk islands using magnetic font sheet
US11267099B2 (en) * 2017-09-27 2022-03-08 Taiwan Semiconductor Manufacturing Company, Ltd. Chemical mechanical planarization membrane
USD918161S1 (en) * 2017-12-19 2021-05-04 Ebara Corporation Elastic membrane
US12005546B2 (en) 2018-01-29 2024-06-11 Menzer Gmbh Sliding ring for a grinding device and method for producing the sliding ring
KR102637832B1 (ko) * 2018-11-09 2024-02-19 주식회사 케이씨텍 연마 장치용 캐리어 헤드 및 이에 사용되는 멤브레인
CN109202697A (zh) * 2018-11-20 2019-01-15 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 抛光头、抛光设备以及抛光头的使用方法
US11691241B1 (en) * 2019-08-05 2023-07-04 Keltech Engineering, Inc. Abrasive lapping head with floating and rigid workpiece carrier
SG10202008012WA (en) * 2019-08-29 2021-03-30 Ebara Corp Elastic membrane and substrate holding apparatus
US12138732B2 (en) 2020-12-14 2024-11-12 Applied Materials, Inc. Polishing system apparatus and methods for defect reduction at a substrate edge
JP2025519183A (ja) 2023-03-15 2025-06-24 ヘマ マシーネン― ウント アパラテシュッツ ゲーエムベーハー 空圧式クランプ及び／又はブレーキ装置のハウジング部材

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Also Published As

Publication number Publication date
EP1925399A3 (en) 2008-07-02
US7950985B2 (en) 2011-05-31
JP2013116555A (ja) 2013-06-13
TWI552829B (zh) 2016-10-11
TW200902227A (en) 2009-01-16
US20100240287A1 (en) 2010-09-23
TWI433753B (zh) 2014-04-11
US8469776B2 (en) 2013-06-25
CN101293334A (zh) 2008-10-29
JP5250243B2 (ja) 2013-07-31
KR20080046557A (ko) 2008-05-27
SG143191A1 (en) 2008-06-27
US20110212672A1 (en) 2011-09-01
EP1925399A2 (en) 2008-05-28
EP1925399B1 (en) 2011-10-19
ATE529220T1 (de) 2011-11-15
CN101293334B (zh) 2016-03-23
US20080119122A1 (en) 2008-05-22
SG175554A1 (en) 2011-11-28
TW201422364A (zh) 2014-06-16
JP5568654B2 (ja) 2014-08-06
JP2008142884A (ja) 2008-06-26
US7727055B2 (en) 2010-06-01

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