JP2007279113A - Scanning exposure apparatus and method for manufacturing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a scanning exposure apparatus that uses a variable forming mask and is capable of performing an exposure process at a high throughput. <P>SOLUTION: The scanning exposure apparatus is equipped with a variable forming mask for forming a predetermined pattern, a substrate stage PST to mount a photosensitive substrate P, and exposure optical system L1 to L3 to form an image on the photosensitive substrate P with a light beam from the variable forming mask so as to expose the substrate P to the predetermined pattern. The exposure optical systems L1 to L3, each have an optical member which deflects the traveling direction of the main light beam of the light beam from the variable forming mask, in a direction nearly orthogonal to the surface of the photosensitive substrate P. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a scanning exposure apparatus for manufacturing a microdevice such as a flat panel display element such as a liquid crystal display element in a lithography process and a device manufacturing method using the scanning exposure apparatus.

  In the case of manufacturing a liquid crystal display element, which is one of micro devices, a mask (reticle, photomask, etc.) pattern is applied via a projection optical system to a plate coated with a photoresist (glass plate, semiconductor wafer, etc.) A projection exposure apparatus that performs projection exposure on top is used.

Conventionally, step-and-repeat type projection exposure apparatuses (steppers) that collectively expose a mask pattern to each shot area on a plate have been widely used. In recent years, instead of using one large projection optical system, a plurality of small projection optical units are arranged in a plurality of rows at predetermined intervals along the scanning direction, and the mask stage and the substrate stage are synchronously scanned, There has been proposed a step-and-scan projection exposure apparatus that continuously exposes each mask pattern on a plate in a projection optical unit (see, for example, Patent Document 1).
Japanese Patent Laid-Open No. 7-57986

  By the way, the plate has been enlarged with the increase in the size of the liquid crystal display element. Currently, a plate of 1 m square or more is used, and the mask is also enlarged. If the pattern rule of the device required for the exposure apparatus is constant, the large mask needs to have the same flatness as the small mask. Therefore, the deflection and undulation of the large mask can be compared with the deflection and undulation of the small mask. In order to keep the same level, it is necessary to make the thickness of the large mask significantly larger than that of the small mask. In general, a mask used in a TFT is high-cost quartz glass. Therefore, if the size is increased, the manufacturing cost increases. Furthermore, the cost for maintaining the flatness of the mask, the cost due to the expansion of the inspection time of the mask pattern, and the like are increasing.

  In view of this, a maskless exposure apparatus has been proposed in which a pattern is exposed on a substrate using DMD or the like, which is an example of a variable shaping mask, instead of a mask. In this maskless exposure apparatus, it is desired to expose a large plate with high throughput.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a scanning exposure apparatus using a variable formation mask, which can perform exposure with high throughput, and a device manufacturing method using the scanning exposure apparatus. It is.

  The scanning exposure apparatus of the present invention comprises a variable shaping mask (8) for forming a predetermined pattern, a substrate stage (PST) for placing a photosensitive substrate (P), and a light beam from the variable shaping mask (8). And an exposure optical system (L1 to L3) that forms an image on the photosensitive substrate (P), and in the scanning exposure apparatus that exposes the predetermined pattern on the photosensitive substrate (P), the exposure optical system (L1 to L3) include an optical member (11) for deflecting the traveling direction so that the principal ray of the light beam from the variable shaping mask (8) is substantially orthogonal to the surface of the photosensitive substrate (P). It is characterized by that.

  The device manufacturing method of the present invention includes an exposure step (S303) in which a predetermined pattern is exposed on a photosensitive substrate (P) using the scanning exposure apparatus of the present invention, and the photosensitive layer exposed by the exposure step. And a developing step (S304) for developing the substrate (P).

  According to the scanning type exposure apparatus of the present invention, the optical exposure apparatus includes the optical members that deflect the traveling direction so that the principal rays of the light beams from the plurality of variable shaping masks are substantially orthogonal to the photosensitive substrate surface. With the light beam from the variable shaping mask, it is possible to form an exposure region that is continuous in a line on the photosensitive substrate. Accordingly, since it is not necessary to arrange a plurality of exposure optical units in the scanning direction as in the conventional scanning exposure apparatus, the scanning distance can be shortened during the scanning exposure, and the throughput is improved. Can do. In addition, the apparatus main body can be reduced in size.

  Further, in the conventional scanning exposure apparatus, there are splice errors in the exposure areas formed by the exposure optical units arranged in different rows along the scanning direction. Since the exposure areas formed by the variable shaping mask can be continued in a line, it is possible to prevent splicing errors and improve the splicing accuracy of the exposure areas formed by the variable shaping masks.

  Further, according to the device manufacturing method of the present invention, a device can be manufactured using the scanning exposure apparatus of the present invention, so that a good device can be obtained.

  A scanning exposure apparatus according to a first embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing a schematic configuration of a scanning exposure apparatus according to the first embodiment. In the first embodiment, a liquid crystal display is performed while relatively moving a flat panel display element plate P having an outer diameter larger than 500 mm with respect to the plurality of exposure optical units L1 to L3 constituting the exposure optical system. A step-and-scan type scanning projection exposure apparatus that transfers a pattern of elements and the like onto a plate P as a photosensitive substrate coated with a photosensitive material (resist) will be described as an example. Note that the outer diameter being larger than 500 mm means that one side or diagonal of the plate P is larger than 500 mm.

  In the following description, the orthogonal coordinate system shown in FIG. 1 is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. The XYZ orthogonal coordinate system is set so that the X axis and the Y axis are parallel to the plate P, and the Z axis is set in a direction orthogonal to the plate P. In the XYZ coordinate system in the figure, the XY plane is actually set to a plane parallel to the horizontal plane, and the Z axis is set to the vertical direction. In this embodiment, the direction in which the plate P is moved (scanning direction) is set to the X direction.

  This scanning exposure apparatus includes an exposure optical system for exposing a predetermined pattern on the plate P. The exposure optical system includes a plurality (three in this embodiment) of exposure optical units (partial exposure optical units). ) L1-L3. The plurality of exposure optical units L1 to L3 are arranged side by side in the Y direction (non-scanning direction).

  A light beam emitted from an LD light source (not shown) enters the fiber. In this embodiment, a plurality of LD light source units and fibers are provided corresponding to the exposure optical units L1 to L3. Note that one LD light source unit and one fiber may be provided, and the fiber may have a plurality of fiber exit ends corresponding to the exposure optical units L1 to L3.

  FIG. 2 is a view showing a schematic configuration of the exposure optical unit L1. A light beam emitted from an LD light source unit (not shown) and incident on the fiber 2 is emitted from the emission end of the fiber 2. The light beam emitted from the emission end of the fiber 2 uniformly illuminates a DMD (Digital Micromirror Device or Deformable Micromirror Device) 8 constituting the exposure optical unit L1 through the collimating optical system 4 and the mirror 6. The DMD 8 may be provided separately from the exposure optical unit L1.

  FIG. 3 is a diagram showing a configuration of a DMD (partially variable molding mask) 8. As shown in FIG. 3, the DMD 8 has a large number of micromirrors 8a as devices divided into minute regions. Each micromirror 8a is configured such that its angle can be changed independently, and the DMD 8 functions as a variable molding mask that forms a predetermined pattern transferred onto the plate P by changing the angle of each micromirror 8a. To do. That is, in synchronization with the scanning of the plate P, the angles of some of the micromirrors 8a are changed so that the reflected light is guided to the relay optical system 10 described later, and the reflected light travels in a different direction from the relay optical system 10. As described above, by changing the angle of the other micromirror 8a, the exposure patterns projected onto the corresponding exposure regions are sequentially generated.

  The DMD (position adjustment mechanism) 8 is configured to be rotatable with respect to the Z axis, shiftable in the XY directions, and movable in the Z directions. By rotating the DMD 8 with respect to the Z axis, the pattern image formed on the plate P rotates. Further, by shifting the DMD 8 in the XY directions, the pattern image formed on the plate P is shifted. Further, since the optical path length is changed by moving the DMD 8 in the Z direction, the spot size narrowed down by the microlens array 16 described later can be corrected.

  The light beam reflected by the DMD 8 (a part of the micromirrors 8 a) enters the relay optical system 10. The relay optical system 10 includes a relay lens 10a, a diaphragm 10b, and a relay lens 10c. The light beam is incident on the incident surface 11a of the rhombus prism 11 through the relay lens 10a, the stop 10b, and the relay lens 10c. The light beam incident on the incident surface 11a of the rhomboid prism 11 is sequentially reflected by the reflecting surfaces 11b and 11c and passes through the exit surface 11d. The rhomboid prism (optical member) 11 deflects the traveling direction of the principal ray of the light beam that has passed through the relay lens 10c. That is, the traveling direction of the light beam in which the principal ray travels in a direction substantially orthogonal to the plane of the plate P (−Z direction) is shifted to the + Y direction, and the image side telecentricity of the exposure optical unit L1 is maintained. Thus, it proceeds in a direction substantially orthogonal to the plate P surface.

  The configuration of the exposure optical units L2 and L3 is the same as that of the exposure optical unit L1 except for the rhombus prism 11 of the exposure optical unit L1. The exposure optical unit L2 does not include the rhombus prism 11, and the exposure optical unit L3 includes a rhombus prism 11 ′ (see FIG. 4) that shifts the traveling direction of the light beam in the −Y direction instead of the rhombus prism 11. Yes.

  FIG. 4 is a diagram showing an optical path through which a light beam passing through each of the exposure optical units L1 to L3 enters a microlens array 16 described later. The light beam that has passed through the relay lens 10 c of the exposure optical unit L 1 is shifted in the + Y direction by the rhombus prism 11 and enters the microlens array 16. The relay lens 10d of the exposure optical unit L2 has the same configuration as the relay lens 10c, and the light beam that has passed through the relay lens 10d enters the microlens array 16 without being shifted. The relay lens 10e of the exposure optical unit L3 has the same configuration as the relay lens 10c, and the light beam that has passed through the relay lens 10e is incident on the rhomboid prism 11 ′ and travels through the rhombus prism 11 ′. Are shifted in the −Y direction and enter the microlens array 16.

  At this time, the light from the relay lenses 10 a to 10 c and 10 e becomes a continuous light beam on the microlens array 16 by the rhombus prisms 11 and 11 ′. This makes it possible to form a continuous image on the plate P. As described above, when the arrangement of the relay lenses 10a to 10c and 10e is deviated obliquely with respect to the optical axis of the microlens array 16, the rhomboid prisms 11 and 11 'are used. It will be made to inject along. The light beams from the relay lenses 10a to 10c and 10e are discrete like the discrete exposure optical unit.

  The microlens array 16 has a number of element lenses 16a corresponding to each of the micromirrors 8a constituting the DMD 8 and the micromirrors (not shown) constituting the DMDs of the exposure optical units L2 and L3. It is arranged at a position optically conjugate with P or in the vicinity thereof. The light beam that has passed through each element lens 16a of the microlens array 16 reaches the plate P from a direction (Z direction) in which the principal ray is substantially orthogonal to the plate P surface. The light beam that has reached the plate P forms an image of a predetermined pattern formed by each DMD (not shown) of the DMD 8 and the exposure optical units L2 and L3, and a predetermined pattern is formed on the resist-coated plate P. The pattern is exposed. At this time, the light beam from each DMD of the DMD 8 and the exposure optical units L2 and L3 forms an image of a continuous pattern on the plate P. That is, the arrangement interval in the Y direction of the DMD included in each exposure optical unit L1 to L3 is different from the arrangement interval in the Y direction of the exposure area formed by the light beam via each exposure optical unit L1 to L3. Since the optical units L1 and L3 include the rhombus prisms 11 and 11 ′ that polarize the traveling direction of the light beam, the light beams that pass through the exposure optical units L1 to L3 are substantially aligned in the Y direction on the plate P. A plurality of (three in this embodiment) exposure regions are formed.

  As shown in FIG. 1, the plate stage PST on which the plate P is placed is provided on a vibration isolator 32a, 32b and a base 34 supported by a vibration isolator (not shown). The plate stage PST is configured to be movable in the scanning direction (X direction) by the linear motor 36, and has a so-called air stage configuration that floats with respect to the guide 37 with an air gap. The plate stage PST has a fine movement stage (not shown) configured to be movable in a small amount in the non-scanning direction (Y direction).

  Further, an X laser interferometer 38 for measuring and controlling the position of the plate stage PST in the X direction with respect to the exposure optical units L1 to L3 using the movable mirrors 40a and 40b is provided. Further, a Y laser interferometer (not shown) that measures and controls the position of the plate PST in the Y direction with respect to the exposure optical units L1 to L3 by using the moving mirror 42 is provided.

  In addition, in the vicinity of the exposure optical units L1 to L3, a plurality of alignment systems (not shown) for detecting alignment marks provided on the plate P and an autofocus system (not shown) for detecting the position of the plate P in the Z direction. Not shown). Further, a reference member 44 having a plurality of AIS marks arranged in the Y direction is provided at the end portion in the −X direction of the plate stage PST. An aerial image measurement sensor (AIS) (not shown) is provided below the reference member 44, and the aerial image measurement sensor is embedded in the plate stage PST.

  The aerial image measurement sensor is used to obtain a relative positional relationship in which the position of each DMD and an image of a predetermined pattern formed by each DMD are projected on the plate P. That is, the plate stage PST is moved so that the fiducial mark formed by the DMD and the AIS mark coincide with each other, the fiducial mark image and the AIS mark are detected by the aerial image measurement sensor, and the position of the DMD is detected based on the detection result. And the position at which the pattern image formed by the DMD is projected onto the plate P. In this case, the reference mark formed by the DMD is stored in a pattern storage unit 74 (see FIG. 5) described later, and the position of the plate stage PST is detected by the X laser interferometer 38 and the Y laser interferometer. The

  FIG. 5 is a block diagram showing the system configuration of the scanning exposure apparatus according to this embodiment. As shown in FIG. 5, the scanning exposure apparatus includes a control unit CONT that performs overall control of operations related to exposure processing. Connected to the control device CONT is a micromirror driving unit 60 that individually drives each micromirror 8a of the DMD 8. The micromirror drive unit 60 changes the angle of each micromirror 8a of the DMD 8 based on a control signal from the control device CONT. Similarly, a micromirror driving unit (not shown) for individually driving the DMD micromirrors constituting the exposure optical units L2 and L3 is connected to the control unit CONT, and the micromirror driving unit is connected to the control unit CONT. The angle of each micromirror of the DMD is changed based on the control signal from.

  In addition, a DMD driving unit 61 that drives the DMD 8 is connected to the control unit CONT. The DMD driving unit 61 rotates the DMD 8 with respect to the Z axis, shifts to the XY plane, or moves in the Z direction based on a control signal from the control device CONT. Similarly, a DMD driving unit (not shown) for driving the DMDs constituting the exposure optical units L2 and L3 is connected to the control device CONT, and the DMD driving unit performs DMD based on a control signal from the control device CONT. Is rotated about the Z axis, shifted to the XY plane, or moved in the Z direction.

  The control device CONT is connected to a plate stage driving unit 72 that moves the plate stage PST along the X direction, which is the scanning direction, and moves it slightly in the Y direction. Further, an alignment system, an autofocus system, an aerial image measurement sensor, an illuminometer, an X laser interferometer 38, and a Y laser interferometer are connected to the control device CONT. The control device CONT is connected to a pattern storage unit 74 that stores a transfer pattern (exposure pattern data) formed in the DMD 8 and a reference mark used for alignment and aerial image measurement.

  In this embodiment, exposure is performed by joining the exposure regions formed on the plate P in a row in the Y direction by the light beams from the DMDs. Therefore, when a relative displacement of the pattern image formed by each DMD has occurred, it is necessary to correct the relative displacement. Therefore, the control device CONT detects the relative positional deviation of the pattern image formed by each DMD based on the measurement result of the aerial image measurement sensor. Based on the detected relative displacement amount, a correction amount of each DMD is calculated, and each DMD is appropriately moved via each DMD driving unit to correct the image position of the pattern formed by each DMD. Do.

  According to the scanning exposure apparatus according to the first embodiment, the rhomboid prisms 11 and 11 ′ that shift the traveling direction so that the principal rays of the light beams from the three DMDs are substantially orthogonal to the plate P surface are provided. Therefore, an exposure region that is continuous in a line in the Y direction can be formed on the plate P by the light beam from each DMD. Accordingly, since it is not necessary to arrange a plurality of exposure optical units in the scanning direction as in the conventional scanning exposure apparatus, the scanning distance can be shortened during the scanning exposure, and the throughput is improved. Can do. Further, the exposure apparatus main body can be reduced in size.

  Further, in the conventional scanning exposure apparatus, there is a splice error in the exposure area formed by the exposure optical units arranged in different rows along the scanning direction. However, the scanning type according to the first embodiment In the exposure apparatus, the exposure areas formed by the DMDs can be continuously arranged in a line, and the image position of the pattern formed by the DMDs can be adjusted. And the splicing accuracy of the exposure area formed by each DMD can be improved.

  Next, a scanning exposure apparatus according to a second embodiment of the present invention will be described with reference to the drawings. FIG. 6 is a diagram showing a configuration of a scanning exposure apparatus according to the second embodiment. In the description of the second embodiment, a detailed description of the same configuration as that of the scanning exposure apparatus according to the first embodiment is omitted. In the description of the scanning exposure apparatus according to the second embodiment, the same reference numerals as those used in the first embodiment are used for the same components as those in the scanning exposure apparatus according to the first embodiment. A description will be given with.

  This scanning exposure apparatus includes exposure optical units L11 to L13. FIG. 7 is a view showing the arrangement of the exposure optical unit L11. The configuration of the exposure optical units L12 and L13 is the same as that of the exposure optical unit L11. As shown in FIG. 7, the exposure optical unit L11 includes an illuminance adjustment filter 7 configured to be detachable in the optical path between the mirror 6 and the DMD 8. The illuminance adjusting filter 7 adjusts the transmittance distribution to adjust the illuminance of the light beam reaching the plate P, that is, within the exposure region formed on the plate P by the light beam via the exposure optical unit L11. Correction of illuminance unevenness. FIG. 7 shows a state in which the illuminance adjustment filter 7 is inserted in the optical path between the mirror 6 and the DMD 8. The illuminance adjustment filter 7 may be inserted in the optical path between the DMD 8 and a relay lens 10a described later.

  The light beam reflected by the DMD 8 passes through the relay lens 10 a and the aperture 10 b of the relay optical system 10 ′, is enlarged by passing through the relay lens 10 c ′ of the enlargement system, and enters the microprism (optical member) 14. . Further, as shown in FIG. 6, the light beam expanded by passing through an enlargement system relay lens (not shown) provided in each of the exposure optical units L12 and L13 also enters the microprism 14. The microprism 14 corrects the principal ray direction of the light beam expanded by breaking the telecentricity on the image side of the exposure optical unit L11 by the relay lens 10c ′ in a direction substantially orthogonal to the plate P, thereby exposing the light. It has a function of restoring telecentricity on the image side of the optical unit L11. That is, by providing the microprism 14, the exposure optical unit L11 becomes an image side telecentric optical system.

  FIG. 8 is a diagram showing the configuration of the microprism 14. As shown in FIG. 8, a zone plate is formed on the incident surface of the microprism 14 corresponding to the exposure optical units L11 to L13. The center of each zone plate is formed at the position of the optical axis of each exposure optical unit L11-L13. The distance between the concentric circles of the zone plates is such that the traveling direction is deflected so that the principal ray of the light beam incident on each of the element lenses 16a of the microlens array 16 via the relay lens 10c 'is substantially perpendicular to the plate P surface. So that it is formed.

That is, as shown in FIG. 9, when the incident angle of the light beam incident on the incident surface of the microprism 14 is θ, the apex angle of the microprism 14 is Δ, and the refractive index of the microprism 14 is n, θ = sin A microprism 14 having an apex angle and a refractive index satisfying the condition of ⁻¹ (n · sin Δ) −Δ is used. When such a microprism 14 is arranged at the front focal position F ′ of the microlens array 16 having the focal length F, telecentricity can be maintained. Further, a zone plate having a pattern pitch that satisfies the condition of θ = sin ⁻¹ (λ / P), where P is the pattern pitch of the zone plate (concentric circle interval) and λ is the exposure wavelength, is used. The exposure wavelength λ at this time is fixed.

  The light beam that has reached the plate P via the microlens array 16 forms a predetermined pattern image formed by the DMD 8 and each DMD (not shown) of the exposure optical units L12 and L13, and a resist is applied. A predetermined pattern is exposed on the plate P. At this time, the light beam from each DMD of the DMD 8 and the exposure optical units L12 and L13 forms an image of a continuous pattern on the plate P. That is, the arrangement interval in the Y direction of the DMD included in each exposure optical unit L11 to L13 is different from the arrangement interval in the Y direction of the exposure region formed by the light beam via each exposure optical unit L11 to L13. Since the system relay lens is provided, a plurality (three in this embodiment) of light beams that pass through each of the exposure optical units L11 to L13 are arranged in a row in the Y direction on the plate P. Form a region.

  In addition, at least one illuminance sensor (not shown) that measures the illuminance of the light beam via the exposure optical units L11 to L13 is provided in the vicinity of the plate stage PST. The illuminance sensor is configured to be movable on the XY plane, moves to a position where the illuminance of the light beam emitted from each of the exposure optical units L11 to L13 can be measured, and from each of the exposure optical units L11 to L13. The illuminance of the emitted light beam is measured. The measurement result by the illuminance sensor is output to the control device CONT.

  In this embodiment, the illuminance unevenness may occur in the exposure region formed by the light beam via the exposure optical units L11 to L13 due to the microprism 14 or the like. In that case, the illuminance of the light beam via the exposure optical units L11 to L13 is measured, and the illuminance adjustment filter 7 is used to correct the illuminance unevenness in the exposure area illuminated by the light beam based on the measurement result. . Specifically, the control device CONT moves the illuminance sensor onto a plurality of measurement points in the exposure area formed by the light beam via the exposure optical unit L11. The illuminance sensor measures the illuminance of the light beam at each measurement point, and outputs the measurement result to the control device CONT. The control device CONT determines whether illuminance unevenness has occurred in the exposure region formed by the light beam via the exposure optical unit L11, based on the measurement result of the illuminance of the light beam at each measurement point by the illuminance sensor. To do. When the illuminance unevenness occurs, the transmittance distribution of the illuminance adjustment filter 7 is adjusted to correct the illuminance unevenness.

  The illuminance sensor similarly measures the illuminance of the light beam at a plurality of measurement points in the exposure region formed by the light beam via the exposure optical units L12 and L13, and the control device CONT is based on the measurement result of the illuminance sensor. Then, it is determined whether or not illuminance unevenness occurs in the exposure region formed by the light beam via the exposure optical units L12 and L13. If illuminance unevenness occurs, the illuminance unevenness is corrected using an illuminance filter provided in each of the exposure optical units L12 and L13.

  According to the scanning exposure apparatus of the second embodiment, the relay lens of the expansion system that expands the light beam from the three DMDs and the principal ray of the light beam travel so as to be substantially orthogonal to the plate P plane. Since the microprism 14 for controlling the direction is provided, it is possible to form an exposure region that is continuous in a line in the Y direction on the plate P by the light beam from each DMD. Accordingly, it is not necessary to arrange a plurality of exposure optical units in the scanning direction as in the conventional scanning exposure apparatus, so that it is possible to shorten the scanning distance at the time of scanning exposure and to improve the throughput. Can do. Further, the exposure apparatus main body can be reduced in size.

  Further, in the conventional scanning exposure apparatus, there has been a splicing error in the exposure area formed by the exposure optical units arranged in different rows along the scanning direction, but the scanning type according to the second embodiment In the exposure apparatus, the exposure areas formed by the DMDs can be continuously arranged in a line, and the image position of the pattern formed by the DMDs can be adjusted. And the splicing accuracy of the exposure area formed by each DMD can be improved.

  In the second embodiment, an example is shown in which three exposure areas are continuously formed in a line on the plate P without a gap, but at least a part of the three exposure areas overlaps. May be. In other words, the joint portions of the three exposure areas formed on the plate P may partially overlap. In this case, it becomes possible to obscure the boundary portion of the joint portion. In addition, the shape of each exposure region at the time of joining may be a rectangular shape, but a shape such as a trapezoid, a parallelogram, and a hexagon is preferable. At this time, the overlapping partial overlapping portions can be made to have an optimum exposure amount by associating triangular portions at positions corresponding to positions where adjacent exposure regions are joined together.

  In the second embodiment, a light beam is magnified by an enlarging relay lens so that a continuous pattern image is formed on the plate P. However, an enlarging relay lens is used. Therefore, a pattern image continuous in a line on the plate P can be formed. For example, as shown in FIG. 10, the exposure optical unit L11 ′ is configured such that the position where the image of the predetermined pattern formed by the exposure optical unit L11 ′ is transferred on the plate P moves in the + Y direction. Further, the exposure optical unit L13 ′ is configured such that the position where the image of the predetermined pattern formed by the exposure optical unit L13 ′ is transferred onto the plate P moves in the −Y direction. Then, a pattern image continuous in a line is formed by the exposure optical units L11 ′ to L13 ′.

  At this time, the light beam that has passed through the exposure optical units L11 ′ to L13 ′ enters the microprism 14 ′. The microprism 14 ′ has a function of correcting the direction of the principal ray of the light beam that has passed through the exposure optical units L 11 ′ and L 13 ′ in a direction substantially orthogonal to the plate P. By providing the microprism 14 ′, the exposure optical units L11 ′ to L13 ′ become an image side telecentric optical system. Thereby, the position accuracy of the image can be kept high without being influenced by the flatness of the plate P.

  Further, as shown in FIG. 7, by using the microprism 14, an exposure area larger than the effective diameter of the relay optical system 10 ′ can be exposed while the plate P side is set to be telecentric. In other words, since the effective diameter of the relay optical system 10 ′ can be made smaller than the exposure area, the size of the relay optical system 10 ′ can be reduced, and the arrangement restriction can be relaxed.

  Further, in each of the above-described embodiments, an optical member (rhombus prism, magnifying relay lens, microprism) that controls the traveling direction of the light beam in order to form a continuous pattern image on the plate P is provided. However, it is possible to form a continuous pattern image on the plate P without providing an optical member. That is, the traveling direction of the light beam is controlled by adjusting the arrangement position of the DMD and the microlens array 16, and a continuous pattern image on the plate P is formed. Specifically, each element lens 16a is set so that the principal ray of the light beam passing through one of the DMD micromirrors passes through the focal position of the element lens 16a of the microlens array 16 corresponding to the micromirror. Deploy. By disposing the element lens 16a in this way, the principal ray of the light beam that has passed through each element lens 16a can be guided so as to be substantially orthogonal to the plate P surface.

  In the scanning exposure apparatus according to each of the above-described embodiments, the DMD included in each exposure optical unit functions as a position adjustment mechanism that adjusts the image position of the pattern formed on the plate. Two DMDs may function as a position adjusting mechanism. Further, although the optical path length is adjusted by moving the DMD in the Z direction, the optical path length may be adjusted by other optical members constituting the exposure optical units L1 to L3.

  In the scanning exposure apparatus according to each of the above-described embodiments, an example is shown in which each exposure optical unit is configured to include a DMD as a partially variable molding mask. However, one DMD is divided into a plurality of regions. It is also possible to make the respective areas decomposed to function as partially variable molding masks.

  The scanning exposure apparatus according to each of the above embodiments includes a microlens array. However, the microlens array may not be used, and a pattern may be projected as it is on the position of the microlens array. Needless to say.

  Further, the embodiment in which a plurality of partial variable molding masks (DMD) are provided corresponding to each of the plurality of exposure optical units has been shown as an example. However, one variable molding is performed for the plurality of exposure optical units. Needless to say, a mask may be provided.

  Further, the present invention is effective when the interval between projection areas projected by a plurality of exposure optical units and the interval between the plurality of exposure optical units are different as in the present embodiment. Therefore, it may be a continuous exposure area as in the present embodiment, or may be a pattern discretely dispersed in a plurality of exposure areas.

  In this embodiment, the variable shaped mask is used. However, the present invention can be applied to a configuration using a general transmission type mask or a reflection type mask. In that case, the microlens array may be omitted.

  In the scanning exposure apparatus according to each of the above-described embodiments, the photosensitive substrate (plate) is exposed (exposure process) by exposing a transfer pattern formed by DMD as a variable molding mask using a projection optical system. Microdevices (semiconductor elements, imaging elements, liquid crystal display elements, thin film magnetic heads, etc.) can be manufactured. Hereinafter, an example of a technique for obtaining a semiconductor device as a micro device by forming a predetermined circuit pattern on a plate or the like as a photosensitive substrate using the scanning exposure apparatus according to each of the above embodiments will be described. This will be described with reference to the flowchart of FIG.

  First, in step S301 in FIG. 11, a metal film is deposited on one lot of plates. In the next step S302, a photoresist is applied on the metal film on the one lot of plates. Thereafter, in step S303, using the scanning exposure apparatus according to each of the above-described embodiments, the pattern image formed by DMD is sequentially applied to each shot area on the plate of one lot via the projection optical system. Exposure transferred. After that, in step S304, the photoresist on the one lot of plates is developed, and in step S305, the resist pattern is used as an etching mask on the one lot of plates to form the DMD. A circuit pattern corresponding to the pattern is formed in each shot area on each plate.

  Thereafter, a device pattern such as a semiconductor element is manufactured by forming a circuit pattern of an upper layer. According to the semiconductor device manufacturing method described above, since the exposure is performed using the scanning exposure apparatus according to each of the above-described embodiments, a good semiconductor device can be obtained. In steps S301 to S305, a metal is vapor-deposited on the plate, a resist is applied on the metal film, and exposure, development and etching processes are performed. Prior to these processes, the process is performed on the plate. It is needless to say that after forming a silicon oxide film, a resist may be applied on the silicon oxide film, and steps such as exposure, development, and etching may be performed.

  In the scanning exposure apparatus according to each of the above embodiments, a liquid crystal display element as a micro device is obtained by forming a predetermined pattern (circuit pattern, electrode pattern, etc.) on a plate (glass substrate). You can also. Hereinafter, an example of the technique at this time will be described with reference to the flowchart of FIG. First, in FIG. 12, in the pattern formation step S401, a pattern formed by DMD as a variable molding mask using the scanning exposure apparatus according to each of the above-described embodiments is formed on a photosensitive substrate (a glass substrate coated with a resist). And so on), a so-called photolithography process is performed. By this photolithography process, a predetermined pattern including a large number of electrodes and the like is formed on the photosensitive substrate. Thereafter, the exposed substrate undergoes steps such as a developing step, an etching step, and a resist stripping step, whereby a predetermined pattern is formed on the substrate, and the process proceeds to the next color filter forming step S402.

  Next, in the color filter forming step S402, a large number of groups of three dots corresponding to R (Red), G (Green), and B (Blue) are arranged in a matrix or three of R, G, and B A color filter is formed by arranging a plurality of stripe filter sets in the horizontal scanning line direction. Then, after the color filter formation step S402, a cell assembly step S403 is executed. In the cell assembly step S403, a liquid crystal panel (liquid crystal cell) is assembled using the substrate having the predetermined pattern obtained in the pattern formation step S401, the color filter obtained in the color filter formation step S402, and the like. In the cell assembly step S403, for example, liquid crystal is injected between the substrate having the predetermined pattern obtained in the pattern formation step S401 and the color filter obtained in the color filter formation step S402, and a liquid crystal panel (liquid crystal cell ).

  Thereafter, in a module assembly step S404, components such as an electric circuit and a backlight for performing a display operation of the assembled liquid crystal panel (liquid crystal cell) are attached to complete a liquid crystal display element. According to the above-described method for manufacturing a liquid crystal display element, since the exposure is performed using the scanning exposure apparatus according to each of the above-described embodiments, a good liquid crystal display element can be obtained.

It is a perspective view which shows schematic structure of the scanning exposure apparatus concerning 1st Embodiment. It is a figure which shows the structure of the exposure optical unit concerning 1st Embodiment. It is a figure which shows the structure of DMD concerning 1st Embodiment. It is a figure which shows the optical path in which the light beam which passed through the exposure optical unit injects into a micro lens array. 1 is a block diagram showing a system configuration of a scanning exposure apparatus according to a first embodiment. It is a figure which shows schematic structure of the scanning exposure apparatus concerning 2nd Embodiment. It is a figure which shows the structure of the exposure optical unit concerning 2nd Embodiment. It is a figure which shows the structure of a microprism. It is a figure for demonstrating the structural requirement of a microprism. It is a figure which shows the other structure of the scanning exposure apparatus concerning embodiment. It is a flowchart which shows the manufacturing method of the semiconductor device as a microdevice concerning embodiment of this invention. It is a flowchart which shows the manufacturing method of the liquid crystal display element as a microdevice concerning embodiment of this invention.

Explanation of symbols

2 ... Fiber, 4 ... Collimating optical system, 6 ... Mirror, 7 ... Illuminance adjustment filter, 8 ... DMD, 10, 10 '... Relay optical system, 11, 11' ... Rhombus prism, 14 ... Micro prism, 16 ... Micro lens Array, 38 ... X laser interferometer, 44 ... reference member, L1-L3, L11-L13 ... exposure optical unit, P ... plate, PST ... plate stage, CONT ... control device.

Claims (15)

A variable shaping mask that forms a predetermined pattern; a substrate stage on which a photosensitive substrate is placed; and an exposure optical system that forms an image on the photosensitive substrate by a light beam from the variable shaping mask. In the scanning exposure apparatus for exposing the predetermined pattern to
The exposure optical system includes an optical member that deflects a traveling direction of the principal ray of the light beam from the variable shaping mask so as to be substantially orthogonal to the surface of the photosensitive substrate. The variable molding mask has a plurality of partially variable molding masks,
2. The scanning exposure apparatus according to claim 1, wherein the optical member deflects a principal ray of the light beam from at least one of the plurality of partially variable shaping masks.   3. The scanning exposure apparatus according to claim 2, wherein the light beams from the plurality of partially variable molding masks form a continuous pattern image on the photosensitive substrate.   4. The scanning exposure apparatus according to claim 2, wherein the light beams from the plurality of partially variable shaping masks form a plurality of exposure regions that are substantially continuous in a row on the photosensitive substrate.   5. The scanning exposure apparatus according to claim 2, wherein at least a part of the light beams from the plurality of partially variable shaping masks overlap on the photosensitive substrate. 6.   6. The scanning exposure apparatus according to claim 2, wherein an arrangement interval between the plurality of partial variable shaping masks is different from an arrangement interval between the plurality of exposure regions.   The scanning exposure apparatus according to claim 1, wherein the optical member includes a plurality of microprisms.   8. The scanning according to claim 2, wherein the exposure optical system includes a plurality of partial exposure optical units arranged so as to correspond to the plurality of partial variable shaping masks. Mold exposure equipment. The exposure optical system includes a plurality of microlenses,
The plurality of microlenses are arranged at positions where a principal ray of the light beam through any of the plurality of partially variable molding masks passes through the focal position of any of the plurality of microlenses, 9. The scanning type exposure apparatus according to claim 2, wherein a principal ray of the light beam is guided so as to be substantially orthogonal to the surface of the photosensitive substrate.   The scanning exposure apparatus according to claim 1, wherein the exposure optical system is an image side telecentric optical system.   11. The scanning exposure according to claim 2, further comprising a deflecting optical member that guides a principal ray of the light beam from the plurality of partially variable shaping masks to the optical member. apparatus.   The at least one partially variable forming mask among the plurality of variable forming masks includes a position adjusting mechanism for adjusting a position of the partially variable forming mask. The scanning exposure apparatus described.   The scanning exposure apparatus according to any one of claims 1 to 12, wherein the photosensitive substrate is a substrate for a flat panel display element.   The scanning exposure apparatus according to any one of claims 1 to 13, wherein the photosensitive substrate is a photosensitive substrate having an outer diameter larger than 500 mm. An exposure step of exposing a predetermined pattern on a photosensitive substrate using the scanning exposure apparatus according to any one of claims 1 to 14,
A development step of developing the photosensitive substrate exposed by the exposure step;
A device manufacturing method comprising:

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