JP2007108559A - Scanning exposure apparatus and method for manufacturing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a scanning exposure apparatus using a variable forming mask and capable of performing an exposure process at high throughput. <P>SOLUTION: The scanning exposure apparatus is equipped with a variable forming mask to form a desired pattern, a substrate stage PST to mount a photosensitive substrate P, and an exposure optical system B1, B2 to expose the photosensitive substrate P to a light beam from the variable forming mask so as to transfer an image onto the substrate, and functions to transfer a pattern by exposure to the photosensitive substrate P by relatively scanning the substrate stage PST and the variable forming mask. The apparatus is characterized in that: the variable forming mask has a first variable forming mask and a second variable forming mask; the exposure optical system B1, B2 include a first exposure optical system B1 corresponding to the first variable forming mask, and a second exposure optical system B2 different from the first optical system B1 and disposed corresponding to the second optical system; and the first exposure optical system B1 and the second exposure optical system B2 are placed in a front-back positional relation along the scanning direction keeping a predetermined distance with respect to the scanning direction. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a scanning exposure apparatus for manufacturing a microdevice such as a flat panel display element such as a liquid crystal display element in a lithography process and a device manufacturing method using the scanning exposure apparatus.

  When manufacturing a liquid crystal display element or the like, which is one of micro devices, a mask (reticle, photomask, etc.) pattern is coated with a photoresist (glass plate, semiconductor wafer, etc.) via a projection optical system. A projection exposure apparatus that performs projection exposure on top is used.

  Conventionally, step-and-repeat type projection exposure apparatuses (steppers) that collectively expose a mask pattern to each shot area on a plate have been widely used. In recent years, instead of using one large projection optical system, a plurality of small projection optical units are arranged in a plurality of rows at predetermined intervals along the scanning direction, and the mask stage and the substrate stage are synchronously scanned, There has been proposed a step-and-scan projection exposure apparatus that continuously exposes a mask pattern on a plate in a projection optical unit (see Patent Document 1).

Japanese Patent Laid-Open No. 7-57986

  By the way, the plate has been enlarged with the increase in the size of the liquid crystal display element. Currently, a plate of 1 m square or more is used, and the mask is also enlarged. If the pattern rule of the device required for the exposure apparatus is constant, the large mask needs to have the same flatness as the small mask. Therefore, the deflection and undulation of the large mask can be compared with the deflection and undulation of the small mask. In order to keep the same level, it is necessary to make the thickness of the large mask significantly larger than that of the small mask. In general, a mask used in a TFT is high-cost quartz glass. Therefore, if the size is increased, the manufacturing cost increases. Furthermore, the cost for maintaining the flatness of the mask, the cost due to the expansion of the inspection time of the mask pattern, and the like are increasing.

  Therefore, a maskless exposure apparatus that exposes a pattern on a substrate using DMD or the like instead of a mask has been proposed. In this maskless exposure apparatus, it is desired to expose a large plate with high throughput.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a scanning exposure apparatus using a variable formation mask, which can perform exposure with high throughput, and a device manufacturing method using the scanning exposure apparatus. It is.

  The scanning exposure apparatus of the present invention comprises a variable shaping mask (8) for forming an arbitrary pattern, a substrate stage (PST) for placing a photosensitive substrate (P), and a light beam from the variable shaping mask (8). And an exposure optical system (LG1, LG2) for exposing an image on the photosensitive substrate (P), and scanning the substrate stage (PST) relative to the exposure optical system (LG1, LG2). In the scanning exposure apparatus that exposes a predetermined pattern on the photosensitive substrate (P), the variable shaping mask (8) includes a first variable shaping mask (8) and a second variable shaping mask, and the exposure. Unlike the first exposure optical system (LG1) and the second exposure optical system (LG1), the optical system (LG1, LG2) is different from the first exposure optical system (LG1) provided corresponding to the first variable shaping mask (8). Provided for variable molding masks A second exposure optical system (LG2), and the first exposure optical system (LG1) and the second exposure optical system (LG2) have a predetermined interval with respect to the scanning direction. It is characterized by being arranged in a front-rear positional relationship.

  Further, the device manufacturing method of the present invention includes an exposure step (S303) in which the predetermined pattern is exposed on the photosensitive substrate (P) using the scanning exposure apparatus of the present invention, and exposure by the exposure step (S303). And a developing step (S304) for developing the photosensitive substrate (P).

  Further, the device manufacturing method of the present invention is a device manufacturing method for manufacturing a plurality of devices on a photosensitive substrate (P), wherein the variable molding mask (8) corresponds to the plurality of devices on the photosensitive substrate (P). ), An exposure step (S303) in which a predetermined pattern is exposed on the photosensitive substrate (P) by a light beam from the plurality of variable shaping masks (8), and the exposure step (S303) It includes a developing step (S304) for developing the photosensitive substrate (P), and a cutting step for cutting the photosensitive substrate (P) into a plurality of devices.

  According to the scanning exposure apparatus of the present invention, the first exposure optical system and the second exposure optical system that are arranged in a positional relationship before and after the scanning direction with a predetermined interval with respect to the scanning direction are provided. Therefore, the photosensitive substrate can be exposed simultaneously by the first exposure optical system and the second exposure optical system. Therefore, exposure can be performed with high throughput as compared with the conventional exposure apparatus.

  Further, according to the device manufacturing method of the present invention, since exposure is performed by the scanning exposure apparatus of the present invention, exposure can be performed with high throughput and a good device can be obtained.

  A scanning exposure apparatus according to a first embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing a schematic configuration of a scanning exposure apparatus according to the first embodiment. In the following description, the orthogonal coordinate system shown in FIG. 1 is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. The XYZ orthogonal coordinate system is set so that the X axis and the Y axis are parallel to the plate P, and the Z axis is set in a direction orthogonal to the plate P. In the XYZ coordinate system in the figure, the XY plane is actually set to a plane parallel to the horizontal plane, and the Z axis is set to the vertical direction.

  This scanning exposure apparatus exposes a plate stage (substrate stage) PST on which a flat panel display plate P having an outer diameter larger than 500 mm is placed, and an arbitrary pattern on the plate P accommodated in the housing B1. The first exposure optical system LG1 (see FIG. 2), the second exposure optical system LG2 (see FIG. 2) that is accommodated in the housing B2 and exposes an arbitrary pattern on the plate P, and the operations related to the exposure process are integrated. And a control device CONT (see FIG. 8) for controlling the plate stage PST to scan the plate stage PST in the X direction relative to the first exposure optical system LG1 and the second exposure optical system LG2 to form a predetermined pattern on the plate P. Is a step-and-scan scanning projection exposure apparatus for exposing Note that the outer diameter being larger than 500 mm means that one side or diagonal of the plate P is larger than 500 mm.

  2 shows the configurations of the first exposure optical system LG1, the alignment systems AL1 to AL6, and the autofocus systems AF1 to AF6 housed in the housing B1 shown in FIG. 1, and the housing B2 shown in FIG. It is a figure which shows the structure of 2nd exposure optical system LG2, alignment system AL7-AL12, and autofocus system AF7-AF12 being performed.

  The first exposure optical system LG1 includes a plurality of exposure optical units L1 to L13 for exposing an arbitrary pattern on the plate P. The exposure optical units L1 to L13 are arranged in a staggered manner with respect to the Y direction (non-scanning direction). The first exposure optical system LG1 (exposure optical units L1 to L13) is configured to be movable in the X direction (scanning direction) by driving a first optical system driving unit (moving mechanism, see FIG. 8) 78. . The exposure optical units L1, L3, L5, L7, L9, L11, and L13 are arranged on the rear side (−X direction side) in the scanning direction and in the Y direction (direction perpendicular to the scanning direction). . The exposure optical units L2, L4, L6, L8, L10, and L12 are arranged in the Y direction on the front side (+ X direction side) in the scanning direction.

  In addition, the second exposure optical system LG2 different from the first exposure optical system LG1 includes a plurality of exposure optical units L21 to L33 for exposing an arbitrary pattern on the plate P. The exposure optical units L21 to L33 are arranged in a staggered manner with respect to the Y direction (non-scanning direction). The second exposure optical system LG2 is arranged in a positional relationship on the front side (+ X direction side) in the X direction with a predetermined interval with respect to the X direction (scanning direction) with respect to the first exposure optical system. The second exposure optical system LG2 (exposure optical units L21 to L33) is configured to be movable in the X direction by driving a second optical system drive unit (moving mechanism, see FIG. 8) 80. The exposure optical units L21, L23, L25, L27, L29, L31, and L33 are arranged on the rear side (−X direction side) in the scanning direction and in the Y direction (direction orthogonal to the scanning direction). . The exposure optical units L22, L24, L26, L28, L30 and L32 are arranged in the Y direction on the front side in the scanning direction.

  The relative distance in the X direction between the first exposure optical system LG1 and the second exposure optical system LG2 is changed by moving at least one of the first exposure optical system LG1 and the second exposure optical system LG2 in the X direction. be able to. The relative position between the first exposure optical system LG1 and the second exposure optical system LG2 is measured by a laser interference system described later, and the distance between the first exposure optical system LG1 and the second exposure optical system LG2 is the X direction of the plate P ( It is set between 1/3 and 2/3 of the length in the scanning direction). The distance between the first exposure optical system LG1 and the second exposure optical system LG2 is, for example, according to the number of divisions of the device pattern formed on the plate P, for example, the first exposure optical system LG1 and the second exposure optical system LG2. Is adjusted by moving at least one of them in the X direction using a moving mechanism.

  FIG. 3 is a view showing a schematic configuration of the exposure optical unit L1. A light beam emitted from an LD light source unit (not shown) enters the fiber 2. The light beam incident on the fiber 2 exits from the exit end of the fiber 2 and uniformly passes through a collimating optical system 4 and a mirror 6 to a DMD (Digital Micromirror Device or Deformable Micromirror Device) 8 constituting the exposure optical unit L1. Illuminate. The DMD 8 may be provided separately from the exposure optical unit L1.

  FIG. 4 is a diagram illustrating the configuration of the DMD 8. The DMD 8 has a large number of micromirrors 8a as devices divided into minute regions. Each of the micromirrors 8a is configured such that its angle can be changed independently. The DMD 8 changes the angle of each micromirror 8a to change the light beam in accordance with predetermined image data (first shaping mask). It functions as a variable molding mask, variable molding mask unit). That is, in synchronization with the scanning of the plate P, the angles of some of the micromirrors 8a are changed so that the reflected light is guided to the relay optical system 10 described later, and the reflected light travels in a different direction from the relay optical system 10. In this way, by changing the angle of the other micromirror 8a, an arbitrary pattern projected onto the corresponding exposure region is sequentially generated.

  The light beam reflected by the DMD 8 (a part of the micromirrors 8 a) enters the relay optical system 10. The light beam emitted from the relay optical system 10 is enlarged and incident on the microlens array 16. FIG. 5 is a diagram showing a partial configuration of the microlens array 16 and a point image field stop 18 described later. The microlens array 16 has a large number of element lenses 16a corresponding to the respective micromirrors 8a constituting the DMD 8, and is arranged at a position optically conjugate with the plate P or in the vicinity thereof. The microlens array 16 is configured to be tiltable with respect to the XY plane.

  The light beam that has passed through each element lens 16 a of the microlens array 16 passes through the point image field stop 18. The point image field stop 18 has a large number of openings 18 a provided corresponding to the element lenses 16 a constituting the microlens array 16. By passing through each opening 18a of the point image field stop 18, it is possible to prevent adverse effects on the exposure due to the ghost generated in the exposure optical unit L1 and the image flow generated when the DMD 8 is turned on and off.

  The other exposure optical units L2 to L13 and the exposure optical units L21 to L33 constituting the second exposure optical system are also DMD (first and second variable shaping masks), a relay optical system, a microlens array, and a point image field. The DMD, the relay optical system, the micro lens array, and the point image field stop have the same configuration as the DMD 8, the relay optical system 10, the micro lens array 16, and the point image field stop 18.

  As shown in FIG. 3, the light beam that has passed through each opening 18a of the point image field stop 18 enters the projection optical system PL1. FIG. 6 is a diagram showing a configuration of the projection optical system PL1 constituting the exposure optical unit L1 and the projection optical system PL2 constituting the exposure optical unit L2. The light beam incident on the projection optical system PL1 enters the focus adjustment mechanism 20 constituting the projection optical system PL1. The focus adjustment mechanism 20 includes a first optical member 20a and a second optical member 20b. The first optical member 20a and the second optical member 20b are glass plates that are formed in a wedge shape and can pass through the optical boom, and constitute a pair of wedge-shaped optical members. The first optical member 20a and the second optical member 20b are configured to be relatively movable. By moving the first optical member 20a so as to slide in the X direction with respect to the second optical member 20b, the image plane position of the projection optical system PL1 moves in the Z direction.

  The light beam that has passed through the focus adjustment mechanism 20 enters the shift adjustment mechanism 22. The shift adjustment mechanism 22 includes a parallel flat glass plate 22a configured to be rotatable about the Y axis and a parallel flat glass plate 22b configured to be rotatable about the X axis. As the plane parallel glass plate 22a rotates around the Y axis, the pattern image on the plate P shifts in the X axis direction. As the plane parallel glass plate 22b rotates around the X axis, the pattern image on the plate P shifts in the Y axis direction.

  The light beam that has passed through the shift adjustment mechanism 22 enters a right-angle prism 24 as a rotation adjustment mechanism. The right-angle prism 24 is configured to be rotatable around the Z axis. As the right-angle prism 24 rotates around the Z axis, the pattern image on the plate P rotates around the Z axis. The light beam reflected by the right-angle prism 24 is reflected by the mirror 28 via the lens group 26. The light beam reflected by the mirror 28 enters the magnification adjusting mechanism 30 through the lens group 26 and the right-angle prism 24 again.

  The magnification adjustment mechanism 30 includes three lenses 30a, 30b, and 30c. The three lenses 30a to 30c are composed of, for example, a concave lens 30a, a convex lens 30b, and a concave lens 30c, and the magnification of the pattern image formed on the plate P can be adjusted by moving the convex lens 30b in the Z direction. . The light beam that has passed through the magnification adjusting mechanism 30 forms a predetermined pattern image in a predetermined exposure area on a flat panel display plate P having an outer diameter larger than 500 mm. Note that the projection optical systems constituting the other exposure optical units L2 to L13 and L21 to L33 (hereinafter referred to as projection optical systems PL2 to PL13 and PL21 to PL33) have the same configuration as the projection optical system PL1.

  As shown in FIG. 1, the plate stage PST on which the plate P is placed is provided on a base 34 supported by a vibration isolation table 32a, 32b and a vibration isolation table (not shown) (hereinafter referred to as a vibration isolation table 32c). It has been. Three or more anti-vibration bases 32a to 32c are usually installed so as not to transmit external vibration to the exposure apparatus. The plate stage PST is configured to be movable in the scanning direction (X direction) by the linear motor 36, and has a so-called air stage configuration that floats with respect to the guide 37 with an air gap. Further, the plate stage PST is configured to be movable in a small amount in the Y direction and the Z direction.

  The scanning exposure apparatus also includes a laser interference system (measuring unit) that measures the position of the plate stage PST. FIG. 7 is a diagram showing the configuration of the laser interference system. The laser interference system includes an X laser interferometer 38 that measures the position of the plate stage PST in the X direction, and a Y laser interferometer (not shown) that measures the position of the plate stage PST in the Y direction. An X moving mirror 40 is provided at the −Y side edge of the −X side of the plate stage PST, and a Y moving mirror 42 extending in the X direction is provided at the −Y side edge of the plate stage PST. Yes.

  A first X reference mirror 39a is provided at the −Y side end of the housing B1 that houses the first exposure optical system LG1, etc., and the −Y side of the housing B2 that houses the second exposure optical system LG2, etc. Is provided with a second X reference mirror 39b. The first X reference mirror 39a and the second X reference mirror 39b are installed so that two reference lights E2 and E3 described later do not interfere with each other. That is, the first X reference mirror 39a is provided on the lower side (−Z side) of the housing B1, and the second X reference mirror 39b is provided on the upper side (+ Z side) of the housing B2. Further, a first Y reference mirror (not shown) is provided at the −Y side end of the housing B1, and a second Y reference mirror is provided at the −Y side end of the housing B2.

  The X laser interferometer 38 irradiates the X moving mirror 40 with the measurement beam E1 and irradiates the first X reference mirror 39a and the second X reference mirror 39b with reference beams E2 and E3, respectively. Reflected light from each of the X moving mirror 40, the first X reference mirror 39a, and the second X moving mirror 39b based on the irradiated length measuring beam E1 and reference beams E2 and E3 is received by the light receiving unit of the X laser interferometer 38. The X laser interferometer 38 detects the interference light, and based on the detection result, the amount of change in the optical path length of the measuring beam E1 with reference to the optical path lengths of the reference beams E2 and E3, and thus the first X reference mirror 39a and The position (coordinates) of the X movable mirror 40 with respect to the second X reference mirror 39b is measured. The control device CONT obtains the position in the X direction of the plate stage PST with respect to the first exposure optical system LG1 and the second exposure optical system LG2 based on the measurement result. Further, the control device CONT has the first exposure optical system LG1 based on the position of the plate stage PST in the X direction relative to the first exposure optical system LG1 and the position of the plate stage PST in the X direction relative to the second exposure optical system LG2. The relative position in the X direction with respect to the second exposure optical system LG2 is obtained.

  The laser interference system includes an X movable mirror (not shown) at the −Y side + Y side edge of the plate stage PST, an X reference mirror (not shown) at the + Y side end of the housing B1, and the + Y side of the housing B2. An X reference mirror (not shown) is provided at the end. The X laser interferometer 38 irradiates the length measurement beam to the X moving mirror and the reference beam to each X reference mirror, detects the interference light, and based on the detection result, the X movement (not shown) based on each X reference mirror Measure the position (coordinates) of the mirror.

  A Y laser interferometer (not shown) irradiates the Y moving mirror 42 with a measurement beam and irradiates a reference beam to each of the first and second Y reference mirrors (not shown). Reflected light from the Y moving mirror 42 and the first and second Y reference mirrors based on the irradiated measurement beam and reference beam is received by the Y laser interferometer. The Y laser interferometer detects the interference light, and based on the detection result, the amount of change in the optical path length of the length measurement beam based on the optical path length of the reference beam, and hence the Y based on the first and second Y reference mirrors The position (coordinates) of the movable mirror 42 is measured. The control device CONT obtains the position of the plate stage PST in the Y direction with respect to the first exposure optical system LG1 and the second exposure optical system LG2 based on the measurement result.

  Further, as shown in FIG. 2, the scanning exposure apparatus includes a plurality of alignment systems AL1 on the rear side (−X direction side) in the scanning direction of the first exposure optical system LG1 (exposure optical units L1 to L13). A first alignment group provided with AL6 and autofocus systems AF1 to AF6 are provided. The alignment systems AL1 to AL6 and the autofocus systems AF1 to AF6 are arranged in the Y direction (direction perpendicular to the scanning direction) so as to correspond to the first exposure optical system LG1.

  Further, this scanning exposure apparatus includes a second alignment having a plurality of alignment systems AL7 to AL12 on the rear side (−X direction side) in the scanning direction of the second exposure optical system LG2 (exposure optical units L21 to L33). Auto focus systems AF7 to AF12 for detecting the position of the group and the plate P in the Z direction are provided. The alignment systems AL7 to AL12 and the autofocus systems AF7 to AF12 are separated from the alignment systems AL1 to AL6 and the autofocus systems AF1 to AF6 in the Y direction (direction perpendicular to the scanning direction), and are aligned in the Y direction to perform second exposure. They are arranged so as to correspond to the optical system LG2.

  The first alignment group (second alignment group) is the first exposure on the plate P when the second and subsequent layers are exposed by the first exposure optical system LG1 (second exposure optical system LG2). The position of the alignment mark near the device pattern to be exposed is measured by the optical system LG1 (second exposure optical system LG2). The measurement result of the first alignment group (second alignment group) is output to the control device CONT, and the control device CONT performs exposure by the first exposure optical system LG1 (second exposure optical system LG2) based on the measurement result. The position of the device pattern to be detected is detected. When the device pattern is misaligned, the controller CONT adjusts or projects the image position by correcting pattern data formed by the DMD included in the exposure optical systems L1 to L13 (L21 to L33). The image position is adjusted using a shift adjustment mechanism or a right-angle prism (rotation adjustment mechanism) provided in the optical systems PL1 to PL13 (PL21 to PL33).

  The autofocus systems AF1 to AF6 (AF7 to AF12) measure the position in the Z direction of the device pattern formed on the plate P and exposed by the first exposure optical system LG1 (second exposure optical system LG2). The measurement results by the autofocus systems AF1 to AF6 (AF7 to AF12) are output to the control device CONT, and the control device CONT projects the projection optical systems PL1 to PL13 (PL21 to PL21) when the focus position shifts. The image position is adjusted using a focus adjustment mechanism provided in PL33).

  Further, a reference member 44 having a plurality of AIS marks arranged in the Y direction is provided at the end portion in the −X direction of the plate stage PST. An aerial image measurement sensor (AIS) is provided below the reference member 44, and the aerial image measurement sensor is embedded in the plate stage PST.

  The aerial image measurement sensor is used to obtain the relationship between the position of each DMD and the position at which the image of the transfer pattern formed by each DMD is projected on the plate P. That is, the plate stage PST is moved so that the fiducial mark formed by the DMD and the AIS mark coincide with each other, and the fiducial mark image and the AIS mark are detected by the aerial image measurement sensor. And the position at which the image of the transfer pattern formed by the DMD is projected onto the plate P is obtained. In this case, the reference mark formed by the DMD is stored in a pattern storage unit 74 (see FIG. 8) described later, and the positions of the plate stage PST are the X laser interferometer 38 and the Y laser interferometer. Is detected.

  FIG. 8 is a block diagram showing the system configuration of the scanning exposure apparatus according to this embodiment. As shown in FIG. 8, the scanning exposure apparatus includes a control unit CONT that comprehensively controls operations related to exposure processing. A DMD driving unit (first driving unit) 60 that individually drives each micromirror 8a of the DMD 8 is connected to the control device CONT. Similarly, the control device CONT includes a DMD driving unit (not shown) that individually drives each micromirror of the DMD constituting the exposure optical systems L2 to L13, and the exposure optical systems L21 to L21 constituting the second exposure optical system LG2. A DMD driving unit (second driving unit, not shown) for individually driving each micromirror of the DMD constituting the L33 is connected. Further, a lens array driving unit 62 that drives the microlens array 16 is connected to the control device CONT. Similarly, a lens array driving unit (not shown) for driving the microlens array constituting the exposure optical systems L2 to L13 is connected to the control device CONT.

  The control device CONT includes a focus adjustment mechanism drive unit 64 that drives the focus adjustment mechanism 20, a shift adjustment mechanism drive unit 66 that drives the shift adjustment mechanism 22, a right-angle prism drive unit 68 that drives the right-angle prism 24, and a magnification adjustment. A magnification adjusting mechanism driving unit 70 for driving the mechanism 30 is connected. Similarly, a focus adjustment mechanism drive unit (not shown) that drives the focus adjustment mechanism that constitutes each of the projection optical systems PL2 to PL13, PL21 to PL33, and a shift adjustment mechanism drive unit (not shown) that drives the shift adjustment mechanism. A right-angle prism driving section for driving the right-angle prism and a magnification adjusting mechanism driving section for driving the magnification adjusting mechanism are connected.

  Further, the control device CONT is connected with a first optical system drive unit 78 that moves the first exposure optical system LG1 in the X direction and a second optical system drive unit 80 that moves the second exposure optical system LG2 in the X direction. ing. Further, the control device CONT is connected to a plate stage driving unit 72 that moves the plate stage PST along the X direction that is the scanning direction and moves it slightly in the Y direction and the Z direction.

  In addition, alignment systems AL1 to AL12, autofocus systems AF1 to AF12, an aerial image measurement sensor, an X laser interferometer 38, and a Y laser interferometer are connected to the control device CONT. The control device CONT is connected to a pattern storage unit 74 that stores a transfer pattern formed in the DMD 8 and a reference mark used for alignment and aerial image measurement. Further, an exposure data storage unit 76 that stores exposure data is connected to the control device CONT.

  In the scanning exposure apparatus according to this embodiment, the micromirror 8a of the DMD 8, each element lens 16a of the microlens array 16, and each opening 18a of the point image field stop 18 are in the X and Y directions in the XY plane. Are arranged two-dimensionally in a direction parallel to the. When scanning exposure is performed in a state where each light beam that has passed through each opening 18a of the point image field stop 18 reaches a position parallel to the X direction and the Y direction, a linear pattern parallel to the X direction is formed. However, a linear pattern parallel to the Y direction cannot be formed. Therefore, for example, the microlens array 16 and the point image field stop 18 are installed by rotating by a predetermined angle α around the Z axis so that a linear pattern parallel to the Y direction can be exposed, as shown in FIG. In addition, the light beam that has passed through each opening 18 a of the rotated point image field stop 18 is allowed to reach the plate P. At this time, the angles of the micromirrors 8 a of the DMD 8 are adjusted so as to correspond to the element lenses 16 of the microlens array 16 and the openings 18 a of the point image field stop 18. When scanning exposure is performed in this state, a linear pattern parallel to the X direction and the Y direction can be formed.

  The control device CONT adjusts the angle of each micromirror of the DMD by rotating the microlens array and the point image field stop included in each of the other exposure optical units L2 to L13 with respect to the Z axis, or The right angle prism is driven to rotate about the Z axis. In this way, the light beam that has passed through each opening of the point image field stop 18 is rotated by a predetermined angle α around the Z axis in the same manner as the light beam that has passed through each opening 18a of the point image field stop 18. To reach P.

  Next, the exposure operation of the scanning exposure apparatus according to this embodiment will be described. First, as shown in FIG. 10, a description will be given of a case where exposure is performed on a plate P having a length of 2400 mm in the X direction in which four device patterns P1 to P4 are formed. By moving the plate P in the −X direction from the position shown in FIG. 10, the second exposure optical system LG2 moves to the device pattern P2, while the first exposure optical system LG1 performs exposure of the device patterns P1 and P3. P4 exposure is performed.

  Here, for comparison, information on the exposure operation (scan length, scan time, scan speed, exposure amount, per 150 mm) when the plate P is exposed by the scanning exposure apparatus having one exposure optical system. The table of FIG. 11 shows time, required illuminance, field area, required power, position resolution, and DMD response. In addition, the table of FIG. 12 shows information of the exposure operation of the first exposure optical system LG1 or the second exposure optical system LG2 according to this embodiment. Information on the exposure operation is stored in the exposure data storage unit 76. The scan length and scan time are half of the scan length and scan time shown in the table of FIG. That is, since the exposure of the plate P is performed by the two exposure optical systems LG1 and LG2, the exposure can be performed in half the scanning time compared to the exposure of the plate P by one exposure optical system. , Improve throughput.

  The table in FIG. 13 shows information on the exposure operation when the position resolution of the first exposure optical system LG1 or the second exposure optical system LG according to this embodiment is increased. That is, the position resolution is higher than the position resolution shown in FIG. In this case, exposure is performed with half the amount of illuminance (required illuminance) and power (required power). Even when the position resolution is increased, the throughput can be improved as compared with the case where the exposure of the plate P is performed by one exposure optical system.

  The table of FIG. 14 shows information on the exposure operation when it is necessary to increase the exposure amount due to the sensitivity of the resist applied on the plate P. That is, the exposure amount is twice the exposure amount shown in FIG. Compared to the exposure of the plate P by one exposure optical system, the exposure can be performed satisfactorily without reducing the throughput until the exposure amount is doubled.

  Next, as shown in FIGS. 15 to 17, a case will be described in which exposure is performed on a plate P having a length of 2400 mm in the X direction in which six device patterns P5 to P10 are formed. When exposing the same pattern to the device patterns P5 to P10, the control device CONT has a pattern storage unit 74 for the DMD driving unit of the first exposure optical system LG1 and the DMD driving unit of the second exposure optical system LG2. The same exposure pattern data stored in is output. At this time, the pattern exposed by the first exposure optical system LG1 and the second exposure optical system LG2 is the same, but the time for exposing the pattern on each device is different.

  By moving the plate P in the −X direction from the position shown in FIG. 15, the first exposure optical system LG1 starts exposure of the device patterns P5 and P6. At this time, the second exposure optical system LG2 does not start exposure. That is, the DMD driving unit provided in each of the exposure optical systems L1 to L13 constituting the first exposure optical system turns on or off the light beam from each DMD based on a control signal from the control device CONT. On the other hand, the DMD driving unit provided in each of the exposure optical systems L21 to L33 constituting the second exposure optical system LG2 turns off the light beam from each DMD based on a control signal from the control device CONT. In this manner, the light beams from the DMDs included in the exposure optical systems L1 to L13 and L21 to L33 can be individually turned on and off.

  When the exposure by the first exposure optical system LG1 is completed to the position shown in FIG. 16, that is, when the second exposure optical system LG2 reaches the exposure start position of the device patterns P7 and P10, the second exposure optical system LG2 Exposure of the patterns P7 and P10 is started. When the second exposure optical system LG2 starts exposure, exposure by the first exposure optical system LG1 and the second exposure optical system LG2 can be performed simultaneously.

  When the exposure of the device patterns P7 and P10 by the second exposure optical system LG2 is completed, that is, when the first exposure optical system LG1 and the second exposure optical system LG2 reach the position shown in FIG. 17, the second exposure optical system LG2 Ends the exposure, and the first exposure optical system LG1 continues the exposure of the device patterns P6 and P9. When the first exposure optical system LG1 finishes the exposure of the device patterns P6 and P9, the exposure of the entire plate P is finished.

  The table of FIG. 18 shows information on the exposure operation of the first exposure optical system LG1 or the second exposure optical system LG2. The scan length and scan time are 2/3 of the scan length and scan time shown in the table of FIG. Compared with exposure of six device patterns P5 to P10 by one exposure optical system, four device patterns P5, P6, P8, P9 by the first exposure optical system LG1, and 2 by the second exposure optical system LG2. Since the exposure of the two device patterns P7 and P10 is performed, the scan time can be shortened to 2/3, and the throughput is improved.

  The table in FIG. 19 shows information on the exposure operation when the position resolution of the first exposure optical system LG1 or the second exposure optical system LG is increased. That is, the position resolution is higher than the position resolution shown in FIG. In this case, exposure is performed with illuminance (required illuminance) and power (required power) of 2/3. Even when the position resolution is increased, the throughput can be improved as compared with the case where the exposure of the plate P is performed by one exposure optical system.

  The table of FIG. 20 shows information on the exposure operation when it is necessary to increase the exposure amount due to the sensitivity of the resist applied on the plate P. That is, the exposure amount is 3/2 times the exposure amount shown in FIG. Compared with the exposure of the plate P by one exposure optical system, the exposure can be performed satisfactorily without reducing the throughput until the exposure amount becomes 3/2 times.

  According to the scanning exposure apparatus of this embodiment, the first exposure optical system and the second exposure optical system that are arranged in a positional relationship before and after the scanning direction with a predetermined interval with respect to the scanning direction. Since it is provided, the plate can be exposed simultaneously by the first exposure optical system and the second exposure optical system. Therefore, the throughput can be improved when exposure is performed with the same exposure amount as that of the conventional exposure apparatus, and the exposure amount can be increased when exposure is performed with the same throughput as that of the conventional exposure apparatus.

  In the scanning exposure apparatus according to this embodiment, the plate stage PST is configured to be movable not only in the X direction but also in the Y direction, and at least one of the first exposure optical system LG1 and the second exposure optical system LG2. A rotation mechanism that rotates the plate in the in-plane direction of the plate P may be provided. For example, when the device patterns formed on the plate P are P1 to P4 as shown in FIG. 21, the first exposure optical system LG1 exposes the device pattern P1 by moving the plate P in the −X direction. While performing the above, the second exposure optical system LG2 exposes the device pattern P2. Further, by moving the plate P stepwise in the + Y direction and moving in the + X direction, the first exposure optical system LG1 performs exposure of the device pattern P3, and the second exposure optical system LG2 performs exposure of the device pattern P4.

  Here, for example, when the device pattern formed on the plate P is P5 to P7 as shown in FIG. 22, the first exposure optical system LG1 and the second exposure optical system LG2 are rotated on the XY plane. It is more efficient to perform exposure by rotating the inside 90 degrees clockwise and moving the plate P in the Y direction. That is, the first exposure optical system LG1 and the second exposure optical system LG2 are rotationally moved from the broken line position to the solid line position in the drawing, and the plate P is moved in the + Y direction, so that the first exposure optical system LG1 has the device pattern P5. Exposure is performed, and the second exposure optical system LG2 exposes the device pattern P6. Further, the plate P is moved stepwise in the −X direction, and the first exposure optical system LG1 or the second exposure optical system LG2 performs exposure of the device pattern P7.

  In the scanning exposure apparatus according to this embodiment, the pattern image is formed on the plate P by the light beam via the point image field stop and the projection optical system, but as shown in FIG. A pattern image may be formed on the plate P by the light beam that has passed through the microlens array. In other words, the point image field stop and the projection optical system may be omitted. In this case, the apparatus main body can be downsized and reduced in cost.

  In the scanning exposure apparatus according to this embodiment, the exposure optical units include the first exposure optical system and the second exposure optical system arranged in two rows in a staggered manner. Two exposure optical systems arranged in a line in the Y direction may be provided.

  In the scanning exposure apparatus according to this embodiment, the first alignment group and the second alignment group are separated from each other in the Y direction. However, the alignment apparatus includes one alignment or one alignment group, and one alignment group. Alternatively, the position of the plate may be measured by one alignment group.

  In this embodiment, a predetermined pattern is scanned and exposed on the plate by moving the plate stage in the X direction. However, the first exposure optical system and the second exposure optical system are moved in the X direction. Thus, the pattern on the plate may be subjected to scanning exposure. In this case, it is preferable that the first exposure optical system and the second exposure optical system can be individually controlled to move. In this case, the stroke and footprint of the apparatus can be reduced, and the apparatus itself can be downsized.

  In this embodiment, two exposure optical systems are provided, but three or more exposure optical systems may be provided.

  In this embodiment, one exposure optical system performs exposure of the entire region of one device pattern formed on the plate P. However, two or more exposure optical systems have one device pattern. The predetermined area may be exposed.

  In the scanning exposure apparatus according to the above-described embodiment, a micropattern (exposure process) is performed by exposing a photosensitive pattern (plate) to a transfer pattern formed by a variable shaping mask using a projection optical system (exposure process). Semiconductor elements, imaging elements, liquid crystal display elements, thin film magnetic heads, etc.) can be manufactured. FIG. 24 shows an example of a technique for obtaining a semiconductor device as a micro device by forming a predetermined circuit pattern on a plate as a photosensitive substrate using the scanning exposure apparatus according to the above-described embodiment. This will be described with reference to the flowchart of FIG.

  First, in step S301 in FIG. 24, a metal film is deposited on one lot of plates. In the next step S302, a photoresist is applied on the metal film on the one lot of plates. Thereafter, in step S303, using the scanning exposure apparatus according to the above-described embodiment, an image of the pattern formed by the variable shaping mask is applied to each shot area on the one lot of plates via the projection optical system. Sequential exposure transfer is performed. After that, in step S304, the photoresist on the one lot of plates is developed, and in step S305, the resist pattern is used as an etching mask on the one lot of plates to form a variable molding mask. A circuit pattern corresponding to the formed pattern is formed in each shot region on each plate.

  Thereafter, the circuit pattern of the upper layer is formed and the like, and the plate is cut into a plurality of devices (cutting step) to manufacture a device such as a semiconductor element. According to the semiconductor device manufacturing method described above, since the exposure is performed using the exposure apparatus described above, a good semiconductor device can be obtained. In steps S301 to S305, a metal is vapor-deposited on the plate, a resist is applied on the metal film, and exposure, development and etching processes are performed. Prior to these processes, the process is performed on the plate. It is needless to say that after forming a silicon oxide film, a resist may be applied on the silicon oxide film, and steps such as exposure, development, and etching may be performed.

  In the scanning exposure apparatus according to the above-described embodiment, a liquid crystal display element as a micro device may be obtained by forming a predetermined pattern (circuit pattern, electrode pattern, etc.) on a plate (glass substrate). it can. Hereinafter, an example of the technique at this time will be described with reference to the flowchart of FIG. First, in FIG. 25, in the pattern formation step S401, the pattern formed by the variable molding mask is transferred to a photosensitive substrate (such as a glass substrate coated with a resist) using the scanning exposure apparatus according to the above-described embodiment. A so-called photolithographic process of exposing is performed. By this photolithography process, a predetermined pattern including a large number of electrodes and the like is formed on the photosensitive substrate. Thereafter, the exposed substrate undergoes steps such as a developing step, an etching step, and a resist stripping step, whereby a predetermined pattern is formed on the substrate, and the process proceeds to the next color filter forming step S402.

  Next, in the color filter forming step S402, a large number of groups of three dots corresponding to R (Red), G (Green), and B (Blue) are arranged in a matrix or three of R, G, and B A color filter is formed by arranging a plurality of stripe filter sets in the horizontal scanning line direction. Then, after the color filter formation step S402, a cell assembly step S403 is executed. In the cell assembly step S403, a liquid crystal panel (liquid crystal cell) is assembled using the substrate having the predetermined pattern obtained in the pattern formation step S401, the color filter obtained in the color filter formation step S402, and the like. In the cell assembly step S403, for example, liquid crystal is injected between the substrate having the predetermined pattern obtained in the pattern formation step S401 and the color filter obtained in the color filter formation step S402, and a liquid crystal panel (liquid crystal cell ).

  Thereafter, in a module assembly step S404, components such as an electric circuit and a backlight for performing a display operation of the assembled liquid crystal panel (liquid crystal cell) are attached to complete a liquid crystal display element. According to the above-described method for manufacturing a liquid crystal display element, since exposure is performed using the above-described exposure apparatus, a good liquid crystal display element can be obtained.

1 is a perspective view showing a schematic configuration of a scanning exposure apparatus according to an embodiment. It is a figure which shows the structure of the 1st and 2nd exposure optical system concerning embodiment. It is a figure which shows the structure of the exposure optical unit concerning Embodiment. It is a figure which shows the structure of DMD concerning Embodiment. It is a figure which shows the structure of a part of micro lens array and a point image field stop. It is a figure which shows the structure of the projection optical system concerning embodiment. It is a figure which shows the structure of the laser interference system concerning embodiment. 1 is a block diagram showing a system configuration of a scanning exposure apparatus according to an embodiment. It is a figure for demonstrating the position where the light beam which passed each opening part of the point image field stop concerning Embodiment reaches | attains on a plate. It is a figure which shows the positional relationship of the device pattern formed on a plate, and a 1st and 2nd exposure optical system. It is a table | surface which shows the information of the exposure operation | movement which exposes the plate whole surface with one exposure optical system. It is a table | surface which shows the information of the exposure operation | movement which exposes a plate by the 1st and 2nd exposure optical system. It is a table | surface which shows the information of the exposure operation | movement which exposes a plate by the 1st and 2nd exposure optical system. It is a table | surface which shows the information of the exposure operation | movement which exposes a plate by the 1st and 2nd exposure optical system. It is a figure which shows the positional relationship of the device pattern formed on a plate, and a 1st and 2nd exposure optical system. It is a figure which shows the positional relationship of the device pattern formed on a plate, and a 1st and 2nd exposure optical system. It is a figure which shows the positional relationship of the device pattern formed on a plate, and a 1st and 2nd exposure optical system. It is a table | surface which shows the information of the exposure operation | movement which exposes a plate by the 1st and 2nd exposure optical system. It is a table | surface which shows the information of the exposure operation | movement which exposes a plate by the 1st and 2nd exposure optical system. It is a table | surface which shows the information of the exposure operation | movement which exposes a plate by the 1st and 2nd exposure optical system. It is a figure which shows the positional relationship of the device pattern formed on a plate, and a 1st and 2nd exposure optical system. It is a figure which shows the positional relationship of the device pattern at the time of rotating a 1st and 2nd exposure optical system 90 degree | times in XY plane, and a 1st and 2nd exposure optical system. It is a figure which shows the structure of the other exposure optical unit concerning embodiment. It is a flowchart which shows the manufacturing method of the semiconductor device as a microdevice concerning embodiment of this invention. It is a flowchart which shows the manufacturing method of the liquid crystal display element as a microdevice concerning embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 2 ... Fiber, 4 ... Collimating optical system, 8 ... DMD, 10 ... Relay optical system, 16 ... Micro lens array, 18 ... Point image field stop, 20 ... Focus adjustment mechanism, 22 ... Shift adjustment mechanism, 24 ... Right angle prism, 30 ... Magnification adjustment mechanism, LG1 ... first exposure optical system, LG2 ... second exposure optical system, P ... plate, PST ... plate stage, CONT ... control device.

Claims (14)

A variable shaping mask that forms an arbitrary pattern; a substrate stage on which a photosensitive substrate is placed; and an exposure optical system that exposes an image on the photosensitive substrate by a light beam from the variable shaping mask; In a scanning exposure apparatus that exposes a predetermined pattern on the photosensitive substrate by scanning relative to the exposure optical system,
The variable shaping mask has a first variable shaping mask and a second variable shaping mask,
The exposure optical system includes a first exposure optical system provided corresponding to the first variable shaping mask, and a second exposure optical system provided corresponding to the second variable shaping mask unlike the first exposure optical system. Exposure optical system,
The scanning exposure apparatus, wherein the first exposure optical system and the second exposure optical system are arranged in a positional relationship before and after the scanning direction with a predetermined interval with respect to the scanning direction.   The first variable shaping mask and the second variable shaping mask are configured so that the light beams from the first variable shaping mask and the second variable shaping mask can be individually turned on and off. The scanning exposure apparatus according to claim 1. Measuring means for measuring a relative position between the first exposure optical system and the second exposure optical system;
The first driving unit that drives the first variable molding mask or the second driving unit that drives the second variable molding mask is controlled based on the measurement result of the measuring unit according to the pattern exposed to the photosensitive substrate. The scanning exposure apparatus according to claim 1 or 2, wherein   At least one exposure optical system of the first exposure optical system and the second exposure optical system includes a moving mechanism that changes a relative distance between the first exposure optical system and the second exposure optical system. The scanning exposure apparatus according to any one of claims 1 to 3, wherein the scanning exposure apparatus is characterized in that:   The moving mechanism includes a mechanism for rotating the at least one exposure optical system in an in-plane direction of the photosensitive substrate, and rotates the at least one exposure optical system so as to be able to scan in a direction crossing the scanning direction. 5. The scanning exposure apparatus according to claim 4, wherein: Comprising at least two alignment systems for measuring the position of a device pattern formed on the photosensitive substrate;
6. The scanning exposure apparatus according to claim 1, wherein the at least two alignment systems are arranged in a direction intersecting the scanning direction. A first alignment group in which the at least two alignment systems are arranged;
The first alignment group includes a second alignment group spaced apart in a direction intersecting the scanning direction and having the at least two alignment systems disposed thereon,
The first alignment group is arranged to correspond to the first exposure optical system,
The scanning exposure apparatus according to claim 6, wherein the second alignment group is disposed so as to correspond to the second exposure optical system.   The distance between the first exposure optical system and the second exposure optical system is 1/3 to 2/3 of the length of the photosensitive substrate in the scanning direction. The scanning exposure apparatus according to claim 7.   The scanning exposure apparatus according to any one of claims 1 to 8, wherein the photosensitive substrate has an outer diameter larger than 500 mm.   The first exposure optical system and the second exposure optical system respectively include a plurality of exposure optical units that expose a plurality of images on the photosensitive substrate and are arranged in a direction crossing the scanning direction. The scanning exposure apparatus according to claim 1, wherein the scanning exposure apparatus is characterized in that:   11. The scanning according to claim 10, wherein each of the first variable shaping mask and the second variable shaping mask includes a plurality of variable shaping mask units disposed so as to correspond to the plurality of exposure optical units. Mold exposure equipment. The photosensitive substrate is configured to be capable of forming a plurality of devices,
The scanning type according to any one of claims 1 to 11, wherein the first exposure optical system and the second exposure optical system expose different devices among the plurality of devices. Exposure device. An exposure step of exposing the predetermined pattern on a photosensitive substrate using the scanning exposure apparatus according to any one of claims 1 to 12,
And a development step of developing the photosensitive substrate exposed in the exposure step. In a device manufacturing method for manufacturing a plurality of devices on a photosensitive substrate,
Provide a plurality of variable molding masks corresponding to the plurality of devices on the photosensitive substrate,
An exposure step of exposing a predetermined pattern on the photosensitive substrate with a light beam from the plurality of variable shaping masks;
A development step of developing the photosensitive substrate exposed by the exposure step;
A device manufacturing method comprising: a cutting step of cutting the photosensitive substrate into a plurality of devices.

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