TWI426295B - Reflection-deflection type projection optical system, projection optical apparatus, and scanning aligner - Google Patents

Description

Reflection and refraction projection optical system, projection optical device, and scanning type exposure device

The present invention relates to a catadioptric projection optical system that projects an image of a first object (mask or the like) onto a second object (substrate or the like), a projection optical device having a plurality of catadioptric projection optical systems, and a projection optical device Scanning exposure technology and component fabrication techniques using scanning exposure techniques.

For example, when manufacturing a semiconductor element or a liquid crystal display element or the like, a pattern of a mask (reticle or reticle or the like) is always projected onto a photoresist-coated board (glass plate) via a projection optical system. Projection exposure device on a semiconductor wafer or the like. Conventionally, a projection exposure apparatus (stepper) that exposes a pattern of a mask to each exposure region of a panel in a step-and-repeat manner in a step-and-repeat manner is often used. In recent years, there has been proposed a projection exposure apparatus having a step and scan method in which a large projection optical system is not used, but a plurality of lines having a magnification of equal magnification are arranged at predetermined intervals along the scanning direction. The plurality of partial projection optical systems scan the mask and the panel while exposing the mask patterns to the panel by using respective partial projection optical systems.

In recent years, the board has become increasingly large, and boards of more than 2 m square have been gradually used. Here, when the projection exposure apparatus using the step-and-scan method described above is exposed on a large-sized board, since the partial projection optical system has a magnification of equal magnification, the size of the mask is also increased. Regarding the cost of the mask, since it is also necessary to maintain the planarity of the mask substrate, the larger the size, the higher the cost. Again, for In order to form a general thin film transistor portion (TFT portion), a mask of 4 to 5 layers is required, so that the mask requires a large cost. Therefore, there has been proposed a projection exposure apparatus in which a mask is reduced by setting the magnification of a plurality of partial projection optical systems to a magnification (see Patent Document 1).

[Patent Document 1] Japanese Patent Laid-Open No. Hei 11-265848

In the projection exposure apparatus of the above magnification, in order to enlarge the projection area, it is necessary to increase the size of the lens constituting each partial projection optical system. However, when the lens is enlarged, the projection optical system including a plurality of partial projection optical systems and the support thereof are supported. The organization will be larger and the weight will increase. As a result, there is a problem that the manufacturing cost of the projection exposure apparatus is increased, and the installation cost of the component manufacturing factory is also increased.

In view of the above problems, it is a first object of the present invention to provide a projection optical system and projection optical apparatus capable of enlarging a projection area and reducing the weight of the optical system.

Further, a second object of the present invention is to provide an exposure technique and a component manufacturing technique, which can form an enlarged image of a pattern such as a mask on an object such as a board by a scanning exposure method.

The projection optical system of the present invention is a catadioptric projection optical system in which an image of a first object disposed on a first surface is formed on a second object disposed on a second surface at an enlarged projection magnification, and the catadioptric projection projection The optical system includes a concave mirror, a front lens group, and a rear lens group, wherein the concave mirror is disposed in an optical path between the first surface and the second surface, and the front lens group is disposed in the first Between the face and the concave mirror In the optical path, the rear lens group is disposed in an optical path between the concave mirror and the second surface, and includes at least one lens having a non-rotationally symmetrical outer shape.

Further, the projection optical device according to the present invention includes the first projection optical system and the second projection optical system including the catadioptric projection optical system of the present invention, and the first projection optical system has a first field of view on the first surface, according to Light from the first field of view, projecting an enlarged image of a portion of the first object onto a first projection area on a second side, the second projection optical system having a distance from the first surface at least in a predetermined direction a second field of view of the first field of view, based on the light from the second field of view, projecting the magnified image of a portion of the first object onto the second surface at least in the predetermined direction away from the first projection region In the two projection areas, the non-rotationally symmetric lens in the first projection optical system and the second projection optical system is substantially line symmetrical about an axis parallel to the predetermined direction.

Further, in the scanning exposure apparatus of the present invention, the image of the first object disposed on the first surface is projected on the second object disposed on the second surface, and the first object is changed with respect to the scanning direction. Exposing the pattern of the first object to the second object, such as the positional relationship with the second object, in the scanning type exposure apparatus, in order to project the image of the first object to the second object The projection optical device of the present invention is provided with the direction orthogonal to the predetermined direction of the projection optical device as the scanning direction.

According to the projection optical system of the present invention, since the concave mirror is used, the region through which the imaging beam in the rear lens group passes can be formed as a non-rotationally symmetrical region deviating from the optical axis. Therefore, the imaging light can be prevented In the case where the beam produces vignetting, the lens shape in the rear lens group is made non-rotationally symmetrical, so that the projection area can be enlarged and the weight of the projection optical system can be reduced.

Further, according to the projection optical apparatus of the present invention, the non-rotationally symmetrical lenses of the two projection optical systems are disposed, for example, in a facing manner. Therefore, the distance between the two non-rotationally symmetrical lenses can be shortened, and the distance in the direction orthogonal to the predetermined direction of the two projection regions can be shortened, so that the projection optical device can be miniaturized.

Moreover, according to the scanning exposure apparatus of the present invention, the images of the two projection areas can be joined by scanning in a direction orthogonal to the direction (predetermined direction) in which the two projection areas are shifted from the original position.

Hereinafter, a first embodiment of the present invention will be described with reference to Figs. 1 to 4 .

Fig. 1 shows a schematic configuration of a scanning type projection exposure apparatus (scanning type exposure apparatus) of the step-and-scan type of the present embodiment. In Fig. 1, the projection exposure apparatus includes an exposure light source (not shown), an illumination device IU, and a mask. a stage (not shown), a projection optical device PL, a board stage (not shown), a drive mechanism (not shown), and a main control system (not shown), wherein the illumination device IU is from the exposure The light source of the light source illuminates a pattern of a mask M (not shown) that holds and moves the mask M, the projection optical device PL including a plurality of masks M The magnified image of the pattern is projected onto the catadioptric projection optical systems PL1 to PL7 on the board P (second object), and the board stage holds and moves the board P, and the driving mechanism includes driving cover The main control system controls the operation of the drive mechanism or the like in a cover stage and a linear motor of the table. Further, the plate P of the present embodiment is, for example, a rectangular flat glass plate of 1.9 m × 2.2 m square, 2.2 m × 2.4 m square, 2.4 m × 2.8 m square, or 2.8 m × 3.2 m square, etc. A photoresist (photosensitive material) for producing a liquid crystal display element is coated thereon. Further, as the plate P, a ceramic substrate for manufacturing a thin film magnetic head or a circular semiconductor wafer for manufacturing a semiconductor element or the like can be used.

In the following description, the positional relationship of each member will be described with reference to the XYZ orthogonal coordinate system set in FIG. The XYZ orthogonal coordinate system is set such that the X axis and the Y axis are parallel to the plate P, and the Z axis is set to a direction orthogonal to the plate P. In the XYZ coordinate system in Fig. 1, for example, the XY plane is set to be parallel to the horizontal plane, and the Z axis is set to the vertical direction. Further, in the present embodiment, the direction (scanning direction) in which the mask M and the plate P are moved in synchronization is set to the X direction.

In Fig. 1, a light beam emitted from an exposure light source (not shown) composed of, for example, an ultrahigh pressure mercury lamp is reflected by an ellipsoid mirror 2 and a dichroic mirror 3 in an illumination device IU, and is incident on a light beam. Collimated lens 4. At this time, the reflection film including the gamma mirror 2 and the reflection film of the dichroic mirror 3 are taken out, and the light including the g-ray (wavelength 436 nm), the h-ray (wavelength 405 nm), and the i-ray (wavelength 365 nm) is taken out. Light in the wavelength domain, and then the extracted light is incident on the collimator lens 4. Further, since the exposure light source is disposed at the first focus position of the ellipsoidal mirror 2, the light source image shape of the light in the wavelength range including the light of the g-ray, the h-ray, and the i-ray is formed. The second focus position of the ellipsoid mirror 2 is formed. The divergent light beam from the image of the light source is converted into parallel light by the collimator lens 4, and penetrates the wavelength selective filter 5 that penetrates only the light beam of the predetermined exposure wavelength range.

The illumination light for exposure that has passed through the wavelength selection filter 5 passes through the dimming filter 6, and is collected by the condensing lens 7 at the incident end of the entrance port 8a of the optical fiber 8. Here, the optical fiber 8 is, for example, a random optical fiber in which a plurality of fiber bundles are bundled randomly, and includes an entrance port 8a and seven injection ports (hereinafter referred to as injection ports 8b, 8c, and 8d, 8e, 8f, 8g, 8h). The illumination light incident on the entrance port 8a of the optical fiber 8 is propagated inside the optical fiber 8, and is divided and emitted by the seven ejection openings 8b to 8h, and incident on the respective portions of the partial illumination of the mask M. Illumination optical system (hereinafter referred to as partial illumination optical systems IL1, IL2, IL3, IL4, IL5, IL6, IL7). The illumination light from each of the partial illumination optical systems IL1 to IL7 has been substantially uniformly illuminated to the corresponding illumination area on the mask M. The illumination device IU is composed of optical components from the ellipsoidal mirror 2 to the local illumination optical systems IL1 to IL7.

A plurality of illumination regions from the mask M, that is, illumination lights of the illumination regions illuminated by the local illumination optical systems IL1 to IL7, are respectively projected on seven projection optical systems (hereinafter, referred to as projection optical systems PL1, PL2). PL3, PL4, PL5, PL6, and PL7) These seven projection optical systems are arranged in such a manner as to correspond to the respective illumination regions, and are used to project images of a part of the pattern of the mask M onto the panel P, respectively. The projection optical system (partial projection optical system) PL1 to PL7 respectively image the image of the pattern surface (first surface) of the mask M on the upper surface (second surface) of the sheet P.

Here, the mask M. is adsorbed and held on a mask stage (not shown) via a mask holder (not shown). The position of the mask stage is measured by a laser interferometer (not shown) on the mask side. Further, the plate P is suction-held on a plate stage (not shown) via a plate holder (not shown). A moving mirror 50 is disposed on the board stage. The position of the plate stage is measured by a laser interferometer (not shown) on the plate side via the moving mirror 50. The main control system (not shown) controls the mask stage (mask M) and the board stage (board P) via a drive mechanism (not shown) based on the measured values of the laser interferometer on the mask side and the board side. Location and speed.

The partial illumination optical systems IL1, IL3, IL5, and IL7 of the first row on the -X direction side of the partial illumination optical systems IL1 to IL7 are arranged at predetermined intervals in the non-scanning direction (Y direction) orthogonal to the scanning direction. Configuration. Similarly, the first-line projection optical systems PL1, PL3, PL5, and PL7 provided corresponding to the local illumination optical systems IL1, IL3, IL5, and IL7 are also on the -X direction side in the projection optical device PL and in the non-scanning direction. Configured at predetermined intervals. Further, the partial illumination optical systems IL2, IL4, IL6 of the second row are arranged at a predetermined interval on the +X direction side and at a predetermined interval in the non-scanning direction corresponding to the first line of partial illumination optical systems. The second line of projection optical systems PL2, PL4, PL6 provided corresponding to the local illumination optical systems IL2, IL4, IL6 also correspond to the first line of projection optical systems, arranged at a predetermined interval in the +X direction and in the non-scanning direction.

Here, the first line of projection optical systems PL1, PL3, PL5, and PL7 respectively have fields of view V1, V3, V5, and V7, and the images are formed in the image fields (projection areas) I1, I3, I5, and I7, respectively. Field V1, V3, V5, V7 It is arranged along a line parallel to the non-scanning direction on the first surface on which the mask M is disposed, and the image fields I1, I3, I5, and I7 are along the second surface on which the plate P is disposed. Straight lines parallel to each other are arranged at predetermined intervals. Further, the second-line projection optical systems PL2, PL4, and PL6 have fields of view V2, V4, and V6, respectively, and the images are formed in the image fields (projection regions) I2, I4, and I6 (I2 and I4 are not shown), wherein The fields of view V2, V4, and V6 are arranged along a line parallel to the non-scanning direction on the first surface on which the mask M is disposed, and the image fields I2, I4, and I6 are along the second line on which the board P is disposed. Straight lines on the surface parallel to the non-scanning direction are arranged at predetermined intervals.

Between the first row of projection optical systems and the second row of projection optical systems, an off-axis alignment system 52 for aligning the panel P is disposed, and a mask M is used to The focus position of the board P (the position in the Z direction) is aligned with the autofocus system 54.

Hereinafter, the configurations of the partial illumination optical systems IL1 to IL7 and the projection optical systems PL1 to PL7 will be described in detail. The projection optical systems PL1 to PL7 of the present example are reflection-refractive projection optical systems in which an image which is an enlarged image in the field of view on the mask M (here, equal to the illumination region) is formed in the image field on the panel P, respectively. The magnification in the scanning direction (X direction) is more than +1 times, and the magnification in the non-scanning direction (Y direction) is less than -1. In other words, the projection optical systems PL1 to PL7 form an upright magnified image on the panel P in the scanning direction of the pattern of the mask M, and form an inverted magnified image on the panel P in the non-scanning direction. The absolute value of the magnification in the scanning direction and the non-scanning direction is, for example, about 2.5.

In this example, the partial illumination optical systems IL1 to IL7 have the same configuration. Further, since the first-line projection optical systems PL1, PL3, PL5, and PL7 have the same configuration, and the second-row projection optical systems PL2, PL4, and PL6 have the same configuration, the following two portions of the first line and the second line are used. The configurations of the illumination optical systems IL1 and IL2 and the two projection optical systems PL1 and PL2 will be described as representative.

FIG. 2 is a view showing the configuration of two partial illumination optical systems IL1, IL2, and two projection optical systems PL1, PL2 corresponding to the two partial illumination optical systems IL1, IL2 in FIG. In FIG. 2, the light beams emitted from the ejection opening 8b and the ejection opening 8c of the optical fiber 8 are incident on the local illumination optical system IL1 and the partial illumination optical system IL2, and are collected by the collimator lens 9b and the collimator lens 9c. The collected light beam is incident on a fly eye lens 10b and a fly-eye lens 10c (ie, an optical integrator). The light beams from the plurality of secondary light sources formed on the rear focal planes of the fly-eye lens 10b and the fly-eye lens 10c are substantially uniformly illuminated by the condenser lens 11b and the condensing mirror 11c.

Further, the projection optical system PL1 includes a concave mirror CCMb, a first lens group G1b, a second lens group G2b, a first deflecting member FM1b, a second deflecting member FM2b, and a third lens group G3b. The concave mirror CCMb is disposed in the optical path between the mask M and the plate P. The first lens group G1b is disposed in the optical path between the mask M and the concave mirror CCMb and has light parallel to the Z axis. The axis AX11; the second lens group G2b is disposed in an optical path between the first lens group G1b and the concave mirror CCMb; the first deflecting member FM1b is disposed on the second lens group G2b and the plate P In the optical path between the two, the light traveling from the second lens group G2b in the +Z direction is deflected along the optical axis AX12 so as to cross the optical axis AX11 in the -X direction; the second deflecting member FM2b is disposed. In the optical path between the first deflecting member FM1b and the plate P, the light traveling from the first deflecting member FM1b in the -X direction is deflected in the -Z direction; the third lens group G3b is disposed in the second deflecting member The optical path between the FM 2b and the plate P has an optical axis AX13 parallel to the optical axis AX11 of the first lens group G1b. The optical axes of the second lens group G2b and the concave mirror CCMb are shared with the optical axis AX11 of the first lens group G1b.

Furthermore, the two deflecting members FM1b and FM2b constitute a first beam transfer portion for causing, for example, a predetermined point (for example, a center) in the field of view of the self-projecting optical system PL1 to pass through the second lens. The light traveling substantially in the +Z direction by the group G2b is substantially transferred in the -X direction, and then travels substantially in the -Z direction, and then guided to the conjugate point on the image field.

Here, in the projection optical system PL1, as an example, the distance between the mask M and the plate P is larger than the distance between the mask M and the concave mirror CCMb, and the actuation distance on the side of the plate P is larger than the movement on the side of the mask M. The concave mirror CCMb, the first lens group G1b, the second lens group G2b, the third lens group G3b, and the deflecting members FM1b and FM2b are disposed in a distance manner.

Further, in the optical path between the concave mirror CCMb and the second lens group G2b, that is, in the vicinity of the reflection surface of the concave mirror CCMb, an aperture for determining the numerical aperture of the plate P side of the projection optical system PL1 is provided. The aperture stop ASb, the aperture stop ASb is positioned such that the M side of the mask and the side of the plate P are substantially telecentric. The position of the aperture stop ASb can be regarded as a projection The pupil plane of the optical system PL1.

Further, in the projection optical system PL1, the first lens group G1b and the third lens group G3b each have a positive refractive power, and the second lens group G2b has a positive refractive power or a negative refractive power. Further, the focal length f3 of the third lens group G3b is set to be longer than the focal length f1 of the first lens group G1b. Further, the distance (radius) from the optical axis AX13 of the lens constituting the third lens group G3b to the outer circumference is larger than the distance (radius) from the optical axis AX11 of the lens constituting the first lens group G1b to the outer circumference.

Further, the projection optical system PL1 is an off-axis optical system using the concave mirror CCMb, and the effective imaging light beam passes through the -X direction with respect to the optical axis AX11 and the optical axis AX13 in the respective lenses of the first lens group G1b and the third lens group G3b. Within half of the side. Therefore, in the present example, for each lens of the third lens group G3b composed of a larger lens, a half portion on the +X direction side (i.e., a portion where the imaging beam does not pass) is cut out from the optical axis AX13. Therefore, in the drawings referred to in FIG. 2 and the following, a lens group having no half side (cut side) with respect to the optical axis is used, and a lens obtained by cutting only half of the optical axis from the optical axis is used. A lens group (G3b, G3c, etc.) formed. As a result, all the lenses constituting the third lens group G3b have a non-rotationally symmetrical outer shape in which half of the +X direction side does not exist from the optical axis AX13.

Further, the projection optical system PL2 has a configuration in which the projection optical system PL1 is arranged symmetrically in the scanning direction (a configuration in which the projection optical system PL1 is rotated by 180 turns around an axis parallel to the Z-axis), and is similar to the projection optical system PL1. The image (ie, the magnified image in the field of view on the mask M) is formed on the board P A catadioptric projection optical system within the image field. In other words, the projection optical system PL2 includes the first lens group G1c, the second lens group G2c, and the concave mirror CCMc arranged along the optical axis AX21 parallel to the z-axis, as well as the Z-axis. The third lens group G3c of the parallel optical axis AX23 and the first deflecting member FM1c that bends the light beam from the second lens group G2c in the +Z direction in the +X direction along the optical axis AX22, and goes in the +X direction. The second deflecting member FM2c, in which the light beam is bent in the -Z direction, and the aperture stop ASc disposed on the pupil plane of the projection optical system PL2. Further, the two deflecting members FM1c and FM2c constitute a second beam transfer unit for causing a predetermined point (for example, a center) in the field of view of the self-projecting optical system PL2 to pass through the second lens group G2c. The light traveling substantially in the +Z direction travels substantially in the -Z direction after being transferred substantially in the +X direction, and then guided to the conjugate point on the image field.

Further, all the lenses constituting the third lens group G3c of the projection optical system PL2 have the same non-rotational symmetry as the half of the -X direction side from the optical axis AX23, similarly to the third lens group G3b of the projection optical system PL1. shape.

Furthermore, the optical axes AX11, AX13 and the optical axes AX21, AX23 may be substantially parallel to the Z axis, and the optical axis AX12 polar axis AX22 may be substantially flat with the X axis. Row.

Further, when the interval between the scanning directions (X directions) of the optical axes AX11 and AX21 of the first lens group G1b and the first lens group G1c is set to Dm, the optical axes of the third lens group G3b and the third lens group G3c are set. The interval in the scanning direction (X direction) of AX13 and AX23 is set to Dp, projection optical system When the projection magnification of the PL1 and the projection optical system PL2 is set to β, the projection optical system PL1 and the projection optical system PL2 satisfy the following relationship.

Dp=Dm×| β |.........(1)

3 is a plan view showing a configuration of a mask M used in the projection exposure apparatus (scanning exposure apparatus) of the embodiment. As shown in FIG. 3, the mask M is provided with seven rows of line pattern portions M10 to M16 which are arranged along the non-scanning direction (Y direction) to determine the trapezoidal shape of the projection optical systems PL1 to PL7 of FIG. It may be an arc shape or a triangular shape at the end, and the same applies to the position of the field of view V1 to V7. The reason why the fields of view V1 to V7 are trapezoidal is that the image of the pattern at both ends of the fields of view V1 to V7 is repeatedly exposed on the board P in order to reduce the stitching error. Therefore, the same pattern is alternately formed at both end portions of the row pattern portions M10 to M16. However, the image of the edge portion inside the fields V1 and V7 at both end portions in the Y direction is a portion that is not repeatedly exposed (because it is an inverted image in the non-scanning direction), and thus has a linear shape parallel to the X-axis.

Further, in order to define the fields of view V1, V2, and the like on the mask M, as an example, illumination field diaphragms and relays (not shown) are disposed in the partial illumination optical systems IL1, IL2, and the like of FIG. Relay) optical system.

4 is a view for explaining the fields of view V1, V3 on the mask M of the first-line projection optical systems PL1, PL3, and the image fields (projection areas) I1, I3 on the panel P, and the second-line projection optical system PL2. A plan view of the relationship between the field of view V2 on the mask M and the image field I2 on the panel P. In FIG. 4, an enlarged image in which the pattern in the fields of view V1, V2, and V3 is erect in the X direction and inverted in the Y direction is formed in the image fields I1, I2, and I3. Again, field of view V1 The image field I1 is shifted from the optical axes AX11 and AX13 in the -X direction, respectively, and the field of view V2 and the image field I2 are shifted from the optical axes AX21 and AX23 in the +X direction, respectively. Therefore, even if the shape of the lens constituting the third lens group G3b and G3c is changed to a non-rotationally symmetrical shape in which half of the concave mirrors CCMb and CCMc are cut off, the imaging beam is directed to the image fields I1 and I2. Nor does it produce vignetting.

Further, a straight line parallel to the Y-axis such as the center VC1 of the first-line field of view V1, V3, or the like, and an X-direction parallel to the Y-axis of the center VC2 such as the second-line field of view V2 are connected (scanning) The interval on the direction is set to Lm. Similarly, a straight line parallel to the Y-axis connecting the center IC1 of the first line image fields I1, I3, etc., and a straight line parallel to the Y-axis such as the center IC 2 connecting the second line image field I2 and the like are arranged in the X direction. The interval is set to Lp. Although the interval Lm and the interval Lp are larger than the interval Dm and the interval Dp of FIG. 2, the following relationship between the interval Lm and the interval Lp is the same as that of the equation (1).

Lp=Lm×| β |.........(2)

At this time, as shown in FIG. 3, even if the line pattern portions M10, M12 and the like for the first line projection optical system are formed in the X direction with the line pattern portions M11, M13 and the like for the second line projection optical system. In the same position, when the mask offset is set to 0, the projection image can be accurately spliced and exposed on the panel P. However, in FIG. 4, the interval Lp in the X direction of the centers of the image fields I1 and I2 is not only the length in the X direction of the image of the entire pattern of the original mask M but also by the onboard stage. The distance (hereinafter, also referred to as the idling distance) for the unnecessary scanning of the board P in the X direction.

Further, in FIG. 4, the length of the first line segment in which the optical axes AX11 and AX13 of the first projection optical system PL1 are connected to S1X and the optical axes AX21 and AX23 connected to the second projection optical system PL2 are S2X (=S1X). The second line segment is parallel to the X axis, but does not overlap each other when viewed from the Y direction.

Referring back to FIG. 2, in the projection optical system PL1 of the present embodiment, half of the concave mirror CCMb side is not provided from the optical axis AX13 of the third lens group G3b. Therefore, as indicated by the positions A1 and A2 of the two-dot chain line, the second deflecting member FM2b and the third lens group G3b can be brought closer to the concave mirror CCMb side. Similarly, in the projection optical system PL2, as shown by the positions A3 and A4 of the two-dot chain line, the second deflecting member FM2c and the third lens group G3c can be brought closer to the concave mirror CCMc side. At this time, since the image plane is moved in the -Z direction, it is necessary to lower the board P to the position A5 with respect to the mask M. Further, since the interval in the X direction of the outer optical axes AX13 and AX23 can be shortened from Dp to Dp', the size of the projection optical device PL can be reduced as a whole.

When the interval in the X direction of the optical axes AX13 and AX23 is shortened from Dp to Dp' as described above, in FIG. 4, the interval Lp of the centers of the image fields I1 and I2 is also shortened to Lp' (<Lp), and the plate The idling distance of the stage is shortened to Lp'. Therefore, the size of the base member (the stage system on the board side) of the pallet can be reduced. In addition, since the scanning distance of the on-board stage at each scanning exposure is shortened, the exposure time is shortened, and throughput is improved.

However, when the magnification in the X direction of the projection optical systems PL1 and PL2 is set to |β|, as in the position 21A to 21C of the two-dot chain line of Fig. 3 As shown, it is necessary to set the X-direction between the line pattern portions M10, M12 and the like for the first-line fields of view V1, V3, etc., and the line pattern portions M11, M13, etc. for the second-line fields of view V2, v4, and the like. The offset is the mask offset MO obtained by the following equation.

MO=Lm-Lp'/| β |.........(3)

Therefore, the idling distance can be shortened, and the stage system on the board side can be miniaturized, and on the other hand, the size of the mask M is slightly increased.

In the present embodiment, in the case of performing scanning exposure, as an example, in a state where the pattern of the mask M is exposed on the sheet P via the projection optical device PPL, in the +X direction indicated by the arrow SM1. The mask M is moved at the speed VM, and in synchronization with this, the board P is moved at the speed VM×|β | in the +X direction indicated by the arrow SP1. β is the projection magnification of the projection optical systems PL1 to PL7. Thereby, the pattern obtained by splicing the image of the magnification ratio β of the row pattern portions M10 to M16 of the mask M of FIG. 3 is exposed on the sheet P. Furthermore, the mask M and the panel P can also be scanned in the -X direction.

Further, according to the projection optical device PL of the present embodiment, since the projection optical systems PL1 to PL7 do not form an intermediate image, the configuration of the optical system can be simplified. Further, since the projection optical systems PL1 to PL7 have magnifications, it is possible to avoid an increase in the size of the mask, and it is possible to reduce the manufacturing cost of the mask.

The effects of this embodiment are as follows.

(1) The projection optical system PL1 of FIG. 2 forms an image of the pattern of the mask M on the board P at a magnification, and includes a concave mirror CCMb, a first lens group G1b, and a third lens group G3b, wherein the concave reflection mirror The CCMb is disposed in an optical path between the mask M and the plate P; the first lens group G1b is disposed in an optical path between the mask M and the concave mirror CCMb; the third lens group G3b is disposed on the concave mirror CCMb and In the optical path between the plates P, and all the lenses have a non-rotationally symmetrical outer shape with respect to the optical axis. Therefore, the distribution of the effective imaging beam in the third lens group G3b can be made non-rotationally symmetric by the concave mirror CCMb, so that the imaging beam can be vignetted without causing vignetting. The outer shape of the lens in the three lens group G3b becomes non-rotational symmetry. Thereby, the projection area can be enlarged, and the weight of the projection optical system PL1 can be reduced. Further, since the projection optical system PL1 is of magnification, the outer shape of the third lens group G3b tends to be larger than the outer shape of the first lens group G1b, so that the projection optical system PL1 can be greatly reduced by reducing the weight of the third lens group G3b. The overall weight.

Furthermore, it is also possible to make only the outer shape of at least one of the plurality of lenses constituting the third lens group G3b (for example, the lens having the largest weight or the lens having the largest radius) non-rotational symmetry, thereby also reducing the projection optical system. The weight of PL1.

Moreover, when a non-rotationally symmetric lens in the third lens group G3b can be formed by splitting, for example, a piece of rotationally symmetric lens, two non-rotationally symmetric lenses can be obtained from the one rotationally symmetric lens. The manufacturing cost of the projection optical system PL1 is lowered.

(2) Further, the projection optical system PL1 further includes deflection members FM1b, FM2b disposed between the concave mirror CCMb and the third lens group G3b composed of lenses of a non-rotationally symmetrical outer shape. In the optical path, the light beam from a predetermined point (for example, the center) in the field of view V1 on the mask M is transferred to the image field I1 on the plate P displaced in the -X direction for the point. Conjugate point. At this time, by making the slit portion of the third lens group G3b face the direction facing the transfer direction, the projection optical system PL1 can be downsized along the transfer direction.

(3) Further, since the second lens group G2b is further included, for example, rotationally symmetric, the second lens group G2b is disposed between the concave mirror CCMb and the first deflecting member FM1b for the light beam incident on the concave mirror CCMb and The light beam reflected by the concave mirror CCMb passes, so that the aberration can be reduced. Further, a configuration in which the second lens group G2b is not used may be formed.

(4) Further, since the pupil position (the pupil plane) of the projection optical system PL1 is located on the optical path between the first lens group G1b and the first deflecting member FM1b, the aperture stop ASb can be easily disposed at this position. .

(5) Further, since the first lens group G1b and the third lens group G3b have positive refractive power, for example, the focal length of the third lens group G3b is longer than the focal length of the first lens group G1b, and the magnification can be easily obtained at a magnification A projection optical system PL1 constituting both sides of the telecentricity.

(6) Further, since the notch surface of the lens of the non-rotationally symmetrical outer shape of the third lens group G3b faces the concave mirror CCMb side, the third lens group G3b can be made as shown in the position A2 of FIG. The distance between the two deflecting members FM2b) and the concave mirror CCMb side is reduced by the cut width, so that the projection optical system PL1 is further miniaturized (in the X direction).

(7) Further, in Fig. 4, the concave mirror CCMb of the projection optical system PL1 is disposed along the optical axis AX11, and the third lens group G3b is disposed along the optical axis AX13 parallel to the optical axis AX11, and the optical axis AX11 and the light The distance S1X between the axes AX13 is preferably smaller than the radius of the second lens group G2b which is the optical member having the largest diameter among the optical members disposed along the optical axis AX11, and the optical member constituting the third lens group G3b. The sum of the radii of the largest diameter optical components. This can be achieved by positioning the notch portion of the third lens group G3b on the concave mirror CCMb side and the third lens group G3b close to the concave mirror CCMb as described above, whereby the projection optical system PL1 can be made small Chemical.

(8) Further, the aperture stop ASb of the projection optical system PL1 of FIG. 2 is an aperture stop disposed in the optical path between the mask M and the plate P for determining the plate-side numerical aperture of the projection optical system PL1, and The aperture stop ASb is positioned such that the projection optical system PL1 is substantially telecentric on both sides. Therefore, even if the position of the mask M and the plate P in the Z direction changes, the magnification does not substantially change.

(9) Further, as shown in FIG. 4, the projection optical device PL of the above embodiment includes the projection optical system PL1 and rotates the projection optical system PL1 by 180. The projection optical system PL2 is formed. The projection optical system PL1 has a field of view V1 on the mask M, and projects an enlarged image of a part of the mask M onto the image field I1 (projection area) on the panel P based on the light from the field of view V1. The projection optical system PL2 has a field of view V2 on the mask M that is far from the field of view V1 in at least the non-scanning direction (Y direction), and projects a magnified image of a part of the mask M onto the board based on the light from the field of view V2. On P Less than the image field I2 away from the image field I1 in the non-scanning direction. The third lens groups G3b and G3c composed of the non-rotationally symmetric lenses in the projection optical system PL1 and the projection optical system PL2 are substantially line symmetrical with respect to the axis parallel to the non-scanning direction. Therefore, as shown in the positions A2, A4, and the like of FIG. 2, the distance between the third lens groups G3b, G3c (and the second deflecting members FM2b, FM2c) and the concave mirrors CCMb, CCMc side can be reduced by the cut width. . Thereby, the distance between the two image fields I1 and I2 can be shortened in the scanning direction (X direction) orthogonal to the non-scanning direction, and the projection optical device PL can be miniaturized in the scanning direction.

Further, in FIG. 4, the fields of view V1, V2 may be arranged on a straight line parallel to the Y-axis, but at this time, the mask offset MO of FIG. 3 is increased. On the other hand, as shown in FIG. 4, by arranging the field of view V2 to be shifted in the Y direction and the X direction with respect to the field of view V1, the mask offset and the idle distance can be made. Get balanced.

(10) Further, the projection exposure apparatus according to the above embodiment is a scanning exposure apparatus that changes the pattern of the mask M while the image of the pattern of the mask M is projected onto the panel P. Like the positional relationship with the plate P, the pattern of the mask M is transferred onto the plate P with respect to the scanning direction (X direction). In the projection exposure apparatus, a projection optical device PL is provided to project an image of the pattern of the mask M on the plate P, and is orthogonal to the Y direction (that is, a direction in which at least the image fields I1 and I2 are far from each other). The X direction is set to the scanning direction. Therefore, after the scanning exposure, the image exposed by the image fields I1, I2 can be spliced, whereby a large-area pattern can be exposed on the board P. In addition, when the distance in the scanning direction of the image fields I1, I2 can be shortened, the length can be shortened The distance traveled by the board (scanning distance). As a result, the manufacturing cost of the exposure apparatus can be further reduced by miniaturization of the stage system, and the exposure time can be shortened, so that the yield of the exposure step can be improved.

Next, a second embodiment of the present invention will be described with reference to Fig. 5 . This embodiment is formed by changing the configuration of the projection optical apparatus of the first embodiment, and has the same configuration as that of the first embodiment. In the following, in FIG. 5, parts corresponding to those in FIG. 2 are denoted by the same reference numerals, and detailed description thereof will be omitted.

Fig. 5 shows the partial illumination optical systems IL1, IL2 and the projection optical systems PLA1, PLA2 of the present embodiment. The main difference between the projection optical systems PLA1, PLA2 and the projection optical systems PL1, PL2 of Fig. 2 is that an intermediate image is formed.

In FIG. 5, the projection optical systems PLA1, PLA2 are constituted by projection optical devices including first imaging optical systems 14b, 14c for forming an intermediate image of the mask M, and for intermediate images and plates P. The second imaging optical system 16b, 16c is optically conjugated. The configuration of the second imaging optical systems 16b, 16c is substantially the same as that of the projection optical systems PL1, PL2 of Fig. 2, but differs in that the first lens groups G1bh, G1ch constituting the second imaging optical systems 16b, 16c are The outer shape of each of the lenses is such that the lenses of the rotationally symmetrical lenses of the first lens groups G1b and G1c constituting the projection optical systems PL1 and PL2 are cut off from the optical axis by the +X direction side and the half portion of the -X direction side. Rotating symmetrical shape. However, even in this case, since the imaging light beam passes through the -X direction side and the +X direction side from the optical axis of the first lens group G1bh, G1ch, the projection can be further reduced. The weight of the optical systems PLA1, PLA2, and the vignetting of the effective imaging beam does not occur.

The magnifications of the projection optical systems PLA1, PLA2 are set such that the magnification in the scanning direction exceeds +1, and the magnification in the non-scanning direction exceeds +1. That is, the projection optical systems PL1, PL2 form the erect positive image of the first surface on the second surface based on the magnification.

Further, field diaphragms 15b and 15c are disposed at positions to be formed at intermediate images in the optical paths between the first imaging optical systems 14b and 14c and the second imaging optical systems 16b and 16c. According to the projection optical system of the present embodiment, the field diaphragms 15b and 15c can be easily disposed, and the field diaphragm can be projected onto the board P with the accuracy of the projection optical system, so that high-precision projection can be performed.

Next, a third embodiment of the present invention will be described with reference to Fig. 6 . The plurality of projection optical systems of the present embodiment are formed by providing an optical characteristic adjustment mechanism in the projection optical system of the first embodiment, and have substantially the same configuration in other respects. In the following, the same components as those in FIG. 2 are denoted by the same reference numerals, and detailed description thereof will be omitted.

Fig. 6 is a view showing the configuration of projection optical systems PLB1 and PLB2 according to the present embodiment. In FIG. 6, the projection optical systems PLB1, PLB2 are different from the projection optical systems PL1, PL2 of FIG. 2 in that the lenses of the first lens groups G1bh, G1ch are non-rotationally symmetrical. Further, the projection optical systems PLB1 and PLB2 are different in that they include first optical characteristic adjustment mechanisms AD1b and AD1c, second optical characteristic adjustment mechanisms AD2b and AD2c, third optical characteristic adjustment mechanisms AD3b, AD3c, and fourth light. Learning characteristics adjustment mechanism AD4b, AD4c. The first optical property adjustment mechanisms AD1b and AD1c are formed of a wedge-shaped double glass disposed in an optical path between the mask M and the first lens groups G1bh and G1ch; the second optical characteristic adjustment mechanism AD2b, AD2c are constituted by rotation mechanisms of the second optical path deflecting members FM2b, FM2c; the third optical characteristic adjusting mechanisms AD3b, AD3c are constituted by three lenses having the same curvature, and the fourth optical characteristic adjusting mechanisms AD4b, AD4c are provided with parallel plates And constitute.

In the first optical property adjustment mechanisms AD1b, AD1c, the double glazing is moved along the wedge angle to change the thickness of the glass, whereby the degree of tilt of the focus or image plane can be adjusted. Further, the rotation of the image can be adjusted by the second optical characteristic adjustment mechanisms AD2b and AD2c. Further, the third optical property adjustment mechanisms AD3b and AD3c can adjust the magnification by moving the lens at the center portion in the vertical direction (Z direction) between the mask M and the panel P. Further, the fourth optical characteristic adjusting mechanisms AD4b and AD4c can adjust the image position by tilting the parallel flat plate with respect to the optical axis. Further, the third optical property adjustment mechanisms AD3b and AD3c and the fourth optical property adjustment mechanisms AD4b and AD4c are cut away from the optical axis by the half side similarly to the third lens groups G3b and G3c.

In addition, as the second optical property adjustment mechanism, a mechanism that rotates only the first optical path deflecting members FM1b and FM1c around the axis parallel to the rotation axes of the second optical path deflecting members FM2b and FM2c may be used. The optical path deflecting members FM1b, FM1c and the second optical path deflecting members FM2b, FM2c are independently or synchronously rotated about the axis.

Next, Fig. 7 shows a projection optical system PLC2 according to a fourth embodiment of the present invention, which is different from the projection optical system PL2 of Fig. 2 in that a difference is formed between the mask M and the panel P. The middle image. In FIG. 7, parts corresponding to those in FIG. 2 are denoted by like symbols. In FIG. 7, the projection optical system PLC2 is configured such that the first lens group GC1, the second lens group GC2, the concave mirror CCM, the first deflecting member FM1, and the fourth lens group GC4 are arranged in order from the mask M. The second deflecting member FM2 and the third lens group GC3. The first deflecting member FM1 deflects the light beam that has been reflected by the concave mirror CCM and passed through the second lens group GC2 in the +X direction, and the second deflecting member FM2 causes the light beam that passes through the fourth lens group GC4 to Z direction is biased.

Then, an intermediate image (primary image) of the pattern 22M of the mask M is formed between the first deflecting member FM1 and the fourth lens group GC4 by the first lens group GC1, the second lens group GC2, and the concave mirror CCM. 23, an image (secondary image) 22P formed by the fourth lens group GC4 and the third lens group GC3 of the intermediate image 23 is formed on the plate P. In the present embodiment, since each of the lenses constituting the third lens group GC3 has a non-rotationally symmetrical outer shape in which half of the concave mirror CCM side is cut off, the weight of the projection optical system PL2 can be reduced, and The projection optical system PL2 is miniaturized in the X direction.

In addition, the magnification of the projection optical system PLC2 of the present embodiment is a magnification which is negative in the scanning direction (X direction) and a positive magnification in the non-scanning direction (Y direction). Therefore, when the projection optical system PL1 to PL7 as shown in FIG. 1 is used, the projection optical system PLC2 is disposed around Z. When the projection optical system in which the axis is rotated by 180 turns and the projection optical device of the projection optical system PLC2 perform scanning exposure, in FIG. 7, the mask M and the plate P must be scanned in opposite directions, for example, in the following manner. In this manner, the mask M is scanned in the -X direction indicated by the arrow SM2, and in synchronization with this, the board P is scanned in the direction indicated by the arrow SP1.

Hereinafter, some embodiments of the above embodiments will be described.

FIG. 8A shows an embodiment of the projection optical system PL2 of FIG. 2. In FIG. 8A, the first lens group G1c is configured such that two convex lenses L11, two concave lenses L12, and two convex lenses L13 are arranged in this order from the mask M side. The second lens group G2c is configured such that two convex lenses L14, two concave lenses L15, and a positive meniscus lens L16 whose concave surface faces the mask M are disposed in this order from the mask M side. The third lens group G3c is configured such that two concave lenses L17, a positive meniscus lens L18 having a concave surface facing the mask M, a positive meniscus lens L19 having a concave surface facing the mask M, and the like are disposed from the side of the mask M, and The convex meniscus lens L1A having a convex surface facing the mask M. Further, a parallel flat optical characteristic adjusting member AD11 is disposed between the first lens group G1c and the mask M, and an optical characteristic adjusting member AD12 is disposed between the third lens group G3c and the plate P. The AD 12 is formed of two parallel flat plates and has a shape in which a half portion of the concave mirror CCMc side is cut with respect to the optical axis AX23.

Further, as shown in FIG. 8B, the positive meniscus lens L1A in the third lens group G3c is, for example, cut in a region CD having a width d including the optical axis AXT after the rotationally symmetrical lens L1AT is manufactured. This lens L1AT is produced. Then, all of the third lens group G3c of FIG. 8A is transparent. The mirror is provided with a non-rotationally symmetrical outer shape obtained by cutting a half of the concave mirror CCMc side with respect to the optical axis AX23. Therefore, the cut surface B1 of all the lenses in the third lens group G3c faces the concave mirror CCMc.

Further, as an example, the focal length f1 of the first lens group G1c is about 600 mm, the focal length f3 of the third lens group G3c is about 1500 mm, and the projection magnification is about 2.5 times.

Next, Fig. 9 shows a projection optical system PLD2 which can also be used as the projection optical system PL2 of Fig. 2 (or the projection optical system PLB2 of Fig. 6). In FIG. 9, the optical characteristic adjustment member AD13 and the first lens group G1A are half-sections on the side of the third lens group G3A with respect to the optical axis AX21 from the optical characteristic adjustment member AD11 and the first lens group G1c of FIG. 8A, respectively. The shape of the formation. Further, the second lens group G2A has the same configuration as the second lens group G2c of FIG. 8A, and the third lens group G3A and the optical characteristic adjustment member AD14 are respectively formed to surround the third lens group G3c and the optical characteristic adjustment member AD12 of FIG. 8A. The shape in which the optical axis AX23 is rotated by 180 turns. Further, the deflecting member FM1c and the deflecting member FM2c deflect the light beams that are inside with respect to the optical axis AX21 and the optical axis AX23, respectively. As a result, the cut surface B2 of the first lens group G1A faces the optical axis AX23 side, and the cut surface B3 of the third lens group G3A faces the opposite side of the concave mirror CCMc, but since the third lens group G3A and the concave mirror have been shortened The interval of the CCMc can reduce the weight of the projection optical system PLD2 and can miniaturize the projection optical system PLD2.

Further, in the embodiment of Fig. 9, half of the first lens group G1A has been cut, and the deflecting member FM1c can be used as compared with the embodiment of Fig. 8A. And the FM2c is disposed at a position close to the mask M. Therefore, although the focal length and projection magnification of the first lens group G1A and the third lens group G3A are the same as those in the embodiment of FIG. 8A, the interval between the mask M and the board P can be shortened. . Further, as the projection optical system PL1 of FIG. 2 (or the projection optical system PLB1 of FIG. 6), an optical system in which the projection optical system PLD2 of FIG. 9 is rotated by 180 turns around the Z axis can be used.

Fig. 10 shows an embodiment of the projection optical system PLB2 of Fig. 6. In FIG. 10, the first lens group G1c is configured such that a plano-concave lens L21 having a concave surface toward the mask M, a plano-convex lens L22 whose plane faces the mask M, and a plane-facing mask M are sequentially disposed from the side of the mask M. Plano-convex lens L23. Further, all the lenses constituting the first lens group G1c are non-rotationally symmetrical shapes in which a half portion of the opposite side of the third lens group G3c is cut off with respect to the optical axis. The second lens group Gc2 is configured such that two convex lenses L24, two convex lenses L25, and two concave lenses L26 are arranged in this order from the mask M side.

The third lens group G3c is configured such that a plano-concave lens L27 whose concave surface faces the mask M, a plano-concave lens L28 whose plane faces the mask M, a plano-convex lens L29 whose plane faces the mask M, and a plane orientation are arranged in this order from the mask M side. The plano-convex lens L2A of the mask M, the plano-convex lens L2B whose convex surface faces the mask M, the plano-concave lens L2C whose plane faces the mask M, and the plano-convex lens L2D whose convex surface faces the mask M. At this time, the lenses L27 to L29 in the third lens group G3c are disposed between the deflecting member FM1c and the deflecting member FM2c, and are non-rotationally symmetrical outer shapes obtained by cutting out half of the mask M side with respect to the optical axis. Further, all the lenses L2A to L2D remaining in the third lens group G3c are disposed between the second deflecting member FM2c and the board P, and are phases A non-rotationally symmetrical outer shape in which the optical axis is cut away from a portion of the half portion of the concave mirror CCMc side.

Further, between the first lens group G1c and the mask M, a parallel flat optical characteristic adjusting member AD21 in which a half of the deflecting member FM1c side is cut off from the optical axis is disposed, and the third lens group G3c and the third lens group G3c are disposed. An optical characteristic adjusting member AD22 having a shape in which a portion parallel to the optical axis AX23 is cut by more than half of the concave mirror CCMc side is disposed between the plates P.

The focal length f1 of the first lens group G1c, the focal length f3 of the third lens group G3c, and the projection magnification of the present embodiment are the same as those of the embodiment of Fig. 8A.

In the projection optical system PLB2 of the embodiment of FIG. 10, it is a lens of a non-rotationally symmetrical outer shape and constitutes all of the lenses of the first lens group G1c and the third lens group G3c, and is a plano-convex lens or a plano-concave lens. Therefore, when the assembly of the lenses of the first lens group G1c and the third lens group G3c is adjusted, for example, as shown in the lens L2A in the third lens group G3c, the laser beam 25 from the laser light source 24 is passed through the beam splitter. The beam splitter 26 is irradiated to the plane portion B4 including the region through which the illumination light of the lens L2A passes. Then, the reflected light 27 from the plane portion B4 is received by the two-dimensional imaging element 28 such as a CCD (Charge Coupled Device) camera via the beam splitter 26. The two-dimensional position of the reflected light 27 is detected from the detection signal of the image sensor 28, whereby the inclination angle around the two axes orthogonal to the plane perpendicular to the optical axis of the plane portion B4 of the lens L2A can be obtained. For example, the angle of the lens L2A is adjusted via a lens frame or the like (not shown) so that the inclination angle is a predetermined value, whereby Perform optical adjustments efficiently. Similarly, the assembly of the plano-convex lens or the plano-concave lens constituting the first lens group G1c and the third lens group G3c can be efficiently adjusted.

Next, Fig. 11 shows another embodiment of the projection optical systems PLB1, PLB2 of Fig. 6. In FIG. 11, the first projection optical system PLB1 uses the projection optical system PLD2 of FIG. 9 as it is. That is, the first lens group G1bh, the second lens group G2b, and the third lens group G3b of the projection optical system PLB1 are composed of the first lens group G1A, the second lens group G2A, and the third lens group G3A of FIG. Further, the second projection optical system PLB2 has a shape in which the first projection optical system PLB1 is rotated by 180 turns around an axis parallel to the Z axis. In other words, the optical characteristic adjusting members AD21 and AD12, the first lens group G1ch, and the third lens group G3c of the second projection optical system PLB2 are optical characteristic adjusting members AD13 and AD14 of the first projection optical system PLB1, respectively. The lens group G1bh and the third lens group G3b are rotated by 180 turns around an axis parallel to the Z axis, and the second lens group G2c and the concave mirror CCMc have the same shape as the second lens group G2b and the concave mirror CCMb. .

In this configuration, the cut faces B3 and B5 of the third lens groups G3b and G3c face the opposite sides of the concave mirrors CCMb and CCMc, respectively, and the distance Lp in the X direction between the image fields on the plate P is set shorter than The distance Lm in the X direction between the fields of view on the mask M. Therefore, the mask offset becomes long, but the idling distance (Lp) of the pallet is shortened, so that the stage system can be miniaturized.

Next, Fig. 12 is a view showing the projection optical system PL2 of Fig. 8A. The peripheral portion of the lens of the non-rotationally symmetrical shape of the three lens group G3c that does not pass through is provided with a plane portion substantially perpendicular to the optical axis AX23. In FIG. 12, planar portions 31A, 31B, 31C, and 31D are provided on the peripheral portions of the lenses L17, L18, L19, and L1A, respectively.

Fig. 13 shows the configuration of the holding portion of the lens L19 in Fig. 12. In FIG. 13, a convex portion (bone portion) B7 is formed on the outer circumference of the lens L19 having the cut surface B6 substantially including the optical axis AX23, and the convex portion B7 is passed through the lens holding portions 33A, 33B, and 33C at three places. The lens frame 32 is held in the lens frame 32, and the lens frame 32 is placed in a lens barrel (not shown) of the projection optical system PL2 of Fig. 8A. In FIG. 13, the upper surface of the convex portion B7 is formed as a flat portion 31C that is substantially perpendicular to the optical axis AX23.

At this time, as an example, the laser beam 25 is irradiated to the plane portion 31C via the beam splitter 26 from the laser light source 24, and the reflected light 27 is received by the image capturing device 28 via the beam splitter 26, whereby the measurement can be performed. The tilt angle of the lens L19 around the two axes orthogonal to the plane perpendicular to the optical axis AX23 of the lens L19. Then, by adjusting the plurality of heights and the like of the lens L19 (lens frame 32) based on the tilt angle, the lens L19 can be optically adjusted efficiently. Similarly, by using the other planar portions 31A, 31B, and 31D of Fig. 12, the other lenses can be optically adjusted efficiently.

The effects of the above embodiments and examples are summarized as follows.

(21) In the embodiment of FIGS. 5 and 6, and the embodiment of FIG. 9 and FIG. 10, all the lenses of the first lens groups G1bh, G1A, and G1c such as the projection optical systems PLA1, PLB1, and PLD2 are formed. It is a non-rotationally symmetrical shape that is cut off from the optical axis with respect to the optical axis. In this case too Yes, since the distribution of the effective imaging beam passing through the first lens group by the concave mirrors CCMb, CCMc is non-rotationally symmetrical, the vignetting of the imaging beam is not generated, thereby further reducing the projection optical system PLA1. Wait for the weight. Further, by manufacturing two lenses having a non-rotationally symmetrical shape by using a rotationally symmetrical lens, the manufacturing cost when manufacturing the plurality of first lens groups G1bh and the like can be reduced.

Furthermore, it is possible to make only the outer shape of at least one lens (for example, the heaviest lens or the lens having the largest outer diameter) of the first lens group G1bh, G1A, G1c, etc., to be non-rotationally symmetrical, thereby also reducing the weight.

(22) Further, for example, the lens L19 of the non-rotationally symmetrical outer shape of Fig. 13 includes a cut surface B6 substantially parallel to the optical axis (AX23) of the lens, and the shortest distance from the cut surface B6 to the optical axis AX23 (positive The value is a negative value, here almost 0), and is set to be shorter than the distance from the outer circumference of the lens L19 to the optical axis AX23. Thereby, the lens L19 is made smaller in weight than the rotationally symmetrical lens.

(23) Further, the lens in the first lens group G1c and the third lens group G3c of FIG. 10 which is a lens of a non-rotationally symmetrical outer shape has a plane portion extending in a direction transverse to the optical axis and through which the light beam passes (B4) Wait). Therefore, the flat portion can be used to perform optical adjustment efficiently.

(24) Further, the lenses L17 to L1A of Fig. 12 which are lenses of a non-rotationally symmetrical outer shape are provided with flat portions 31A to 31D which are formed on the peripheral portion where the light beam does not pass. Therefore, there is an advantage that the flat portion can be used to perform optical adjustment efficiently, and the lens can be made into any shape other than flat convex or flat concave.

Further, by using a scanning projection exposure apparatus to which the projection optical system PL of Fig. 1 of the above-described embodiment is applied, a predetermined pattern (a circuit pattern, an electrode pattern, or the like) is formed on a substrate (glass plate), whereby it can be obtained as a micro A liquid crystal display element of a component. Hereinafter, an example of this manufacturing method will be described with reference to the flowchart of Fig. 14 .

In step S401 (pattern forming step) of FIG. 14, first, a coating step, an exposure step, and a development step are performed; in the coating step, a photoresist is coated on a substrate to be exposed to prepare a photosensitive substrate; in the exposing step, In the above scanning type exposure apparatus, a mask pattern for a liquid crystal display element is transferred onto the photosensitive substrate, and in the developing step, the photosensitive substrate is developed. A predetermined photoresist pattern is formed on the substrate by a photolithography step including the coating step, the exposing step, and the developing step. Following the photolithography step, a predetermined pattern including a plurality of electrodes or the like is formed on the substrate via an etching step using the photoresist pattern as a mask, a photoresist stripping step, and the like. This photolithography step or the like is performed a plurality of times in accordance with the number of layers on the substrate.

In the next step S402 (color filter forming step), a plurality of sets of three fine filters corresponding to red R, green G, and blue B are arranged in a matrix, or in the horizontal scanning line direction. A plurality of sets of three strip filters of red R, green G, and blue B are arranged, thereby forming a color filter. In the next step S403 (unit assembly step), for example, a liquid crystal panel is manufactured by injecting liquid crystal between a substrate having a predetermined pattern obtained by step S401 and a color filter obtained by step S402. ).

In the subsequent step S404 (module assembly step), as described above The assembled liquid crystal panel (liquid crystal cell) is provided with a circuit for performing display operation of the liquid crystal panel, and a component such as a backlight, thereby completing the fabrication of the liquid crystal display element. According to the manufacturing method of the liquid crystal display device described above, the exposure step and the development step are performed by exposing the pattern of the mask to the photosensitive substrate by using the scanning type exposure apparatus of the above embodiment, and the developing step is performed by the exposure The exposed photosensitive substrate is developed in steps.

Therefore, the weight of the exposure apparatus is reduced, so that the installation cost of the exposure apparatus in the component manufacturing factory can be reduced. Further, when the scanning distance (the idling distance) of the stage of the exposure apparatus can be shortened, the substrate stage can be miniaturized, and the liquid crystal display element can be manufactured at a low cost and with high yield.

The present invention is not limited to the process of applying to a liquid crystal display element, and can be widely applied to, for example, a process of a display device such as a plasma display, an image pickup element (CCD, etc.), a micro machine, or a MEMS (Micro Electromechanical Systems, miniature). Electromechanical systems), the use of ceramic wafers and the like as thin film magnetic heads for substrates, and various components such as semiconductor elements.

Further, in the above embodiment, a discharge lamp is provided as a light source, and necessary g-ray (436 nm) light, h-ray (405 nm), and i-ray (365 nm) light are selected. However, it is not limited thereto, when using light from an ultraviolet LED, laser light of KrF excimer laser (248 nm) or ArF excimer laser (193 nm), or high harmonics of a solid laser (semiconductor laser, etc.), The invention can also be applied.

Further, the projection optical system PL1 of the above embodiment and the projection light The learning device PL is manufactured by assembling the respective constituent elements listed in the patent application scope in such a manner as to maintain predetermined mechanical precision and optical precision. Further, the scanning exposure apparatus (projection exposure apparatus) of the above-described embodiment includes various components including projection optical devices and the like which are included in the scope of the patent application of the present invention in a predetermined mechanical precision, electrical precision, and optical precision. Various subsystems are manufactured. In order to ensure these various precisions, various optical systems are used to adjust the optical precision before and after the assembly, and various mechanical systems are used to achieve mechanical precision adjustment, and for various electrical systems, electrical precision is achieved. Adjustment. The steps of assembling the various types of subsystems into an exposure apparatus include mechanical connection of various subsystems, wiring connection of circuits, piping connection of a pneumatic circuit, and the like. Prior to the step of assembling the various subsystems into an exposure apparatus, of course, there are individual assembly steps for each system. After the assembly steps of the exposure devices of the various subsystems are completed, comprehensive adjustment is performed to ensure various precisions as the entire exposure device. Furthermore, it is desirable that the exposure apparatus be manufactured in a clean room that is managed such as temperature and cleanliness.

Further, the present invention is not limited to the above-described embodiments, and various configurations can be made without departing from the gist of the invention. The entire disclosure of Japanese Patent Application No. 2007-054882, filed on Jan. 5,,,,,,,,,,,,,,,,

IU‧‧‧Lighting device

2‧‧‧Elliptical mirror

3‧‧‧ dichroic mirror

4‧‧‧ Collimating lens

5‧‧‧Wavelength Selection Filter

6‧‧‧Light reduction filter

7‧‧‧ Concentrating lens

8‧‧‧Optical fiber

8a‧‧‧Inlet port

8b, 8c, 8d, 8e, 8f, 8g, 8h‧‧‧ shots

9b, 9c‧‧ ‧ collimating lens

10b, 10c‧‧ ‧ fly eye lens

11b, 11c‧‧ ‧ condenser

L11, L13‧‧‧ convex lens

L12‧‧‧ concave lens

L28, L2C‧‧‧ plano-concave lens

L29, L2A, L2B, L2D‧‧‧ Plano-convex lenses

14b, 14c‧‧‧ first imaging optical system

15b, 15c‧‧‧ field of view

16b, 16c‧‧‧second imaging optical system

31A~31D‧‧‧Flat Department

50‧‧‧Mobile mirror

52‧‧‧Alignment system

54‧‧‧Auto Focus System

AD11‧‧‧Optical characteristics adjustment parts

AD1b, AD1c‧‧‧ first optical characteristic adjustment mechanism

AD2b, AD2c‧‧‧second optical characteristic adjustment mechanism

AD3b, AD3c‧‧‧ third optical characteristic adjustment mechanism

AD4b, AD4c‧‧‧ fourth optical characteristic adjustment mechanism

AX11, AX12, AX13, AX21, AX22, AX23‧‧‧ optical axis

ASb, ASc‧‧‧ aperture diaphragm

CCMb, CCMc‧‧‧ concave mirror

DP, DP'‧‧‧ spacing in the scanning direction (X direction)

FM1b, FM1c‧‧‧ first deflecting parts

FM2b, FM2c‧‧‧ second deflecting parts

GC1, G1b, G1c, G1bh, G1ch‧‧‧ first lens group

GC2, G2b, G2c‧‧‧ second lens group

G3b, G3c‧‧‧ third lens group

GC4‧‧‧Fourth lens group

I1~I7‧‧‧Island

IL1~IL7‧‧‧Local illumination optical system

IC1, IC2‧‧‧ Center

L17‧‧‧ concave lens

L18, L19, L1A‧‧‧ positive meniscus lens

Lp, Lm‧‧‧ interval

M‧‧‧ mask

P‧‧‧ board

PL1~PL7‧‧‧Projection Optical System

PLA1, PLB1‧‧‧ first projection optical system

PLA2, PLB2‧‧‧second projection optical system

SP1‧‧‧ scan direction

V1~V7‧‧‧ field of view

VC1, VC2‧‧‧ Center

S401~S404‧‧‧Steps

Fig. 1 is a view showing the configuration of a scanning exposure apparatus according to a first embodiment; Figure.

Fig. 2 is a view showing the configuration of two partial illumination optical systems and two projection optical systems according to the first embodiment;

3 is a plan view showing an example of a pattern formed on the mask in FIG. 1.

4 is a plan view showing a relationship between a field of view and an image field of the plurality of projection optical systems of FIG. 1.

Fig. 5 is a configuration diagram showing an illumination optical system and a projection optical system according to a second embodiment;

Fig. 6 is a configuration diagram showing two projection optical systems according to a third embodiment;

Fig. 7 is a configuration diagram showing a projection optical system according to a fourth embodiment.

FIG. 8A is a configuration diagram showing an embodiment of the projection optical system PL2.

Fig. 8B is a view for explaining a method of manufacturing the lens L1A in Fig. 8A.

Fig. 9 is a configuration diagram showing a projection optical system of another embodiment.

FIG. 10 is a configuration diagram showing an embodiment of the projection optical system PLB2.

Fig. 11 is a configuration diagram showing another embodiment of the projection optical systems PLB1 and PLB2.

Fig. 12 is a view showing an example in which a plurality of lenses of Fig. 8A are provided with flat portions.

Fig. 13 is a perspective view showing a holding mechanism of the lens L19 in Fig. 12 .

Fig. 14 is a flow chart for explaining a method of manufacturing the micro device of the embodiment.

IL1, IL2‧‧‧local illumination optical system

8b, 8c‧‧‧ shots

9b, 9c‧‧ ‧ collimating lens

10b, 10c‧‧ ‧ fly eye lens

11b, 11c‧‧‧ concentrating lens

AX11, AX12, AX13, AX21, AX22, AX23‧‧‧ optical axis

A1, A2, A3, A4, A5‧‧‧ two-point chain position

P‧‧‧ board

CCMb, CCMc‧‧‧ concave mirror

ASb, ASc‧‧‧ aperture diaphragm

DP, DP'‧‧‧ spacing in the scanning direction (X direction)

Dm‧‧ interval

SP1‧‧‧ scan direction

M‧‧‧ mask

G1b, G1c‧‧‧ first lens group

PL1, PL2‧‧‧ projection optical system

G3b, G3c‧‧‧ third lens group

G2b, G2c‧‧‧second lens group

FM1b, FM1c‧‧‧ first deflecting parts

FM2b, FM2c‧‧‧ second deflecting parts

Claims (19)

A catadioptric projection optical system, wherein an image of a first object disposed on a first surface is formed on a second object disposed on a second surface at an enlarged projection magnification, the catadioptric projection optical system being characterized by a concave mirror disposed in an optical path between the first surface and the second surface, wherein the concave mirror has a first optical axis perpendicular to the second surface; and a front lens group disposed on the first surface And an optical path between the concave mirror and the rear lens group disposed in the optical path between the concave mirror and the second surface, wherein the rear lens group is different from the first optical axis a second optical axis that is apart from and parallel with respect to the first optical axis in the first direction; and the rear lens group includes: a lens of a non-rotationally symmetrical outer shape in which at least one of the first direction sides is cut off. The catadioptric projection optical system according to claim 1, further comprising a beam transfer member disposed in an optical path between the concave mirror and the at least one non-rotationally symmetrical lens. And transmitting a light beam from a predetermined field of view on the first object to a conjugate point on the second object displaced at least in the first direction for the field of view. The catadioptric projection optical system according to claim 2, further comprising an intermediate lens group disposed between the concave mirror and the beam transfer member for incident on the concave mirror The light beam and the light beam reflected by the concave mirror pass. The catadioptric projection optical system according to claim 2, wherein the aperture of the catadioptric projection optical system is located between the front lens group and the beam transfer member. The catadioptric projection optical system according to claim 1, wherein the front lens group has a positive refractive power, and the rear lens group has a positive refractive power. The catadioptric projection optical system of claim 1, wherein the front lens group comprises at least one lens of a non-rotationally symmetrical outer shape. The catadioptric projection optical system according to claim 1, wherein the non-rotationally symmetrical outer lens has a slit surface substantially parallel to an optical axis of the lens, and a shortest distance from the slit surface to the optical axis It is shorter than the distance from the outer circumference of the above lens to the optical axis. The catadioptric projection optical system according to claim 7, wherein the slit surface of the non-rotationally symmetrical outer shape lens in the rear lens group faces the concave mirror side. The catadioptric projection optical system according to claim 1, wherein the concave mirror is disposed along a first optical axis, and the rear lens group is disposed along a second optical axis parallel to the first optical axis. The distance between the first optical axis and the second optical axis is smaller than the radius of the optical member having the largest diameter among the optical members disposed along the first optical axis and the largest of the optical members constituting the rear lens group diameter The sum of the radii of the optical components. The catadioptric projection optical system according to claim 1, wherein the non-rotationally symmetrical outer shape lens of the rear lens group has a flat portion extending in a direction transverse to an optical axis of the lens. The catadioptric projection optical system according to claim 10, wherein the planar portion of the lens of the non-rotationally symmetrical outer shape is formed at a portion where the light beam passes or a peripheral portion where the light beam does not pass. The catadioptric projection optical system of claim 1, further comprising an aperture stop disposed in the optical path between the first surface and the second surface to determine the reflection and refraction projection The second surface side numerical aperture of the optical system is positioned such that the first surface side and the second surface side are substantially telecentric. The catadioptric projection optical system according to any one of claims 1 to 12, wherein the first surface and the second surface are parallel to each other. The catadioptric projection optical system according to any one of claims 1 to 12, wherein an intermediate image of the first object is not formed between the first surface and the second surface. The catadioptric projection optical system according to any one of claims 1 to 12, wherein the first object of the first object is formed on the second object. A projection optical device comprising the catadioptric projection optical system according to any one of claims 1 to 12 a first projection optical system and a second projection optical system, wherein the first projection optical system has a first field of view on the first surface, and the light is generated based on light from the first field of view An enlarged image of a portion of the first object is projected onto the first projection area on the second surface, and the second projection optical system has the first surface on the first surface at least at least in a second direction perpendicular to the first direction a second field of view of the field of view, based on the light from the second field of view, projecting an enlarged image of a portion of the first object onto the second surface at least in the second direction away from the first projection area In the second projection region, the non-rotationally symmetrical lens in the rear lens group of the first and second projection optical systems is substantially line-symmetrical with respect to an axis parallel to the first optical axis. A scanning type exposure apparatus that changes an image of the first object and a first aspect with respect to a scanning direction while projecting an image of the first object disposed on the first surface onto a second object disposed on the second surface a positional relationship between the two objects, wherein the pattern of the first object is transferred onto the second object, and the scanning type exposure apparatus is characterized in that: in order to project the image of the first object onto the second object, The projection optical device according to claim 16, wherein the first direction of the projection optical device is regarded as the scanning direction. The scanning exposure apparatus according to claim 17, wherein the second object is a rectangular glass plate having a length of 1.9 m to 3.2 m. A component manufacturing method characterized by comprising: an exposure step of exposing a pattern of a mask as the first object to a scanning exposure apparatus as described in claim 17 or 18 As the photosensitive substrate on the second object; and a developing step, the photosensitive substrate exposed by the exposure step is developed.