JPWO2009128488A1 - Illumination apparatus, exposure apparatus, and device manufacturing method - Google Patents

Abstract

In the illumination device IL that irradiates illumination light onto the mask M provided with a pattern, the partial illumination optical systems IL2 to IL6 (first irradiation unit) that irradiate the illumination light onto the first pattern region on the mask M, and The partial illumination optical systems IL1 and IL7 (second irradiation units) that irradiate the illumination light to a second pattern region different from the first pattern region on the mask M, and the illumination light incident from the incident units 12a to 12c are branched. And a light guide 13 for deriving different amounts of illumination light to the first irradiation unit and the second irradiation unit.

Description

  The present invention relates to an illumination apparatus, an exposure apparatus, and a device manufacturing method for illuminating a mask provided with a pattern.

  Conventionally, an exposure apparatus has been used to manufacture devices such as a semiconductor element, a liquid crystal display element, and a thin film magnetic head in a photolithography process. In the manufacturing process using this photolithography technique, an original pattern formed on a mask is illuminated with illumination light and transferred onto a plate (photosensitive substrate) coated with a photosensitive agent such as a photoresist. Yes.

  In recent years, an increase in area of a liquid crystal display element or the like has been demanded, and accordingly, an exposure device is desired to be expanded in an exposure apparatus. In contrast, a plurality of projection optical modules are arranged in a direction intersecting the scanning direction (non-scanning direction), and the mask and the photosensitive substrate are synchronously moved in the scanning direction with respect to the plurality of projection optical modules. A multi-lens type exposure apparatus that transfers a pattern formed thereon onto a photosensitive substrate has been developed (see, for example, Patent Document 1). In such an exposure apparatus, illumination light from a light source is equally divided according to the number of projection optical modules using a light guide.

JP 2003-203853 A

  By the way, in the above-described exposure apparatus, it is necessary to perform a plurality of scanning exposures on a single photosensitive substrate in accordance with the size and number of patterns to be transferred. Scanning exposure may be performed. For example, a pattern for four surfaces (2 × 2 surface arrangement) is transferred by performing four times of scanning exposure, and a pattern for six surfaces (3 × 2 surface arrangement) by performing six times of scanning exposure. May be transferred. Usually, the substrate processing time required for processing one photosensitive substrate becomes longer as the number of times of scanning exposure is increased even for photosensitive substrates of the same size.

  On the other hand, in a peripheral device such as a coater / developer connected in-line to an exposure apparatus, in general, the substrate processing time depends on the size of the photosensitive substrate regardless of the size and number of patterns transferred to the photosensitive substrate. It has been decided. For this reason, in a production line including an exposure apparatus and peripheral devices such as a coater / developer, the throughput of the entire line may be limited by the substrate processing time in the exposure apparatus. For example, 4 for a photosensitive substrate of the same size. In a production line where it is necessary to appropriately perform six scanning exposures and six scanning exposures, the throughput of the entire line is limited by the substrate processing time of the exposure apparatus when performing six scanning exposures.

  The object of the present invention is to shorten the substrate processing time for the larger number of scanning exposures and perform the difference in the substrate processing time according to the number of scanning exposures when performing different numbers of scanning exposures on the same size photosensitive substrate. To provide an illumination apparatus, an exposure apparatus, and a device manufacturing method that can be reduced.

  The illuminating device of the present invention is an illuminating device that irradiates an object provided with a pattern with illuminating light. A second irradiating part that irradiates the illumination light to a second pattern area different from the one pattern area, and the illumination light incident from the incident part is branched, so that the first irradiating part and the second irradiating part have different light amounts. And a light branching means for deriving illumination light.

  The exposure apparatus of the present invention includes the illumination apparatus of the present invention, a mask holding mechanism that holds a mask provided with a pattern, and a substrate holding mechanism that holds a photosensitive substrate, and the illumination apparatus is on the mask. The illumination light is irradiated onto the photosensitive substrate through at least one of the first and second pattern regions.

  Further, the device manufacturing method of the present invention uses the exposure apparatus of the present invention to develop an exposure step of transferring the pattern provided on the mask to the photosensitive substrate, and developing the photosensitive substrate to which the pattern is transferred, The method includes a development step of generating a transfer pattern layer having a shape corresponding to the pattern on the photosensitive substrate, and a processing step of processing the photosensitive substrate through the transfer pattern layer.

  According to the illumination apparatus, the exposure apparatus, and the device manufacturing method of the present invention, when scanning exposure is performed a different number of times on a photosensitive substrate of the same size, the substrate processing time with the larger number of scanning exposures is shortened, and scanning exposure is performed. The difference in substrate processing time according to the number of times can be reduced, and the throughput of the entire production line including the exposure apparatus and peripheral devices such as a coater / developer can be improved.

1 is a perspective view showing a schematic configuration of an exposure apparatus according to a first embodiment. It is a figure which shows the structure of the exposure apparatus which concerns on 1st Embodiment. It is a figure which shows the structure of the incident part of the light guide which concerns on 1st Embodiment, and the light quantity distribution of the illumination light in an incident part. It is a figure which shows the structure of the light guide which concerns on 1st Embodiment. It is a figure which shows the structure of the mask and plate in the case of performing 4 times scanning exposure. It is a figure which shows the structure of the mask and plate in the case of performing 6 times of scanning exposure. It is a figure which shows the positional relationship of the pattern area | region on a mask in the case of performing 4 times scanning exposure, and a partial illumination area | region. It is a figure which shows the positional relationship of the pattern area | region and partial illumination area | region on a mask in the case of performing 6 times of scanning exposure. It is a figure which shows the structure of the incident part of the light guide which concerns on a 1st modification, and the light quantity distribution of the illumination light in an incident part. It is a figure which shows the structure of the light guide which concerns on a 1st modification. It is a figure which shows the structure of the incident part of the light guide which concerns on a 2nd modification, and the light quantity distribution of the illumination light in an incident part. It is a figure which shows the structure of the light guide which concerns on a 2nd modification. It is a figure which shows the structure of the incident part of the light guide which concerns on a 3rd modification, and the light quantity distribution of the illumination light in an incident part. It is a figure which shows the structure of the light guide which concerns on a 3rd modification. It is a figure which shows the structure of the opening part and shielding plate of a field stop which concern on 2nd Embodiment. It is a figure which shows the structure of the illuminating device which concerns on 3rd Embodiment. 3 is a flowchart showing a method for manufacturing a semiconductor device according to the present invention. 3 is a flowchart showing a method for manufacturing a liquid crystal device according to the present invention.

  Hereinafter, an illumination apparatus, an exposure apparatus, and a device manufacturing method according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing the overall configuration of an exposure apparatus EX according to the first embodiment of the present invention. In the present embodiment, a mask stage (not shown) for holding a mask M and a plate stage (for holding a plate P as a photosensitive substrate) for a projection optical system PL comprising a plurality of catadioptric projection optical modules. An example of a step-and-scan type exposure apparatus that transfers an image of a pattern provided on the mask M to the plate P while moving in synchronization with (not shown) will be described.

  In the following description, the XYZ orthogonal coordinate system shown in FIG. 1 is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. The XYZ orthogonal coordinate system is set so that the X axis and the Y axis are parallel to the plate P, and the Z axis is set in a direction orthogonal to the plate P. In the XYZ orthogonal coordinate system in the figure, the XY plane is actually set to a plane parallel to the horizontal plane, and the Z axis is set to the vertically upward direction. In this embodiment, the direction in which the mask M and the plate P are moved synchronously (scanning direction) is set in the X-axis direction.

  The exposure apparatus EX includes an illumination apparatus IL that emits illumination light for uniformly illuminating the mask M. The illuminating device IL includes three light sources 2a, 2b, and 2c that are discharge lamps such as ultra-high pressure mercury lamps. As shown in FIG. 2, the illumination light emitted from the light source 2a is collected by the elliptical mirror 4a, and is collected by the illumination relay optical system 6a on the incident portion 12a of the light guide 13. The illumination light emitted from the light source 2b is condensed on the incident portion 12b of the light guide 13 via the elliptic mirror 4b and the illumination relay optical system 6b, and the illumination light emitted from the light source 2c is reflected on the elliptic mirror 4c and The light is condensed on the incident portion 12c of the light guide 13 through the illumination relay optical system 6c.

  The light guide 13 is configured using a random light guide fiber that is an optical fiber bundle in which a plurality of optical fibers are randomly bundled on the incident side and the emission side, and includes three incident portions 12a, 12b, and 12c (see FIG. 2 includes only the incident portion 12a) and seven exit portions 14a to 14g (only the exit portion 14g is illustrated in FIG. 2). The illumination light that has entered the incident portions 12a to 12c propagates through the light guide 13 and is branched into seven emission portions 14a to 14g to be emitted.

  As shown in FIG. 3, the incident portions 12 a to 12 c include a plurality of circular portions 8 a, 8 b, and 8 c (regions indicated by right-upward oblique lines in the drawing) in which a plurality of optical fibers are bundled in a circular shape, and a plurality of peripheral portions. The optical fibers are respectively constituted by annular portions 9a, 9b, 9c (regions indicated by slanting lines in the left-hand side in the figure) in which the optical fibers are bundled in an annular shape. In addition, the circular area | regions 10a, 10b, 10c shown around the entrance parts 12a-12c have shown the area | region illuminated with illumination light. The illumination light incident on the circular portions 8a to 8c is derived from the emission portions 14b to 14f, and the illumination light incident on the annular portions 9a to 9c is derived from the emission portions 14a and 14g as shown in FIG. .

  Here, although the light quantity distribution LQD of the illumination light condensed on the incident parts 12a to 12c is shown in FIG. 3, the light quantity of the illumination light condensed on the ring zones 9a to 9c of the incident parts 12a to 12c is The light amount of the illumination light condensed on the circular portions 8a to 8c is reduced. Therefore, the amount of illumination light incident on the circular portions 8a to 8c and derived from the exit portions 14b to 14f is incident on the annular portions 9a to 9c, and the amount of illumination light derived from the exit portions 14a and 14g. Become more. Moreover, the light quantity of the illumination light derived | led-out from the emission parts 14b-14f is increased compared with the case where the illumination light which injects from the incident parts 12a-12c is branched equally to the emission parts 14a-14g, and is made to inject. Yes.

  The illumination lights derived from the seven exit portions 14a to 14g of the light guide 13 are transmitted to partial illumination optical systems IL1 to IL7 (partial illumination optical systems IL2 and IL4 are not shown) that partially illuminate the mask M. Each incident.

  As shown in FIG. 2, a shutter 20 g is disposed in the vicinity of the emission portion 14 g of the light guide 13. The shutter 20g has a blocking member that blocks the optical path of the illumination light emitted from the emitting portion 14g, and selectively opens and closes (opens) the optical path by inserting and removing the blocking member with respect to the optical path of the illumination light. And shut off).

  The illumination light that has passed through the shutter 20g enters the neutral density filter 21g. The neutral density filter 21g is a transmittance variable filter formed so that the light transmittance is continuously different in the X direction, and is configured to be detachable with respect to the optical path between the shutter 20g and the collimating lens 16g. Yes. By inserting an appropriate amount of the neutral density filter 21g in the X direction with respect to the optical path, the amount of illumination light passing through the neutral density filter 21g can be changed, and illumination is performed with illumination light via the partial illumination optical system IL7. The irradiation amount on the mask M can be adjusted.

  The illumination light that has passed through the neutral density filter 21g is collimated by the collimating lens 16g and enters the fly-eye lens 17g that is an optical integrator. Illumination light incident on the fly-eye lens 17g is wavefront-divided by a number of lens elements constituting the fly-eye lens 17g, and a secondary image composed of the same number of light-emitting images as the number of lens elements on the rear focal plane (near the exit surface). A light source (surface light source) is formed, and the partial illumination region I7 (see FIG. 1) on the mask M is illuminated almost uniformly by the condenser lens 18g. The partial illumination optical systems IL1 to IL6 have the same configuration as the partial illumination optical system IL7, and illuminate the corresponding partial illumination regions I1 to I6 on the mask M substantially uniformly.

  The illumination light from the partial illumination region I7 is a projection optical module among a plurality of projection optical modules PL1 to PL7 (PL2 and PL4 are not shown in FIG. 1) arranged so as to correspond to the partial illumination regions I1 to I7. Incident on PL7. As shown in FIG. 2, the projection optical module PL7 includes a first catadioptric optical system PL11 that forms an intermediate image of a pattern located in the partial illumination region I7 among the patterns provided on the mask M, and a partial illumination region I7. And a second catadioptric optical system PL12 that forms a projected image (equal magnification upright image) of the inner pattern on the plate P.

  Similarly, the illumination lights from the partial illumination regions I1 to I6 corresponding to the partial illumination optical systems IL1 to IL6 respectively enter the projection optical modules PL1 to PL6 provided corresponding to the partial illumination optical systems IL1 to IL6. To do. The projection optical modules PL1 to PL6 have the same configuration as the projection optical module PL7, and form projected images of patterns in the corresponding partial illumination areas I1 to I6 on the plate P, respectively. Here, the partial illumination areas I1 to I7 are respectively defined by a field stop (not shown) provided in the projection optical modules PL1 to PL7. Note that the projection optical modules PL1 to PL7 are arranged in a zigzag manner so that the projection optical modules PL2, PL4, and PL6 are respectively positioned between the projection optical modules PL1, PL3, PL5, and PL7 in the Y direction.

  Further, as shown in FIG. 2, the exposure apparatus EX includes a control unit 30 that adjusts the irradiation amount of illumination light that illuminates the mask M, and shutters of the partial illumination optical systems IL1 to IL7 (including seven shutters 20g). A shutter drive unit 32 that opens and closes the shutter), and a filter drive unit 34 that moves each of the neutral density filters (the seven neutral density filters including the neutral density filter 21g) of the partial illumination optical systems IL1 to IL7 in the X direction. I have.

  In this exposure apparatus EX, the mask M is illuminated by the illumination apparatus IL, and scanning exposure (scanning exposure) is performed while the mask stage and the plate stage are moved synchronously in the X direction with respect to the projection optical modules PL1 to PL7. The projected image of the pattern formed on the mask M is transferred to the plate P. A driving unit (not shown) that moves the mask stage and the plate stage in the X direction is driven and controlled by the control unit 30.

  By the way, in the exposure apparatus EX, it is necessary to perform scanning exposure on the plate P a plurality of times in accordance with the size and the number of patterns to be transferred to the plate P. Exposure may be performed. For example, as shown in FIG. 5, a pattern for two surfaces is provided in the pattern region M10 of the mask M1, and a pattern for eight surfaces (2 × 4 surface arrangement) is formed on the plate P by performing scanning exposure four times. When transferring, or as shown in FIG. 6, a pattern for one surface is provided in the pattern region M20 of the mask M2, and six scanning exposures are performed on the plate P for six surfaces (3 × 2 surface arrangement). In some cases, the pattern is transferred.

  FIG. 7 is a diagram showing the positional relationship between the pattern region M10 on the mask M1 and the partial illumination regions I1 to I7 illuminated by the partial illumination optical systems IL1 to IL7, respectively. FIG. 8 is a diagram showing a positional relationship between the pattern region M20 on the mask M2 and the partial illumination regions I1 to I7. Here, the pattern area M10 (area shown by oblique lines) is arranged in parallel at the first pattern area PA1 irradiated with illumination light by the partial illumination optical systems IL2 to IL6 and at both ends in the Y direction of the first pattern area PA1. And the second pattern area PA2 irradiated with illumination light by the partial illumination optical systems IL1 and IL7, and the pattern area M20 includes only the second pattern area PA2.

  As shown in FIG. 7, the width in the Y direction of the pattern region M10 is wider than the width in the Y direction of the pattern region M20 shown in FIG. 8, and both end edges in the Y direction of the pattern region M10 are the partial illumination optical systems IL1 to IL7. Among them, the partial illumination optical systems IL1 and IL7 arranged at both ends in the Y direction lie within the partial illumination regions I1 and I7. Therefore, when four scanning exposures are performed as shown in FIG. 5, the pattern in the pattern region M10 is transferred to the plate P by illuminating the mask M1 using all of the partial illumination optical systems IL1 to IL7. .

  In this case, the control unit 30 outputs a control signal to the shutter driving unit 32 before the start of scanning exposure, for example, when the pattern is transferred, and opens the optical path of the illumination light by each shutter of the partial illumination optical systems IL1 to IL7. To do. In addition, the control unit 30 outputs a control signal to the filter driving unit 34 and moves the respective neutral density filters of the partial illumination optical systems IL1 to IL7 by an appropriate amount in the X direction, respectively, in the partial illumination regions I1 to I7. Make the illumination light dose equal. At this time, the control unit 30 reduces and adjusts the illumination light irradiation amount in the partial illumination regions I2 to I6.

  On the other hand, as shown in FIG. 8, both end edges in the Y direction of the pattern region M20 are in the partial illumination regions I2 and I6 illuminated by the partial illumination optical systems IL2 and IL6. Therefore, as shown in FIG. 6, when scanning exposure is performed six times, the mask M2 is not illuminated using the partial illumination optical systems IL1 and IL7, and only the partial illumination optical systems IL2 to IL6 are used. The pattern in the pattern region M20 is transferred onto the plate P by performing the illumination.

  In this case, the control unit 30 outputs a control signal to the shutter driving unit 32, for example, before the start of scanning exposure, for pattern transfer, and opens the optical path of the illumination light by each shutter of the partial illumination optical systems IL2 to IL6. At the same time, the optical path of the illumination light is closed (blocked) by the shutters of the partial illumination optical systems IL1 and IL7. In addition, the control unit 30 outputs a control signal to the filter driving unit 34, and moves the respective neutral density filters of the partial illumination optical systems IL2 to IL6 by an appropriate amount in the X direction, respectively, in the partial illumination regions I2 to I6. Make the illumination light dose equal. At this time, the control unit 30 increases and adjusts the illumination light irradiation amount in the partial illumination regions I2 to I6.

  According to the exposure apparatus EX according to the first embodiment, the amount of illumination light to be derived from the emission units 14b to 14f is branched equally to the emission units 14a to 14g. Therefore, when the number of times of scanning exposure (for example, 4 times or 6 times of scanning exposure) is performed on the same size plate P, the number of times of scanning exposure is larger. The irradiation amount of illumination light in the exposure process can be increased as compared with the conventional technique in which the irradiation amount is the same regardless of the number of scanning exposures, and the substrate processing time with the larger number of scanning exposures can be shortened. Therefore, the difference in substrate processing time according to the number of scanning exposures (for example, the difference between the substrate processing time by four scanning exposures and the substrate processing time by six scanning exposures) can be reduced, and the exposure apparatus EX and the coater can be reduced. -The throughput of the entire production line including peripheral devices such as developers can be improved.

  In the first embodiment, the light guide 13 includes three incident portions 12a to 12c. However, as a first modification, a single incident portion 12 as shown in FIGS. 9 and 10 is used. The provided light guide 23 may be used. In this case, as shown in FIG. 9, the incident portion 12 includes a circular portion 8 in which a plurality of optical fibers are bundled in a circular shape (a region indicated by an oblique line rising to the right in the drawing), and a plurality of optical fibers at the peripheral portion. It is comprised by the ring zone part 9 (area | region shown with the upward slanting diagonal line in the figure) bundled in ring shape. Then, as shown in FIG. 10, the illumination light incident on the circular portion 8 is branched to the emission portions 14b to 14f and led out to the partial illumination optical systems IL2 to IL6, and the illumination light incident on the annular zone 9 is emitted. Branches to 14a and 14g and is led to the partial illumination optical systems IL1 and IL7. Even when the light guide 23 is used, as in the case where the light guide 13 is used, the amount of illumination light incident on the circular portion 8 and derived from the emission portions 14b to 14f is incident on the annular zone 9 and emitted. More than the amount of illumination light derived from the parts 14a and 14g.

  In the first embodiment, the illumination light incident on the circular portions 8a to 8c is derived from the emission portions 14b to 14f, and the illumination light incident on the annular portions 9a to 9c is derived from the emission portions 14a and 14g. However, as a second modification, as shown in FIGS. 11 and 12, the light guide 13 ′ is used, and the illumination light incident on the circular portions 8a and 8c and the incident portion 12b (the circular portion 8b and the annular portion 9b). May be derived from the emitting portions 14b to 14f, and illumination light incident on the annular portions 9a and 9c may be derived from the emitting portions 14a and 14g, respectively. In this light guide 13 ′, the length of the optical fiber corresponding to the emission portions 14a and 14g can be shortened compared with the light guide 13, and the transmittance of illumination light derived from the emission portions 14a and 14g is improved. The cost of the light guide can be reduced.

  When the exposure apparatus according to the present invention includes 11 partial projection optical systems, as shown in FIGS. 13 and 14 as a third modification, three first incident portions 120a, 120c, and 120d are used. The light guide 130 that emits the illumination light incident from the first emission units 140c to 140i and emits the illumination light incident from one second incident unit 120b from the second emission units 140a, 140b, 140j, and 140k is used. be able to. In this case, the illumination light that has entered the first incident portions 120a, 120c, and 120d is equally divided into the first emission portions 140c to 140i, led out to the corresponding partial illumination optical systems, and incident on the second incidence portion 120b. The illuminating light is equally divided into the second emitting portions 140a, 140b, 140j, and 140k, and led out to the corresponding partial projection optical systems.

  Since it is desirable that the areas of the emission parts 140a to 140k be the same, the area of the second incident part 120b is configured to be larger than the areas of the first incident parts 120a, 120c, and 120d. That is, when the area of each of the first incident parts 120a, 120c, and 120d is S1, the area of the second incident part 120b is S2, and the area of each of the emission parts 140a to 140k is S3, the expressions (1) and (2) A relationship is established.

S1 = S3 × 7/3 (1)
S2 = S3 × 4 (2)
Accordingly, the area S2 of the second incident part 120b is 4 × (3/7) ≈1.7 times the area S1 of each of the first incident parts 120a, 120c, and 120d from the expressions (1) and (2). Is desirable. In FIG. 13 and FIG. 14, three first incident portions 120a, 120c, 120d and one second incident portion 120b are provided. However, two or more first incident portions and first incident portions are provided. What is necessary is just to provide fewer 2nd incident parts. 13 and 14, seven first injection units 140c to 140i and four second injection units 140a, 140b, 140j, and 140k are provided, but at least one first injection unit and What is necessary is just to provide the 2nd injection | emission part.

  In the first embodiment, the example in which the illumination light from the partial illumination optical systems IL1 and IL7 installed at both ends in the Y direction is blocked has been described. However, the size of the pattern area of the mask M is described. Correspondingly, the illumination light from the partial illumination optical system IL1 or IL7 may be blocked. Further, the illumination light from at least one of the other partial illumination optical systems IL2 to IL6 may be blocked.

  In the first embodiment, each of the partial illumination optical systems IL1 to IL7 includes a shutter and a neutral density filter. However, the partial illumination optical system (for example, IL1) located at least at one end in the Y direction. Only a partial illumination optical system (for example, IL2 to IL7) that does not include a shutter may be provided with a neutral density filter.

  Next, an exposure apparatus according to the second embodiment of the present invention will be described. The configuration of the exposure apparatus according to the second embodiment is the same as that of the exposure apparatus according to the first embodiment except that the configurations of the light guide 13 and the projection optical modules PL1 to PL7 are changed. Have Therefore, in the description of the second embodiment, the same components as those of the exposure apparatus according to the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  The light guide included in the illumination device IL according to the second embodiment includes three incident portions and seven emission portions, and the illumination light incident on the three incident portions of the light guide is generated by the light guide. It propagates through the inside and is branched evenly from the seven injection parts and injected. That is, the irradiation amount of each illumination light emitted from the seven emission parts is the same.

  Each of the projection optical modules PL1 to PL7 constituting the projection optical system PL according to the second embodiment includes a field stop at a position where an intermediate image is formed by the first catadioptric optical system. The shape of the apertures of the field stops of the modules PL1 and PL7 is different from the shape of the apertures of the field stops of the projection optical modules PL2 to PL6.

  FIG. 15 is a diagram showing the shape of the aperture of the field stop of each of the projection optical modules PL1 to PL7. The field stop opening f1 of the projection optical module PL1 and the field stop opening f7 of the projection optical module PL7 have the short side of the parallel opposite sides positioned in the + X direction and have an exposure width (trapezoidal height) d. It has a trapezoidal shape. The field stop opening f3 of the projection optical module PL3 and the field stop opening f5 of the projection optical module PL5 have the short side of the parallel opposite sides positioned in the + X direction, and the exposure width (trapezoidal height) D (D It has a trapezoidal shape with> d). The field stop opening f2 of the projection optical module PL2, the field stop opening f4 of the projection optical module PL4, and the field stop opening f6 of the projection optical module PL6 have short sides of the parallel opposite sides positioned in the −X direction. And a trapezoidal shape having a height D (D> d).

Further, the projection optical module PL2 includes a shielding plate 40b in the vicinity of the field stop. The shielding plate 40b is used to change the exposure width D of the opening f2 of the field stop, and is configured to be detachable with respect to the optical path of the illumination light passing through the opening f2 of the field stop. By inserting or retracting the shielding plate 40b in the optical path, the exposure width D of the aperture f2 of the field stop changes, and by changing the exposure width D, illumination via the partial illumination optical system IL2 and the projection optical module PL2 The exposure amount by light can be changed. That is, when the exposure width D is shortened by inserting the shielding plate 40b into the optical path, the exposure amount decreases, and when the exposure width D is not changed by retracting the shielding plate 40b from the optical path, the exposure is performed. The amount gets bigger. Thus, the exposure amount can be adjusted by inserting / removing the shielding plate 40b with respect to the optical path.
Note that each of the projection optical modules PL3 to PL6 also includes shielding plates 40c to 40f (not shown) having the same configuration as the shielding plate 40b in the vicinity of the field stop. The shield plates 40 b to 40 f are controlled to move in the X direction by a shield plate drive unit (not shown), and the drive of the shield plate drive unit is controlled by the control unit 30.

  In this exposure apparatus, when a pattern for eight surfaces is transferred onto the plate P by performing four scanning exposures, the control unit 30 before the start of the scanning exposure, the shutters 20a to 20 of the partial illumination optical systems IL1 to IL7. A 20 g passage portion is arranged in the optical path of the illumination light derived from the emission portions 14 a to 14 g, and the optical path is opened. Next, the control unit 30 outputs a control signal to the shielding plate driving unit to drive the shielding plates 40b to 40f of the projection optical modules PL2 to PL6, and moves the shielding plates 40b to 40f in the X direction. The exposure width D of the apertures f2 to f6 of the field stop is changed. Specifically, the shielding plates 40b to 40f are arranged at positions where the exposure width D of the apertures f2 to f6 of the field stop is the same as the exposure width d of the openings f1 and f7 of the field stop. Since the shielding plates 40b to 40f are inserted and the exposure widths of the apertures f1 to f7 of the field stop are all set to d, the exposure amount by the illumination light through the projection optical modules PL1 to PL7 becomes the same size. Become. Thereafter, the control unit 30 outputs a control signal to the drive unit, and performs the pattern scanning for eight surfaces on the plate P by performing four times of scanning exposure.

  In addition, when a pattern for six surfaces is transferred onto the plate P by performing six scanning exposures, the control unit 30 sets the shutters 20a and 20g of the partial illumination optical systems IL1 and IL7 before the start of the scanning exposure. The blocking unit is disposed in the optical path of the illumination light derived from the emission units 14a and 14g, the optical path is closed, and the passages of the shutters 20b to 20f of the partial illumination optical systems IL2 to IL6 are derived from the emission units 14b to 14f. It is placed in the optical path of the illumination light and the optical path is opened. Next, the control unit 30 outputs a control signal to the shielding plate driving unit, moves the shielding plates 40b to 40f in the X direction, and retracts them from the optical path. By retracting the shielding plates 40b to 40f, the exposure width of the apertures f2 to f6 of the field stop is set to D, and the exposure amount by the illumination light through the projection optical modules PL2 to PL6 increases. After that, the control unit 30 outputs a control signal to the driving unit, and performs a six-time scanning exposure to transfer a pattern for six surfaces onto the plate P. In this case, the neutral density filters 21a to 21g included in the partial illumination optical systems IL1 to IL7 are retracted from the optical path.

  According to the exposure apparatus of the second embodiment, when four or six scanning exposures are performed on the same size plate P, the exposure amount in six scanning exposures with a large number of scanning exposures is increased. Therefore, the exposure processing time for six scanning exposures can be shortened. Therefore, the difference between the exposure processing time of four scanning exposures and the exposure processing time of six scanning exposures can be reduced, and the throughput of the entire production line comprising the exposure apparatus and peripheral devices such as a coater / developer can be reduced. Can be improved.

  In the first and second embodiments described above, the light guide includes three or four incident portions. However, it is only necessary to include one or more incident portions. Moreover, although the light guide is provided with seven or eleven injection parts, it may be provided with a plurality of injection parts such as five.

  Next, an exposure apparatus according to the third embodiment of the present invention will be described. The configuration of the exposure apparatus according to the third embodiment has the same configuration as that of the exposure apparatus according to the first embodiment except that the illumination apparatus IL described above is changed to an illumination apparatus IL ′. Therefore, in the description of the third embodiment, the same components as those of the exposure apparatus according to the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  FIG. 16 is a diagram illustrating a configuration of an illumination device IL ′ according to the third embodiment. As shown in FIG. 16, the illumination device IL ′ includes a laser light source 42 for supplying illumination light. The illumination light emitted from the laser light source 42 enters the λ / 2 plate 45 via the illumination relay optical system 43 and the mirror 44. The λ / 2 plate 45 is a birefringent element that changes the direction of linearly polarized light included in the illumination light, and is configured to be rotatable with respect to the optical axis. The ratio of the S polarization component and the P polarization component contained in the illumination light is adjusted by rotating the λ / 2 plate 45 and placing it at a predetermined position. The illumination light that has passed through the λ / 2 plate 45 enters a polarization beam splitter (hereinafter referred to as PBS) 46. The PBS 46 is used for branching the illumination light according to the polarization of the illumination light, transmits the P-polarized component contained in the illumination light, and reflects the S-polarized component contained in the illumination light.

  The P-polarized component of the illumination light transmitted through the PBS 46 enters the PBS 48a through the λ / 2 plate 47a. The S-polarized component of the illumination light reflected by the PBS 48a passes through the depolarizing element 49a. The depolarizing element 49a is used to convert illumination light, which is laser light, into non-polarized light. Unpolarized illumination light emitted from the depolarization element 49a enters the fly-eye lens 17a.

  Similar to the illumination light transmitted through the PBS 46, the P-polarized component of the illumination light transmitted through the PBSs 48a and 48c enters the PBSs 48c and 48e via the λ / 2 plates 47c and 47e. The S-polarized components of the illumination light reflected by the PBSs 48c and 48e pass through the depolarizers 49c and 49e and enter the fly-eye lenses 17c and 17e. Similarly, the P-polarized component of the illumination light transmitted through the PBS 48e is reflected by the mirror 50b, passes through the depolarization element 49g, and enters the fly-eye lens 17g.

  On the other hand, the S-polarized component of the illumination light reflected by the PBS 46 is incident on the PBSs 48b and 48d via the λ / 2 plates 47b and 47d in the same manner as the illumination light reflected by the mirror 51 and transmitted through the PBS 46. The S-polarized component of the illumination light reflected by the PBSs 48b and 48d passes through the depolarization element 49b and enters the fly-eye lenses 17b and 17d. Similarly, the P-polarized component of the illumination light transmitted through the PBS 48d is reflected by the mirror 50a, passes through the depolarization element 49f, and enters the fly-eye lens 17f.

  The λ / 2 plates 47a to 47e have the same configuration as the λ / 2 plate 45, the PBSs 48a to 48e have the same configuration as the PBS 46, and the depolarizers 49b to 49g have the same configuration as the depolarizer 49a. Further, a λ / 2 plate driving unit (not shown) for rotating the λ / 2 plates 45, 47a to 47e is provided for each λ / 2 plate 45, 47a to 47e, and these λ / 2 plate driving units. Is controlled by the control unit 30.

  In this exposure apparatus, when a pattern for eight surfaces is transferred onto the plate P by performing four scanning exposures, the control unit 30 rotates the λ / 2 plates 45, 48a to 48e before the start of the scanning exposure. In order to move it, a control signal is output to the λ / 2 plate driving unit, and the λ / 2 plates 45, 48a to 48e are rotated and moved so that the ratio of the S-polarized component and the P-polarized component contained in the illumination light respectively. Set. Specifically, the λ / 2 plate 45 is rotated so that the illumination light transmitted through the λ / 2 plate 45 has a ratio of S polarization component: P polarization component = 3: 4. Similarly, in the λ / 2 plate 48a, S polarization component: P polarization component = 1: 3, and in the λ / 2 plates 48b, 48c, S polarization component: P polarization component = 1: 2, λ / 2 plates 48d, 48e. , The λ / 2 plates 48a to 48e are rotated so that the ratio of S-polarized light component: P-polarized light component = 1: 1. By passing through each λ / 2 plate 45, 48a to 48e, the S-polarized component and the P-polarized component of the illumination light are set to a predetermined ratio, and the illumination light irradiation amount irradiating each of the partial illumination regions I1 to I7 is the same. It becomes the amount of. Thereafter, the control unit 30 outputs a control signal to the drive unit, and performs the pattern scanning for eight surfaces on the plate P by performing four times of scanning exposure.

  In addition, when a pattern for six surfaces is transferred onto the plate P by performing six scanning exposures, the control unit 30 rotates and moves the λ / 2 plates 45 and 48a to 48e before the start of the scanning exposure. A control signal is output to the λ / 2 plate driving unit for rotating the λ / 2 plates 45 and 48a to 48e, and the ratios of the S polarization component and the P polarization component included in the illumination light are respectively set. . In the λ / 2 plate 45, S polarization component: P polarization component = 3: 2, in the λ / 2 plate 48a, S polarization component: P polarization component = 0: 2, and in the λ / 2 plate 48b, S polarization component: P. For the polarization component = 1: 2, the ratio of S polarization component: P polarization component = 1: 1 for the λ / 2 plates 48c and 48d, and the ratio of S polarization component: P polarization component = 1: 0 for the λ / 2 plate 48e. In this way, the λ / 2 plates 48a to 48e are rotated. By passing through each of the λ / 2 plates 45, 48a to 48e, the S-polarized component and the P-polarized component of the illumination light are set to a predetermined ratio, and the amount of illumination light that illuminates the partial illumination regions I1, I7 becomes zero. The irradiation amount of the illumination light that irradiates the partial illumination regions I2 to I6 is the same amount. After that, the control unit 30 outputs a control signal to the driving unit, and performs a six-time scanning exposure to transfer a pattern for six surfaces onto the plate P.

  According to the exposure apparatus according to the third embodiment, when four or six scanning exposures are performed on the same size plate P, the laser light source 42 performs the six scanning exposures with a large number of scanning exposures. The amount of the emitted illumination light is divided into five equal parts, and each of the divided illumination lights irradiates each of the partial illumination regions I2 to I6. Further, the illumination light emitted from the laser light source 42 is divided into seven equal parts in four scanning exposures with a small number of scanning exposures, and each of the seven illumination lights is irradiated onto each of the partial illumination regions I1 to I7. Therefore, since the irradiation amount of illumination light in six scanning exposures can be increased, the exposure processing time for six scanning exposures can be shortened. Therefore, the difference between the exposure processing time of four scanning exposures and the exposure processing time of six scanning exposures can be reduced, and the throughput of the entire production line comprising the exposure apparatus and peripheral devices such as a coater / developer can be reduced. Can be improved.

  In each of the above-described embodiments, the mask stage and the plate stage are synchronously moved in the X direction with respect to the projection optical modules PL1 to PL7 to perform scan exposure (scan exposure). However, only the plate stage is used for the projection optical module. A configuration may be adopted in which scan exposure (scan exposure) is performed by synchronously moving in the X direction with respect to PL1 to PL7.

  Next, a device manufacturing method using the exposure apparatus according to the present invention will be described. FIG. 17 is a flowchart showing a manufacturing process of a semiconductor device. As shown in this figure, in the semiconductor device manufacturing process, a metal film is vapor-deposited on a wafer to be a semiconductor device substrate (step S40), and a photoresist, which is a photosensitive material, is applied onto the vapor-deposited metal film ( Step S42). Subsequently, the pattern formed on the mask is transferred to each shot area on the wafer using the exposure apparatus according to the present invention (step S44: exposure process), and the development of the wafer after the transfer, that is, the pattern is transferred. The developed photoresist is developed (step S46: development step). Thereafter, using the resist pattern formed on the wafer surface in step S46 as a mask for processing, the wafer surface is processed such as etching (step S48: processing step).

  Here, the resist pattern is a photoresist layer (transfer pattern layer) in which unevenness having a shape corresponding to the pattern transferred by the exposure apparatus according to the present invention is formed, and the recess penetrates the photoresist layer. It is what. In step S48, the wafer surface is processed through this resist pattern. The processing performed in step S48 includes at least one of etching of the wafer surface or film formation of a metal film, for example. In step S44, the exposure apparatus according to the present invention performs pattern transfer using the photoresist-coated wafer as a photosensitive substrate.

  FIG. 18 is a flowchart showing a manufacturing process of a liquid crystal device such as a liquid crystal display element. As shown in this figure, in the liquid crystal device manufacturing process, a pattern forming process (step S50), a color filter forming process (step S52), a cell assembling process (step S54) and a module assembling process (step S56) are sequentially performed.

  In the pattern formation process of step S50, predetermined patterns such as a circuit pattern and an electrode pattern are formed on a glass substrate coated with a photoresist as a plate using the exposure apparatus according to the present invention. In this pattern forming process, an exposure process for transferring the projected image of the pattern provided on the mask to the photoresist layer using the exposure apparatus according to the present invention, and development of the plate on which the projected image of the pattern is transferred, that is, A development process for developing a photoresist layer (transfer pattern layer) on a glass substrate to form a photoresist layer having a shape corresponding to the pattern, and a processing process for processing the glass substrate through the developed photoresist layer And are included.

  In the color filter forming step in step S52, a large number of sets of three dots corresponding to R (Red), G (Green), and B (Blue) are arranged in a matrix, or three of R, G, and B are arranged. A color filter is formed by arranging a plurality of stripe filter sets in the horizontal scanning direction. In the cell assembly process in step S54, a liquid crystal panel (liquid crystal cell) is assembled using the glass substrate on which the predetermined pattern is formed in step S50 and the color filter formed in step S52. Specifically, for example, a liquid crystal panel is formed by injecting liquid crystal between a glass substrate and a color filter. In the module assembling process in step S56, various components such as an electric circuit and a backlight for performing the display operation of the liquid crystal panel are attached to the liquid crystal panel assembled in step S54.

  The present invention is not limited to application to an exposure apparatus for manufacturing a semiconductor device or a liquid crystal device. For example, an exposure apparatus for a display device such as a plasma display, an image sensor (CCD or the like), a micromachine, The present invention can be widely applied to an exposure apparatus for manufacturing various devices such as a thin film magnetic head and a DNA chip. Furthermore, the present invention can also be applied to an exposure process (exposure apparatus) when manufacturing a mask (photomask, reticle, etc.) on which mask patterns of various devices are formed using a photolithography process.

  2a-2c ... light source, 4a-4c ... elliptical mirror, 12a-12c ... incident part, 13 ... light guide, 14a-14g ... ejecting part, 16g ... collimator lens, 17a-17g ... fly eye lens, 18g ... condenser lens, DESCRIPTION OF SYMBOLS 30 ... Control part, 32 ... Shutter drive part, 34 ... Filter drive part, 40b ... Shielding board, 42 ... Laser light source, 45, 48a-48e ... Lambda / 2 board, 46, 47a-47e ... Polarizing beam splitter (PBS) , 49a to 49g ... depolarization element, EX ... exposure apparatus, f1 to f7 ... aperture of field stop, I1 to I7 ... partial illumination region, IL, IL '... illumination apparatus, IL1 to IL7 ... partial illumination optical system, PL ... projection optical system, PL1 to PL7 ... partial projection optical system, M ... mask, P ... plate.

Claims (17)

In an illumination device that irradiates illumination light to a mask provided with a pattern,
A first irradiation unit that irradiates the illumination light to the first pattern region on the mask;
A second irradiation unit that irradiates the illumination light to a second pattern region different from the first pattern region on the mask;
A light branching unit for branching the illumination light incident from the incident unit and deriving the illumination light with different light amounts to the first irradiation unit and the second irradiation unit;
An illumination device comprising:   The lighting device according to claim 1, wherein the light branching unit guides the illumination light incident from an edge of the incident unit to the second irradiation unit.   The light branching unit guides the illumination light incident from two or more first incident portions among the plurality of incident portions to the first irradiation portion, and enters from the second incident portions smaller than the first incident portion. The illumination apparatus according to claim 1, wherein the illumination light is led to the second irradiation unit.   The irradiation area of the illumination light on the second pattern area by the second irradiation section is smaller than the irradiation area of the illumination light on the first pattern area by the first irradiation section. The illuminating device as described in any one of -3.   5. The illumination according to claim 4, wherein the light branching unit has a lead-out port that leads the illumination light to the second irradiation unit smaller than a lead-out port that leads the illumination light to the first irradiation unit. apparatus.   The light branching unit includes a plurality of optical fibers, and guides the illumination light incident from the incident unit to the first and second irradiation units via the optical fiber. The lighting device according to claim 5.   The light branching unit includes a polarization branching element that splits light according to polarization, and the first irradiation unit emits one branched light split by the polarization branching element among the illumination light incident from the incident part. The illumination device according to claim 1, wherein the other branched light is derived to the second irradiation unit.   The light branching unit includes a birefringent element that sets the polarization direction of the illumination light incident on the polarization branching element to a polarization direction in which the amount of the other branched light is smaller than that of the one branched light. The lighting device according to claim 7.   The illumination device according to claim 7 or 8, wherein the light branching unit includes a depolarization element that cancels at least one polarization of the one branched light and the other branched light.   The irradiation amount adjusting mechanism provided in the optical path of the illumination light in the first irradiation unit and changing the irradiation amount of the illumination light irradiated by the first irradiation unit. The illumination device according to any one of the above. An optical path opening and closing mechanism for opening and closing the optical path of the illumination light irradiated by the second irradiation unit;
When the optical path opening / closing mechanism opens the optical path, the irradiation amount adjusting mechanism reduces the illumination light irradiation amount, and when the optical path opening / closing mechanism closes the optical path, the irradiation amount adjusting mechanism applies the illumination light irradiation amount. A dose control unit for adjusting the increase,
The illuminating device according to claim 10, further comprising:   The irradiation amount control unit makes the irradiation amount of the illumination light in the first pattern region equal to the irradiation amount of the illumination light in the second pattern region when the optical path opening / closing mechanism opens the optical path. The lighting device according to claim 11.   The lighting device according to any one of claims 1 to 12, wherein the second pattern region is arranged at both ends or one end in a predetermined direction of the first pattern region. The lighting device according to any one of claims 1 to 13,
A mask holding mechanism for holding a mask provided with a pattern;
A substrate holding mechanism for holding the photosensitive substrate,
The exposure apparatus irradiates the photosensitive substrate with the illumination light through at least one of the first and second pattern regions on the mask. A plurality of projection optical modules for projecting an image of the pattern onto the photosensitive substrate;
The exposure apparatus according to claim 14, wherein the illumination apparatus irradiates the photosensitive substrate with the illumination light through the projection optical module that is different for each of the first irradiation unit and the second irradiation unit. An exposure control unit that moves the substrate holding mechanism in a scanning direction while the illumination device irradiates the photosensitive substrate with the illumination light;
16. The exposure apparatus according to claim 14, wherein the second pattern area is arranged at both ends or one end of the first pattern area in a non-scanning direction that intersects the scanning direction. An exposure step of transferring a pattern provided on the mask to the photosensitive substrate using the exposure apparatus according to any one of claims 14 to 16.
Developing the photosensitive substrate to which the pattern has been transferred, and generating a transfer pattern layer having a shape corresponding to the pattern on the photosensitive substrate;
A processing step of processing the photosensitive substrate through the transfer pattern layer;
A device manufacturing method comprising:

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