JP2006039512A - Exposure apparatus and method for manufacturing microdevice - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an exposure apparatus which can favorably control the exposure width in a direction intersecting a scanning direction. <P>SOLUTION: The exposure apparatus carries out scanning exposure by synchronously moving a mask stage mounting a mask M2 and a substrate stage mounting a plate P2 in the scanning direction and is equipped with: partial projection optics PM1, PM3, PM5 in a first column disposed in a plurality of numbers as a first column at specified intervals in a direction intersecting the scanning direction so as to project a part of a mask pattern onto a plate; a partial projection optics PM4 or the like in a second column disposed in a plurality of numbers as a second column at a specified interval in the direction intersecting the scanning direction so as to project a part of the mask pattern onto a plate; shielding members 62a, 62b disposed at the ends in a direction intersecting the scanning direction so as to control the exposure width in a direction intersecting the scanning direction so as to block a part of the exposure light through the partial projection optics of the first column and a part of the exposure light through the partial projection optics of the second column; and driving units 64a, 64b to drive the light shielding members in a direction intersecting the scanning direction. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an exposure apparatus used for manufacturing a flat panel display element (FPD) such as a semiconductor integrated circuit and a liquid crystal display element, and a method of manufacturing a micro device using the exposure apparatus.

  A liquid crystal display element, which is one of the micro devices, is usually formed by patterning a transparent thin film electrode on a glass substrate (plate) into a desired shape by a photolithography technique, and switching elements and electrodes such as TFT (Thin Film Transistor). Manufactured by forming wiring. In a manufacturing process using this photolithography technique, a projection exposure apparatus that projects and exposes a pattern, which is an original image formed on a mask, onto a plate coated with a photosensitive agent such as a photoresist via a projection optical system. It is used.

  In recent years, with an increase in the area of a liquid crystal display element, it is desired to expand an exposure area of a projection exposure apparatus used in a photolithography process. To enlarge the exposure area of the projection exposure apparatus, mask the slit-shaped illumination light whose length in the longitudinal direction is set to be the same as the effective diameter of the projection optical system on the object plane side (mask side) of the projection optical system In a state where slit-like light through the mask is irradiated onto the plate through the projection optical system, the mask and the plate are moved relative to the projection optical system and scanned. A part of the pattern formed on the plate is sequentially transferred to one shot area set on the plate, and after the transfer, the plate is moved stepwise to perform exposure on the other shot areas in the same manner. A projection exposure apparatus of the type has been devised.

  Also, in recent years, in order to further expand the exposure area, projection exposure including a so-called multi-lens projection optical system that uses a plurality of small partial projection optical systems instead of using one large projection optical system. An apparatus has been devised (see, for example, Patent Document 1). In the projection exposure apparatus described in Patent Document 1, a plurality of small partial projection optical systems are arranged as a first row at a predetermined interval in a direction orthogonal to the scanning direction (non-scanning direction) and in a second row. Are arranged in a non-scanning direction at a predetermined interval. Further, the first row partial projection optical system and the second row partial projection optical system are arranged at a predetermined interval in the scanning direction, and the exposure region joint and the second row corresponding to the first row partial projection optical system are arranged. The whole surface of the plate is exposed by connecting the joints of the exposure areas corresponding to the partial projection optical system.

JP 2000-356855 A

  By the way, in the projection exposure apparatus described in Patent Document 1, in order to control the exposure width in the direction orthogonal to the scanning direction (non-scanning direction), a projection optical system (a plurality of small partial projection optical systems) and a plate are used. Four blinds (light shielding members) are provided between them. That is, a blind that blocks one part of the exposure light that passes through the first row of partial projection optical systems arranged in one of the non-scanning directions, and an exposure light that passes through the first row of partial projection optical systems arranged in the other of the non-scanning directions Blind that shields a part of the light, a blind that is arranged in one of the non-scanning directions and shields a part of the exposure light through the second-row partial projection optical system, and a second projection that is arranged in the other of the non-scanning directions A blind for shielding a part of the exposure light through the optical system is provided.

  Further, these four blinds are cantilevered to a driving device that drives each blind, and are inserted between the projection optical system and the plate by the driving device. However, it is necessary to enlarge these four blinds as the plate becomes larger. By supporting the enlarged blinds in a cantilever manner, the blinds are bent and it is difficult to insert the blinds at accurate positions. It was. Furthermore, since these blinds are inserted between the projection optical system and the plate, which are usually at intervals of about 20 mm, the optical member or plate on the most photosensitive substrate side that constitutes the projection optical system by the deflection of the blinds, etc. There was a risk of contact.

  An object of the present invention is to provide an exposure apparatus that can satisfactorily control an exposure width in a direction that intersects the scanning direction, and a method of manufacturing a microdevice using the exposure apparatus.

  An exposure apparatus according to the present invention is an exposure apparatus that performs scanning exposure by synchronously moving a first stage on which a first substrate is placed and a second stage on which a second substrate is placed in a scanning direction. A plurality of first-row partial projection optics that are arranged in a plurality of first rows with a predetermined interval in a direction intersecting the scanning direction and project a partial image of the pattern on the first substrate onto the second substrate, respectively. A plurality of second rows arranged in a second row with a predetermined interval in a direction intersecting the scanning direction and projecting an image of a part of the pattern of the first substrate onto the second substrate; In order to control the exposure width in the direction intersecting the projection optical system and the scanning direction, one of the exposure light beams arranged at the end in the direction intersecting the scanning direction and passing through the partial projection optical system in the first row Or through the partial projection optical system in the second row A light shielding member for shielding a part of light, characterized in that it comprises a drive unit that drives the light blocking member in a direction intersecting with the scanning direction.

  According to the exposure apparatus of the present invention, exposure via the partial projection optical systems in the first row and the second row is performed by the light shielding member disposed at the end in the direction intersecting the scanning direction (hereinafter referred to as the non-scanning direction). A part of the light can be shielded, and a light shielding member that shields a part of the exposure light through the first row of partial projection optical systems and a part of the exposure light through the second row of partial projection optical systems are shielded. There is no need to provide a separate light shielding member, and the exposure width in the non-scanning direction on the side of the partial projection optical system in the first row and the exposure width in the non-scanning direction on the side of the partial projection optical system on the second row are controlled simultaneously and reliably can do. Therefore, the exposure width in the non-scanning direction can be easily set to a desired exposure width, and good exposure can be performed.

  A microdevice manufacturing method of the present invention is a microdevice manufacturing method using the exposure apparatus according to any one of the present invention, wherein an exposure step of exposing a pattern image of a mask onto a photosensitive substrate And a developing step of developing the photosensitive substrate exposed by the exposure step.

  According to the microdevice manufacturing method of the present invention, since the microdevice is manufactured using the exposure apparatus according to any one of the present invention, the mask pattern image is exposed on the photosensitive substrate. The exposure width can be reliably controlled, and good exposure can be performed.

  According to the exposure apparatus of the present invention, a part of the exposure light that passes through the partial projection optical systems in the first row and the second row can be shielded by the light shielding member disposed at the end portion in the non-scanning direction. There is no need to separately provide a light shielding member that shields a part of the exposure light through the partial projection optical system in the first row and a light shielding member that shields a part of the exposure light through the partial projection optical system in the second row, The exposure width in the non-scanning direction on the partial projection optical system side of the first row and the exposure width in the non-scanning direction on the partial projection optical system side of the second row can be controlled simultaneously and reliably. Therefore, the exposure width in the non-scanning direction can be easily set to a desired exposure width, and good exposure can be performed.

  In addition, since the light shielding member is supported by the shaft member disposed between the partial projection optical system in the first row and the partial projection optical system in the second row, the partial projection optical systems in the first row and the second row The second substrate of the partial projection optical system in the first row and the second row that can be prevented from being bent by the deflection of the light shielding member, etc. Contact between the optical member on the side or the second substrate and the light shielding member can be prevented. Accordingly, it is possible to prevent damage to the optical members of the first and second rows of the partial projection optical systems or the optical members due to contact between the second substrate and the light shielding member, and to perform good exposure. it can.

  Further, a shutter provided corresponding to each partial projection optical system constituting the first row partial projection optical system or the second row partial projection optical system blocks exposure light based on the moving position of the light shielding member. Interlocked control. That is, since the exposure light incident on the partial projection optical systems constituting the partial projection optical systems of the first row and the second row can be shielded for each partial projection optical system, based on the moving position of the light shielding member, Exposure light incident on a partial projection optical system that is not used for exposure and cannot be shielded by the light shielding member can be shielded by a shutter corresponding to the partial projection optical system. By providing a shutter that blocks the exposure light incident on the partial projection optical system, the light blocking member can be made smaller, and the light blocking member can be reduced in weight.

  In addition, according to the microdevice manufacturing method of the present invention, since the microdevice is manufactured using the exposure apparatus of the present invention, the exposure width is reliably set when the mask pattern image is exposed on the photosensitive substrate. It is possible to control and good exposure can be performed.

  A projection exposure apparatus according to a first embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing an overall schematic configuration of the projection exposure apparatus according to the first embodiment. In the first embodiment, as shown in FIG. 1, a part of the pattern of the mask (first substrate) M2 arranged so that the pattern formation surface is positioned on the mask focal plane which is the first surface. Are projected onto a plate (second substrate) P2 as a photosensitive substrate disposed so that the plate surface is positioned on the plate focal plane which is the second surface (in this embodiment, a plurality of projections). The mask M2 and the plate P2 are synchronously moved in the scanning direction with respect to the projection optical system PL2 composed of five (5) catadioptric partial projection optical systems (PM1, PM3 to PM5 and one partial projection optical system not shown). A step-and-scan type scanning projection exposure apparatus that scans and exposes the pattern image formed on the mask M2 onto the plate P2 will be described as an example.

  In the following description, the XYZ orthogonal coordinate system shown in FIG. 1 is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. The XYZ orthogonal coordinate system is set so that the X axis and the Y axis are parallel to the plate P2, and the Z axis is set to a direction orthogonal to the plate P2. In the XYZ coordinate system in the figure, the XY plane is actually set to a plane parallel to the horizontal plane, and the Z-axis is set vertically upward. In this embodiment, the direction (scanning direction) in which the plate P2 is moved is set in the X-axis direction.

  As shown in FIG. 1, the projection exposure apparatus includes a light source 50 including an ultrahigh pressure mercury lamp disposed at the first focal position of an elliptical mirror 52. The light beam emitted from the light source 50 is reflected by the elliptical mirror 52, reflected by the reflecting mirror 54, collected at the second focal position of the elliptical mirror, passes through the relay optical system 56, and enters the incident end of the optical fiber bundle 58. Incident at 58a. The optical fiber bundle 58 is a random light guide fiber configured by, for example, randomly bundling a large number of fiber strands, and includes an incident end 58a and five exit ends 58b, 58c, 58d, 58e, and 58f. The light beam incident on the incident end 58a of the optical fiber bundle 58 is mixed by propagating through the inside of the optical fiber bundle 58 and divided into a plurality (in this embodiment, five), and the five of the optical fiber bundles 58 are divided. The light exits from the exit ends 58b to 58f and enters the five shutters 60b, 60c, 60d, 60e, and 60f, respectively.

  The five shutters 60b to 60f have a function of shielding exposure light incident on the partial projection optical systems PM1 to PM5 corresponding to the partial projection optical systems PM1 to PM5 described later. That is, for example, the shutter 60b is configured to be detachable with respect to the optical path of light emitted from the exit end 58b of the optical fiber bundle 58, and the shutter 60b is inserted into the optical path of light emitted from the exit end 58b. By shielding the optical path of the light emitted from 58b, the exposure light incident on the partial projection optical system PM1 among the partial projection optical systems PM1 to PM5 can be shielded. The shutter 60b is retracted from the optical path of the light emitted from the emission end 58b and the optical path of the light emitted from the emission end 58b is opened, so that the exposure light can be incident on the partial projection optical system PM1.

  Similarly, each of the shutters 60c to 60f is configured to be detachable with respect to each optical path of light emitted from the emission ends 58c to 58f of the optical fiber bundle, and the shutters 60c to 60f are inserted and the emission ends 58c. By shielding the optical paths of the light emitted from ˜58f, it is possible to shield the exposure light incident on each of the partial projection optical systems PM2 to PM5. The shutters 60c to 60f are retracted from the optical paths of the light emitted from the emission ends 58c to 58f, and the respective optical paths of the lights emitted from the emission ends 58c to 58f are opened, so that the partial projection optical systems PM2 to PM5 are opened. The exposure light can be incident on each of these.

  When the shutters 60b to 60f are retracted from the respective optical paths of the light emitted from the five emission ends 58b to 58f of the optical fiber bundle 58, the light is emitted from each of the five emission ends 58b to 58f of the optical fiber bundle 58. The incident light enters the five illumination optical units IM1, IM2, IM3, IM4, and IM5, respectively. Here, the illumination optical units IM1, IM3, and IM5 are arranged in a first row with a predetermined interval in the non-scanning direction (Y direction), and the illumination optical units IM2 and IM4 have a predetermined interval in the non-scanning direction (Y direction). Arranged as the second row. The first row illumination optical units IM1, IM3, and IM5 and the second row illumination optical units IM2 and IM4 are arranged at a predetermined interval in the X direction.

  Here, the light beam that has passed through the illumination optical unit IM1 illuminates the illumination area corresponding to the illumination optical unit of the mask M2 substantially uniformly. As shown in FIG. 1, the light from the illumination area corresponding to the illumination optical unit IM1 of the mask M2 is partially projected out of the five partial projection optical systems PM1 to PM5 arranged so as to correspond to each illumination area. The light enters the optical system PM1. Here, the partial projection optical systems PM1, PM3, and PM5 are arranged in a first row with a predetermined interval in the Y direction (non-scanning direction), and are not shown in the partial projection optical system, partial projection optical system PM4 (hereinafter referred to as partial projection optical system). PM4 etc.) are arranged in a second row at a predetermined interval in the Y direction. The first row of partial projection optical systems PM1, PM3, PM5, the second row of partial projection optical systems PM4, and the like are arranged at a predetermined interval in the X direction.

  The partial projection optical system PM1 projects an image of a pattern formed in the illumination area corresponding to the illumination optical unit IM1 of the mask M2 on the plate P2. The light that has passed through the partial projection optical system PM1 forms an image of the pattern of the mask M2 on the plate P2. The image at this time is an erect image.

  The light that has passed through the illumination optical units IM2 to IM5 illuminates the illumination areas corresponding to the illumination optical units IM2 to IM5 of the mask M2 almost uniformly. Light from each illumination area corresponding to each illumination optical unit IM2 to IM5 of the mask M2 enters the partial projection optical system PM2 to PM5, and enters each illumination area corresponding to each illumination optical unit IM2 to IM5 on the plate P2. An image of the formed pattern is formed.

  The mask M2 is fixed by a mask holder (not shown), and is placed on a mask stage (first stage, not shown). The mask stage is provided with a movable mirror MIF. Laser light emitted from a mask stage laser interferometer (not shown) is incident on the movable mirror MIF, and the position of the mask stage is measured and controlled based on the interference of the laser light reflected by the movable mirror MIF. . The plate P2 is fixed by a plate holder (not shown), and is placed on a plate stage (second stage, not shown). The plate stage is provided with a movable mirror PIF. Laser light emitted from a plate stage laser interferometer (not shown) is incident on the movable mirror PIF, and the incident laser light is reflected by the movable mirror PIF. The position of the plate stage is measured and controlled based on the interference of the laser light incident on the movable mirror PIF and reflected by the movable mirror PIF.

  The projection exposure apparatus also drives the first light shielding member 62a on one end of the Y direction and the first light shielding member 62a in the Y direction in order to control the exposure width in the non-scanning direction (Y direction). The first drive unit 64a is provided. Further, in order to control the exposure width in the Y direction, a second light shielding member 62b and a second drive unit 64b for driving the second light shielding member 62b in the Y direction are provided on the other end of the Y direction. The first light shielding member 62a and the second light shielding member 62b are supported by a guide member 66 disposed between the first row of partial projection optical systems PM1, PM3, PM5 and the second row of partial projection optical systems PM4. Has been.

  As shown in FIG. 2, the first light shielding member 62a and the second light shielding member 62b have concave portions at both ends in the Y direction, and the first row of partial projection optical systems PM1, PM3, PM5 across the concave portion. The first row light shielding unit 70 shields a part of the exposure light through the second row, and the second row light shielding unit 71 shields a part of the exposure light through the second row partial projection optical system PM4 and the like. By having such a shape, weight reduction of the 1st light shielding member 62a and the 2nd light shielding member 62b is achieved.

  FIG. 3 is a side view showing the first light shielding member 62a, the second light shielding member 62b, the first drive unit 64a, the second drive unit 64b, the shaft member 66, and the like. As shown in FIG. 3, a stopper 68a for preventing a collision between the distal end portion of the first light shielding member 62a and the distal end portion of the second light shielding member 62b is provided above the first light shielding member 62a and the second light shielding member 62b. 68b respectively. The stopper 68a is provided on the second light shielding member side of the first light shielding member 62a so as to protrude from the front end portion of the first light shielding member 62a. Further, the stopper 68b is provided on the first light shielding member side of the second light shielding member 62b so as to protrude from the front end portion of the second light shielding member 62b.

  The first drive unit 64a includes an AC motor 80, a base plate 81, and a ball screw 82. By rotating the ball screw 82 by the AC motor 80, the base plate 81 is moved forward or backward in the Y direction. . Accordingly, the shaft member 69a moves forward or backward in the arrow direction (Y direction) in the drawing, and the first light shielding member 62a moves forward or backward in the arrow direction (Y direction) in the drawing. The second drive unit 64b has the same configuration as the first drive unit 64a, and moves the second light shielding member 62b forward or backward in the arrow direction (Y direction) in the drawing.

  FIG. 4A is a view showing a state where the first light shielding member 62a does not shield any of the exposure regions E1 to E5 corresponding to the partial projection optical systems PM1 to PM5, respectively. Here, as shown in FIG. 4B, the first driving unit 64a moves the first light shielding member 62a in the + Y direction, so that the first light shielding member 62a is interposed between the projection optical system PL2 and the plate P2. A part of the exposure area E5 corresponding to the partial projection optical system PM5 in the first row (area shown by hatching in the drawing) is shielded from light. In this case, all the shutters 60b to 60f described above are retracted from the respective optical paths.

  Further, as shown in FIG. 4C, the first driving unit 64a further moves the first light shielding member 62a in the + Y direction, so that one of the exposure areas E5 corresponding to the partial projection optical system PM5 in the first row is obtained. Part of the exposure area E4 (area indicated by the slanted line in the figure) corresponding to the part (area shown by the slanted line in the figure) and the second row partial projection optical system PM4 is shielded from light. In this case, the shutters 60b to 60e described above are retracted from the respective optical paths, and the shutter 60f is inserted into the optical path of the light emitted from the emission end 58f. Accordingly, a portion of the exposure region E5 that is not shielded by the light shielding member 62a (a region indicated by white in the drawing) is also shielded by the shutter 60f. In this manner, the exposure width in the Y direction can be controlled by moving the first light shielding member 62a in the + Y direction by the first driving unit 64a and interlocking the insertion / removal of the shutters 60b to 60f. .

  FIG. 4 shows the definition of one exposure width in the Y direction of the exposure region by moving the first light shielding member 62a in the + Y direction, that is, the definition of one end of the exposure region in the Y direction. By moving the second light shielding member 62b in the -Y direction, the other exposure width in the Y direction of the exposure region, that is, the other end portion in the Y direction of the exposure region can be defined.

  In the first and second embodiments, the first light shielding member 62a and the second light shielding member 62b are provided between the projection optical system and the plate. However, the first light shielding member 62a and the second light shielding member are provided. As another example of the position 62b, it may be provided immediately above the mask corresponding to between the illumination optical unit and the mask, or may be directly below the mask corresponding to between the projection optical system and the mask. In addition, when it is provided directly under the mask, it is preferable that the wings come to the mask side so that the positional relationship is in the order of the mask, the wings, and the guide.

  According to the projection exposure apparatus according to the first embodiment, the first light shielding member 62a disposed at one end in the non-scanning direction (Y direction) has the first and second rows of partial projection optical systems. In order to shield a part of the exposure light through the first projection line, a part of the exposure light through the first row partial projection optical system and a part of the exposure light through the second row partial projection optical system are shielded. There is no need to provide a separate light-shielding member, and the Y-direction exposure width on the first row partial projection optical system side and the Y-direction exposure width on the second row partial projection optical system side can be controlled simultaneously and reliably. can do. Similarly, the second light shielding member 62b disposed at the other end in the Y direction shields part of the exposure light through the first and second rows of partial projection optical systems, and thus the first row of partial projections. There is no need to separately provide a light shielding member that shields part of the exposure light through the optical system and a light shielding member that shields part of the exposure light through the second row of partial projection optical systems. The exposure width in the Y direction on the projection optical system side and the exposure width in the Y direction on the second column partial projection optical system side can be controlled simultaneously and reliably.

  Further, since the first light shielding member 62a and the second light shielding member 62b are supported by the guide member 66 disposed between the first row partial projection optical system and the second row partial projection optical system, the light shielding member. It is possible to prevent contact between the light-shielding member and the optical member on the most plate side of the partial projection optical systems in the first row and the second row, which may be caused by deflection of the first row and the second row.

  The shutters 60b to 60f provided corresponding to the partial projection optical systems constituting the first row partial projection optical system or the second row partial projection optical system include the first light shielding member 62a and the second light shielding member. Interlocking control of the shielding of the exposure light is performed based on the movement position of 62b. That is, since the exposure light incident on each partial projection optical system can be shielded for each partial projection optical system, the partial projection optics not used for exposure based on the movement positions of the first light shielding member and the second light shielding member. Exposure light incident on a partial projection optical system that is a system and cannot be shielded by the first light shielding member and the second light shielding member can be shielded by a shutter corresponding to the partial projection optical system. By providing this shutter, the first light shielding member and the second light shielding member can be made small, so that the deflection of the first light shielding member and the second light shielding member can be prevented. Therefore, it is possible to prevent contact between the optical member on the most plate side of the partial projection optical system in the first row and the second row, which may be caused by the deflection of the light shielding member, and the like.

  Also, the first light blocking member 62a is provided on the second light blocking member side (+ Y direction) so as to protrude from the tip of the first light blocking member, and the first light blocking member 62b is on the first light blocking member side. Since the second stopper 68b is provided so as to protrude from the tip of the second light shielding member in the (−Y direction), collision between the first light shielding member and the second light shielding member can be prevented.

  The exposure apparatus according to the first embodiment includes the first light shielding member 62a disposed on one side in the Y direction and the second light shielding member 62b disposed on the other side in the Y direction as light shielding members. However, you may make it provide the one light shielding member arrange | positioned at one side of a Y direction as a light shielding member. Also in this case, the light shielding member is inserted in a predetermined position between the partial projection optical systems of the first and second rows and the plate by moving the light shielding member in the Y direction by the driving unit, and the first row. In addition, a part of the exposure light that passes through the partial projection optical system in the second row can be shielded, and the exposure width in the Y direction can be appropriately controlled. Further, it is necessary to separately provide a light shielding member that shields a part of the exposure light through the first row partial projection optical system and a light shielding member that shields a part of the exposure light through the second row partial projection optical system. Therefore, the exposure width in the Y direction on the side of the partial projection optical system in the first row and the exposure width on the side of the partial projection optical system in the second row can be controlled simultaneously and reliably. Therefore, the exposure width in the Y direction can be easily set to a desired exposure width, and good exposure can be performed.

  Further, in the first embodiment, a shutter that can be inserted into and removed from the optical path of the exposure light is provided, and by inserting the shutter, the exposure light incident on the shutter is shielded and the shutter is retracted. The exposure light is configured to be incident on the partial projection optical system, but includes a shutter having an opening that can be opened and closed, and the exposure light incident on the shutter is shielded by closing the opening of the shutter. The exposure light may enter the partial projection optical system by opening the opening.

  Next, a projection exposure apparatus according to a second embodiment of the present invention will be described with reference to the drawings. The configuration of the projection exposure apparatus according to the second embodiment is changed to the configuration of the first drive unit and the second drive unit of the projection exposure apparatus according to the first embodiment as shown in FIG. Is. Therefore, in the description of the second embodiment, a detailed description of the same configuration as that of the projection exposure apparatus according to the first embodiment is omitted. In the description of the projection exposure apparatus according to the second embodiment, the same configuration as that of the projection exposure apparatus according to the first embodiment is the same as that used in the first embodiment. This will be described using the reference numerals.

  FIG. 5 is a side view showing the first light shielding member 62a, the second light shielding member 62b, the guide member 66, and the like. As shown in FIG. 5, in order to control the exposure width in the non-scanning direction (Y direction), the first light shielding member 62a provided at one end of the Y direction and the other end of the Y direction are provided. The second light shielding member 62b is supported by a guide member 66 disposed between the first row of partial projection optical systems PM1, PM3, PM5 and the second row of partial projection optical systems PM4.

  Further, stoppers 68a and 68b for preventing a collision between the front end portion of the first light shielding member 62a and the front end portion of the second light shielding member 62b are provided above the first light shielding member 62a and the second light shielding member 62b, respectively. ing. The stopper 68a is provided on the second light shielding member side of the first light shielding member 62a so as to protrude from the front end portion of the first light shielding member 62a. Further, the stopper 68b is provided on the first light shielding member side of the second light shielding member 62b so as to protrude from the front end portion of the second light shielding member 62b.

  The AC motor 85 provided at one end of the Y-direction end is connected to a ball screw 86 for moving the first light shielding member 62a forward or backward in the arrow direction (Y direction) in the figure. The AC motor 87 provided at the other end in the Y direction is connected to a ball screw 88 for moving the second light shielding member 62b forward or backward in the arrow direction (Y direction) in the drawing. By independently controlling the AC motor 85 and the AC motor 87, the first light shielding member 62a and the second light shielding member 62b can be moved forward or backward independently in the arrow direction (Y direction) in the drawing.

  According to the projection exposure apparatus according to the second embodiment, the first light shielding member 62a disposed at one end portion in the non-scanning direction (Y direction) and the second light shielding member disposed at the other end portion. Since 62b shields part of the exposure light that passes through the first and second partial projection optical systems, the light shielding member and the second row shield part of the exposure light that passes through the first partial projection optical system. It is not necessary to separately provide a light shielding member for shielding a part of the exposure light through the partial projection optical system, and the exposure width in the Y direction on the first column partial projection optical system side and the second column partial projection optics The exposure width in the Y direction on the system side can be controlled simultaneously and reliably.

  Further, since the first light shielding member 62a and the second light shielding member 62b are supported by the guide member 66 disposed between the first row partial projection optical system and the second row partial projection optical system, the light shielding member. It is possible to prevent contact between the light-shielding member and the optical member on the most plate side of the partial projection optical systems in the first row and the second row, which can be caused by deflection of the first row and the second row.

  The shutters 60b to 60f provided corresponding to the partial projection optical systems constituting the first row partial projection optical system or the second row partial projection optical system include the first light shielding member 62a and the second light shielding member. Interlocking control of the shielding of the exposure light is performed based on the movement position of 62b. Therefore, based on the movement positions of the first light shielding member and the second light shielding member, the light is incident on the partial projection optical system that is not used for exposure and cannot be shielded by the first light shielding member and the second light shielding member. The exposure light to be shielded can be shielded by a shutter corresponding to the partial projection optical system. By providing this shutter, the first light shielding member and the second light shielding member can be made small, so that the deflection of the first light shielding member and the second light shielding member can be prevented. Therefore, it is possible to prevent contact between the optical member on the most plate side of the partial projection optical system in the first row and the second row, which may be caused by the deflection of the light shielding member, and the like.

  Also, the first light blocking member 62a is provided on the second light blocking member side (+ Y direction) so as to protrude from the tip of the first light blocking member, and the first light blocking member 62b is on the first light blocking member side. Since the second stopper 68b is provided so as to protrude from the tip of the second light shielding member in the (−Y direction), collision between the first light shielding member and the second light shielding member can be prevented.

  According to the exposure apparatus of the present invention, since the light shielding member is supported by the guide member disposed between the partial projection optical system in the first row and the partial projection optical system in the second row, Deflection of the light shielding member inserted between the two rows of partial projection optical systems and the second substrate can be prevented. Accordingly, it is possible to prevent contact between the optical member closest to the second substrate or the second substrate and the light shielding member in the first and second row partial projection optical systems, which may be caused by the deflection of the light shielding member. The optical member of the partial projection optical system in the first row and the second row, or damage to the optical member due to contact between the second substrate and the light shielding member, etc. can be prevented, and good exposure can be performed. .

  According to the exposure apparatus of the present invention, the shutter provided corresponding to each partial projection optical system constituting the first row partial projection optical system or the second row partial projection optical system moves the light shielding member. The exposure light shielding is controlled based on the position. That is, since the exposure light incident on the partial projection optical systems constituting the partial projection optical systems of the first row and the second row can be shielded for each partial projection optical system, based on the moving position of the light shielding member, Exposure light incident on a partial projection optical system that is not used for exposure and cannot be shielded by the light shielding member can be shielded by a shutter corresponding to the partial projection optical system. By providing a shutter that blocks the exposure light incident on the partial projection optical system, the light blocking member can be made smaller, and the light blocking member can be reduced in weight.

  Further, according to the exposure apparatus of the present invention, a part of the exposure light that passes through the partial projection optical systems in the first and second rows can be shielded by the first light shielding member arranged on one side in the non-scanning direction. it can. Therefore, it is necessary to separately provide a light shielding member that shields part of the exposure light through the partial projection optical system in the first row and a light shielding member that shields a part of the exposure light through the partial projection optical system in the second row. In addition, one exposure range in the non-scanning direction can be reliably controlled by the first light shielding member arranged on one side in the non-scanning direction. Similarly, a part of the exposure light that passes through the partial projection optical systems in the first and second rows can be shielded by the second light shielding member arranged on the other side in the non-scanning direction. Therefore, it is necessary to separately provide a light shielding member that shields part of the exposure light through the partial projection optical system in the first row and a light shielding member that shields a part of the exposure light through the partial projection optical system in the second row. In addition, the second light-shielding member arranged on the other side in the non-scanning direction can reliably control the other exposure range in the non-scanning direction.

  Further, according to the exposure apparatus of the present invention, since the stopper is provided between the partial projection optical system of the first row and the partial projection optical system of the second row, the first light shielding member and the second light shielding member Collisions can be prevented. That is, even when the first light shielding member or the second light shielding member runs away due to a malfunction of the first driving unit or the second driving unit, the tip of the first light shielding member collides with the tip of the second light shielding member. Before, a stopper provided on the second light shielding member side of the first light shielding member so as to protrude from the front end portion of the first light shielding member and a front end portion of the second light shielding member on the first light shielding member side of the second light shielding member. Further, since the overhanging stopper collides, the collision between the first light shielding member and the second light shielding member can be avoided.

  In the projection exposure apparatus according to each of the above-described embodiments, the reticle (mask) is illuminated by the illumination optical system, and the transfer pattern formed on the mask is exposed to the photosensitive substrate (plate) using the projection optical system. By performing (exposure step), a micro device (semiconductor element, imaging element, liquid crystal display element, thin film magnetic head, etc.) can be manufactured. FIG. 6 is a flowchart of an example of a technique for obtaining a semiconductor device as a micro device by forming a predetermined circuit pattern on a plate or the like as a photosensitive substrate using the exposure apparatus according to the above-described embodiment. Will be described with reference to FIG.

  First, in step S301 of FIG. 6, a metal film is deposited on one lot of plates. In the next step S302, a photoresist is applied on the metal film on the one lot of plates. Thereafter, in step S303, using the projection exposure apparatus according to the above-described embodiment, the pattern image on the mask is sequentially exposed and transferred to each shot area on the one lot of plates via the projection optical system. The That is, the image of the pattern on the mask is sequentially exposed and transferred onto the plate using a projection exposure apparatus in which the exposure width in the Y direction is reliably controlled.

  Thereafter, in step S304, the photoresist on the one lot of plates is developed, and in step S305, etching is performed on the one lot of plates using the resist pattern as a mask to obtain a pattern on the mask. Corresponding circuit patterns are formed in each shot area on each plate.

  Thereafter, a device pattern such as a semiconductor element is manufactured by forming a circuit pattern of an upper layer. According to the above-described microdevice manufacturing method, since exposure is performed using the exposure apparatus according to the above-described embodiment, the exposure width is reliably controlled when the mask pattern image is exposed on the photosensitive substrate. And good exposure can be performed. In steps S301 to S305, a metal is vapor-deposited on the plate, a resist is applied on the metal film, and exposure, development and etching processes are performed. Prior to these processes, the process is performed on the plate. It is needless to say that after forming a silicon oxide film, a resist may be applied on the silicon oxide film, and steps such as exposure, development, and etching may be performed.

  In the projection exposure apparatus according to each of the above-described embodiments, a liquid crystal display element as a micro device can be obtained by forming a predetermined pattern (circuit pattern, electrode pattern, etc.) on a plate (glass substrate). it can. Hereinafter, an example of the technique at this time will be described with reference to the flowchart of FIG. In FIG. 7, in the pattern forming step S401, a so-called photolithographic step is performed in which the exposure pattern according to the above-described embodiment is used to transfer and expose the mask pattern onto a photosensitive substrate (such as a glass substrate coated with a resist). Is done. In other words, the pattern image on the mask is transferred and exposed onto the wafer using a projection exposure apparatus in which the exposure width in the Y direction is reliably controlled.

  By this photolithography process, a predetermined pattern including a large number of electrodes and the like is formed on the photosensitive substrate. Thereafter, the exposed substrate undergoes steps such as a developing step, an etching step, and a resist stripping step, whereby a predetermined pattern is formed on the substrate, and the process proceeds to the next color filter forming step S402.

  Next, in the color filter forming step S402, a large number of groups of three dots corresponding to R (Red), G (Green), and B (Blue) are arranged in a matrix or three of R, G, and B A color filter is formed by arranging a plurality of stripe filter sets in the horizontal scanning line direction. Then, after the color filter formation step S402, a cell assembly step S403 is executed. In the cell assembly step S403, a liquid crystal panel (liquid crystal cell) is assembled using the substrate having the predetermined pattern obtained in the pattern formation step S401, the color filter obtained in the color filter formation step S402, and the like. In the cell assembly step S403, for example, liquid crystal is injected between the substrate having the predetermined pattern obtained in the pattern formation step S401 and the color filter obtained in the color filter formation step S402, and a liquid crystal panel (liquid crystal cell ).

  Thereafter, in a module assembly step S404, components such as an electric circuit and a backlight for performing a display operation of the assembled liquid crystal panel (liquid crystal cell) are attached to complete a liquid crystal display element. According to the above-described method for manufacturing a liquid crystal display element, since the exposure is performed using the projection exposure apparatus according to the above-described embodiment, the exposure width is surely ensured when the pattern image of the mask is exposed on the photosensitive substrate. It is possible to control and good exposure can be performed.

1 is a perspective view showing a schematic configuration of a projection exposure apparatus according to a first embodiment of the present invention. It is a figure which shows the structure of the light-shielding member concerning 1st Embodiment of this invention. It is a figure which shows the light-shielding member, drive part, guide member, etc. concerning 1st Embodiment of this invention. It is a figure for demonstrating the state of light shielding by the light-shielding member concerning 1st Embodiment of this invention. It is a figure which shows the light-shielding member, drive part, guide member, etc. concerning 2nd Embodiment of this invention. It is a flowchart which shows the manufacturing method of the semiconductor device as a microdevice concerning embodiment of this invention. It is a flowchart which shows the manufacturing method of the liquid crystal display element as a microdevice concerning embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 50 ... Light source, 52 ... Elliptical mirror, 54 ... Reflective mirror, 56 ... Relay optical system, 58 ... Optical fiber bundle, 58a ... Incident end, 58b-58f ... Outlet end, 60b-60f ... Shutter, 62a ... 1st light shielding member , 62b ... second light shielding member, 64a ... first driving unit, 64b ... second driving unit, 66 ... guide member, 68a ... first stopper, 68b ... second stopper, IM1 to IM5 ... illumination optical unit, PL2 ... projection Optical system, PM1 to PM5, partial projection optical system, M2, mask, P2, plate, MIF, PIF, movable mirror.

Claims (11)

An exposure apparatus that performs scanning exposure by synchronously moving a first stage for placing a first substrate on a first surface and a second stage for placing a second substrate on a second surface in a scanning direction. And
A plurality of first column partial projection optical systems that are arranged in a plurality of first columns at predetermined intervals in a direction crossing the scanning direction and project a partial image of the pattern on the first substrate onto the second substrate, respectively. When,
A plurality of second column partial projection optical systems that are arranged in a plurality of second columns with a predetermined interval in a direction intersecting the scanning direction and project a partial image of the pattern on the first substrate onto the second substrate, respectively. When,
In order to control the exposure width in the direction crossing the scanning direction, a part of the exposure light that is disposed at the end in the direction crossing the scanning direction and passes through the partial projection optical system in the first row, or the second A light shielding member provided to limit a part of the exposure light through the partial projection optical system of the row;
A drive unit for driving the light shielding member in a direction intersecting the scanning direction;
An exposure apparatus comprising:   The exposure apparatus according to claim 1, wherein the light shielding member is located in the vicinity of the first surface.   The light shielding member is disposed between the first substrate and the partial projection optical system of the first row or the second row, or between the first substrate and an illumination system that illuminates the first substrate. The exposure apparatus according to claim 2, wherein the exposure apparatus is provided.   2. The light-shielding member is located in the vicinity of the second surface and is located between the second substrate and the partial projection optical system in the first row or the second row. Exposure equipment.   The light shielding member is supported by a guide member disposed between the partial projection optical system in the first row and the partial projection optical system in the second row. The exposure apparatus according to any one of the above. It is arranged between the light source unit that emits the exposure light and the partial projection optical system of the first row or the partial projection optical system of the second row, and the partial projection optical system of the first row or the second row Corresponding to each partial projection optical system constituting the partial projection optical system, a shutter for shielding exposure light incident on each partial projection optical system is provided,
6. The exposure apparatus according to claim 1, wherein the shutter controls the exposure light to be blocked based on a moving position of the light blocking member. The light shielding member includes a first light shielding member and a second light shielding member,
The driving unit includes a first driving unit that drives the first light shielding member in a direction that intersects the scanning direction, and a second driving unit that drives the second light shielding member in a direction that intersects the scanning direction. The exposure apparatus according to any one of claims 1 to 6, wherein the exposure apparatus includes:   8. The first light shielding member is disposed so as to define one of the exposure widths, and the second light shielding member is disposed so as to define the other of the exposure widths. Exposure device.   A stopper is disposed between the partial projection optical system of the first row and the partial projection optical system of the second row, and prevents a collision between the first light shielding member and the second light shielding member. An exposure apparatus according to claim 7 or claim 8.   The stopper is provided on the second light shielding member side of the first light shielding member so as to protrude from the front end portion of the first light shielding member, and the second light shielding member on the first light shielding member side of the second light shielding member. The exposure apparatus according to claim 9, wherein the exposure apparatus is provided so as to protrude from a front end portion of the exposure apparatus. A method of manufacturing a microdevice using the exposure apparatus according to any one of claims 1 to 10,
An exposure step of exposing the pattern image of the mask onto the photosensitive substrate;
A development step of developing the photosensitive substrate exposed by the exposure step;
A method for manufacturing a microdevice, comprising:

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