KR100938191B1 - Exposure apparatus and exposing method, and method of manufacturing a device - Google Patents

Abstract

An object of the present invention is to provide an exposure apparatus capable of arbitrarily setting the size of a pattern formed on a photosensitive substrate when continuously exposing a dividing pattern and arbitrarily setting the dividing position of the pattern on the mask.

The scanning exposure apparatus is movable in the non-scanning direction, the field stop for setting the width in the scanning direction of the projection area 50 on the photosensitive substrate P, the light shielding plate for setting the width in the non-scanning direction, and A blind 30 is provided which sets the continuous portion on the pattern and attenuates the accumulated exposure amount in the continuous portion almost continuously as it goes to the periphery of the irradiation area.

Description

Exposure apparatus and exposure method, and device manufacturing method {EXPOSURE APPARATUS AND EXPOSING METHOD, AND METHOD OF MANUFACTURING A DEVICE}

1 is a schematic perspective view showing one embodiment of an exposure apparatus of the present invention.

2 is a schematic configuration diagram showing one embodiment of the exposure apparatus of the present invention.

3 is a plan view for explaining the filter;

4 is a schematic diagram for explaining a field stop, a first light shielding plate, and a second light shielding plate;

5 is a schematic diagram for explaining a field stop, a first light shielding plate, and a second light shielding plate;

6 is a schematic diagram for explaining a field stop, a first light shielding plate, and a second light shielding plate;

7 is a view for explaining how a projection area is set by a first light blocking plate or a second light blocking plate.

8 is a diagram illustrating a projection area set in the projection optical system.

9 is a plan view showing a relationship between a mask and a projection area.

10 is a plan view illustrating a relationship between a photosensitive substrate and a projection region.

11 is a flowchart showing a sequence of exposure operations.

It is a schematic diagram explaining the state which match | positions the mask alignment mark and a 2nd light shield plate.

It is a schematic diagram explaining the state which matches the position of a mask alignment mark and a board | substrate alignment mark.

14 (a) and 14 (b) are diagrams for explaining how the exposure amount is controlled in the overlapping region.

15 is a plan view illustrating another embodiment when performing continuous exposure;

16 is a plan view showing another embodiment when performing continuous exposure;

17 illustrates another embodiment of the second light shielding plate.

18 illustrates another embodiment of the second light shielding plate.

19 illustrates another embodiment of the second light shielding plate.

20 illustrates another embodiment of the second light shielding plate.

21 is a view showing another embodiment of the second light shielding plate.

22 (a) and 22 (b) are diagrams showing another embodiment when setting an overlapping area.

23 is a flowchart showing an example of semiconductor device manufacturing steps.

24A to 24C are diagrams illustrating a sensor and position measurement.

25 is a diagram illustrating a conventional continuous exposure method.

26 (a) and 26 (b) show a conventional continuous exposure method.

<Explanation of symbols for the main parts of the drawings>

20: field of view aperture

30 blinds (second shading plate)

40: shading plate (first shading plate)                 

46, 47: split pattern

48, 49: overlapping area

50a to 50g: projection area (lighting area)

52a to 52f: overlapping area (continuous portion)

60A, 60B: Mask Align Mark

62, 63: dividing pattern

64: redundant area (continuous part)

72: substrate alignment mark

CONT: Control Unit

EL: exposure light (light beam)

EX: exposure device

IL: Illumination Optical System

IMa∼IMg: Illumination module

M: Mask

MST: Mask Stage

Lx: width in the scanning direction on the pattern

Ly: width in the direction orthogonal to the scanning direction on the pattern

P: photosensitive substrate, glass substrate

PL (PLa to PLg): projection optical system

PST: Board Stage                 

X: scan direction

Y: non-scanning direction (direction perpendicular to the scanning direction)

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a scanning exposure apparatus and an exposure method for exposing a pattern of a mask to a photosensitive substrate by synchronously moving the mask and the photosensitive substrate, and in particular, an exposure apparatus and an exposure method for exposing a portion of an adjacent pattern on the photosensitive substrate in duplicate. And a device manufacturing method.

A liquid crystal display device or a semiconductor device is manufactured by a so-called photolithography method for transferring a pattern formed on a mask onto a photosensitive substrate. The exposure apparatus used in this photolithography step has a substrate stage that arranges a photosensitive substrate and a mask stage that moves two-dimensionally by placing a mask having a pattern, and a mask stage that moves two-dimensionally by placing a pattern formed on the mask. It transfers to the photosensitive board | substrate through a projection optical system, moving in order. The exposure apparatus includes a batch type exposure apparatus that simultaneously transfers the entire pattern of the mask onto the photosensitive substrate, and a scanning type exposure apparatus that continuously transfers the mask pattern onto the photosensitive substrate while synchronously scanning the mask stage and the substrate stage. Two are mainly known. Among these, when manufacturing a liquid crystal display device, the scanning type exposure apparatus is mainly used by the request of enlargement of a display area.                         

In the scanning exposure apparatus, a plurality of projection optical systems are arranged so that adjacent projection regions are displaced by a predetermined amount in the scanning direction, and end portions of adjacent projection regions overlap in a direction orthogonal to the scanning direction. There is an exposure apparatus (multi-lens scanning type exposure apparatus). The multi-lens type scanning exposure apparatus can obtain a large exposure area without increasing the size of the apparatus while maintaining good imaging characteristics. The field stop of each projection optical system in the said scanning type exposure apparatus is a trapezoid shape, for example, and it sets so that the sum total of the opening width of the field stop of a scanning direction may always be the same. Therefore, since the continuous portions of the adjacent projection optical systems are overlapped and exposed, the scanning exposure apparatus has the advantage that the optical aberration and the exposure illuminance of the projection optical system are smoothly changed.

In the scanning exposure apparatus, the mask and the photosensitive substrate are synchronously moved to perform scanning exposure, and then the mask and the photosensitive substrate are moved in steps in a direction orthogonal to the scanning direction, and a plurality of scanning exposures are performed to overlap a part of the pattern. The liquid crystal display device which has a large display area is manufactured by carrying out and exposing and combining these patterns one by one.

As a method of performing pattern synthesis on the photosensitive substrate by repeating the scanning exposure and the step movement, for example, a plurality of divided patterns are formed on the mask, and the method of joining these divided patterns on the photosensitive substrate and a plurality of pattern images of the mask are provided. And a method of dividing the projected areas into pieces on the photosensitive substrate. In the former method, for example, as shown in FIG. 25, three divided patterns Pa, Pb, and Pc are formed in the mask M, and each of the divided patterns Pa, Pb, and Pc is formed on a photosensitive substrate. It exposes to (P) one by one, and joins on the photosensitive board | substrate P together.

On the other hand, in the latter method, for example, as shown in FIGS. 26A and 26B, the irradiation area of the exposure light with respect to the pattern formed in the mask M is changed for each scanning exposure. And scanning composition are sequentially performed on the photosensitive board | substrate P in the projection area | region corresponding to these irradiation areas, and pattern synthesis is performed. Here, five projection optical systems are provided, and as shown in Fig. 26A, each of the projection regions 100a to 100e is set in a trapezoidal shape and integrated in the scanning direction (X direction). Each end part is arrange | positioned so that it may overlap each other in a Y direction so that an exposure amount may always be the same, and it sets so that the sum total of the width | variety of the projection area | region in the X direction may be equal. And when exposing a pattern to the photosensitive board | substrate P, the light path corresponding to a predetermined projection area among the several projection area | regions 100a-100e is shielded with a shutter, and only the predetermined area | region of the mask M is irradiated with exposure light. It exposes so that the edge part of a projection area | region may overlap in multiple scanning exposure. Specifically, as shown in FIG. 26B, the end portion a1 on the −Y side of the projection region 100d in the first scanning exposure and the projection region in the second scanning exposure. The end portion a2 on the + Y side of 100b is exposed to overlap. Similarly, the end portion a3 on the −Y side of the projection region 100c in the second scanning exposure and the end portion a4 on the + Y side of the projection region 100b in the third scanning exposure overlap. Exposure is performed. At this time, the projection area 100e is shielded from the first scanning exposure, and the projection areas 100a, 100d, and 100e are shielded from the second scanning exposure, and the projection area 100a from the third scanning exposure. ) Is shaded.

Here, the length L12 in the Y direction of the dividing pattern formed on the photosensitive substrate P by the first scanning exposure is the + Y-direction end point of the short side of the projection area 100a and the length of the projection area 100d. The distance in the Y direction between the Y-direction end points of the sides. The length L13 in the Y direction of the dividing pattern formed on the photosensitive substrate P by the second scanning exposure is the + Y direction end point of the long side of the projection area 100b and the long side of the projection area 100c. It is the distance in Y direction between Y direction end points. The length L14 in the Y direction of the dividing pattern formed on the photosensitive substrate P by the third scanning exposure is determined by the + Y direction end point of the long side of the projection area 100b and the short side of the projection area 100e. It is the distance in Y direction between Y direction end points. In this way, the size (lengths L12, L13, L14 in the Y-direction) of each divided pattern is based on the sizes of the long and short sides of the trapezoidal projection area.

However, the following problems exist in the conventional scanning exposure method and the scanning exposure apparatus as described above.

In the method shown in FIG. 25, since a plurality of independent division patterns are formed on the mask M, there is a restriction in the pattern configuration on the mask M. FIG. In addition, since the scanning exposure is performed for each divided pattern, the number of scanning exposures increases, and the throughput is reduced.

In addition, in the methods shown in Figs. 26A and 26B, when the pattern is synthesized by a plurality of scanning exposures, as described above, the size (the length in the Y direction ( L12, L13, L14)] is based on the size of the long side and short side of the trapezoidal projection area. That is, in the methods shown in FIGS. 26A and 26B, the size of the pattern formed on the photosensitive substrate P is determined by the size of the projection area, and thus the size (shape) of the field stop. It becomes limited. Further, since the joining of the divided patterns is made only at the end of the trapezoidal projection area, the divided positions of the patterns are also limited. As described above, in the conventional method, the position at which the pattern is divided and the size of the pattern formed on the photosensitive substrate P are limited, making arbitrary devices difficult.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and when the portions of the divided pattern are overlapped and exposed on the photosensitive substrate, the size of the pattern formed on the photosensitive substrate can be arbitrarily set, and the pattern is divided on the mask. It is an object of the present invention to provide an exposure apparatus, an exposure method, and a device manufacturing method capable of arbitrarily setting the position and realizing efficient device manufacturing.

MEANS TO SOLVE THE PROBLEM In order to solve said subject, this invention uses the following structures provided corresponding to FIGS. 1-24 (a)-24 (c) shown in the Example.

The exposure apparatus EX of the present invention includes an illumination optical system IL for irradiating the mask M with a light beam EL, a mask stage MST for arranging the mask M, and a pattern 44 of the mask M. FIG. Having a substrate stage PST for arranging the photosensitive substrates P for exposing the light beams 45a, 45b, 46, 47, and causing the mask M and the photosensitive substrate P to move synchronously with respect to the light beam EL. In the exposure apparatus which scan-exposes and divides into several times of scanning exposure so that a part of pattern image 50a-50g, 62, 63 of the mask M may overlap and exposes the pattern to the photosensitive board | substrate P continuously, The aperture stop 20 which sets the width Lx of the scanning direction X of the pattern images 50a-50g illuminated on the photosensitive board | substrate P, and orthogonal to the scanning direction of the pattern images 50a-50g. The first light shielding plate 40 that sets the width Ly of the direction Y and the regions 48, 49, and 64 that are movable in the direction Y orthogonal to the scanning direction and which overlap the pattern image are set. It characterized in that it includes a second light shielding plate 30 that at the time, substantially continuously attenuated by an integrated exposure amount in the overlap regions exposed in accordance with facing to the periphery of the region (48, 49, 66) for irradiating.

According to the present invention, when the width of the scanning direction and the direction orthogonal to the scanning direction of the pattern image on the photosensitive substrate is set by the field stop and the first light shielding plate, By arranging the second light shielding plate on the optical path and moving in the direction orthogonal to the scanning direction, it is possible to arbitrarily set the area (irradiation area of the illumination optical system) to which the light beam is irradiated to the mask by the second light shielding plate. Therefore, since the continuous part of the pattern, that is, the pattern division position of the mask can be arbitrarily set, the size of the pattern formed on the photosensitive substrate can be arbitrarily set. Further, the second light shielding plate is provided so as to be movable in a direction orthogonal to the scanning direction, and to expose the area around the irradiated area (irradiation area of the illumination photoelectric field), the photosensitive light which attenuates the accumulated exposure amount in the overlapping area of the pattern almost continuously. Because of the characteristics, the exposure dose in the overlapping region can be set to a desired value, and the exposure doses in the overlapping region and the non-overlapping region can be matched. Therefore, the exposure process with high precision can be performed. In addition, since the size and shape of the illumination region (in the case of an exposure apparatus with a projection optical system) of the light beam to the photosensitive substrate can be arbitrarily set by moving the second light shielding plate with respect to the field of view aperture, The accuracy of the joining can be improved and the exposure amount can be realized.

The exposure method of the present invention irradiates the mask M with the light beam EL, and simultaneously scans and exposes the mask M and the photosensitive substrate P with respect to the light beam EL, thereby forming a pattern image of the mask M. FIG. In a continuous exposure method in which a part of (50a to 50g, 62, 63) is overlapped and divided into a plurality of scanning exposures to perform pattern synthesis on the photosensitive substrate P, the pattern image illuminated on the photosensitive substrate P ( The width Lx of the scanning direction X of 50a-50g is set by the visual field stop 20, and the width Ly of the direction Y orthogonal to the scanning direction of the pattern image 50a-50g is visualized. It is set by the 1st light shielding plate 40 different from the aperture 20, and attenuates the irradiation light quantity of the overlapping area | region 48, 49, and 64 substantially continuously as it goes to the periphery of the area | region to irradiate, and the pattern image 50a The area | region 48 which performs continuous exposure of the 2nd light shielding plate 30 provided so that the movement to the direction Y orthogonal to the scanning direction of -50g, 62, 63 is carried out 49, 64).

According to the present invention, the field stop and the first light shielding plate can set the width of the scanning direction and the direction orthogonal to the scanning direction of the pattern on the photosensitive substrate. And when this set pattern image is bonded together on the photosensitive board | substrate, the area | region (irradiation area of an illumination optical system) which irradiates a light beam to a mask can be arbitrarily set by setting a 2nd light shielding plate according to the area | region which performs continuous exposure. , The continuous part of the pattern, that is, the pattern division position of the mask can be arbitrarily set. Therefore, the size of the pattern formed on the photosensitive substrate can be arbitrarily set, and a large pattern can be formed. In addition, since the second light shielding plate has a photosensitivity characteristic that attenuates the amount of irradiation light in the overlapping region of the pattern almost continuously, the exposure amount in the overlapping region can be set to a desired value. Therefore, the exposure amounts of the overlapping region and the portions other than the overlapping region can be matched, and the exposure processing with high accuracy can be performed.

The device manufacturing method of this invention irradiates the mask M with the light beam EL, and simultaneously exposes and exposes the exposure apparatus EX which scan-exposes the mask M and the glass substrate P with respect to the light beam EL. In the device manufacturing method which combines one part of the pattern of the mask M by joining together, and manufactures a liquid crystal device larger than the continuous pattern area | region 46 and 47 of the mask M, it is made to glass substrate P The pattern of joining and joining of the pattern of the mask M is set to the exposure apparatus EX as a recipe, and the exposure light EL is adjusted in accordance with the pattern of the mask M to be exposed according to the recipe. While setting the irradiation area for irradiation, the pattern 48 of the mask M provided at the continuous position located on one side of the irradiation area is exposed by matching the position of the light shielding plate 30 for continuous exposure. After that, the glass substrate P is scanned Irradiation area for irradiating exposure light in accordance with the pattern of the mask M to be exposed is set at a position partially overlapping the area exposed to the glass substrate P with the direction Y orthogonal to the direction to be made At the same time, the light shielding plate 30 for continuous exposure is matched and exposed to the pattern 49 of the mask M provided at the joining position located on one side of the irradiation area.

According to the present invention, when the patterns are exposed one after another, the information of the joining positions (divided positions) of the patterns of the masks is set in advance as a recipe in the exposure apparatus, and according to this recipe, the first scanning for one after another exposure. At the time of exposure, the position of a light shielding plate is matched and exposed to the said joining position, and after a 1st scanning exposure, a glass substrate is moved in steps in a direction orthogonal to a scanning direction, and at the time of a 2nd scanning exposure, By adjusting the position and exposing, the pattern of a mask can be divided | segmented and it can join together on a glass substrate only by adjusting the position of the light shielding plate in the case of a 1st scanning exposure and a 2nd scanning exposure, respectively. In this way, since the joining position can be set simply by adjusting the position of the light shielding plate, the joining accuracy is improved, and a device having desired performance can be manufactured.

EMBODIMENT OF THE INVENTION Hereinafter, the exposure apparatus, exposure method, and device manufacturing method of this invention are demonstrated, referring drawings. 1 is a schematic perspective view showing an embodiment of an exposure apparatus of the present invention, and FIG. 2 is a schematic configuration diagram of the exposure apparatus.

1 and 2, the exposure apparatus EX exposes the mask stage MST on which the mask M is disposed, and the mask M disposed on the mask stage MST to expose the exposure light (light beam) EL. Irradiated with the exposure light by the illumination optical system IL to be irradiated with the light, the substrate stage PST for arranging the exposure substrate P for exposing the pattern formed on the mask M, and the illumination optical system IL. The projection optical system PL which projects and exposes the pattern image of the mask M to the board | substrate stage PST is provided. The illumination optical system IL has a plurality (in this embodiment, seven) illumination system modules IM (IMa to IMg). The projection optical system PL also has a plurality of projection optical systems PLa to PLg (seven in this embodiment) corresponding to the number of the illumination system modules IM. Each of the projection optical systems PLa to PLg is disposed corresponding to each of the illumination system modules IMa to IMg. The photosensitive substrate P is obtained by applying a photosensitive agent (photoresist) to a glass plate (glass substrate).

The exposure apparatus EX is a scanning exposure apparatus which performs scanning scanning by synchronously moving the mask M and the photosensitive substrate P with respect to the exposure light EL. In the following description, the optical axis direction of the projection optical system PL is adjusted. The direction perpendicular to the Z direction and the X direction (the scanning direction) is assumed to be the Z direction, and the synchronous movement direction (the scanning direction) of the mask M and the photosensitive substrate P is the X direction in a direction perpendicular to the Z direction. The non-scanning direction) is Y direction.

And the exposure apparatus EX is provided in the projection optical system PL, as mentioned later, The visual field which sets the width | variety of the scanning direction (X direction) on the pattern of the mask M illuminated on the photosensitive board | substrate P. Width of the diaphragm 20 and the non-scanning direction (Y direction) on the pattern of the mask M illuminated at the same position as the field stop 20 of the projection optical system PL and illuminated on the photosensitive substrate P. A light shielding plate (first light shielding plate) 40 for setting an X-ray and a blind (second light shielding plate) 30 provided in the illumination optical system IL and movably provided in the non-scanning direction (Y direction) are provided.

As shown in FIG. 2, the illumination optical system IL includes a light source 1 composed of an ultra-high pressure mercury lamp, an ellipse mirror 1a for condensing the light beam emitted from the light source 1, and the elliptical mirror 1a. The dichroic mirror 2 which reflects the light flux of the wavelength necessary for exposure among the light fluxes condensed by), and transmits the light flux of other wavelengths, and the wavelength required for exposure among the light fluxes reflected by the dichroic mirror 2 (Normally, at least one band of g-line, h-line, and i-line) Further, the wavelength selection filter 3 and the light beam from the wavelength selection filter 3 are plural lines (seven in this embodiment). It is provided with the light guide 4 which branches to and injects into each illumination system module IMa-IMg through the reflection mirror 5. As shown in FIG.

A plurality of illumination system modules IM (seven IMa to IMg in this embodiment) are arranged (however, only those corresponding to the illumination system module IMg are shown in FIG. 2 for convenience), and the illumination optical systems IMa to IMg. Are arranged at regular intervals in the X and Y directions. The exposure light EL emitted from each of the plurality of illumination system modules IMa to IMg illuminates another small area (illumination area of the illumination optical system) on the mask M, respectively.

Each of the illumination system modules IMa to IMg includes an illumination shutter 6, a relay lens 7, a fly's eye lens 8 as an optical integrator, and a condenser lens 9. The illumination shutter 6 is arrange | positioned in the light path downstream of the ride guide 4 so that advancing with respect to an optical path can be carried out. The illumination shutter 6 shields the light beam from this optical path when shielding the optical path, and releases the light shielding to the light beam when releasing the optical path. The shutter shutter 6a is connected to the illumination shutter 6 to move the illumination shutter 6 back and forth with respect to the light path of the light beam. The shutter driver 6a is controlled by the control device CONT.                     

In addition, the light quantity adjustment mechanism 10 is provided in each of the illumination system modules IMa-IMg. The light amount adjusting mechanism 10 adjusts the exposure amount of each light path by setting the illuminance of the light beam for each light path, thereby adjusting the half mirror 11, the detector 12, the filter 13, and the filter driver 14. Equipped. The half mirror 11 is disposed in the optical path between the filter 13 and the relay lens 7 and allows a part of the light beam passing through the filter 13 to enter the detector 12. Each detector 12 always independently detects the illuminance of the incident light beam, and outputs the detected illuminance signal to the control apparatus CONT.

As shown in FIG. 3, the filter 13 is patterned in the shape of a foot with Cr or the like on the glass plate 13a and is formed such that the transmittance gradually changes linearly in a specific range along the Y direction. It is arrange | positioned between the illumination shutter 6 and the half mirror 11 in each optical path.

These half mirrors 11, the detector 12, and the filter 13 are arranged for each of the plurality of optical paths. The filter drive unit 14 moves the filter 13 along the Y direction based on the instruction of the control device CONT. Then, by moving the filter 13 by the filter driver 14, the amount of light for each optical path is adjusted.

The light beam passing through the light amount adjusting mechanism 10 reaches the fly's eye lens 8 through the relay lens 7. The fly's eye lens 8 forms a secondary light source on the exit surface side, and can irradiate the irradiation area of the mask M with uniform illuminance through the condenser lens 9. The exposure light EL passing through the condenser lens 9 includes a reflection refracting optical system 15 including a right-angle prism 16, a lens system 17, and a concave mirror 18 among the illumination system modules. After passing through, the mask M is illuminated to a predetermined irradiation area. The mask M is illuminated to another irradiation area | region by each exposure light EL which permeate | transmitted illumination system modules IMa-IMg. Here, a blind (second light shielding plate) 30 is provided between the condenser lens 9 and the reflective refractive optical system 15 so as to be movable in the non-scanning direction (Y direction) by the blind driver 31. . The blind B will be described later.

The mask stage MST supporting the mask M has a long stroke in the X direction and a stroke of a predetermined distance in the Y direction orthogonal to the scanning direction to perform one-dimensional scanning exposure. As shown in FIG. 2, the mask stage MST includes a mask stage driver MSTD for moving the mask stage MST in the XY direction. The mask stage driver MSTD is controlled by the control device CONT.

As shown in FIG. 1, the moving mirrors 32a and 32b are provided in the direction orthogonal to each end edge of the X-direction and Y-direction on the mask stage MST, respectively. The laser interferometer 33a is arrange | positioned facing the moving mirror 32a. Moreover, the laser interferometer 33b is arrange | positioned facing the moving mirror 32b. Each of these laser interferometers 33a and 33b emits laser light to each of the moving mirrors 32a and 32b to measure the distance between these moving mirrors 32a and 32b, thereby measuring the distance between the X-direction and the mask stage MST. The position in the Y direction, that is, the position of the mask M can be detected with high resolution and high precision. The detection result of the laser interferometers 33a and 33b is output to the control apparatus CONT. The control device CONT monitors the position of the mask stage MST from the outputs of the laser interferometers 33a and 33b to control the mask stage driver MSTD, thereby moving the mask stage MST to a desired position.

The exposure light EL transmitted through the mask M is incident on the projection optical system PL PL-PLg, respectively. The projection optical systems PLa to PLg form a pattern image existing in the irradiation range of the mask M on the photosensitive substrate P, and project the exposure of the pattern image to a specific area of the photosensitive substrate P. It is arrange | positioned corresponding to the modules IMa-IMg.

As shown in FIG. 1, of the plurality of projection optical systems PLa to PLg, the projection optical systems PLa, PLc, PLe, and PLg and the projection optical systems PLb, PLd, and PLf are arranged in a zigzag form in two rows. That is, each projection optical system PLa-PLg arrange | positioned in the zigzag form displaces adjacent projection optical systems (for example, projection optical systems PLa and PLb, PLb, and PLc) by predetermined amount in the X direction. Each of these projection optical systems PLa to PLg is emitted from the illumination system modules IMa to IMg, transmits a plurality of exposure light EL passing through the mask M, and is disposed on the substrate stage PST. The pattern image of the mask M is projected on (P). That is, the exposure light EL transmitted through each of the projection optical systems PLa to PLg has a predetermined imaging characteristic in a pattern image corresponding to the irradiation area of the mask M in another projection area (lighting area) on the photosensitive substrate P. It is imaged as.

As shown in Fig. 2, each of the projection optical systems PLa to PLg includes an image shift mechanism 19, two groups of reflective refractive optical systems 21 and 22, a field stop 20, The magnification adjustment mechanism 23 is provided. The phase shift mechanism 19 shifts the pattern image of the mask M to an X direction or a Y direction, for example by rotating two parallel flat plate glass about the Y axis or X axis, respectively. The exposure light EL transmitted through the mask M passes through the image shift mechanism 23 and then enters the reflective refractive optical system 21 of the first group.

The reflective refractive optical system 21 forms an intermediate image of the pattern of the mask M, and includes a right-angle prism 24, a lens system 25, and a concave mirror 26. The rectangular prism 24 is free to rotate about the Z axis, and can rotate the pattern image of the mask M. As shown in FIG.

The visual field stop 20 is arrange | positioned at this intermediate | middle upper position. The visual field stop 20 sets the projection area | region on the photosensitive board | substrate P, and sets the width | variety of the scanning direction (X direction) of the pattern image on the photosensitive board | substrate P especially. The light beam passing through the field stop 20 is incident on the reflective refractive optical system 22 of the second group. Similar to the reflective refractive optical system 21, the reflective refractive optical system 22 includes a right angle prism 27, a lens system 28, and a concave mirror 29. The rectangular prism 27 is also freely rotated around the Z axis, so that the pattern image of the mask M can be rotated.

The exposure light EL emitted from the reflection refracting optical system 22 passes through the magnification adjusting mechanism 23, and forms the pattern image of the mask M on the photosensitive substrate P at the same magnification. The magnification adjustment mechanism 23 consists of three lenses, for example, a flat convex lens, a biconvex lens, and a flat convex lens, and moves the biconvex lens positioned between the flat convex lens and the flat convex lens in the Z direction. The magnification of the pattern image of the mask M is changed.

The board | substrate stage PST which supports the photosensitive board | substrate P has the board | substrate holder PH, and hold | maintains the photosensitive board | substrate P through this board | substrate holder PH. The substrate stage PST, like the mask stage MST, has a long stroke in the X direction to perform one-dimensional scanning exposure and a long stroke for moving stepwise in the Y direction orthogonal to the scanning direction. The board | substrate stage drive part PSTD which moves the stage PST to an XY direction is provided. The substrate stage driver PSTD is controlled by the controller CONT. The substrate stage PST is also movable in the Z direction.

Moreover, the substrate stage PST is provided with the detection apparatus (not shown) which detects the position of the pattern surface of the mask M and the Z direction of the exposure surface of the photosensitive board | substrate P, and the pattern of the mask M The position is controlled so that the surface and the exposure surface of the photosensitive substrate P are always at a predetermined interval. This detection apparatus is comprised by the multi-point focus position detection system which is one of the focal-detection systems of the injective system, for example, and this detection value, ie, the position information of the Z direction of the photosensitive board | substrate P, is controlled. It is output to the device CONT.

As shown in FIG. 1, the moving mirrors 34a and 34b are provided in the direction orthogonal to each end edge of the X direction and the Y direction on the board | substrate stage PST, respectively. The laser interferometer 35a is arrange | positioned facing the moving mirror 34a. Moreover, the laser interferometer 35b is arrange | positioned facing the moving mirror 34b. Each of these laser interferometers 35a and 35b emits laser light to the moving mirrors 34a and 34b to measure the distance between the moving mirrors 34a and 34b, thereby measuring the distance between the X and Y directions of the substrate stage PST. The position of, i.e., the position of the photosensitive substrate P can be detected with high resolution and high accuracy. The detection results of the laser interferometers 35a and 35b are output to the control device CONT. The control device CONT monitors the position of the substrate stage PST from the outputs of the laser interferometers 35a and 35b and the detection device (multi-point focus position detection system) to control the substrate stage driver PSTD, thereby controlling the substrate stage ( PST) can be moved to a desired position.

The mask stage driver MSTD and the substrate stage driver PSTD are independently controlled by the control device CONT, and the mask stage MST and the substrate stage PST are respectively controlled by the mask stage driver MSTD and the substrate stage driver. Based on each drive of PSTD), it can move independently. Then, the control device CONT controls both the driving units PSTD and MSTD while monitoring the positions of the mask stage MST and the substrate stage PST, thereby controlling the mask M and the photosensitive substrate P with the projection optical system PL. ) Is moved synchronously in the X direction at an arbitrary scanning speed (synchronous movement speed).

Here, the mask M supported by the mask stage MST and the photosensitive substrate P supported by the substrate stage PST are arrange | positioned in the conjugate position through the projection optical system PL.

Next, the visual field stop 20, the light blocking plate (first light blocking plate) 40, and the blind (second light blocking plate) 30 will be described with reference to FIGS. 4 and 5. 4 and 5 show the positional relationship between each of the visual field stop 20, the light shielding plate 40, and the blind 30, and the projection optical system PL, the mask M, and the photosensitive substrate P, respectively. It is a schematic diagram.

4, the projection optical system PLg is representatively shown, the field stop 20 is arranged in the projection optical system PLg, and has a slit-shaped opening. This field stop 20 sets the shape of the projection area | region (lighting area) 50 and 50g on the photosensitive board | substrate P, and especially the scanning direction X of the projection area | region 50 as a pattern image. Direction). The field stop 20 is arrange | positioned in the positional relationship of substantially conjugate with respect to the mask M and the photosensitive board | substrate P among the projection optical system PL.

The light shielding plate (first light shielding plate) 40 also sets the shape of the projection area on the photosensitive substrate P, and in particular, the width Ly in the non-scanning direction (Y direction) of the projection area 50 as a pattern image. To set it. The light shielding plate 40 is also provided in the projection optical system PLg, is disposed so as to overlap with the field stop 20, and is formed by the opening K formed along the field stop 20 and the light shielding plate 40. The size and shape of each of the projection regions 50g on (P) are set. In this embodiment, the projection area 50g formed by the field stop 20 and the light shielding plate 40 is set in a trapezoidal shape in plan view. Here, the light shielding plate 40 which is arrange | positioned so that it may overlap each other in the field stop 20 is also arrange | positioned with respect to the mask M and the photosensitive board | substrate P among the projection optical system PL in substantially conjugate position position relationship.

In addition, what is necessary is just to move the photosensitive board | substrate P with respect to the light shielding plate 40 relatively, and the light shielding plate 40 may be fixed or movable. In order to have more degrees of freedom, they may be moved as shown in FIGS. 4 and 5.

The light shielding plate 40 is provided with a drive device (not shown) for the light shielding plate, and the light shielding plate 40 is movable in the non-scanning direction (Y direction) based on the drive of the light shielding plate drive device. Then, by moving the light shielding plate 40 in the Y direction, for example, the width Ly in the Y direction of the projection area 50g can be arbitrarily set, whereby the size in which the projection areas 50a to 50g are aligned Arbitrarily set. Here, the light shielding plate 40 provided in the projection optical system PLg can move independently, and by setting the position in each Y direction of the light shielding plate 40, the size and shape of the projection area | region 50 are changed, respectively. It is possible to set.

As the light shielding plate 40, two large light shielding plates may be provided for the projection regions 50a to 50g. This may be, for example, a shape as indicated by reference numeral 30F in FIG. 20. The position may be provided near the photosensitive substrate P, the mask M, or the blind 30.

As shown in FIG. 2 and the like, the blind (second light shielding plate) 30 is disposed in the illumination optical system IL (lighting system module IM), and is operated in the non-scanning direction (Y direction) by the blind driver 31. It is installed to be movable. The driving of the blind driver 31 is controlled by the control device CONT, and the blind 30 moves based on the control device CONT. In this embodiment, the blind 30 is a blind 30A and an illumination module IMg installed at a position proximate to an optical path corresponding to the illumination system module IMa and the projection optical system PLa, as shown in FIG. ) And blinds 30B provided at positions close to the optical path corresponding to the projection optical system PLg. Then, the blind 30 moves in the Y direction, as shown in FIG. 5, thereby shielding a part of the opening K formed by the field stop 20 and the light shielding plate 40 (on the other hand, view in FIG. 5). Only the opening K is easily shown, and the field stop 20 and the light shielding plate 40 are not shown], and the size and shape of the projection area 50 are arbitrarily set.

The blind 30 is an inclined blind formed obliquely such that the width of the X direction at the tip portion (part corresponding to the opening K) gradually decreases toward the Y direction. And the shape of the projection area | region 50 is set by shielding exposure light EL by this inclined part. In this embodiment, the projection area (lighting area) 50 formed by the field stop 20, the light shielding plate 40, and the blind 30 is set in a trapezoidal shape (parallel quadrilateral shape).

And the blind 30 is arrange | positioned in the positional relationship of substantially conjugate with respect to the mask M and the photosensitive board | substrate P among illumination optical system IL. That is, in this embodiment, the field stop 20, the light shielding plate 40, and the blind 30 are with respect to the mask M and the photosensitive substrate P which are arranged in the conjugate position through the projection optical system PL. It is arranged almost in the position of airspace.

Here, the visual field stop 20, the light shielding plate 40, and the blind 30 need only be arranged in the positional relationship of the air space with respect to the mask M and the photosensitive board | substrate P, and, for example, in FIG. As shown, the light shielding plate (first light shielding plate) 40 may be disposed in close proximity to the blind B. FIG. Alternatively, the blind 30 may be disposed in the projection optical system PL in close proximity to the field stop 20. Alternatively, these members 20, 30, 40 may be disposed at positions close to the mask M or the photosensitive substrate P. FIG. That is, each of the field stop 20, the light shielding plate 40, and the blind 30 are exposed to light when the airspace position (see symbols A and B of FIG. 2) with respect to the mask M and the photosensitive substrate P. It may be arranged at any position on the optical path of EL). In addition, even if the blind 30 is placed in a defocused position with respect to the conjugate plane, the sum of the amounts of light becomes constant, so it may be a position shifted in the focus direction.

In addition, the light blocking plate 40 sets the width Ly in the Y direction of the projection area 50 by moving in the Y direction. The light blocking plate 40 is installed to be rotatable about the Z axis, and the light blocking plate 40 is rotated around the Z axis. Thus, as shown in FIG. 7, the shape of the projection area 50 can be changed. Similarly, the shape of the projection area 50 can also be changed by rotating the blind 30 around the Z axis.

8 is a plan view of the projection regions 50a to 50g of the projection optical systems PLa to PLg on the photosensitive substrate P. FIG. Each projection area | region 50a-50g is set to predetermined shape (trapezoidal shape in this embodiment) by the visual field stop 20 and the light shielding plate 40. FIG. Projection area | region 50a, 50c, 50e, 50g and projection area | region 50b, 50d, 50f are arrange | positioned facing the X direction. Further, the projection regions 50a to 50g are illustrated by the dashed-dotted lines between the end portions (boundary portions) of adjacent projection regions 51a and 51b, 51c and 51d, 51e and 51f, 51g and 51h, 51i and 51j, 51k and 51l. As described above, they are arranged in parallel so as to overlap each other in the Y direction to form overlapping regions (continuous portions) 52a to 52f. Then, the boundary portions of the projection regions 50a to 50g are arranged in parallel so as to overlap each other in the Y direction, so that the total sum of the widths of the projection regions in the X direction is substantially equal. By doing in this way, the exposure amount at the time of scanning exposure to the X direction becomes equal.

Thus, by providing the overlapping area | region (continuous part) 52a-52f which each of the projection area | regions 50a-50g by each projection optical system PLa-PLg overlap each other, the optical in the continuous parts 52a-52f is provided. Changes in aberrations or changes in illuminance can be smoothed. Here, the position and width of the continuous portions 52a to 52f in the Y direction can be arbitrarily set by moving the light shielding plate 40.

In addition, as shown by the dotted line in FIG. 8, one of the blinds 30, one of the blinds 30A moves in the ± Y direction to set the irradiation area with respect to the mask M, so that The size and shape of the projection area 50a can be set, and one blind 30B also moves in the ± Y direction to set the irradiation area for the mask M, so that the projection area 50g on the -Y side can be set. You can set the size and shape. In addition, one blind 30A can block the optical path corresponding to the projection area 50a and set the size and shape of the projection area 50c. The other blind 30B is the projection area 50g. It is possible to shield the light path corresponding to and set the size and shape of the projection area 50e. In this way, by moving each of the blinds 30A and 30B in the Y direction, the light path corresponding to the specific projection area can be shielded from among the plurality of projection areas, and the size and shape of the predetermined projection area can be arbitrarily set. have.

In addition, the blinds 30 can move to set the respective sizes of the boundary portions 51a, 51d, 51e, 51h, 51i and 51l of the projection area. The blind 30 moves in the non-scanning direction (Y direction) and sets the size and shape of the boundary of the projection area, whereby the overlapping areas 52a to 52f of the projection area (patterned) can be set. And since the blind 30 is formed obliquely so that the width | variety of the X direction in the front-end | tip part (part corresponding to opening K) may shrink gradually toward a Y direction, the optical path corresponding to each of the boundary parts of a projection area | region By shielding part of the light source, the accumulated exposure amount in the overlapping area can be attenuated almost continuously as it is directed toward the periphery of the projection area.

Here, in Fig. 8, the inclination angle when viewed in the plane of the boundary portions 51a, 51e, 51i of the projection area and the inclination angle at the tip of the blind 30A are set to coincide, and similarly, the boundary of the projection area The inclination angle when viewed in the plane of 51d, 51h, 51l and the inclination angle at the distal end of the blind 30B are set to coincide. In addition, the blind 30A sets the overlap region 52a or the overlap region 52c by arranging the tip portion thereof in a part of the optical path corresponding to the boundary portion 51a or the boundary portion 51e. The accumulated exposure amount in 52a) 52c is set to attenuate almost continuously toward the -Y side. The blind 30B sets the overlap region 52f or the overlap region 52d by arranging the tip portion thereof in a part of the optical path corresponding to the boundary portion 51l or the boundary portion 51h, and at the time of scanning exposure, the overlap region 52f. The cumulative exposure amount at 52d) is set to attenuate almost continuously toward the + Y side.

In this way, the projection area is divided into a plurality of parts by the field stop 20, the light shield plate 40, and the blind 30, and each size and shape are arbitrarily set. By setting the position of the blind 30, the accumulated exposure amount is attenuated almost continuously as it goes to the periphery of the irradiation area with respect to the mask M at the time of scanning exposure, and the Y direction of the overlapping areas 52a to 52f. The cumulative exposure amount of is changed almost continuously.

Referring again to FIG. 2, a detector (photodetecting device) 41 is disposed on the substrate stage PST. The detector 41 detects information about the light amount of exposure light to be irradiated to the photosensitive substrate P, and outputs the detected detection signal to the control apparatus CONT.

On the other hand, the information regarding the light amount of exposure light includes the amount of illumination light (illuminance) projected per unit area on the object surface or the amount of exposure light emitted per unit time. In this embodiment, the information regarding the light amount of this exposure light is demonstrated as illuminance.

This detector 41 is an illuminance sensor which measures the irradiation amount of exposure light of the position corresponding to each projection optical system PLa-PLg on the photosensitive board | substrate P, and is shown by (a) CCD sensor as shown to FIG. Consists of. The detector 41 can be installed at the same level as the photosensitive substrate P by the guide axis (not shown) arranged in the Y direction on the substrate stage PST, and is scanned in the scanning direction by the detector driver. It is provided so that a movement is possible in the direction orthogonal to (X direction).

This detector 41 projects each corresponding to projection optical system PLa-PLg by the movement of the X-direction of the board | substrate stage PST, and the movement of the Y direction by the illuminance sensor drive part, prior to 1 time or several times of exposure. Scanning is performed under the regions 50a to 50g. Therefore, the information regarding the light quantity of the exposure light in the projection area | region 50a-50g on each photosensitive board | substrate P, and each boundary part 51a-51l of these 50a-50g is detected by the detector 41 two-dimensionally. It is supposed to be. Information about the light amount of the exposure light detected by the detector 41 is output to the control device CONT. At this time, the control apparatus CONT is able to detect the position of the detector 41 by each drive amount of the board | substrate stage drive part PSTD and the detector drive part.                     

As illustrated in FIG. 9, a pixel pattern 44 and peripheral circuit patterns 45a and 45b positioned at both ends of the pixel pattern 44 in the pattern region of the mask M are formed. In the pixel pattern 44, a pattern in which a plurality of electrodes according to a plurality of peak cells is regularly arranged is formed. In the peripheral circuit patterns 45a and 45b, a driving circuit for driving an electrode of the pixel pattern 44 is formed.

Each projection area 50a to 50g is set to a predetermined size. In this case, as shown in Fig. 8, the length of the long side is L1, the length of the short side is L2, and the interval between adjacent projection areas is shown. (Pitch in the Y direction of the projection area) is set to L3.

In addition, the peripheral circuit patterns 45a and 45b of the mask M shown in FIG. 9 are formed in the same dimensions and the same shape as the peripheral circuit patterns 61a and 61b of the photosensitive substrate P shown in FIG. On the mask M so as to be exposed by the projection optical systems 50a and 50g at both ends. The pixel pattern 44 of the mask M has the same length in the X direction with respect to the pixel pattern 60 of the photosensitive substrate P, and has a different length in the Y direction.

Subsequently, using the exposure apparatus EX having the above-described configuration, the mask M and the photosensitive substrate P are synchronously moved with respect to the exposure light EL to perform scanning exposure, and a part of the pattern of the mask M is exposed. The method of performing continuous exposure of a pattern to the photosensitive board | substrate P by dividing | segmenting into plural scanning exposure so that it may expose overlapping is demonstrated.

Here, in the following description, the movement of the mask stage MST and the substrate stage PST shall be made based on the control of the control apparatus CONT via the mask stage driver MSTD and the substrate stage driver PSTD. .                     

In the following description, as shown in FIG. 9, the pattern formed on the mask M has a length LA in the Y direction and a part of the peripheral circuit pattern 45a and the pixel pattern 44. Divided into two regions of the divided pattern 46 including the divided pattern 46 having a length LB in the Y direction and including a portion of the peripheral circuit pattern 45b and the pixel pattern 44. A part of each of the divided patterns 46 and 47 is divided into two scanning exposures so as to overlap the exposure, and pattern synthesis is performed on the photosensitive substrate P. FIG. As shown in FIG. 10, the entire exposure pattern on the photosensitive substrate P has a length LA in the Y direction by two scanning exposures, and the peripheral circuit pattern 61a and the pixel pattern 60 are separated from each other. A division pattern (exposure region) 62 including a part and a division pattern (exposure region) 63 having a length LB in the Y direction and including a portion of the peripheral circuit pattern 61b and the pixel pattern 60. Assume that the division pattern divided into two areas of () is synthesize | combined.

Here, the length LA is an intersection point between the end point of the short side of the projection area 50a in the + Y direction and the blind 30B disposed on the short side of the projection area 50e and the optical path corresponding to the projection area 50e. It is the distance in the Y direction. The length LB is the intersection of the short side of the projection area 50c and the blind 30A disposed on the optical path corresponding to the projection area 50c, and the end point in the −Y direction of the short side of the projection area 50g. It is the distance in the Y direction.

In addition, it is assumed that the divided pattern 62 and the divided pattern 63 overlap each other in the overlapping region (continuous portion) 64 on the photosensitive substrate P. As shown in FIG. The length LK in the Y direction of the overlapped region 64 is set to be the same distance as the overlapped regions 52a to 52f of the projection areas 50a to 50g.                     

And the length LK which is the distance of the Y direction of the overlapping area 64 is set by the position in the Y direction of the blind 30B, and the projection area | region 50e, as shown in FIG. The integration exposure amount coincides with the distance in the Y direction of the continuous portion 48 which attenuates almost continuously as the + Y side of 50e is directed. Similarly, the length LK is set by the position in the Y direction of the blind 30A and the projection area 50c, and the continuous exposure amount of the integrated exposure is almost continuously attenuated toward the -Y side of the projection area 50c. It corresponds to the distance of the part 49 in the Y direction. That is, the shape (inclined angle) of each of the front end portions of the blinds 30A and 30B is set so that the distances in the Y direction of the continuous portion 48 and the continuous portion 49 coincide with each other.

On the other hand, when detecting the position of each tip portion of the blinds 30A and 30B, the sensor is moved by using a sensor as shown in Figs. 24B and 24C and the light amount is half (about 50%). A position may be detected and aligned.

In the mask M, the positions at which the continuous portions 48 and 49 are to be formed by the blind 30, that is, the regions to be subjected to continuous exposure are set in advance, and the continuous portions 48 and 49 are to be set. The alignment marks 60 (60A, 60B) are formed in order to align the position of the blind 30 in the vicinity of the pattern of the mask M, which corresponds to the position (region for continuous exposure).

Hereinafter, with reference to FIG. 11, an exposure procedure is demonstrated. In this embodiment, the continuous portions 48 and 49 of the dividing patterns 46 and 47 of the mask M are joined to each other in a photosensitive substrate (glass substrate) P to be combined to form a continuous pattern region of the mask M ( It is assumed that a liquid crystal device larger than 45a, 44, 45b) is manufactured.                     

First, the control apparatus CONT instructs to start the continuous exposure of the division pattern (step S1).

Here, in the control apparatus CONT, the information regarding the arrangement position of the pattern of the mask M with respect to the photosensitive board | substrate P, and the information about the joining position of the pattern in the mask M are previously set as a recipe. . That is, the position where each of the division patterns 46 and 47 of the mask M are to be exposed on the photosensitive substrate P is set in advance, and the positions where the continuous portions 48 and 49 are to be provided on the mask M. FIG. Is also set in advance.

The control device CONT starts the calibration of the device when the actual exposure process is performed.

First, the control device CONT drives the field stop 20 and the light shielding plate 40, and simultaneously drives the mask stage MST, and irradiates the exposure light EX in accordance with the pattern of the mask M. FIG. Set. In addition, the control apparatus CONT adjusts the size and shape of the opening K by using the field stop 20 and the light shielding plate 40 provided in each of the projection optical systems PLa to PLg, and the photosensitive substrate P The width of the scanning direction (X direction) and the width of the non-scanning direction (Y direction) of the projection areas 50a to 50g projected on the upper surface are set.

And the control apparatus CONT sets the blind position at the time of performing continuous exposure based on the information regarding the exposure process preset as a recipe.

Here, in this embodiment, in the first scanning exposure as shown in Fig. 10, the blind 30B is arranged to shield a part of the projection area 50e, and the blind 30A is set to retreat on the optical path. . On the other hand, in the second scanning exposure, the blind 30A is arranged to shield a part of the projection area 50c, and the blind 30B is set to retreat on the optical path.

The control apparatus CONT sets the position of the blind 30B at the time of performing 1st scanning exposure (step S2).

That is, the control apparatus CONT is the pattern of the mask M provided in the continuous part 48 located in one side of the irradiation area | region (namely, the division pattern 46) of the exposure light EL with respect to the mask M. FIG. With respect to the position of the blind 30B for continuous exposure.

Specifically, the control apparatus CONT matches the position of the front end of the blind 30B with the alignment mark 60B provided on the mask M corresponding to the continuous part (redundant area | region) 48. When the alignment mark 60B of the mask M and the position of the blind 30B are aligned, as shown in the schematic diagram of FIG. 12, alignment light is emitted from the alignment light emitting part 70 provided in the substrate stage PST. It ejects and irradiates the alignment mark 60B of the mask M through the projection optical system PL. The alignment light irradiated to the alignment mark 60B of the mask M passes through the mask M, passes through the vicinity of the tip end portion of the blind 30B, and is received by the alignment light receiving unit 71. Here, by moving the blind 30B in the Y direction while irradiating the alignment mark 60B with the alignment mark, the alignment light received by the light receiving portion 71 is shielded by the blind 30B, for example, the amount of light is 50%. Condition occurs. The detection signal of the light receiving unit 71 at this time is output to the control device CONT, and the control device CONT is blind when the light receiving unit 71 is changed to a state in which the light receiving unit 71 is not receiving light ( It is determined that the position of the blind 30B is aligned with the alignment mark 60B at the position of 30B. The blind 30B is also aligned with respect to the continuous portion 48 by positioning the alignment mark 60B.

Here, alignment mark 60B is formed in two places of -X side edge part and + X side edge part of mask M. As shown in FIG. Then, the alignment of each of the two alignment marks 60B and the blind 30B is performed in advance, and the exposure is performed by scanning exposure while setting the position of the blind 30B based on these position information. By this, the desired continuous section 48 can be set.

If the positions of the blind 30B and the mask alignment mark 60B are aligned in the manner as described above, the control device CONT is at the position of the blind 30B and the mask stage MST (mask M) at this time. The related information is stored in a storage device (not shown) (step S3).

Next, the control apparatus CONT sets the position of the blind 30A at the time of performing a 2nd time scanning exposure (step S4).

That is, the control apparatus CONT is the pattern of the mask M provided in the continuous part 49 located in one side of the irradiation area | region (namely, the division pattern 47) of the exposure light EL with respect to the mask M. FIG. With respect to the position of the blind 30A for continuous exposure.

Specifically, the control apparatus CONT matches the position of the front end of the blind 30A with the alignment mark 60A formed on the mask M corresponding to the continuous part (redundant area) 49. Aligning the position of the alignment mark 60A of the mask M and the blind 30A can be performed in the same procedure as the method demonstrated using FIG. The blind 30A is also aligned with respect to the continuous portion 49 by positioning the alignment mark 60A.                     

Here, alignment mark 60A is also formed in two places of -X side edge part and + X side edge part of mask M. FIG. Then, by placing each of these two alignment marks 60A and the position of the blind 30A in advance and scanning exposure while setting the position of the blind 30A based on these position information, the blind 30A The desired continuous section 49 can be set.

As described above, when the position of the blind 30A and the mask alignment mark 60A are aligned, the control device CONT at this time has information about the position of the blind 30A and the mask stage MST (mask M). Is stored in a storage device (not shown) (step S5).

Subsequently, illuminance calibration and position detection of each projection area | region 50a-50g are performed.

First, exposure operation | movement is performed with respect to the area | region corresponding to the division | segmentation pattern 62 (part of length LA) on the photosensitive board | substrate P, in the state which does not mount the photosensitive board | substrate P to the board | substrate stage PST. Start (step S6).

Specifically, first, the control apparatus CONT drives the filter drive part 14 to move the filter 13 so that the light beam from the light source 1 may permeate the filter 13 at the maximum transmittance. When the filter 13 moves, the light beam is irradiated from the light source 1 through the ellipsoidal mirror 1a. The irradiated light beam passes through the filter 13, the half mirror 11, the mask M, the projection optical systems PLa to PLg, and then reaches the substrate stage PST. At this time, the mask M is moved so that it may become a position where a pattern etc. are not formed in the irradiation area of exposure light EL.                     

Here, each of the projection areas 50a to 50g is set by the field stop 20 and the light shielding plate 40, and the blind 30B is retracted from the optical path.

At the same time, the detector 41 is moved in the X direction and the Y direction in the region corresponding to the dividing pattern 62 and scanned in the projection regions 50a to 50g corresponding to the projection optical systems PLa to PLg. The detector 41 which scans measures the illumination intensity in each projection area | region 50a-50g, and the illumination intensity Wa-Wl in the boundary parts 51a-51l sequentially (step S7).

The detection signal of the detector 41 is output to the control apparatus CONT. The control apparatus CONT performs image processing based on the detection signal from the detector 41, and detects the shape and roughness of each projection area | region 50a-50g and the boundary parts 51a-51l. The control device CONT stores the illuminance Wa to W1 of the boundary portions 51a to 51l in the storage device.

Subsequently, based on the illuminance Wa to Wl of the boundary portions 51a to 51l measured by the detector 41, the illuminances Wa to Wl are approximately predetermined values, and (| Wa-Wb |, | Wc). Each illumination system module IMa to IMg while measuring the illuminance by the detector 41 so that -Wd |, | We-Wf |, | Wg-Wh |, | Wi-Wj |, | Wk-Wl | The filter 13 is driven each time (step S8).

As a result, the light amount of the light beam is corrected for each optical path.

At this time, a part of the light beam irradiated from the light source 1 is incident on the detector 12 by the half mirror 11, and the detector 12 measures the illuminance of the incident light beam and detects it. The signal is output to the control device CONT. Therefore, the control apparatus CONT may adjust the light quantity for each optical path by controlling the filter drive part 14 so that this illumination intensity may become a predetermined value based on the illumination intensity of the light beam which the detector 12 detected.                     

The control apparatus CONT calculates the position of each boundary part 51a-51l based on the information regarding the light quantity of the exposure light detected by the detector 41 which scans (step S9).

That is, based on the detection signal of the detector 41 to scan, the control apparatus CONT obtains the shape of each boundary part 51a-51l with respect to a predetermined | prescribed coordinate system, and based on this calculated | required shape, with respect to the predetermined | prescribed coordinate system The position of each boundary part 51a-51l is calculated | required. Specifically, the predetermined predetermined positions, such as the tip position and the figure center position, are obtained from the triangular boundary portions 51a to 51l.

At this time, the position of the detector 41 can be calculated | required based on the drive amount of each drive part with respect to a reference position. That is, the initial position (standby position) etc. of the detector 41 can be set to a reference position, and the position of the detector 41 which scans with respect to this reference position can be calculated | required. The control apparatus CONT calculates the position with respect to the reference position of each boundary part 51a-51l based on the position of the detector 41 with respect to a reference position.

And the control apparatus CONT memorize | stores the position with respect to the predetermined | prescribed coordinate system of the boundary parts 51a-51l in a memory | storage device. At this time, the relative positions of the respective projection areas 50a to 50g (boundary parts 51a to 511) are also stored.

When light quantity adjustment and position detection of each projection area | region 50a-50g are performed in the state which retracted the blind 30B from the optical path, the control apparatus CONT makes blind 30B in step S2 based on the information of a memory | storage device. It arrange | positions in a set position and performs exposure operation in this state. And the control apparatus CONT detects the illuminance of the small area KB of the projection area | region 50e corresponding to the continuous part 48 with the detector 41 (step S10).                     

The small area KB is attenuated almost continuously by the blind 30B in the overlap region 64 on the photosensitive substrate P as it is directed in the -Y direction.

The detection signal of the detector 41 is output to the control apparatus CONT, and the control apparatus CONT performs image processing based on the detection signal from the detector 41, and detects the shape and illuminance of the small area KB. do. The control device CONT stores the shape and roughness Wkb of this small area KB in the storage device. In addition, the control apparatus CONT calculates the position and shape of the small area KB based on the information on the amount of exposure light detected by the detector 41. The position of the small area KB is a predetermined predetermined position such as, for example, a tip position and a figure center position among the triangular small areas KB.

When the illuminance, the position, and the shape of the small area KB are obtained, the control device CONT retreats the blind 30B from the optical path, and at the same time, arranges the blind 30A at the position set in step S4 and exposes it in this state. Perform the operation. And the control apparatus CONT detects the illuminance of the small area KA of the projection area | region 50c corresponding to the continuous part 49 with the detector 41 (step S11).

Here, the small area | region KA is attenuated by the blind 30A in the + Y direction, and the accumulated exposure amount in the overlapping area | region 64 on the photosensitive board | substrate P is substantially continuous.

The detection signal of the detector 41 is output to the control apparatus CONT, and the control apparatus CONT performs image processing based on the detection signal from the detector 41, and detects the shape and illuminance of the small area KA. do. And the control apparatus CONT memorize | stores the shape and illumination intensity Wka of this small area | region KA in a memory | storage device. In addition, the control apparatus CONT calculates the position and shape of the small area KA based on the information on the amount of exposure light detected by the detector 41. The position of the small area | region KA is a predetermined predetermined position among the small area | region KA of a triangular shape, for example, a tip position and a figure center position.

The control device CONT is based on the illuminance Wkb of the small area KB obtained in step S10 and the illuminance Wka of the small area KA obtained in step S1, and thus the illuminance Wka and the illuminance Wkb. (Wa-Wb |, | Wc-Wd |, | We-Wf |, | Wg-Wh |, | Wi-Wj |, | Wk-Wl |, | Wka-Wkb |) The filter 13 is driven to each of the illumination system modules IMc and IMe while the illuminance is measured by the detector 41 so that the minimum is (step S12).

That is, while adjusting the light amount in the continuous part, the exposure amount in another projection area is readjusted according to the light amount detection result in this continuous part.

Moreover, the control apparatus CONT corrects the shape of each of these small areas KA and KB based on the shape detection result of the small area KA and the small area KB detected in steps S10 and S11 ( Step S13).

For example, when the shape of the small area | region KA detected later does not have a desired shape with respect to the shape of the small area | region KB detected earlier, when it does not overlap uniformly by scanning exposure, for example, In the case where the width LK of the overlapping area 64 formed by the small areas KA and KB is significantly different from the width of each of the projection areas 52a to 52f, the projection area 50e or the projection area 50c may be used. The image shift mechanism 19, the magnification adjusting mechanism 23, and the right angle prisms 24 and 27 of the projection optical system PLe or projection optical system PLc corresponding to the image characteristics such as shift, scaling and rotation. Correct (lens calibration).

In addition, in the control apparatus CONT, each shape of the projection area | regions 50a-50g does not have a predetermined shape, or the width | variety of the overlapping area | regions 52a-52f of adjacent projection area | regions 50a-50g is scanning exposure. Also in the case where it is changed by this, the image characteristic can be correct | amended by driving the image shift mechanism 19, the magnification adjustment mechanism 23, and the right angle prism 24, 27 of each projection optical system PLa-PLg. The control device CONT stores these correction values in the storage device.

In the manner as described above, when the calibration (illumination calibration, lens calibration) of the projection areas 50a to 50g including the continuous portion is performed, the control apparatus CONT exposes the mask M so as to actually perform the exposure process. It arrange | positions on the optical path of EL, and arrange | positions the photosensitive board | substrate P to the board | substrate holder PH of the board | substrate stage PST via the loader which is not shown in figure (step S14).

In order to perform the first scanning exposure, the control apparatus CONT uses the field stop 20 and the light shielding plate 40 in the scanning direction and the non-scanning direction based on the set value or the correction value set in each calibration step. While setting the projection area having a predetermined width, the mask stage MST is driven to set the irradiation area for irradiating the exposure light EX in accordance with the pattern of the mask M. FIG. The position of the mask stage MST is controlled so that the exposure light EL is irradiated to the divided pattern 46 used in at least the first scanning exposure in the pattern region of the mask M, and at the same time, FIG. 12 is used. As described above, the blind 30B shields a part of the projection area 50e while shielding the optical path corresponding to the projection area 50g by using the alignment mark 60B formed on the mask M. FIG. The position of the blind 30B is adjusted (step S15).

Moreover, the position of the photosensitive board | substrate P arrange | positioned on the board | substrate stage PST and the mask M is aligned using the alignment mark 60B of the mask M (step S16).

Here, in the photosensitive board | substrate P, the board | substrate alignment mark 72 is previously formed in the pattern area vicinity corresponding to the area | region which performs continuous exposure, ie, the overlapping area | region 64 of the photosensitive board | substrate P. As shown in FIG. The control apparatus CONT is made of the alignment mark 60B of the mask M arrange | positioned at the mask stage MST, and the alignment mark 72 of the photosensitive board | substrate P arrange | positioned and arrange | positioned at the substrate stage PST. By aligning, the position of the dividing pattern 46 of the mask M is exposed to the exposure area 62 of the photosensitive board | substrate P, and is exposed.

In addition, when aligning the position of the alignment mark 60B of the mask M and the alignment mark 72 of the photosensitive board | substrate P, as shown in the schematic diagram of FIG. 13, it is located on the upper side of the mask M, for example. Alignment light is irradiated to the mask alignment mark 60B from the light emission part 75 provided. The alignment light irradiated to the alignment mark 60B passes through the mask M, and is irradiated to the substrate alignment mark 72 of the photosensitive substrate P through the projection optical system PL. Then, the reflected light reflected by the substrate alignment mark 72 is detected by the light receiving portion 76 provided above the mask M through the projection optical system PL and the alignment mark 60B of the mask M, and the mask alignment is performed. When the position of the substrate stage PST is adjusted so that the mask alignment mark 60B and the substrate alignment mark 72 coincide with each other based on the reflected light in the mark 60B and the reflection light in the substrate alignment mark 72. do.

In addition, since the photosensitive board | substrate P is a glass substrate, the light receiving part 76 'is provided in the board | substrate stage side, for example, without detecting the reflected light in a board | substrate alignment mark, and passed through the mask alignment mark 60B. The position of the mask M and the photosensitive substrate P may be aligned based on the light and the light passing through the substrate alignment mark 72.

Here, the substrate alignment mark 72 is formed in two places of the -X side end part and the + X side end part of the photosensitive board | substrate P similarly to the mask alignment mark 60B. Then, the positions of each of the mask alignment marks 60B on the + X side and the -X side and the substrate marks 72 on the + X side and the -X side are previously aligned, and scanning is performed based on these positional information. Exposure precision can be improved by performing exposure.

In this way, when the position of the mask M and the photosensitive substrate P is aligned, and the position of the mask M and the blind 30B are aligned, the control apparatus CONT performs the first scanning exposure process with respect to the photosensitive substrate P. FIG. (Step S17).

First, the part corresponding to the division pattern 62 (length LA part) is exposed. In this case, the illumination shutter 6 of the illumination system module IMf corresponding to the projection optical system PLf is inserted into the optical path by the driving of the shutter driver 6a, and as shown in FIG. 10, the projection area 50f. It shields the illumination light of the optical path corresponding to this. At this time, the illumination shutters 6 of the illumination system modules IMa to IMe and IMg open the respective optical paths. And blind 30B shields a part of projection area | region 50e, and light-shields the optical path corresponding to projection area | region 50g. The blind 30B forms a small region KB having photosensitive characteristics in the Y direction in the projection region 50e, and the peripheral circuit 61a and a part of the pixel pattern 60 with respect to the photosensitive substrate P are formed. The exposure area | region of Y direction length LA containing is set.

Then, the mask M and the photosensitive substrate P move in synchronization with the X direction, and the first scanning exposure is performed. Accordingly, as shown in FIG. 10, the division pattern 62 set by the projection regions 50a, 50b, 50c, 50d and a part of the projection region 50e is exposed on the photosensitive substrate P. As shown in FIG. And based on the small area | region KB set by the blind 30B, the overlap area | region 64 formed in the one side of the division pattern (exposure area | region) 62 at the side of-Y is this division pattern 62 The exposure dose is attenuated almost continuously as it is directed toward the-Y side of c).

Next, in order to perform a 2nd scan exposure, the position with respect to the predetermined position of the substrate stage PST is adjusted (step S18).

Specifically, the substrate stage PST is moved stepwise by a predetermined distance in the + Y direction, and the position of the substrate stage PST is finely adjusted.

The alignment of the substrate stage PST for performing the second scanning exposure is performed by the mask alignment mark 60A formed corresponding to the continuous portion 49 in the mask M, and the overlapping region in the photosensitive substrate P. FIG. This is achieved by aligning the position of the substrate alignment mark 72 formed corresponding to 64. The control apparatus CONT irradiates the alignment light with respect to the mask alignment mark 60A from the light emitting portion 75 in the same manner as described with reference to FIG. 13, and arranges the substrate of the photosensitive substrate P through the projection optical system PL. The substrate stage PST is positioned so that the mask alignment mark 60A and the substrate alignment mark 72 coincide with each other based on the reflected light of the alignment light irradiated onto the mark 72 and the reflected light in the mask alignment mark 60A. Adjust

Thus, by using the mask alignment mark 60 formed in the mask M and the substrate alignment mark 72 formed in the photosensitive board | substrate P, the position of a continuous part at the time of continuous exposure is matched, The positioning accuracy of a continuous part can be improved.

When the mask M and the photosensitive substrate P are aligned, the control device CONT retracts the blind 30B from the optical path of the exposure light EL, and moves the blind 30A in the Y direction to project it. A part of the area 50c is shielded and a light path corresponding to the projection area 50a is shielded (step S19).

The alignment of the blinds 30A with respect to the mask M at this time is made by using the mask alignment marks 60A as described with reference to FIG. 12, and the blinds 30A with respect to the mask alignment marks 60A. Is aligned. The blind 30A positioned at a predetermined position forms a small area KA having a photosensitive characteristic in the Y direction on a part of the projection area 50c. In addition, the illumination shutter 6 of the illumination system module IMb corresponding to the projection optical system PLb is inserted into the optical path by the driving of the shutter driver 6a, and as shown in FIG. 10, in the projection area 50b. The illumination light of the corresponding optical path is shielded. At this time, the illumination shutters 6 of the illumination system modules IMa and IMc to IMg open the respective optical paths. The blind 30A shields a part of the projection area 50c, and shields the optical path corresponding to the projection area 50a, and the peripheral circuit 61b and the pixel pattern 60 with respect to the photosensitive substrate P. An exposure area of the Y-direction length LB including a part of is set.

In this way, the control apparatus CONT has the small area | region projected and exposed by the 2nd scanning exposure to the overlapping area 64 (continuous part 48) based on the small area KB projected and exposed by the 1st scanning exposure ( The substrate stage PST is moved in the + Y direction so that the continuous portions 49 based on KA are overlapped with each other so as to be positioned.

Here, when the step movement for performing the second scanning exposure or when the blind 30A is arranged on the optical path, the control device CONT is based on the respective set values and correction values stored in the storage device at the time of calibration, Correction of the image characteristic with respect to the photosensitive board | substrate P and fine adjustment of the blind 30B are possible. That is, the image characteristics (shift, scaling, rotation) can be adjusted so that the overlapped region 64 based on the small area KA and the overlapped region 64 based on the small area KB coincide with each other.

In addition, the position of the substrate stage PST can be adjusted so that the irradiation amount of each exposure light between the overlapped region 64 of the pattern and a portion other than the overlapped region is substantially coincident. That is, the shape and amount of light of each of the small areas KA and KB are detected and adjusted in advance in steps S10 to S13, and the control device CONT stores the shape of each of the small areas KA and KB stored or Based on the amount of light, the position of the substrate stage PST is finely adjusted so that the illuminance of each of the overlapping region 64 and the overlapping region other than the overlapping region (that is, the regions 62 and 63) is approximately coincident. Specifically, the irradiation amount of the exposure light of the overlap region 64 based on each of the small region KB by the first scanning exposure and the small region KA by the second scanning exposure is shown in FIGS. In the illuminance distribution as shown in Fig. 14B, for example, as shown in Fig. 14A, by the small area KB of the first scanning exposure and the second scanning exposure, When the total irradiation amount of the exposure light of the overlapping region 64 based on the small area KA is lower than the irradiation amount of the exposure light other than the overlapping region 64, the position of the substrate stage PST is adjusted to increase the overlapping range. As shown in Fig. 14B, the irradiation amounts of the exposure light are approximately coincident at all positions (step S20).

In addition, the blind 30 may be driven so that the irradiation amount of the exposure light in the overlapping region 64 and the irradiation amount of the exposure light in the portion other than the overlapping region 64 may be approximately equal, and the irradiation amount of the exposure light in the overlapping region 64 may be adjusted. . Thereby, the light quantity of the luminous flux of each optical path can be correct | amended.

In addition, since the desired position with respect to a reference | standard position at the time of a calibration is arrange | positioned on the optical path of 30 A of blinds at the time of a 2nd scanning exposure, the blind 30A is moved based on this setting value. You may.

The step movement of the substrate stage PST during the second scanning exposure may be performed without using the substrate alignment mark 72 and the mask alignment mark 60A. In this case, step movement of the board | substrate stage PST may be calculated | required in advance at the time of calibration, and may be step shifted based on this calculated information. Moreover, you may perform based on the position of each small area | region KA and KB calculated | required at the time of calibration. That is, the position of the overlapping area 64 (continuous part 48) with respect to the reference position projected and exposed in the first scanning exposure is obtained, and the continuous part 49 projected and exposed subsequently to the overlapping area 64. What is necessary is just to set the position of the board | substrate stage PST so that may become a predetermined positional relationship.                     

Then, the mask M and the photosensitive substrate P are synchronously moved in the X direction to perform the second scanning exposure (step S21).

Accordingly, as shown in FIG. 10, the division pattern 63 set by part of the projection area 50c, 50d, 50e, 50f and 50g is exposed on the photosensitive substrate P. As shown in FIG. Then, by scanning exposure by the small area KA set by the blind 30A, the overlapped area 64 formed on one side of the + Y side of the divided pattern (exposure area) 63 is divided into this divided pattern 63. The exposure amount has a light amount distribution that is substantially attenuated toward the + Y side of, and overlaps with the overlapping region 64 formed during the first scanning exposure, thereby obtaining a predetermined compound exposure amount.

In this manner, by using one mask M, continuous exposure to the photosensitive substrate P larger than the mask M is completed (step 22).

As described above, the continuous portion of the pattern in the mask M is disposed by arranging the blind 30 movable in the Y direction with respect to the pattern image (projection area) set by the field stop 20 and the light shielding plate 40. (Split position) 48, 49 can be set arbitrarily. Therefore, the magnitude | size of the pattern formed in the photosensitive board | substrate P can be arbitrarily set, and arbitrary devices can be manufactured efficiently.

In addition, the blind 30 is provided to be movable in the non-scanning direction, and the photosensitive which attenuates the accumulated exposure amount almost continuously in the continuous part (redundant area) of the pattern as it goes to the periphery of the irradiation area of the illumination optical system IL. Since it has a characteristic, the exposure amount in a continuous part can be set to a desired value, and the exposure amount of the overlap area | region 64 and parts other than the overlap area | region 64 can be made to match. Therefore, the exposure process can be performed with high accuracy.

Moreover, the size and shape of the projection area | region 50a-50g of exposure light EL with respect to the photosensitive board | substrate P by making each of the light shielding plate 40 and the blind 30 moveable with respect to the visual field stop 20 is carried out. Can be arbitrarily set, it is possible to realize the improvement of the matching accuracy and the uniformity of the exposure amount during continuous exposure.

By forming a multi-lens scanning type exposure apparatus in which the projection area is divided into a plurality of 50a to 50g by the field stop 20, the light shielding plate 40, and the blind 30, and the exposures are connected one after another, the device is maintained while maintaining good imaging characteristics. It is possible to form a large pattern without increasing the size. The projection optical system PL is composed of a plurality of projection optical systems PLa to PLg arranged in a direction orthogonal to the scanning direction, and the optical paths of the predetermined optical systems PLa to PLg in the plurality of optical systems PLa to PLg. By shielding light, the projection area can be easily adjusted for each scanning exposure. In addition, a uniform pattern can be formed with respect to the large sized photosensitive board | substrate P, without using the large size mask M when joining the division | segmentation patterns 62 and 63 together. Therefore, it is possible to prevent the size of the apparatus and the increase in cost.

Since the shape of the projection area | region 50a-50g divided into several pieces is trapezoidal shape, when performing continuous exposure, the exposure amount of a continuous part and parts other than a continuous part can be easily matched.

On the mask M, it corresponds to the continuous parts 48 and 49 which are areas which perform continuous exposure, and arrange | positions the alignment marks 60A and 60B for aligning with the blind 30, and utilizes this alignment mark. In this way, the position of the blind 30 can be precisely aligned. Therefore, the overlapped region 64 can be exposed at a desired exposure amount.

Moreover, since it corresponds to the area | region 64 which performs continuous exposure also to the photosensitive board | substrate P, and provided the board | substrate alignment mark 72 for aligning with the mask alignment mark 60A, 60B, the mask M and the photosensitive member are provided. The alignment marks 60A, 60B, 72 can be used to move the substrate stage PST stepwise to perform a plurality of scanning exposures by adjusting the position of the substrate P with high accuracy. Since the position needs to be aligned, the positioning accuracy is improved.

In this embodiment, the illuminance is measured and corrected so that the illuminances of the boundary portions 51a to 51l overlapping the projection areas 50a to 50g are approximately the same, and the illuminance at the continuous portions 52a to 52f is also uniform. I can do it. And the position of the blind 30 and the light shielding plate 40 in the Y direction can be changed, and the illumination intensity in the overlapping area | region 64 in the division patterns 62 and 63 can also be made the same as the illumination intensity of another area | region, The whole pattern can be exposed with a uniform exposure amount, and the pattern line width can be made uniform over the entire pattern. For this reason, the quality of the liquid crystal device after exposure improves.

In addition, although the length LK of the Y direction of the overlapping area | region 64 is set to the same distance as the overlapping areas 52a-52f of the projection area | regions 50a-50g in FIG. 9 and FIG. 10, it is a blind which is a diagonal blind. By changing the inclination angles of the tip portions of the 30A and 30B, the length in the Y direction of the overlapping region 64 between the divided patterns 62 and 63 and the overlapping regions 52a to 52f between the projection regions 50a to 50g. May be set differently in the Y direction.                     

In addition, in this embodiment, when the division pattern 62 and the division pattern 63 are joined together, in the first scanning exposure, a part of the projection area 50e is shielded from the blind 30B so that a small area KB is obtained. ), And in the second scanning exposure, a part of the projection area 50c is blocked by the blind 30A to form a small area KA, and these small areas KA and KB are overlapped with each other. The projection area | region which forms small area | region KA and KB may be any of projection area | regions 50a-50g. That is, in a plurality of scanning exposures, small regions having photosensitive characteristics in the Y direction can be formed in arbitrary projection regions, and they can overlap each other. In addition, light shielding of the optical path by the illumination shutter 6 can be performed with respect to arbitrary optical paths.

In this embodiment, the blind 30B is used for the first scanning exposure and the blind 30A is used for the second scanning exposure. However, as shown in FIG. 15, the blind (for the first scanning exposure) is blind ( 30B) may be used to shield the optical path corresponding to the predetermined projection area using the illumination shutter 6 without using blinds for the second scanning exposure. In FIG. 15, the optical path corresponding to the projection area 50f is shielded by the illumination shutter 6 in the first scanning exposure, and corresponds to the projection areas 50a and 50b in the second scanning exposure. The optical path is shielded by the illumination shutter 6.

In the above embodiment, the plurality of parallel optical paths is set to seven locations, and the illumination system modules IMa to IMg and the projection optical systems PLa to PLg are provided correspondingly. However, the illumination path module is set to one location. And a projection optical system one by one. That is, the present invention can be applied to an exposure method and an exposure apparatus in which continuous exposure is performed by dividing a plurality of scanning exposures so that a part of the pattern on the mask is overlapped.

In addition, the optical path in parallel is not limited to seven places, For example, the structure made into six or less places and eight or more places may be sufficient.

In the above embodiment, although there is only one detector 41 provided for detecting information on the amount of light of the exposure light in the projection area, it is also possible to provide a configuration in which a plurality of detectors that know a position relative to the reference position are provided in advance. And it is possible to set it as the structure which detects the illumination intensity Wa-W1 in each boundary part 51a-51l simultaneously using these detectors provided in multiple numbers. In this case, roughness measurement of each projection area | region 50a-50g and boundary parts 51a-51l and position detection of boundary parts 51a-51l can be performed at high speed, and workability improves.

In the above embodiment, when the calibration is performed, the illuminance detection is performed by the detector 41, and the calibration is performed based on the detection result. However, the pattern is formed by actually performing exposure processing on the test photosensitive substrate at the time of calibration. The shape may be measured, and calibration may be performed based on the measurement result.

In the above embodiment, the alignment of the photosensitive substrate P after the step movement for performing the second scanning exposure after the completion of the first scanning exposure is performed by the mask alignment mark 60 formed on the mask M. FIG. And the substrate alignment mark 72 formed on the photosensitive substrate P, the step movement distance may be set in advance at the time of calibration, and may be moved step by step based on the set result. .

In addition, although a liquid crystal device (semiconductor device) is formed by laminating | stacking a some material layer, when the exposure process is performed after the 2nd layer, for example, the photosensitive board | substrate P may deform | transform by the development process or each heat processing. have. In this case, the correction value (offset value) may be calculated by calculating the change amount of the phase characteristic such as the scaling of the photosensitive substrate P at the time of calibration, and moving step by step based on this correction value. Also in this case, as described above, the projection area is set by driving the position of the blind 30 or the light shielding plate 40 in accordance with the change of each image characteristic such as rotation and shift, and the continuous exposure is controlled. can do.

In addition, although there is only one light source 1 in the said embodiment, not one light source 1 but each light path is provided, or a plurality of light sources are provided, and a plurality of light sources (or one) is provided using a light guide or the like. The light flux from the light beams may be combined into one, and the light may be distributed to each optical path. In this case, the adverse effect due to the fluctuation of the light amount of the light source can be eliminated, and even when one of the light sources is turned off, the total light amount only decreases, and the exposed device can be prevented from becoming unusable. When a plurality of light sources 1 are provided to synthesize and distribute light beams, the irradiation amount of the irradiated light to be irradiated is adjusted to a desired irradiation amount by inserting a filter that changes the amount of transmitted light, such as an ND filter, into the optical path, thereby adjusting each projection area. You may control the irradiation amount of exposure light in (50a-50g).

In addition, although the shape of the projection area | regions 50a-50g is trapezoidal in the said Example, it may be a hexagon, a ridge, or a parallelogram. On the other hand, by making it trapezoidal, continuous exposure can be performed easily and stably.

In the said embodiment, although the screen was synthesize | combined on the photosensitive board | substrate P by two scanning exposures, it is not limited to this, For example, on the photosensitive board | substrate P by three or more scanning exposures, for example. The configuration may be of a method of synthesizing the screens.

In the above embodiment, the projection optical system PL is divided into a plurality of PLa to PLg, but as can be easily seen from FIG. 6, the field stop 20 and the first light shielding plate 40 are described. It is also applicable to an exposure apparatus having a projection optical system PL of a single lens having a rectangular slit formed of a single lens, or to an exposure apparatus having an exposure region of circular arc slits instead of a rectangle, and the second light shielding plate 30 is exposed to an exposure region. By moving relative to, it is possible to continue at any position.

FIG. 16 shows an example in which a pattern is divided into three divided patterns Pa, Pb, and Pc by three scanning exposures, and synthesized. In addition, the some projection area | region 50 shown in FIG. 16 is a form arrange | positioned in line rather than a zigzag form. The continuous portion 80a is formed using the blind 30B to expose the pattern Pa, and the continuous portions 80b and 80c are formed using the blinds 30A and 30B to expose the pattern Pb. Is formed, and the continuous portion 80d is formed using the blind 30A to expose the pattern Pc. Here, a periodic pattern 81 as a circuit pattern having a specific shape period is formed around the mask M pattern. The alignment marks 60A, 60B for aligning the positions of the mask M and the blinds 30A, 30B are formed at positions corresponding to the respective boundary portions of the periodic pattern 81. In the case of continuously exposing such a periodic pattern 81, since the continuous part is conventionally set along each projection area, since the position of the continuous part cannot be arbitrarily set, it is difficult to continuously expose the periodic pattern 81 in the present invention. Since the position of the continuous portion can be arbitrarily set by the blind 30 movable in the Y direction, the number of the wirings (pitch) arranged in each of the plurality of periodic patterns 81a to 81h formed on the photosensitive substrate P. Can be matched, and continuous exposure can be performed with high precision.

In the above embodiment, the blind 30 is an inclined blind formed obliquely such that the width of the X direction at the end thereof is gradually reduced toward the Y direction, but by scanning, the accumulated exposure amount in the Y direction in the overlapping region is almost continuous. Since it is sufficient to attenuate, as shown in FIG. 17, for example, it may be a several sawtooth shape formed obliquely so that the width | variety of the X direction may shrink gradually toward a Y direction. In this case, the formation range in the Y direction of the toothed portion is the length LK in the Y direction of the overlapping region. 17 shows the state in which the illumination shutter 6 corresponding to the projection area 50f shields the optical path.

In the above embodiment, the blind 30A provided in proximity to the projection area 50a and the blind 30B provided in proximity to the projection area 50g are described as being opposed to each other in the Y direction, but shown in FIG. As described above, the configuration may be such that the two blinds 30C and the blinds 30D movable in the Y direction are arranged in parallel in the X direction. In this case, the blinds 30C are provided corresponding to the projection areas 50a, 50c, 50e, and 50g arranged on the −X side among the projection areas 50a to 50g arranged in a zigzag shape, and the blinds 30D are provided. It is provided corresponding to the projection areas 50b, 50d, and 50f arranged on the + X side. Then, each of the blind 30C and the blind 30D moves in the Y direction to set the size and shape of the predetermined projection area while shielding the optical path of the specific projection area among the plurality of projection areas. Here, the movement of the blind 30C and the blind 30D in the Y-direction may be a synchronous movement or may be a structure that moves independently. Also in this case, as shown by the dotted line in FIG. 18, even if the blinds 30C 'and 30D' which are movable in the Y direction are disposed at positions facing the Y direction with respect to each of the blinds 30C and 30D. good.

In the above embodiment, as one blind 30 sets the size and shape of the projection area 30c while, for example, the blind 30A shields the optical path corresponding to the projection area 30a, Although it demonstrated so that it may be arrange | positioned over the projection area | region, as shown in FIG. 19, the small blind 30 which can move to a Y direction with respect to the optical path corresponding to each of the some projection area | regions 50a-50g is each, respectively. It is good also as a structure arrange | positioned (on the other hand, in FIG. 19, only the blind 30E corresponding to the projection area | region 50e is displayed). In the case where it is desired to shield light paths of specific projection areas, for example, projection areas 50f and 50g, light shielding may be performed using the illumination shutter 6 of the light paths corresponding to the projection areas 50f and 50g.

In addition, as shown in Fig. 20, when viewed in a small plane that can be disposed to correspond to each of the projection areas 50a to 50g and move in the Y direction, and the plurality of projection areas in a large plane capable of shielding light simultaneously, The rectangular blinds 30F may be combined. Here, the blind 30F is arranged in the vicinity of the surface of the photosensitive substrate P, that is, in the substantially conjugate position with respect to the photosensitive substrate P and the mask M. For example, the projection optical system is moved by moving in the Y direction. It is possible to retreat and arrange | position between PL and the photosensitive board | substrate P. FIG.

21 is a view showing another embodiment of the blinds as the second light shielding plate. The blind 30G shown in FIG. 21 is a member in which the transmittance is continuously changed between a portion formed by forming a chromium dot pattern, which is a light shielding pattern on a glass substrate, and shielded. The blind 30G is movable in the Y direction, and has a light shielding portion 77 for shielding light, and a transmission portion 78 for transmitting light with a predetermined transmittance distribution. The light shielding portion 77 is a region in which a chromium film that is a light shielding material is formed on a glass substrate and the transmittance is set to almost 0%. The transmissive portion 78 is a region in which the transmittance is continuously changed from 0 to 100% as the chromium dot, which is a light blocking material, is deposited on the glass substrate while varying the density and is directed from the boundary portion with the light shielding portion 77 to the tip portion. . Here, the chromium dot in the permeation | transmission part 78 is set to the magnitude | size below the resolution limit of exposure apparatus EX.

Thus, also by providing the permeation | transmission part 78 as a light quantity distribution adjustment filter in the blind 30G, the accumulated exposure amount in the overlapping area | region on a pattern can be reduced substantially continuously. By forming the chromium dot pattern on the glass substrate by vapor deposition, the light quantity distribution can be precisely adjusted at the molecular level, so that the exposure dose adjustment in the overlapping region can be precisely performed when performing continuous exposure. I can do it.                     

In each of the above embodiments, in order to adjust the exposure dose distribution of the overlapping area, a blind having a slanted blind, a sawtooth blind or a transmission 78 having a predetermined transmittance distribution is used, but the position of the blind in the optical path direction is used. By adjusting, the exposure amount distribution of an overlapping area can also be adjusted. That is, as shown in FIG. 22A, the blind 30 is disposed (defocused) at a position slightly displaced from the position of the air space with respect to the mask M, thereby passing through the edge portion of the blind 30. The exposure light is diffused, and the mask M is irradiated with a predetermined light amount distribution. Here, the width (that is, the width to be the overlapping area) LK on the mask M of the diffused light at this time is a numerical aperture of the illumination optical system IL as NA, and the position of α on the mask M. When the blind 30 is arrange | positioned at it, it becomes LK = 2 * (alpha) * NA. As shown in FIG. 22B, the light amount distribution in the width LK has a light amount distribution that is continuously attenuated in the Y direction. Thus, by adjusting the position of the blind 30 in the optical path direction (Z direction), the overlap area | region with desired width LK can be formed.

As the exposure apparatus EX of this embodiment, it is also applicable to a proximity exposure apparatus which exposes the pattern of the mask M by bringing the mask M and the photosensitive substrate P into close contact without using a projection optical system. .

As an application of the exposure apparatus EX, it is not limited to the exposure apparatus for liquid crystal which exposes a liquid crystal display element pattern on a square glass plate, For example, the exposure apparatus for semiconductor manufacture and thin film magnetic field which expose a circuit pattern to a semiconductor wafer It is widely applicable to the exposure apparatus for manufacturing a head.                     

The light sources of the exposure apparatus EX of this embodiment are not only g line (436 nm), h line (405 nm) and i line (365 nm), but also KrF excimer laser (248 nm), ArF excimer laser (193 nm) and F2 laser (157 nm) or the like may be used.

The magnification of the projection optical system PL may be not only an equal magnification system but also any one of a reduction system and an enlargement system.

When using far ultraviolet rays such as excimer laser as the projection optical system PL, a material that transmits far ultraviolet rays such as quartz or fluorite is used as the base material, and when using F ₂ laser or X-ray, it is used as a reflective refractometer or optical system of refractometer. do.

When a linear motor is used for the substrate stage PST or the mask stage MST, any one of an air floating type using air bearing and a magnetic floating type using Lorentz power or reactance power may be used. The stage may be of a type that moves along a guide or may be a guideless type in which no guide is provided.

When using a planar motor as a driving device for the stage, one of the magnet unit (permanent magnet) and the armature unit may be connected to the stage, and the other of the magnet unit and the armature unit may be provided on the moving surface side (base) of the stage.

The reaction force generated by the movement of the substrate stage PST may be mechanically pushed to the floor (ground) using a frame member, as described in JP-A-8-166,475. The present invention is also applicable to an exposure apparatus having such a structure.

The reaction force generated by the movement of the mask stage MST may be mechanically pushed to the floor (ground) using a frame member, as described in JP-A-8-330,224. This invention is applicable also to the exposure apparatus provided with such a structure.

As described above, the exposure apparatus of the embodiment of the present application is manufactured by assembling various subsystems including each component described in the claims of the present application so as to maintain predetermined mechanical precision, electrical precision, and optical precision. In order to secure these various precisions, before and after this assembly, adjustments for achieving optical precision for various optical systems, adjustments for achieving mechanical precision for various mechanical systems, and electrical precisions for various electric systems are performed. Adjustment is made. The assembling with the exposure apparatus in the various subsystems includes mechanical connections of various subsystems, wiring connections of electrical circuits, piping connections of the pneumatic circuit, and the like. It goes without saying that there is an assembly step for each subsystem individually before the step of assembling with the exposure apparatus in these various subsystems. When the assembling step of the various subsystems into the exposure apparatus is completed, comprehensive adjustment is made, and the overall accuracy of the exposure apparatus is ensured. In addition, it is preferable to manufacture an exposure apparatus in the clean room where temperature, cleanliness, etc. were managed.

As shown in Fig. 23, the semiconductor device includes a step 201 of designing a function and a performance of the device, a step 202 of manufacturing a mask based on this design step, and a step of manufacturing a substrate which is a substrate of the device (203). ), A substrate processing step 204 for exposing a pattern of a mask to a substrate by the exposure apparatus of the above-described embodiment, a device assembly step (including a dicing step, a bonding step, and a package step) 205 and an inspection step 206 ) And the like.

According to this invention, the continuous part of the pattern in a mask can be arbitrarily set by arrange | positioning the 2nd light shielding plate which can move in the direction orthogonal to a scanning direction with respect to the pattern set by the visual field stop and a 1st light shielding plate. Therefore, the size of the pattern formed on the photosensitive substrate can be set arbitrarily, and arbitrary devices can be manufactured efficiently. Further, by allowing each of the first and second light shielding plates to be movable relative to the field of view aperture, the size and shape of the illumination region of the exposure amount with respect to the photosensitive substrate can be arbitrarily set, thereby improving the accuracy of the joining during continuous exposure. In addition, it is possible to realize uniformization of the exposure amount. The second light shielding plate is provided to be movable in a direction orthogonal to the scanning direction, and has a photosensitivity characteristic that substantially attenuates the accumulated exposure amount in the overlapping region of the pattern as it is directed to the periphery of the irradiation area of the illumination optical system. The exposure dose in the continuous portion can be set to a desired value, and the exposure doses of the overlapping region and the portions other than the overlapping region can be matched. Therefore, exposure processing can be performed with high precision, and a high quality device can be manufactured.

Claims (21)

An exposure apparatus performing scanning exposure by synchronously moving a mask disposed on a mask stage and a photosensitive substrate disposed on a substrate stage in a scanning direction with respect to exposure light irradiated onto the photosensitive substrate through the mask. A field stop for setting a width in the scanning direction of an illumination region on the photosensitive substrate illuminated by the exposure light; A first light shielding plate for setting a width in a scan orthogonal direction perpendicular to the scan direction of the illumination region; A second light blocking plate which is formed to be movable in the scanning orthogonal direction, and shields a part of the optical path of the exposure light corresponding to the illumination region set by the field stop and the first light blocking plate to a predetermined shape; An exposure apparatus characterized by the above-mentioned. The said 2nd light shielding plate is an integrated exposure amount by the said scanning exposure of the said illumination area | region set by shielding a part of the optical path of the said exposure light, toward the periphery of the said scan orthogonal direction of the said illumination area | region. Exposure device characterized in that the attenuation continuously. The exposure apparatus according to claim 1, wherein the second light shielding plate is formed such that the width of the scanning direction at the tip portion of the scanning orthogonal direction is gradually reduced toward the scanning orthogonal direction. The exposure apparatus according to claim 1, wherein the second light shielding plate is a member in which a pattern for light shielding is formed on a glass substrate to continuously change transmittance between a light shielding portion and a light transmitting portion. The said predetermined shape is trapezoid shape, The exposure apparatus of Claim 1 characterized by the above-mentioned. The projection optical system according to claim 1, further comprising a projection optical system for projecting the pattern image formed on the mask to the illumination region on the photosensitive substrate, The field stop sets the width of the scanning direction of the projection area on the pattern on the photosensitive substrate, The first light shielding plate sets a width in the scanning orthogonal direction of the projection area, And the second light shielding plate shields a part of the optical path of the exposure light corresponding to the projection area set to the predetermined shape by the field stop and the first light shielding plate. The system according to claim 6, comprising a plurality of said projection optical systems, The field stop and the first light shielding plate are formed corresponding to each of the plurality of projection optical systems, The second light shielding plate shields a part of the optical path of the exposure light corresponding to a predetermined projection area from among the plurality of projection areas set corresponding to the plurality of projection optical systems. The said optical system of Claim 7 is arranged along the said scan orthogonal direction, And the second light shielding plate is provided at a position close to an optical path of the exposure light corresponding to the projection optical system arranged at an end in the scanning orthogonal direction among the plurality of projection optical systems. The exposure apparatus according to claim 6, further comprising: a control device for controlling the continuous exposure of the pattern image on the photosensitive substrate by dividing the scanning exposure into a plurality of times so that a part of the pattern image of the mask is overlapped and exposed. . An illumination optical system according to claim 1, further comprising an illumination optical system for irradiating said exposure light to an irradiation area on said mask corresponding to said illumination area, The second light shielding plate is disposed in the illumination optical system. The exposure apparatus according to claim 1, wherein the field stop is disposed in a positional relationship between the first light shielding plate and the second light shielding plate with respect to the mask and the photosensitive substrate. The exposure apparatus according to claim 1, wherein the first light shielding plate is formed to be movable in the scan orthogonal direction. The exposure apparatus of Claim 1 provided with the detection apparatus which detects the position of the said 2nd light shielding plate with respect to the said mask. An exposure method in which a mask disposed on a mask stage and a photosensitive substrate disposed on a substrate stage are synchronously moved in a scanning direction with respect to exposure light irradiated to the photosensitive substrate through the mask to perform scanning exposure. A setting step of setting a width in the scanning direction of an illumination region on the photosensitive substrate illuminated by the exposure light; A first light shielding step of setting a width in a scanning orthogonal direction orthogonal to the scanning direction of the illumination region; A second light shielding step of shielding a part of the optical path of the exposure light corresponding to the illumination region set to a predetermined shape by the setting step and the first light shielding step Exposure method comprising a. The said 2nd light-shielding process is a thing in which the accumulated exposure amount by the scanning exposure of the said illumination area | region set by shielding a part of the optical path of the said exposure light toward the periphery of the said scan orthogonal direction of the said illumination area | region. And continuously attenuated accordingly. The method according to claim 14, further comprising a projection step of projecting the pattern image formed on the mask to the illumination region on the photosensitive substrate, The said setting process sets the width | variety of the said scanning direction of the projection area | region of the said pattern image on the said photosensitive board | substrate, In the first light shielding step, the width in the scanning orthogonal direction of the projection area is set, The second light shielding step shields a part of the optical path of the exposure light corresponding to the projection area set to the predetermined shape by the setting step and the first light shielding step. The said projection process is a projection process of Claim 16 projecting the said pattern image to a some said illumination area | region, The setting step sets widths of the scanning direction of the plurality of projection regions corresponding to each of the plurality of illumination regions, In the first light shielding step, widths in the scanning orthogonal directions of the plurality of projection regions are set, The second light shielding step shields a part of an optical path of the exposure light corresponding to a predetermined projection area from among the plurality of projection areas. The exposure method of Claim 16 including the continuous exposure process of performing the continuous exposure of the said pattern image to the said photosensitive board | substrate so that a part of said pattern image of the said mask may be overlapped and exposed. The exposure method of Claim 14 including the positioning process of aligning the light shielding plate which shields a part of the optical path of the said exposure light with respect to the said mask. The liquid crystal device is manufactured using the exposure apparatus in any one of Claims 1-13, The device manufacturing method characterized by the above-mentioned. The pattern of the said mask using the exposure apparatus which carries out the synchronous movement of the mask arrange | positioned at the mask stage and the photosensitive board | substrate arrange | positioned at the board | substrate stage to the exposure light irradiated to the said photosensitive board in a scanning direction, and scans exposure. In the device manufacturing method which produces a liquid crystal device larger than the continuous pattern area | region of the said mask by synthesize | combining a part of together, Setting the exposure apparatus as a recipe using information on the joining positions of the patterns for arranging and joining the patterns of the mask on the photosensitive substrate; According to the said recipe, the width | variety of the said scanning direction of the illumination area | region for irradiating the said exposure light in accordance with the pattern of the said mask to expose, and the width | variety of the scanning orthogonal direction orthogonal to this scanning direction are set, and the said illumination area | region is predetermined shape. The light shielding plate to be exposed together with each other with respect to the pattern corresponding to the joining position located on one side of the illumination region, and the exposure light corresponding to the illumination region set to the predetermined shape. Shielding a part of the optical path, and exposing the accumulated exposure amount by the scanning exposure of the illumination region thus set in the state of being continuously attenuated toward the periphery of the scanning orthogonal direction perpendicular to the scanning direction; After the exposure, moving the photosensitive substrate in the scanning orthogonal direction; The illumination region is set to the predetermined shape at a position partially overlapping with the region exposed to the photosensitive substrate, and is matched with the pattern corresponding to the joining position located on one side of the illumination region. Positioning the light shielding plate for exposure, shielding a part of the optical path of the exposure light corresponding to the illumination area set to the predetermined shape, and accumulating the accumulated exposure amount by the scanning exposure of the illumination area thus set in the scanning orthogonal direction Exposing in a continuously attenuated state towards the periphery of the device.

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