JP2013021265A - Illumination device, exposure device, exposure method, and manufacturing method of device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To achieve a high quality illumination by making it possible to adjust an illumination light, that illuminates an object to be illuminated, to be a uniform illuminance.SOLUTION: An illumination device 10 comprises an illumination light emitting unit 11 and an illumination light guide unit 31. The illumination light guide unit is arranged so that an illumination light is incident on a rod integrator 32, and the illumination light emitting unit illuminates a whole illumination region by making a plurality of branching laser beams Lm1 and Lm2 for illumination incident on the rod integrator 32, and illuminates a part of a region illuminated by the branching laser beams Lm1 and Lm2 for illumination by making a branching laser beam Ls1 for adjusting incident on the rod integrator 32.

Description

  The present invention relates to an illumination technique for illuminating a predetermined illumination area, an exposure technique, and a device manufacturing technique using the exposure technique.

  In a photolithography technique used when manufacturing a semiconductor element, a liquid crystal display element, or the like, a pattern formed on a mask (reticle or photomask) is projected onto a substrate coated with a photosensitive material such as a resist. In order to form a fine pattern thereon, it is required to illuminate a predetermined illumination area set for the mask with substantially uniform illuminance (for example, Patent Document 1).

JP 2001-337462 A

  In such a photolithography technique, it is necessary to improve the illuminance uniformity of the illumination light that illuminates the mask in accordance with the demand for further miniaturization or higher accuracy of the pattern formed on the substrate.

  In view of the above, an object of an aspect of the present invention is to provide an illumination apparatus, an exposure apparatus, an exposure method, and a device manufacturing method that can improve the illuminance uniformity of illumination light that illuminates a predetermined illumination area.

  According to one aspect of the present invention, a rod integrator that has a pair of side surfaces facing each other and emits light reflected between the pair of side surfaces, and a light guide that irradiates a predetermined illumination region with light emitted from the rod integrator. An illumination device comprising an optical system, wherein the illumination region is illuminated by the first light and a first incident portion that causes the first light to be incident on the rod integrator so as to illuminate the entire illumination region. There is provided an illuminating device comprising: a second incident portion that causes the second light to be incident on the rod integrator so as to illuminate a part of the second integrator.

  Moreover, according to one aspect of the present invention, there is provided an exposure apparatus that exposes the substrate by irradiating the substrate with light through the pattern formed on the mask, and illuminates the pattern. There is provided an exposure apparatus comprising the illumination device according to the above.

  Moreover, according to one aspect of the present invention, there is provided an exposure method for exposing a substrate by irradiating the substrate with light through a pattern formed on a mask, wherein the illumination device according to one aspect of the present invention is provided. An exposure method is provided that includes using to illuminate the pattern.

  According to another aspect of the present invention, there is provided a device manufacturing method for forming an electronic device on a substrate, wherein the substrate is exposed using the exposure method according to the above-described one aspect of the present invention, and exposed. Developing a substrate, a device manufacturing method is provided.

  According to the aspects of the present invention, there are provided an illumination apparatus, an exposure apparatus, an exposure method, and a device manufacturing method that can improve the illuminance uniformity of illumination light that illuminates a predetermined illumination area.

1 is a view showing an exposure apparatus according to a first embodiment of the present invention, and is a perspective view showing a schematic overall configuration thereof. FIG. 3 is an elevation view showing a partial configuration of an illumination optical system and a projection optical system. It is a top view which shows the structure of a mask. It is a top view which shows the relationship between the visual field by a part of illumination optical system, and the image field by a part of projection optical system. It is an arrangement plan of an optical system explaining adjustment of illumination light. It is a block diagram which shows the structure of the light branching part of the illumination light emission unit in the illuminating device for every illumination optical system. It is a figure which shows the partial structure of the illumination light emission unit and illumination light light guide unit in the illuminating device for every system of an illumination optical system, (a) is the front view seen from the one direction, (b) is the one direction It is the side view seen from the orthogonal direction to. It is an enlarged view which shows a principal part structure. (A) is a top view which shows a partial structure of an illumination light emission unit and an illumination light light guide unit, (b) is a graph which shows the illumination intensity distribution in the width direction of the rod integrator of illumination light. It is a graph explaining an effect. It is a figure which shows the exposure apparatus which concerns on 2nd Embodiment of this invention, and is a block diagram which shows the structure of the light branching part of the illumination light emission unit in the illuminating device for every system | strain of the illumination optical system. (A) is a top view which shows a partial structure of an illumination light emission unit and an illumination light light guide unit, (b) is a graph which shows the illumination intensity distribution in the width direction of the rod integrator of illumination light. FIG. 10 is an elevation view showing a partial configuration of an illumination optical system and a projection optical system in an exposure apparatus according to a modification of the first and second embodiments. It is a flowchart explaining the device manufacturing method which concerns on embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. 1 to 10 are views showing an exposure apparatus according to the first embodiment of the present invention.

  In FIG. 1, an exposure apparatus 100 is a step-and-scan scanning projection exposure apparatus, and illuminates an illumination apparatus IU that illuminates illumination light on a pattern (illumination target) of the mask M, and the mask M. A projection optical apparatus PL including a mask stage (not shown) that holds and moves, and a plurality of catadioptric projection optical systems PL1 to PL7 that project an enlarged image of the pattern of the mask M onto a plate P (exposure target); A plate stage (not shown) that holds and moves the plate P, a drive mechanism (not shown) that includes a linear motor that drives the mask stage and the plate stage, and the operation of the drive mechanism and the like are comprehensively controlled. A main control system (not shown).

  Although not shown, the exposure apparatus 100 holds the mask M on the mask stage via a mask holder, and the position of the mask stage is measured by a laser interferometer on the mask side. Further, the plate P is sucked and held on a plate stage including a movable mirror 150 via a plate holder, and the position of the plate stage is measured by a laser interferometer on the plate side via the movable mirror 150. Based on the measurement values of the mask-side and plate-side laser interferometers, the main control system (not shown) positions, postures, speeds, and the like of the mask stage (mask M) and plate stage (plate P) via a drive mechanism. To control. Here, as an example, the plate P of this embodiment has a 1.9 × 2.2 m square and 2.2 × 2.4 m coated with a photoresist (photosensitive material) for manufacturing a liquid crystal display panel (electronic device). It is a rectangular flat plate-shaped glass plate such as a corner, 2.4 × 2.8 m square, or 2.8 × 3.2 m square, and as another example, the length of one side or the diagonal length is larger than 500 mm It is a glass plate. As the plate P, a ceramic substrate for manufacturing a thin film magnetic head, a circular semiconductor wafer for manufacturing a semiconductor element, or the like is also applicable.

  In the description of the exposure apparatus 100, the positional relationship of each member will be described with reference to the XYZ orthogonal coordinate system set in FIG. This XYZ orthogonal coordinate system is set so that the X axis and the Y axis are parallel to the plate P, and the Z axis is set in a direction orthogonal to the plate P. In the XYZ coordinate system in FIG. 1, for example, the XY plane is set parallel to the horizontal plane and the Z axis is set in the vertical direction. In this embodiment, the direction in which the mask M and the plate P are moved synchronously (scanning direction) is set in the X direction.

  Further, the exposure apparatus 100 irradiates illumination light corresponding to each of the partial illumination optical systems IL1, IL2, IL3, IL4, IL5, IL6, and IL7 of the illumination apparatus IU to the corresponding illumination area on the mask M to uniformly illuminate. . In FIG. 1, the partial illumination optical systems IL2 and IL4 are located on the back side of the partial illumination optical systems IL1, IL3, IL5, and IL7, and only their positional relationship is indicated by arrows.

  Projection optical systems PL1, PL2, PL3, PL4, PL5, PL6, and PL7 of the projection optical apparatus PL are images of a part of the pattern of the mask M that is respectively illuminated by the partial illumination optical systems IL1 to IL7 of the illumination apparatus IU. The images of the patterns in the plurality of illumination areas formed on the mask M are respectively projected onto the plate P and formed on the upper surface (exposure surface, photosensitive surface) of the plate P.

  The projection optical systems PL1, PL3, PL5, and PL7 in the first column corresponding to the first column partial illumination optical systems IL1, IL3, IL5, and IL7 aligned along the non-scanning direction (Y direction) orthogonal to the scanning direction are as follows. , Each having a field of view V1, V3, V5, V7 along the non-scanning direction on the surface (first surface) on which the pattern surface of the mask M is disposed, and the surface on which the upper surface of the plate P is disposed (second surface) Pattern images of the mask M are formed on image fields (projection areas) I1, I3, I5, and I7 arranged at predetermined intervals along the upper non-scanning direction. Similarly, the second column of projection optical systems PL2, PL4, and PL6 corresponding to the second column of partial illumination optical systems IL2, IL4, and IL6 arranged along the non-scanning direction are respectively in the non-scanning direction on the first surface. Are masked on image fields (projection regions) I2, I4, I6 (I2 and I4 are not shown) arranged at predetermined intervals along the non-scanning direction on the second surface. M pattern images are formed. Between the projection optical system of the first row and the projection optical system of the second row, an off-axis alignment system 152 as a measurement system used for aligning the plate P, the mask M, and the plate P An autofocus system 154 as a measurement system used for adjusting the focus position (position in the Z direction) is arranged.

  Projection optical systems PL1 to PL7 of the projection optical apparatus PL are arranged between the mask M and the plate P, and are respectively illuminated on the mask M uniformly illuminated by partial illumination optical systems IL1 to IL7 of the illumination apparatus IU described later. Is a catadioptric projection optical system that forms a primary image, which is an enlarged image in the field of view (equivalent to the illumination area in this case), in the image field on the plate P.

  The projection optical system PL1 will be described in detail as an example. As shown in FIG. 2, the projection optical system PL1 includes a concave reflecting mirror CCM arranged in the optical path between the mask M and the plate P, and the mask M. The first lens group G1 having an optical axis AX11 parallel to the Z-axis disposed in the optical path between the first lens group G1 and the concave reflecting mirror CCM, and the optical path between the first lens group G1 and the concave reflecting mirror CCM. The second lens group G2 is arranged in the optical path between the second lens group G2 and the plate P, and the light traveling from the second lens group G2 in the + Z direction is deflected in the −X direction so as to be the optical axis. A first deflecting member FM1 that extends along the optical axis AX12 crossing AX11, and the light that travels in the −X direction from the first deflecting member FM1 is disposed in the optical path between the first deflecting member FM1 and the plate P− A second deflection member FM2 for deflecting in the Z direction, and a second It is disposed in an optical path between the direction member FM2 and the plate P, and includes a third lens group G3 having an optical axis AX13 parallel to the optical axis AX11 of the first lens group G1, the. The optical axes of the second lens group G2 and the concave reflecting mirror CCM are the same as the optical axis AX11 of the first lens group G1. That is, the projection optical system PL1 is an off-axis optical system using the concave reflecting mirror CCM, and the light passing through the mask M that has passed through the first and second lens groups G1 and G2 is reflected again by the concave reflecting mirror CCM. After that, the field of view V1 of the mask M is projected on the plate P via the third lens group G3 via the first and second deflecting members FM1, FM2, and an image is formed in the image field I1. An aperture stop AS for determining the numerical aperture on the plate P side of the projection optical system PL1 is in the vicinity of the reflecting surface of the concave reflecting mirror CCM in the optical path between the concave reflecting mirror CCM and the second lens group G2. The aperture stop AS is positioned so that the mask M side and the plate P side are substantially telecentric. The position of the aperture stop AS can be regarded as the pupil plane of the projection optical system PL1.

  Further, the projection optical system PL1 is an effective imaging light beam by an off-axis optical system using the concave reflecting mirror CCM, with respect to the optical axes AX11 and AX13 in the first and third lens groups G1 and G3. For this reason, in each lens of the third lens group G3 composed of a larger lens, the optical axis AX13, which is a portion through which the imaging light beam does not pass, passes through the half surface on the X direction side. The half on the + X direction side is cut.

  By the way, as shown in FIG. 3, the mask M set in the exposure apparatus 100 is arranged along the non-scanning direction (Y direction), and the trapezoidal shape (arc shape, projection optical system PL1 to PL7 in FIG. 1). Alternatively, seven row pattern portions M10 to M16 in which the visual fields V1 to V7 of which the end portion may be triangular or the like may be positioned are provided. The reason why the fields of view V1 to V7 are trapezoidal is to overlap and expose images of patterns corresponding to both ends of the fields of view V1 to V7 on the plate P in order to reduce joint errors. The same pattern is alternately formed on both ends of the pattern portions M10 to M16. Here, the same pattern is alternately formed because, as the imaging characteristics of the projection optical systems PL1 to PL7, an erect image is formed in the scanning direction (X direction), and in the non-scanning direction (Y direction). This is because an inverted image is formed. However, since the images of the edge portions inside the visual fields V1 and V7 at both ends in the Y direction are portions that are not exposed to each other (because they are inverted images in the non-scanning direction), the visual fields V1 and V7 in the Y direction One end is a straight line parallel to the X axis. For example, an illumination field stop (not shown in FIG. 2) and a relay optical system (light guide optical system) 33, which will be described later, are arranged in order to define the fields V1, V2, etc. on the mask M.

  FIG. 4 shows fields V1, V3 on the mask M of the projection optical systems PL1, PL3 in the first row and image fields (projection regions) I1, I3 on the plate P, and a mask M of the projection optical system PL2 in the second row. It is a top view which shows the relationship between the upper visual field V2 and the image field I2 on the plate P. FIG. The projection optical systems PL1 to PL3 form images in the image fields I1, I2, and I3 in which the patterns in the visual fields V1, V2, and V3 are upright in the X direction and are inverted in the Y direction. The visual field V1 and the image field I1 are deviated in the −X direction from the optical axes AX11 and AX13, respectively. The visual field V2 and the image field I2 are deviated in the + X direction from the optical axes AX21 and AX23, respectively. For this reason, even if the shape of the lens constituting the third lens group G3 is rotationally asymmetrical by cutting off the half on the concave reflecting mirror CCM side, vignetting does not occur in the image forming light beam directed to the image fields I1 and I2.

Also, the X direction (scanning) of a straight line parallel to the Y axis connecting the centers VC1 etc. of the first column visual fields V1, V3 and the like and a straight line parallel to the Y axis connecting the centers VC2 etc. of the second column visual fields V2, etc. (Direction) is set to Ln, and similarly, a straight line parallel to the Y axis connecting the center IC1 etc. of the image fields I1, I3 etc. in the first row and the center IC2 etc. of the image field I2 etc. in the second row are connected If the interval in the X direction with the straight line parallel to the axis is Lp, and the projection magnification of each projection optical system PL1, PL2, PL3 is β, the relationship of equation (A) is established between the intervals Ln and Lp. .
Lp = Ln × | β | (A)

  Thereby, in the exposure apparatus 100, as shown in FIG. 3, the column pattern portions M10 and M12 for the first column projection optical system, the column pattern portions M11 and M13 for the second column projection optical system, and the like. Are formed at the same position in the X direction and the mask offset MO is set to 0, the projected images can be accurately connected on the plate P and exposed.

However, when the distance Ln and the distance Lp satisfy the relationship of the following formula (B), the two-dot chain line positions 21A to 21C in FIG. 3 correspond to the mask offset MO obtained by the following formula (C). As shown, the X-direction offset between the column pattern portions M10, M12, etc. for the first column visual fields V1, V3, etc. and the column pattern portions M11, M13, etc. for the second column visual fields V2, V4, etc. It is necessary to provide.
Lp <Ln × | β | (B)
MO = Ln−Lp / | β | (C)

  Therefore, in the exposure apparatus 100, for example, the mask M is moved at the speed VM in the + X direction indicated by the arrow SM1 (see FIG. 2) in a state in which the pattern of the mask M is projected and exposed on the plate P during the scanning exposure. In synchronization with this, the plate P moves at the speed VM × | β | in the + X direction indicated by the arrow SP1. As a result, a pattern in which images of the magnification factor β of the row pattern portions M10 to M16 of the mask M in FIG. It is also possible to scan the mask M and the plate P in the −X direction.

  The illumination device IU includes a laser light source 10 that emits a laser beam Lb as shown in FIGS. 5 to 7 for each partial illumination optical system IL1, IL2, IL3, IL4, IL5, IL6, and IL7, and the laser light source 10. Illumination light emitting unit 11 that divides the laser beam Lb emitted from the laser beam into branched laser beams Lm and Ls and emits the laser beam to a predetermined position, and the uniform illumination intensity upon receiving the branched laser beams Lm and Ls emitted from the illumination light emitting unit 11 And the illumination light guide unit 31 that guides to the irradiation position while adjusting to the illumination light L and irradiates the mask M (illumination target). In addition, the illumination area illuminated with the illumination light L in this embodiment is set to have a long shape in one direction (Y direction), and an exit end face 32b of a rod integrator 32 described later corresponds to this. It is formed in a rectangular shape that is long in one direction (Y direction). The laser light source 10, the illumination light emitting unit 11, and the illumination light guiding unit 31 are configured so that the illumination intensity of the illumination light is uniform in at least the longitudinal direction of the illumination region and the emission end face 32b.

  Note that the illumination light emitting unit 11 shown in FIG. 6 may guide the laser light Lb emitted from the laser light source 10 through an optical fiber (not shown) and then enter the light branching unit 12 described later.

  Here, as a general illumination device, there is an intensity distribution in a laser beam, and in addition to an assembly error of optical components such as an optical fiber and a lens, nonuniformity in transmittance of the optical components is a factor. In some cases, illuminance unevenness (nonuniformity in the light amount distribution) appears in the light amount distribution in the illumination area or exposure field. In the exposure apparatus 100, since it is necessary to guarantee uniform exposure processing on the plate P, the illuminance distribution on the mask M and the plate P is made uniform in consideration of the effects of assembly errors of optical components, transmittance distribution and the like. It is necessary to adjust to.

  Therefore, for example, as shown in FIG. 5, in the illumination light guide unit 31, the illumination light when the branched laser light Lm is incident on the rod integrator 32 from the illumination light emitting unit 11 and is irradiated on the illumination target as illumination light L. Equipped with a mechanism for appropriately adjusting the optical characteristics of L, and this adjustment mechanism can adjust telecentricity and illuminance unevenness (non-uniform light amount) in the illumination area so that they are within the required quality. Yes. In FIG. 5, the first and second lenses 16 a and 16 b of the input lens group 16 are substantially conjugated with exit ports 13 b and 14 b of optical fibers 13 and 14 to be described later and an incident end face 32 a of the rod integrator 32. (See FIG. 7A), and the magnification is set to 0.5 times as an example. A field stop 41 (see FIG. 7) corresponding to the fields of view V1 to V7 of the mask M is disposed in the vicinity of the emission end face 32b of the rod integrator 32, and an image of the field stop 41 is taken as an example by the relay optical system 33. Is set to form an image on the mask M at a projection magnification of 2 times.

  The relay optical system 33 includes an illumination relay lens 42 and a condenser lens 43 between the rod integrator 32 and the mask M, parallel plane plates 44a and 44b of optical elements arranged on the downstream side of the illumination relay lens 42, and illumination. A correction lens 45 disposed on the upstream side of the relay lens 42 and a correction filter 46 disposed on the downstream side of the condenser lens 43 are provided. The plane of inclination of the plane parallel plate 44 a is adjusted around the Y axis with respect to the optical axis of the relay optical system 33, and the plane of inclination of the plane parallel plate 44 b is adjusted around the X axis with respect to the optical axis of the relay optical system 33. Then, the tilt telecentricity of the illumination light L with respect to the mask M is adjusted by shifting the incident position of the illumination light L on the condenser lens 43. Here, the tilted telecentricity is a component of telecentricity having the same tilt in the field of view. The correction lens 45 is appropriately replaced to adjust the telecentricity of the illumination light L that is symmetric with respect to the optical axis. The correction filter 46 adjusts so-called secondary illuminance unevenness that follows a quadratic function within a cross section including the optical axis by being rotated around the optical axis. In addition, when a so-called primary illuminance unevenness that follows a linear function in a cross section including the optical axis appears, the incident end face of the rod integrator 32 of the first and second lenses 16a and 16b of the input lens group 16 The primary illuminance unevenness is adjusted by adjusting the assembly position and orientation with respect to 32a and making it eccentric. The first and second lenses 16a and 16b of the input lens group 16 may be supported by an adjustment mechanism similar to the third lens 16c described later so that the degree of eccentricity can be easily adjusted.

  On the other hand, in the illumination light emitting unit 11, as will be described later, the laser light Lm is introduced into the rod integrator 32 via the optical fibers 13 and 14. Further, in the illumination light guiding unit 31, the rod integrator 32 is formed in a thick plate shape corresponding to the shapes of the fields of view V1 to V7 of the mask M (see FIG. 3), and therefore is incident from the incident end face 32a. The light beam of the laser beam Lm is adjusted to the illumination light L having a uniform light quantity in the thickness direction (X direction) by repeating the total reflection a plurality of times between the large opposing surfaces 32c, but between the small opposing surfaces 32d. Since sufficient total reflection is not repeated, uneven illumination due to the influence of the optical fibers 13 and 14 may remain in the width direction (Y direction). For this reason, for example, as shown in FIG. 9B, illuminance unevenness (illuminance depression) LI may appear locally in the width direction of the rod integrator 32.

  It is difficult to adjust the illuminance unevenness LI without regularity as shown in FIG. 9B to a sufficiently uniform illuminance only with the above-described parallel flat plates 44a and 44b, the correction lens 45, the correction filter 46, and the like. . Even when so-called quaternary illuminance unevenness that follows a quartic function in the cross section including the optical axis occurs, it is difficult to adjust the illuminance to be sufficiently uniform with the above adjustment mechanism. The adjustment mechanism in the case where the fourth-order illuminance unevenness occurs will be described in a second embodiment to be described later. In this embodiment, the uneven illuminance LI where the amount of light is locally insufficient as shown in FIG. An adjustment mechanism for adjusting to uniform illuminance will be described.

  In the present embodiment, as shown in FIG. 9C, the portion of the illuminance unevenness LI is irradiated with a laser beam Ls1 that cancels (corrects) the illuminance unevenness LI. The entire light quantity distribution is made uniform.

  For this purpose, as shown in FIG. 6, the illumination light emitting unit 11 emits the laser light Lb emitted from the laser light source 10 for two illumination branch laser lights Lm1 and Lm2 and one system for each of the partial illumination optical systems IL1 to IL7. Branching laser beam Ls1 for branching, and branching laser beams Lm1, Lm2, and Ls1 from the branching light beam 12 are received to the vicinity of the incident end face 32a of the rod integrator 32 of the illumination light guiding unit 31. The optical fiber 13-15 which guides light, and the input lens group 16 which makes the branched laser beam Lm1, Lm2, Ls1 which the optical fiber 13-15 guides enter in the incident end surface 32a of the rod integrator 32 are provided.

  The optical branching unit 12 is incident on one end side of each of the optical fibers 13 to 15 that are incident on the fiber relay lens 21a facing the emission port 10a of the laser light source 10 and the branched laser beams Lm1, Lm2, and Ls1 branched from the laser beam Lb. A fiber relay lens 21b disposed for each of the ports 13a to 15a; two branch sets of a half-wave plate 17 and a polarization beam splitter 18 disposed on the optical path between the fiber relay lenses 21a and 21b; including.

  After the half-wave plate 17 has rotated the polarization plane of the laser beam, the polarization beam splitter 18 reflects a part of the laser beam according to the rotation angle of the polarization plane and a part thereof. To Penetrate. The branch set of the half-wave plate 17 and the polarization beam splitter 18 in the previous stage branches a part of the laser light Lb emitted from the emission port 10a of the laser light source 10 as the branched laser light Lm1, and further of the remaining part. A part of the branched set of the half-wave plate 17 and the polarization beam splitter 18 is branched as a branched laser beam Lm2, and the remainder is a branched laser beam Ls1. The branched laser beams Lm1, Lm2, and Ls1 are incident on the optical fibers 13, 14, and 15 from the incident ports 13a, 14a, and 15a, respectively. Here, the light branching unit 12 can adjust the ratio of the amounts of the branched laser beams Lm1, Lm2, and Ls1 reflected or transmitted by the polarization beam splitter 18 by adjusting the rotation angle of the half-wave plate 17. . That is, the light branching unit 12 constitutes a light amount adjusting mechanism.

  As described above, the optical fibers 13 to 15 are arranged so that the incident laser beams Lm1, Lm2, and Ls1 branched by the light branching portion 12 are incident on the incident ports 13a to 15a on one end side. As shown in FIG. 7, the exit ports 13b and 14b on the other end side of the optical fibers 13 and 14 are incident end faces 32a of the rod integrator 32 of the illumination light guide unit 31 arranged for each of the partial illumination optical systems IL1 to IL7. Are arranged so as to face each other at both ends. Further, the exit port 15b on the other end side of the optical fiber 15 is disposed so as to face the center of the incident end surface 32a.

  The input lens group 16 is arranged between the exit ports 13 b to 15 b on the other end side of the optical fibers 13 to 15 and the incident end face 32 a of the rod integrator 32 of the illumination light guide unit 31. On the exit ports 13b and 14b side of the optical fibers 13 and 14, the illumination branched laser beams Lm1 and Lm2 emitted from the exit ports 13b and 14b are collected on or near the entrance end surface 32a of the rod integrator 32. First and second lenses 16 a and 16 b that are incident on the rod integrator 32 are arranged. Further, on the exit port 15b side of the optical fiber 15, the rod integrator 32 does not collect the adjustment laser light Ls1 emitted from the exit port 15b on the incident end surface 32a of the rod integrator 32 and in the vicinity of the incident end surface 32a. A third lens 16c that is incident on the first lens 16c is disposed.

  As shown in FIG. 7, the illumination light guide unit 31 includes a rod integrator 32 that emits the branched laser beams Lm1, Lm2, and Ls1 incident from the incident end surface 32a as the illumination light L from the emission end surface 32b, and the rod integrator 32 A relay optical system (light guide optical system) 33 that irradiates the mask M with the illumination light L emitted from the emission end face 32b.

  The rod integrator 32 has a large opposing surface 32c that faces and faces the long side of the incident end surface 32a and the outgoing end surface 32b, and a small opposing surface 32d that faces and faces the short side of the incident end surface 32a and the outgoing end surface 32b. And the fields of view V1 to V7 of the mask M illuminated by the partial illumination optical systems IL1 to IL7 are set to illumination areas that are long in one direction, so that the entire illumination area can be illuminated uniformly. A thick plate-shaped optical element having a long outgoing end face 32b is made of a transparent material.

  The rod integrator 32 totally reflects a part of the light beam of the incident light a plurality of times between each of the two facing surfaces 32c (side surface pair) and the two facing surfaces 32d (side surface pair) parallel to the central axis CX32. The light intensity of the luminous flux is averaged by being emitted, and the illumination light L with uniform illuminance is emitted at the emission end face 32b. In this embodiment, the branched laser light Lm1 incident from the incident end face 32a is emitted. , Lm2, and Ls1 are totally reflected on each of the large facing surface 32c and the small facing surface 32d. In particular, since the facing distance is short between the large facing surfaces 32c, it is repeated more than between the small facing surfaces 32d having a long facing distance. The light is totally reflected and emitted from the emission end face 32b. The center axis CX32 of the rod integrator 32 corresponds to the center between the two large opposing surfaces 32c and the center between the two small opposing surfaces 32d.

  The first and second lenses 16a and 16b of the input lens group 16 are adapted to emit the branching laser beams Lm1 and Lm2 for illumination from the exit ports 13b and 14b of the optical fibers 13 and 14, respectively, and the central axis CX32 of the incident end surface 32a of the rod integrator 32. Are focused and incident at two locations equally spaced from each other in the Y direction. As shown in FIG. 9A, the light beams of the branching laser beams Lm1 and Lm2 for illumination spread after being intersected at the incident end face 32a of the rod integrator 32 and are incident on the rod integrator 32. By being totally totally reflected between the opposing surfaces 32c and between the small opposing surfaces 32d, the entire emitting end face 32b is emitted as illumination light L having uniform illuminance. In the rod integrator 32 of the present embodiment, as an example, the facing distance between the large facing surface 32c and the small facing surface 32d is 10 mm: 100 mm, and in the X direction between the large facing surfaces 32c, the Y direction between the small facing surfaces 32d. The number of reflections is approximately 10 times that of the above. For this reason, the X direction is sufficiently averaged and the illuminance distribution becomes uniform, but the illuminance distribution in the Y direction may not be uniform.

  The third lens 16c of the input lens group 16 is made incident from the vicinity of the center of the incident end face 32a of the rod integrator 32 without condensing the adjusting branch laser light Ls1 from the emission port 15b of the optical fiber 15. As shown in FIG. 9A, the luminous flux of the adjusting branch laser beam Ls1 passes through the rod integrator 32 without intersecting at the incident end surface 32a of the rod integrator 32, for example, and at least a small opposing surface. Without being totally reflected between 32d (total reflection is 0 times), it is emitted from the emission end face 32b in a form that can easily irradiate the target area in the illumination area by the illumination branching laser beams Lm1 and Lm2. Is set. That is, the branching laser beams Lm1 and Lm2 for illumination constitute the first light and are incident on the incident end surface (second end surface) 32a so as to illuminate the entire emission end surface (first end surface) 32b of the rod integrator 32. Yes. The adjustment branch laser beam Ls1 is incident on the incident end surface 32a so as to constitute a second light and illuminate a part of the emission end surface 32b of the rod integrator 32. The adjustment branching laser beam Ls1 illuminates a part of the illumination area illuminated by the illumination branching laser beams Lm1 and Lm2. The illumination light guide unit 31 projects the emission end face 32a of the rod integrator 32 onto the illumination area. Further, the laser light source 10 constitutes an emission part that emits laser light (third light). First and second lenses 16a of the input lens group 16 that make the branched laser beams Lm1 and Lm2 for illumination guided from the optical branching unit 12 and emitted from the optical fibers 13 and 14 enter the incident end face 32a of the rod integrator 32, The first incident part is configured up to 16b. Similarly, the third lens 16c of the input lens group 16 that makes the adjustment branch laser light Ls1 emitted from the optical fiber 15 incident on the incident end face 32a of the rod integrator 32 constitutes a second incident portion.

  The exit end face 32b of the rod integrator 32 and the illumination area set on the mask M are optically conjugate by the relay optical system 33, and both the mask M and the plate P are optically conjugate by the projection optical device PL. Therefore, the effect of improving the illuminance uniformity of the illumination light by irradiating the adjustment branch laser beam Ls1 to the emission end face 32b of the rod integrator 32 is not only the illumination area on the mask M but also the exposure on the plate P. The same applies to the image fields I1 to I7.

  By the way, the optical fiber 15 and the third lens 16c of the input lens group 16 can illuminate the illumination light L by the illumination branch laser lights Lm1 and Lm2 in the field of view V1 to V7 of the mask M with a sufficiently high quality uniform light quantity. In this case, all of the branched laser beam Lb may be adjusted to branch to the illumination branched laser beams Lm1 and Lm2, and the adjustment branched laser beam Ls1 may be made useless, and the optical fiber 15 and the input lens group may be used. The 16 third lenses 16c may not be attached.

  The illumination light emitting unit 11 is constructed by assembling the exit ports 13b to 15b of the optical fibers 13 to 15 and the first to third lenses 16a to 16c of the input lens group 16 on the apparatus frame side and branching laser beams Lm1, Lm2, Ls1 is emitted, and the emission port 15b of the optical fiber 15 and the third lens 16c of the input lens group 16 are assembled in a common housing 51a as shown in FIG. The casing 51a can be adjusted and supported at an arbitrary angle and position by a fixing member 55 fixed to the apparatus frame side.

  Specifically, the casing 51a is integrally formed with a projecting member 52 that extends to the side of the extension line of the central axis CX32 of the rod integrator 32 and has a convex spherical ball portion 52a on the distal end side. On the other hand, the fixing member 55 is formed in a cylindrical shape into which the rod-like portion 56a of the rod-like intermediate support member 56 is inserted so as to be able to advance and retreat. The incident position in the width direction with respect to the incident end face 32a of the rod integrator 32 of the adjustment branched laser light Ls1 by the emission port 15b and the third lens 16c of the input lens group 16 can be fixed. The intermediate support member 56 is integrally formed with a connecting portion 57 having a concave spherical housing portion 57a capable of housing the ball portion 52a of the protruding member 52 of the housing 51a in a non-detachable manner on the distal end side of the rod-like portion 56a. The connecting portion 57 is formed with a slit 57b so that the opening area can be enlarged when the spherical portion 52a of the protruding member 52 is accommodated in the accommodating portion 57a, and the spherical portion 52a of the accommodated protruding member 52 is attached by a screw 53. By positioning, the incident angle of the branch laser beam Ls1 for adjustment by the exit port 15b of the optical fiber 15 and the third lens 16c of the input lens group 16 with respect to the incident end surface 32a of the rod integrator 32 can be fixed. That is, the projecting member 52, the fixing member 55, and the intermediate support member 56 can easily adjust the incident position and the incident angle of the adjustment branch laser beam Ls1 by the emission port 15b of the optical fiber 15 and the third lens 16c of the input lens group 16. The incident adjustment mechanism 50 is made possible.

  As a result, when the illumination unevenness LI with insufficient light quantity appears locally when the illumination branching laser beams Lm1 and Lm2 are irradiated to the illumination area of the mask M as the illumination light L via the rod integrator 32 and illuminated. The branching laser beam Ls1 for adjusting the amount of light that supplements (corrects) the insufficient illuminance by the light branching unit 12 is branched, and a small region where the illuminance unevenness LI appears in the illumination region in the mask M It can irradiate (illuminate) by entering from the incident end face 32a of the rod integrator 32 as aimed.

  For example, for an illuminance unevenness LI (shown by a broken line) that forms a depression in the light amount distribution with the illumination light L ′ as shown in FIG. 9B, an intensity distribution (light amount distribution) as shown in FIG. ) Of the adjustment branch laser beam Ls1 (shown by a chain line). In this case, as shown in FIG. 10, when the illuminance unevenness LI in the illumination light L ′ indicated by the broken line in the figure where the illuminance unevenness LI appears is a hollow portion of 9% from the average light amount, Irradiation is performed by irradiating the mask M as uniform illumination light L in which the variation in the light amount distribution is suppressed to 1.6% as shown by the solid line in the figure by irradiating the adjusting branch laser beam Ls1 indicated by the chain line. (Exposure).

At this time, as a light amount ratio of the branched laser beams Lm1, Lm2, and Ls1 by the half-wave plate 17 and the polarization beam splitter 18 in the light branching portion 12, the depression of the light amount distribution of the illuminance unevenness LI is α% from the average light amount. In such a case, the adjustment may be made so that the ratio is about the following formula.
Lm1: Lm2: Ls1 = (50−α / 2) :( 50−α / 2): α

Further, when the rod integrator 32 has a height h in the Z direction and the illuminance unevenness LI has a width w in the Y direction, the exit port 15b of the optical fiber 15 has a light beam effective diameter t and a numerical aperture (NA) na. On the other hand, when the third lens 16c of the input lens group 16 has a focal length fc, the relationship of the following equation (1) is established:
fc = w / 2 × na (1)
Further, the spread width w ′ of the light flux depending on the size of the exit port 15b of the optical fiber 15 can be expressed by the following equation (2).
w ′ = (2 × t × na × h) / w (2)
From this, for example, when the width w in the Y direction of the illuminance unevenness LI exceeds 20 mm, the length (width) of the region in which the illuminance is corrected by the irradiation of the adjusting branch laser beam Ls1 is approximately the above formula ( Determined by 1).

For example, when the height h in the Z direction of the rod integrator 32 is 384 mm, the effective beam diameter t of the exit port 15b of the optical fiber 15 is 0.2 mm, and the numerical aperture na is 0.12, the input lens group The focal length fc of the 16 third lenses 16c can be obtained by the following equation (3):
fc = w / 0.24 (3)
Further, the spread w ′ of the light flux depending on the size of the exit port 15b of the optical fiber 15 is also given by the following equation (4).
w ′ = (0.048 × h) / w (4)

  Returning to FIG. 1, the exposure apparatus 100 moves the mask M by moving the illuminance sensor 160 (shown by a broken line in the drawing) adjacent to the movable mirror 150 in the Y direction together in the X direction. The illuminance distribution of the exposure light (illumination light L) projected to the installation position of the plate P is detected, and the individual illumination device 10 is adjusted according to the illuminance quality (detection information) in the mask M. The mask M is illuminated with high-quality uniform illumination light L by performing additional irradiation to the appearance region of the local illuminance unevenness LI with the branch laser beam Ls1. In this exposure apparatus 100, instead of the plate P to be exposed, a plate provided with an illuminance sensor 160 is installed at a position adjacent to the movable mirror 150 during setting work, and the illuminance quality at the position of the mask M is inspected. Uniformity of the illuminance distribution of the illumination light L may be ensured, or the illuminance sensor 160 may be installed together with the plate P so that the illuminance quality of the illumination light L can be appropriately inspected.

  As a result, the exposure apparatus 100 determines the light quantity and irradiation position of the adjustment branch laser light Ls1 based on the detection information of the illuminance distribution in the exposure area (illumination area) by the illumination light L through the mask M depending on the subjectivity of the operator. It can be determined objectively and easily. Therefore, an exposure method for irradiating the adjustment branch laser beam Ls1 together with the illumination branch laser beams Lm1 and Lm2 to illuminate the mask M with a uniform illuminance can be executed, and the plate P ( The manufacturing method of the liquid crystal display panel (electronic device) which implements the exposure process which performs a high quality exposure process to a photoreceptor substrate) can be performed.

  As described above, in the present embodiment, the adjustment branch laser beam Ls1 can be applied to the region where the illumination intensity unevenness LI where the light intensity is insufficient with only the illumination branch laser beams Lm1 and Lm2 can be emitted. It is possible to realize high-quality illumination with more uniform illuminance by increasing the amount of irradiation light in a region smaller than the illumination region with the light Lm1 and Lm2. Therefore, the laser beam emitted from the laser light source LS is irradiated onto the mask M without waste, and the exposure apparatus 100 can manufacture a high-quality plate P by performing high-precision exposure processing.

  Next, FIGS. 11 and 12 are views showing a second embodiment of an exposure apparatus for manufacturing an electronic device by mounting a lighting apparatus according to the present invention and executing a manufacturing method including an exposure method. Here, since the present embodiment is configured in substantially the same manner as the above-described embodiment, the same components are denoted by the same reference numerals and the characteristic portions will be described.

  In FIG. 11, in the individual illumination device 10 of the exposure apparatus 100, the second light branching unit 12 of the illumination light emitting unit 11 splits the branched laser light Lb into two systems of branched laser light Lm1 for illumination for each of the partial illumination optical systems IL1 to IL7. , Lm2 and the two branch laser beams Ls1 and Ls2 for adjustment. In the second light branching section 12, a branching set of a half-wave plate 17 and a polarizing beam splitter 18 that branch the illumination branch laser light Lm2, and an entrance 15a of the optical fiber 15 that receives the adjustment branch laser light Ls1. A branching set of a half-wave plate 17 and a polarizing beam splitter 18 is disposed on the optical path between the first-stage fiber relay lens 21b and the branched adjustment branching laser beam. Ls <b> 2 enters the entrance 51 a of the optical fiber 51.

  In short, the second optical branching unit 12 branches the branched laser light Lb emitted from the emission port Lba of the first optical branching unit du as the branching laser beams Lm1 and Lm2 for illumination, and then the remaining part is branched for adjustment. The light beams Ls1 and Ls2 are branched so as to be incident on the incident ports 13a to 15a and 51a of the optical fibers 13 to 15 and 51 while being adjusted to a predetermined light amount ratio.

  The exit ports 13b and 14b of the optical fibers 13 and 14 are disposed together with the first and second lenses 16a and 16b of the input lens group 16 on both ends of the incident end surface 32a of the rod integrator 32, as shown in FIG. The emission ports 15b and 51b of the optical fibers 15 and 51 are arranged in parallel in the longitudinal direction of the incident end face 32a of the rod integrator 32 together with the third lens 16c of the input lens group 16 therebetween. That is, the exit ports 15b and 51b of the optical fibers 15 and 51 and the third lens 16c of the input lens group 16 are symmetrically centered about the central axis CX32 of the rod integrator 32, and the adjustment branch laser beams Ls1 and Ls2 are incident on the incident end face 32a. It is installed so that it may enter without condensing.

  Similarly to the exit port 15b of the optical fiber 15, the exit port 51b of the optical fiber 51, together with the third lens 16c of the input lens group 16, has an incident angle of the adjusting branched laser beam Ls2 with respect to the incident end surface 32a of the rod integrator 32. And the incident adjustment mechanism 50 is positioned and fixed so that the incident position can be adjusted.

  For this reason, the individual illumination device 10 has a so-called fourth-order illuminance unevenness LI (indicated by a broken line in the figure) in which the illuminance in the width direction of the rod integrator 32 as shown in FIG. When the figure appears), the illuminance unevenness LI can be eliminated and the illuminance can be adjusted to be uniform. Specifically, as shown in FIG. 12B, even when the secondary illuminance unevenness symmetric to the optical axis is adjusted to the fourth-order illuminance unevenness LI by the correction filter 46 shown in FIG. The correction can be made only to the extent indicated by the chain line, and it can only be adjusted to the illumination light L ′ in which the light quantity at both ends of the emission end face 32 b of the rod integrator 32 is insufficient. For this reason, the individual illumination device 10 cooperates with the correction filter 46 when the fourth-order illuminance unevenness LI appears. Specifically, the individual illuminating device 10 branches the adjustment branch laser beams Ls1 and Ls2 for the amount of light that supplements (corrects) the insufficient illuminance by the second light branching unit 12, and emits the optical fibers 15 and 51. By entering the entrance end surface 32a of the rod integrator 32 from the mouths 15b and 51b through the third lens 16c of the input lens group 16, the fourth-order illuminance unevenness LI appears on both end sides in the illumination area of the mask M. Aim at a small area.

  At this time, the adjustment branching laser beams Ls1 and Ls2 incident from the incident end surface 32a of the rod integrator 32 are overlapped with the unreflected light flux by overlapping the light flux that has been totally reflected once by the small facing surface 32d, and unevenness in illuminance on the mask M. Both ends of the LI can be irradiated, and as shown in FIG. 12B, the illuminance is improved toward the both ends so as to match the illuminance unevenness LI where the light intensity is insufficient at the both ends. The illumination light L can be adjusted.

Further, as the light quantity ratio of the branched laser lights Lm1, Lm2, Ls1, and Ls2 by the half-wave plate 17 and the polarization beam splitter 18 in the second light branching section 12, the depression of the light quantity distribution of the fourth-order illuminance unevenness LI is the average light quantity. If γ% from γ, the ratio may be adjusted so that the ratio is represented by the following equation.
Lm1: Lm2: Ls1: Ls2 = (50−γ) :( 50−γ): γ: γ

  As a result, the exposure apparatus 100 performs an exposure process of irradiating the illumination light L adjusted to a uniform illuminance onto the mask M by the individual illumination apparatus 10 to perform a high-accuracy exposure process, so that the liquid crystal display panel (electronic device) Manufacturing directions can be implemented.

  As described above, in the present embodiment, in addition to the operational effects of the above-described embodiment, aiming at a plurality of regions where illuminance unevenness LI where the light intensity is insufficient with only the illumination branch laser lights Lm1 and Lm2 appears. It is possible to irradiate not only the branching laser beam Ls1 but also the adjusting branching laser beam Ls2, and increase the amount of irradiation light in a small area such as both ends of the illumination area of the mask M to achieve high-quality illumination with more uniform illumination. Can be realized. Therefore, the laser beam emitted from the laser light source LS is irradiated onto the mask M without waste, and the exposure apparatus 100 can manufacture a high-quality plate P by performing high-precision exposure processing.

  Here, in the first and second embodiments described above, the case where the exposure apparatus 100 including the projection optical system shown in FIGS. 2 and 4 is mounted will be described as an example. However, the present invention is not limited to this. Needless to say, the exposure apparatus 100 having the projection optical system shown in FIG.

  The same components as those in the first embodiment are simply denoted by the same reference numerals and their characteristic parts will be described. In FIG. 13, the partial illumination optical systems IL1 and IL2 and the projection optical systems PLA1 and PLA2 in the first embodiment are shown. The corresponding configuration is illustrated, and the configuration for forming an intermediate image in the projection optical systems PLA1 and PLA2 is mainly different. In the projection optical systems PLA1 and PLA2 shown in FIG. 13, a first imaging optical system 114 that forms an intermediate image of the mask M, and a second imaging optical system that optically conjugates the intermediate image and the plate P to each other. 116, and a projection optical device. The second imaging optical system 116 is substantially the same as the projection optical systems PL1 and PL2 shown in FIG. 2, but each lens constituting the first lens group G1h of the second imaging optical system 116 is a projection optical system. Each of the rotationally symmetric lenses constituting the first lens group G1 of PL1 and PL2 is different in that it has a rotationally asymmetric outer shape in which half of the + X direction side and the X direction side are cut out with respect to the optical axis. Even in this case, since the imaging light flux passes through the −X direction side and the + X direction side from the optical axis of the first lens group G1h, the projection optical systems PLA1 and PLA2 can be further reduced in weight and effective imaging is possible. No vignetting of the luminous flux occurs.

  The magnifications of the projection optical systems PLA1 and PLA2 are set so that the magnification in the scanning direction exceeds +1 and the magnification in the non-scanning direction exceeds +1. In other words, these projection optical systems PL1 and PL2 form an erect image of the first surface on the second surface with an enlargement magnification. A field stop 115 is disposed at a position where an intermediate image in the optical path between the first imaging optical system 114 and the second imaging optical system 116 is formed. According to this projection optical system, the field stop 115 can be easily arranged, and the field stop can be projected onto the plate P with the accuracy of the projection optical system. Can do.

  In the above-described embodiment, the case where the laser light source 10 is provided for each of the partial illumination optical systems IL1 to IL7 has been described as an example. However, the present invention is not limited to this, and two or more partial illuminations from one laser light source 10 are described. Needless to say, the laser light Lb may be distributed to the optical system (illumination light emitting unit 11).

  FIG. 14 shows a liquid crystal display device as an electronic device (or microdevice) by forming a predetermined pattern (circuit pattern, electrode pattern, etc.) on a glass plate (substrate) P using the exposure apparatus 100 described above. It is a flowchart explaining about an example of the manufacturing method which manufactures.

  In step S101 (pattern formation process) of FIG. 14, first, a mask pattern for a liquid crystal display device is formed using an exposure apparatus 100, which is a coating process for preparing a photosensitive substrate by coating a photoresist on a plate P to be exposed. An exposure process for transferring and exposing on the plate P as a photosensitive substrate and a developing process for developing the plate P exposed by this exposure process are executed. A predetermined resist pattern is formed on the plate P by a lithography process including the coating process, the exposure process, and the development process. Following this lithography process, a predetermined pattern including a large number of electrodes and the like is formed on the plate P through an etching process using the resist pattern as a mask, a resist stripping process, and the like. The lithography process or the like is executed a plurality of times according to the number of layers on the plate P.

  In step S102 (color filter forming step), a large number of groups of three fine filters corresponding to red R, green G, and blue B are arranged in a matrix, or three of red R, green G, and blue B are arranged. A color filter is formed by arranging a set of a plurality of stripe-shaped filters in the horizontal scanning line direction. In step S103 (cell assembly process), for example, liquid crystal is injected between the plate P having the predetermined pattern obtained in step S101 and the color filter obtained in step S102, and a liquid crystal panel (liquid crystal cell) is formed. To manufacture.

  In subsequent step S104 (module assembling process), the liquid crystal panel (liquid crystal cell) thus assembled is attached with an electric circuit for performing a display operation and components such as a backlight to complete a liquid crystal display device. Let

  It should be noted that the scope of the present invention is not limited to the illustrated and described exemplary embodiments, but includes all embodiments that provide the same effects as those intended by the present invention. Further, the scope of the invention is not limited to the combinations of features of the invention defined by the claims, but may be defined by any desired combination of particular features among all the disclosed features. .

  Although one embodiment of the present invention has been described so far, it is needless to say that the present invention is not limited to the above-described embodiment, and may be implemented in various forms within the scope of the technical idea.

DESCRIPTION OF SYMBOLS 10 Illuminating device 11 Illumination light emission unit 12 Optical branch part 13-15, 51 Optical fiber 13a-15a Incident opening 13b-15b, 51b Outlet 16 Input lens group 16a-16c 1st-3rd lens 17 1/2 wavelength plate 18 Polarizing beam splitter 31 Illumination light guiding unit 32 Rod integrator 32a Incident end face 32b Outlet end face 32c Large opposing face 32d Small opposing face 33 Relay optical system 43 Condenser lenses 44a and 44b Parallel plane plate 45 Correction lens 46 Correction filter 50 Incident adjustment mechanism 52 Projection member 52a Sphere portion 53, 59 Screw 55 Fixing member 56 Intermediate support member 56a Bar-shaped portion 57 Connecting portion 57a Housing portion 57b Slit 100 Exposure device 150 Moving mirror 160 Illuminance sensor AX32 Optical axis CX32 Central axis L Illumination light LI Illuminance unevenness Lm1, Branched laser beam for Lm2 illumination Ls1, Ls2 adjustment laser beam M mask P plate

Claims (19)

An illumination device comprising a pair of side surfaces facing each other, a rod integrator that emits light reflected between the pair of side surfaces, and a light guide optical system that irradiates a predetermined illumination region with light emitted from the rod integrator. And
A first incident portion that causes the first light to be incident on the rod integrator so that the entire illumination area is illuminated;
A second incident portion that causes the second light to be incident on the rod integrator so as to illuminate a part of the illumination area illuminated by the first light;
A lighting device comprising: The first incident portion causes the first light to enter the rod integrator so as to illuminate the entire first end surface of the rod integrator from which the first light is emitted,
The second incident portion causes the second light to be incident on the rod integrator so as to illuminate a part of the first end face of the rod integrator,
The illumination device according to claim 1, wherein the light guide optical system optically conjugates the first end surface with the illumination area. The first incident portion transmits the first light from a plurality of positions symmetrical to each other with respect to the center of the second end surface of the second end surface of the rod integrator on which the first light is incident. Incident on
The lighting device according to claim 1, wherein the second incident unit causes the second light to be incident on the rod integrator from a position different from the plurality of positions on the second end surface.   The said 2nd incident part makes the said 2nd light inject into the said rod integrator so that the said 2nd light is not reflected twice or more by the said side surface pair, The any one of Claim 1 to 3 characterized by the above-mentioned. The lighting device according to item. The first incident portion forms a condensing point of the first light at an end face of the rod integrator or in the vicinity of the end face, and causes the first light to enter the rod integrator from the end face,
The second incident portion causes the second light to be incident on the rod integrator from the end face without forming a condensing point of the second light on the end face of the rod integrator or in the vicinity of the end face. The lighting device according to any one of claims 1 to 4.   The said 1st incident part is provided with the optical fiber which guides the said 1st light, and makes the said 1st light guided by this optical fiber inject into the said rod integrator, The said 1 to 5 characterized by the above-mentioned. The illumination device according to any one of the above. An emission part for emitting third light;
An optical branching unit that branches the third light emitted by the emitting unit into a plurality of branched lights including at least the first light and the second light;
The first incident portion causes the first light branched by the light branching portion to enter the rod integrator,
The lighting device according to claim 1, wherein the second incident unit causes the second light branched by the light branching unit to be incident on the rod integrator.   The lighting device according to claim 7, wherein the light branching unit includes a light amount adjusting mechanism capable of adjusting a light amount ratio between the first light and the second light.   The said 2nd incident part has an incident adjustment mechanism which adjusts one or both of the incident angle and incident position of the said 2nd light with respect to the said rod integrator, The any one of Claim 1 to 8 characterized by the above-mentioned. The lighting device described in 1.   The second incident portion may be configured such that the second light is incident at symmetrical incident angles from a plurality of mutually symmetrical positions with respect to the center of the incident end face among incident end faces intersecting the pair of side faces of the rod integrator. The illumination device according to claim 1, wherein the illumination device is made incident on the rod integrator. An exposure apparatus that exposes a substrate by irradiating the substrate with light through a pattern formed on a mask,
An exposure apparatus comprising the illumination device according to claim 1 that illuminates the pattern.   12. The exposure apparatus according to claim 11, further comprising a projection optical system that projects an image of the pattern in the illumination area illuminated by the illumination apparatus onto the substrate.   The exposure apparatus according to claim 12, wherein the projection optical system projects an enlarged image of the pattern onto the substrate.   The exposure apparatus according to any one of claims 11 to 13, wherein the substrate has a side length or a diagonal length greater than 500 mm. An exposure method of exposing a substrate by irradiating the substrate with light through a pattern formed on a mask,
An exposure method comprising: illuminating the pattern using the illumination device according to claim 1.   The exposure method according to claim 15, further comprising: projecting an image of the pattern in the illumination area illuminated by the illumination device onto the substrate. Detecting an illuminance distribution in the illumination area or in an area on the substrate corresponding to the illumination area;
The exposure method according to claim 15, further comprising: illuminating a part of the illumination area with the second light based on detection information of the illuminance distribution. A device manufacturing method for forming an electronic device on a substrate,
Exposing the substrate using the exposure method according to any one of claims 15 to 17,
Developing the exposed substrate;
A device manufacturing method comprising:   An electronic device manufactured by the device manufacturing method according to claim 18.

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