JP2005024584A - Scanning projection aligner and exposure method - Google Patents

Scanning projection aligner and exposure method Download PDF

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Publication number
JP2005024584A
JP2005024584A JP2003186655A JP2003186655A JP2005024584A JP 2005024584 A JP2005024584 A JP 2005024584A JP 2003186655 A JP2003186655 A JP 2003186655A JP 2003186655 A JP2003186655 A JP 2003186655A JP 2005024584 A JP2005024584 A JP 2005024584A
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Japan
Prior art keywords
optical system
substrate
image
member
lens
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Pending
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JP2003186655A
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Japanese (ja)
Inventor
Hitoshi Hatada
Masanori Kato
正紀 加藤
仁志 畑田
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Nikon Corp
株式会社ニコン
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Priority to JP2003186655A priority Critical patent/JP2005024584A/en
Publication of JP2005024584A publication Critical patent/JP2005024584A/en
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Abstract

Disclosed is a scanning projection exposure apparatus capable of easily adjusting distortion and image plane even after a projection optical system is mounted on an exposure apparatus main body.
An illumination optical system that illuminates a first substrate with a light beam emitted from a light source, and a plurality of partial projection optical systems that project an image of a part of a pattern on the first substrate onto a second substrate, respectively. PL1 to PL5, a first stage on which the first substrate is placed, and a second stage on which the second substrate is placed, and scanning exposure is performed by synchronously moving the first stage and the second stage in the scanning direction. In the scanning projection exposure apparatus to be performed, each of the plurality of partial projection optical systems PL1 to PL5 guides an imaging optical system including a refractive optical system and a concave reflecting mirror, and light from the first substrate to the imaging optical system. A first deflection member, a second deflection member for guiding light through the imaging optical system to the second substrate, an optical path between the first substrate and the first deflection member, and a second deflection member Distortion arranged in at least one of the optical paths between the second substrate And a settling member.
[Selection] Figure 1

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention projects and exposes a mask pattern onto a glass substrate while moving the mask and the glass substrate with respect to a plurality of partial projection optical systems for forming an image of the pattern on the first substrate on the second substrate. The present invention relates to a scanning projection exposure apparatus and an exposure method using the scanning projection exposure apparatus.
[0002]
[Prior art]
In recent years, liquid crystal display panels are frequently used as display elements for word processors, personal computers, televisions, and the like. The liquid crystal display panel is manufactured by patterning a transparent thin film electrode on a glass substrate into a desired shape by a photolithography technique. As an apparatus for this photolithography, a projection exposure apparatus that exposes an original pattern formed on a mask onto a photoresist layer on a glass substrate via a projection optical system is used.
[0003]
Recently, there is an increasing demand for a liquid crystal display panel with a large area, and in accordance with this demand, it is desired to expand the exposure area even in this type of projection exposure apparatus. In order to enlarge the exposure area, a so-called scanning projection exposure apparatus has been proposed. In this scanning projection exposure apparatus, a mask pattern is projected and exposed onto a glass substrate while moving the mask and the glass substrate with respect to a projection optical system composed of a plurality of projection optical units. The projection optical system of such a scanning projection exposure apparatus is configured to include a refractive optical system, an imaging optical system including a concave mirror, and an optical system having a reflecting prism, and forms an intermediate image once, and further, the same optical system Is an optical system that exposes the pattern on the mask on the plate at the same magnification as an erect image.
[0004]
In such a projection optical system of a scanning projection exposure apparatus, distortion, image plane, image position, focus position, etc. can be adjusted by adjusting lenses and prisms constituting the projection optical unit (for example, patents). Reference 1).
[0005]
[Patent Document 1]
JP 2001-337463 A
[0006]
[Problems to be solved by the invention]
By the way, in recent years, as symbolized by a large-sized liquid crystal television, as the size of the mask increases, the size of the plate increases and a glass substrate exceeding 1 m square is used. Here, when exposure is performed on a glass substrate having a width of 800 mm using a scanning projection exposure apparatus including a projection optical system including a plurality of projection optical units, the width of the exposure field of one projection optical unit is 80 mm. In this case, it is necessary to arrange 10 projection optical units so that the exposure fields partially have overlapping exposure areas.
[0007]
In the case of a single projection optical unit, the distortion, image plane, image position, focus position, etc. can be adjusted by adjusting the lenses and prisms constituting the projection optical unit as described above. When incorporated in the exposure apparatus main body, the projection optical units are arranged very close to each other, making adjustment very difficult. Therefore, it is very difficult to adjust the projection optical unit in the case of an exposure apparatus that exposes a large glass substrate that must be adjusted at the installation site, such as distortion, image plane, image position, and focus position. It becomes. The projection optical unit is arranged as a first column with a predetermined interval in a direction perpendicular to the scanning direction and is arranged as a second column with a predetermined interval in a direction orthogonal to the scanning direction. Adjustment is impossible when an alignment system and an autofocus system are arranged between the second rows. In addition, the prism part or the like may be touched during transportation or packing, and the distortion and the state of the image plane may be distorted.
[0008]
An object of the present invention is to provide a scanning projection exposure apparatus and an exposure method using the scanning projection exposure apparatus that can easily adjust distortion and image plane even after the projection optical system is mounted on the exposure apparatus body. Is to provide.
[0009]
[Means for solving the problems]
The scanning projection exposure apparatus according to claim 1 projects an illumination optical system for illuminating the first substrate with a light beam emitted from a light source and a partial image of the pattern on the first substrate on the second substrate. A plurality of partial projection optical systems; a first stage on which the first substrate is placed; and a second stage on which the second substrate is placed, wherein the first stage and the second stage are arranged in a scanning direction. In the scanning projection exposure apparatus that performs scanning exposure while moving in synchronization, each of the plurality of partial projection optical systems includes an imaging optical system including a refractive optical system and a concave reflecting mirror, and light from the first substrate. A first deflection member for guiding to the imaging optical system, a second deflection member for guiding light through the imaging optical system to the second substrate, the first substrate, and the first deflection member; And the optical path between the second deflecting member and the second substrate Characterized in that it comprises a distortion adjustment member disposed on at least one of.
[0010]
According to the scanning projection exposure apparatus of claim 1, each of the plurality of partial projection optical systems includes an optical path between the first substrate and the first deflection member, and the second deflection member and the second substrate. Since the distortion adjusting member disposed in at least one of the intermediate optical paths is provided, the distortion can be easily adjusted even after the plurality of partial projection optical systems are incorporated into the exposure apparatus main body.
[0011]
The scanning projection exposure apparatus according to claim 2, wherein each of the plurality of partial projection optical systems includes an optical path between the first substrate and the first deflecting member, and the second deflecting member and the second deflecting member. An image plane adjusting member disposed in at least one of the optical paths between the second substrate and the second substrate is further provided.
[0012]
According to the scanning projection exposure apparatus according to claim 2, each of the plurality of partial projection optical systems includes an optical path between the first substrate and the first deflecting member and the second deflecting member and the second substrate. Since the image plane adjusting member disposed in at least one of the intermediate optical paths is provided, the image plane can be easily adjusted even after the plurality of partial projection optical systems are incorporated into the exposure apparatus main body.
[0013]
According to a third aspect of the present invention, there is provided a scanning projection exposure apparatus that includes an illumination optical system that illuminates the first substrate with a light beam emitted from a light source, and a partial image of the pattern on the first substrate on the second substrate A plurality of partial projection optical systems for projecting, a first stage for placing the first substrate, and a second stage for placing the second substrate, and scanning the first stage and the second stage In the scanning projection exposure apparatus that performs scanning exposure while moving in synchronization with each other, each of the plurality of partial projection optical systems includes an imaging optical system including a refractive optical system and a concave reflecting mirror, and a first substrate from the first substrate. A first deflection member for guiding light to the imaging optical system, a second deflection member for guiding light via the imaging optical system to the second substrate, the first substrate, and the first deflection. In the optical path between the member and between the second deflection member and the second substrate Characterized in that it comprises an eccentric aberration adjustment member disposed on at least one of the optical path.
[0014]
According to a fourth aspect of the present invention, the decentering aberration adjusting member adjusts at least one of decentering distortion, decentering field aberration, decentering coma aberration, and decentering chromatic aberration.
[0015]
According to the scanning projection exposure apparatus according to claim 3 and claim 4, each of the plurality of partial projection optical systems is in the optical path between the first substrate and the first deflecting member and the second deflecting member and the second deflecting member. Since the image plane adjusting member is provided in at least one of the optical paths between the two substrates, the decentration aberration can be easily adjusted even after the plurality of partial projection optical systems are incorporated in the exposure apparatus main body. it can.
[0016]
The scanning projection exposure apparatus according to claim 5, wherein the imaging optical system collects light from the pattern of the first substrate to form a primary image of the pattern. And a first catadioptric optical system including a first concave reflecting mirror, and a second refractive optical system for condensing light from the primary image to form a secondary image of the pattern on the second substrate A second catadioptric optical system including a second concave reflecting mirror, a third deflecting member for guiding light through the first catadioptric optical system to the primary image, and light from the primary image And a fourth deflecting member for guiding to the second catadioptric optical system.
[0017]
According to the scanning projection exposure apparatus of claim 5, the first catadioptric optical system for forming the primary image of the pattern and the secondary image of the pattern are formed by condensing the light from the primary image. Even in an exposure apparatus having a second catadioptric optical system for this purpose, after incorporating a plurality of partial projection optical systems into the exposure apparatus body, distortion adjustment, image plane adjustment, and decentration aberration adjustment can be easily performed. Can do.
[0018]
The scanning projection exposure apparatus according to claim 6, wherein the distortion adjusting member includes a lens having power, and the lens is shifted in the plane orthogonal to the optical axis of the partial projection optical system or the partial projection. It is configured to be tiltable with respect to the optical axis of the optical system.
[0019]
According to the scanning projection exposure apparatus of the sixth aspect, the lens having the power constituting the distortion adjusting member is shifted in the plane orthogonal to the optical axis of the partial projection optical system or relative to the optical axis of the partial projection optical system. By adjusting the tilt, the distortion can be adjusted.
[0020]
The scanning projection exposure apparatus according to claim 7 is characterized in that the distortion adjusting member includes a lens having power, and the lens is configured to be exchangeable with a lens having a different curvature radius.
[0021]
According to the scanning projection exposure apparatus of the seventh aspect, the distortion can be adjusted by replacing the lens having the power constituting the distortion adjusting member with a lens having a different curvature radius.
[0022]
The scanning projection exposure apparatus according to claim 8, wherein the image plane adjustment member includes a lens having power, and the lens is shifted in the plane orthogonal to the optical axis of the partial projection optical system or the part. It is configured to be tiltable with respect to the optical axis of the projection optical system.
[0023]
According to the scanning projection exposure apparatus of the eighth aspect, the lens having the power constituting the image plane adjusting member is shifted within the plane orthogonal to the optical axis of the partial projection optical system, or the optical axis of the partial projection optical system. The image plane can be adjusted by tilting it.
[0024]
The scanning projection exposure apparatus according to claim 9, wherein the distortion adjusting member is composed of at least two lenses, and moves at least one of the lenses in the optical axis direction of the partial projection optical system. The magnification of the partial projection optical system is adjusted.
[0025]
According to the scanning projection exposure apparatus of the ninth aspect, the magnification of the partial projection optical system can be adjusted by moving the lens constituting the distortion adjusting member in the optical axis direction of the partial projection optical system.
[0026]
Here, in the scanning projection exposure apparatus according to claim 9, the distortion adjusting member includes a first plano-concave lens having a first concave lens surface, a first convex lens surface and a second convex lens surface facing the first concave lens surface side. And a second plano-concave lens having a second concave lens surface directed toward the second convex lens surface, the partial projection by moving the biconvex lens in the optical axis direction of the partial projection optical system. It is preferable to adjust the magnification of the optical system. The scanning projection exposure apparatus according to claim 9, wherein the distortion adjusting member includes a first plano-convex lens having a first convex lens surface, a first concave lens surface and a second concave lens having a concave surface facing the first convex lens surface. And a second plano-convex lens having a second convex lens surface directed toward the second concave lens surface, and moving the biconcave lens in the optical axis direction of the partial projection optical system. It is preferable to adjust the magnification of the projection optical system.
[0027]
The scanning projection exposure apparatus according to claim 10, wherein the image plane adjustment member is composed of at least two lenses, and moves at least one of the lenses in the optical axis direction of the partial projection optical system. The magnification of the partial projection optical system is adjusted.
[0028]
According to the scanning projection exposure apparatus of this aspect, the magnification of the partial projection optical system can be adjusted by moving the lens constituting the image plane adjustment member in the optical axis direction of the partial projection optical system.
[0029]
Here, in the scanning projection exposure apparatus according to claim 10, the image plane adjusting member includes a first plano-concave lens having a first concave lens surface, a first convex lens surface and a second convex lens directed toward the first concave lens surface. It is preferable to include a biconvex lens having a surface and a second plano-concave lens having a second concave lens surface directed toward the second convex lens surface. Here, it is preferable that the magnification of the partial projection optical system is adjusted by moving the biconvex lens in the optical axis direction of the partial projection optical system. Further, it is preferable that the image plane of the partial projection optical system is adjusted by moving the first and second plano-concave lenses in the optical axis direction of the partial projection optical system.
[0030]
The scanning projection exposure apparatus according to claim 10, wherein the image plane adjusting member includes a first plano-convex lens having a first convex lens surface, a first concave lens surface having a concave surface facing the first convex lens surface, and a second one. It is preferable to include a biconcave lens having a concave lens surface and a second plano-convex lens having a second convex lens surface directed toward the second concave lens surface. Here, it is preferable that the magnification of the partial projection optical system is adjusted by moving the biconcave lens in the optical axis direction of the partial projection optical system. It is preferable that the image plane of the partial projection optical system is adjusted by moving the first and second plano-convex lenses in the optical axis direction of the partial projection optical system.
[0031]
The scanning projection exposure apparatus according to claim 11, wherein each of the plurality of partial projection optical systems adjusts a focus position of the partial projection optical system and an image position of the partial projection optical system. It is provided with at least one of an image position adjusting mechanism for adjusting, an image rotating position adjusting mechanism for adjusting the rotational position of the image of the partial projection optical system, and a magnification adjusting mechanism for adjusting the magnification of the partial projection optical system. And
[0032]
According to the scanning projection exposure apparatus of the eleventh aspect, it is possible to adjust the focus position, the image position, the image rotation position, and the magnification in each of the plurality of partial projection optical systems. .
[0033]
The scanning projection exposure apparatus according to claim 12 is an illumination optical system that illuminates the first substrate with a light beam emitted from a light source, and a partial image of the pattern on the first substrate on the second substrate. A plurality of partial projection optical systems for projecting, a first stage for placing the first substrate, and a second stage for placing the second substrate, and scanning the first stage and the second stage In the scanning projection exposure apparatus that performs scanning exposure while moving in synchronization with each other, each of the plurality of partial projection optical systems is formed by a distortion adjustment member that adjusts distortion of the partial projection optical system and the partial projection optical system An image rotation position adjustment mechanism that adjusts the rotation position of the obtained image is provided.
[0034]
The scanning projection exposure apparatus according to claim 13, wherein each of the plurality of partial projection optical systems includes an imaging optical system including a refractive optical system and a concave reflecting mirror, and light from the first substrate. A first deflecting member for guiding to the imaging optical system; and a second deflecting member for guiding the light that has passed through the imaging optical system to the second substrate, wherein the distortion adjusting member includes the imaging optical The concave rotating mirror provided in the system is included, and the image rotation position adjusting mechanism includes the first deflecting member and the second deflecting member provided in the partial projection optical system. And
[0035]
According to the scanning type projection exposure apparatus of claim 12 and claim 13, when the distortion is adjusted using the concave reflecting mirror provided in the imaging optical system and the image position is rotated. The rotation position of the image can be adjusted by rotating the first deflection member and the second deflection member, for example.
[0036]
The scanning projection exposure apparatus according to claim 14 projects an illumination optical system that illuminates the first substrate with a light beam emitted from a light source, and projects a partial image of the pattern on the first substrate onto the second substrate. A projection optical system, a first stage on which the first substrate is placed, and a second stage on which the second substrate is placed, and the first stage and the second stage are moved synchronously in the scanning direction. In the scanning projection exposure apparatus that performs scanning exposure, the projection optical system includes a first imaging optical system that forms an intermediate image of the first substrate and a second imaging optical that forms an image of the intermediate image. A system, a first deflection member disposed in an optical path between the first substrate and the second substrate to deflect light, and disposed in an optical path between the first substrate and the second substrate. And a second deflecting member for deflecting the light, and the first and second imaging optical systems At least one of the main lens group disposed along a predetermined optical axis, and a reflecting member disposed along the optical axis to reflect light through the main lens group and return the light to the main lens group again. The reflecting member is configured to be capable of adjusting at least one of an inclination with respect to the optical axis and a position in a direction crossing the optical axis in order to adjust distortion of the projection optical system. And
[0037]
According to the scanning projection exposure apparatus of claim 14, the position and orientation of the reflecting member for forming a reciprocating optical path with the main lens group is adjusted, and the light beam traveling toward the reflecting member is within the main lens group. And the optical path in the main lens group of the luminous flux after passing through the reflecting member can generate (correct) eccentric distortion.
[0038]
According to the scanning projection exposure apparatus of claim 15, at least one of the first deflecting member and the second deflecting member corrects image rotation due to adjustment of the reflecting member. It is configured to be rotatable.
[0039]
According to the scanning projection exposure apparatus of the fifteenth aspect, image rotation caused by adjusting the position and posture of the reflecting member can be canceled, and only the eccentric distortion can be generated (corrected) as the entire apparatus. it can.
[0040]
The scanning projection exposure apparatus according to claim 16, wherein the first deflection member is disposed in an optical path between the first substrate and the first imaging optical system, and the second deflection member is It is arranged between the second imaging optical system and the second substrate.
[0041]
An exposure method according to a seventeenth aspect provides the first substrate and the first substrate with respect to the partial projection optical system provided in the scanning projection exposure apparatus according to any one of the first to sixteenth aspects. It includes a step of performing scanning exposure by moving two substrates synchronously.
[0042]
According to the exposure method of the seventeenth aspect, since the exposure is performed by the exposure apparatus that can easily adjust the distortion and the image plane, a good scanning exposure can be performed.
[0043]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an exposure apparatus according to an embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a perspective view showing an overall schematic configuration of an exposure apparatus according to an embodiment of the present invention. In the present embodiment, a mask (first substrate) M and a plate (second substrate) P as a substrate are relative to a projection optical system PL composed of a plurality of catadioptric projection optical units PL1 to PL5. An example of a step-and-scan type exposure apparatus that transfers an image of the pattern DP of the liquid crystal display element formed on the mask M onto the plate P as a substrate while moving the image to FIG.
[0044]
In the following description, the XYZ rectangular coordinate system shown in each drawing is set, and the positional relationship of each member will be described with reference to this XYZ rectangular coordinate system. The XYZ orthogonal coordinate system is set so that the X axis and the Y axis are parallel to the plate P, and the Z axis is set in a direction orthogonal to the plate P. In the XYZ coordinate system in the figure, the XY plane is actually set to a plane parallel to the horizontal plane, and the Z-axis is set vertically upward. In the present embodiment, the direction (scanning direction) in which the mask M and the plate P are moved is set in the X-axis direction.
[0045]
The exposure apparatus according to the present embodiment uniformly illuminates a mask M supported in parallel to the XY plane via a mask holder (not shown) on a mask stage (first stage) MS (see FIG. 2). An illumination optical system IL is provided. FIG. 2 is a side view of the illumination optical system IL, and the same members as those shown in FIG. 1 are denoted by the same reference numerals. 1 and 2, the illumination optical system IL includes a light source 1 made of, for example, a mercury lamp or an ultrahigh pressure mercury lamp. Since the light source 1 is arranged at the first focal position of the elliptical mirror 2, the illumination light beam emitted from the light source 1 forms a light source image at the second focal position of the elliptical mirror 2 via the dichroic mirror 3.
[0046]
In the present embodiment, the light emitted from the light source 1 is reflected by the reflective film formed on the inner surface of the elliptical mirror 2 and the dichroic mirror 3, so that the g-line (436 nm) light and the h-line (405 nm) are reflected. ) Light and light in the wavelength region of 300 nm or more, including i-line (365 nm) light, are formed at the second focal position of the elliptical mirror 2. That is, components that are unnecessary for exposure outside the wavelength region including g-line, h-line, and i-line are removed when reflected by the elliptical mirror 2 and the dichroic mirror 3.
[0047]
A shutter 4 is disposed at the second focal position of the elliptical mirror 2. The shutter 4 includes an opening plate 4a (see FIG. 2) disposed obliquely with respect to the optical axis AX1, and a shielding plate 4b (see FIG. 2) that shields or opens the opening formed in the opening plate 4a. . The shutter 4 is arranged at the second focal position of the elliptical mirror 2 because the illumination light beam emitted from the light source 1 is focused so as to shield the opening formed in the aperture plate 4a with a small amount of movement of the shield plate 4b. This is because the amount of the illumination light beam passing through the aperture can be changed abruptly to obtain a pulsed illumination light beam.
[0048]
The divergent light beam from the light source image formed at the second focal position of the elliptical mirror 2 is converted into a substantially parallel light beam by the collimator lens 5 and enters the wavelength selection filter 6. The wavelength selection filter 6 transmits only a light beam in a wavelength region including g-line, h-line, and i-line. The light that has passed through the wavelength selection filter 6 forms an image again via the relay lens 8. An incident end 9a of the light guide 9 is disposed in the vicinity of the imaging position. The light guide 9 is, for example, a random light guide fiber configured by randomly bundling a large number of fiber strands, and has the same number of incident ends 9a as the number of light sources 1 (one in FIG. 1), and a projection optical system. The same number of exit ends as the number of projection optical units (partial projection optical systems) (5 in FIG. 1) constituting the PL, that is, the exit end 9b and the other four exit ends (in FIG. 2, only the exit end 9b is shown). ). Thus, the light incident on the incident end 9a of the light guide 9 propagates through the inside thereof, and then is divided and emitted from the emission end 9b and the other four emission ends. When the amount of light is insufficient with only one light source 1, a plurality of light sources are provided, and each light source has a plurality of incident ends provided. It is preferable to provide a light guide that divides into the same amount of light and emits from each exit end.
[0049]
As shown in FIG. 2, a blade 10 configured to be able to continuously change the position is disposed at the incident end 9 a of the light guide 9. This blade 10 shields part of the incident end 9a of the light guide 9 so as to continuously vary the intensity of light emitted from the exit end 9b of the light guide 9 and each of the other four exit ends. belongs to. The amount of light shielding with respect to the incident end 9 a of the light guide 9 of the blade 10 is controlled by the main control system 20 in FIG.
[0050]
Between the exit end 9b of the light guide 9 and the mask M, a collimating lens 11b, a fly-eye integrator 12b, an aperture stop 13b (not shown in FIG. 1), a beam splitter 14b (not shown in FIG. 1), and a condenser The lens system 15b is arranged in order. Similarly, between the other four exit ends of the light guide 9 and the mask M, a collimating lens, a fly-eye integral, an aperture stop, a beam splitter, and a condenser lens system are arranged in that order. .
[0051]
Here, for simplification of description, the configuration of the optical member provided between each exit end of the light guide 9 and the mask M is provided between the exit end 9b of the light guide 9 and the mask M. The collimating lens 11b, the fly-eye integrator 12b, the aperture stop 13b, the beam splitter 14b, and the condenser lens system 15b will be representatively described.
[0052]
The divergent light beam emitted from the exit end 9b of the light guide 9 is converted into a substantially parallel light beam by the collimator lens 11b, and then enters the fly-eye integrator 12b. The fly-eye integrator 12b is configured by arranging a large number of positive lens elements vertically and horizontally and densely so that the central axis thereof extends along the optical axis AX2. Accordingly, the light beam incident on the fly-eye integrator 12b is divided into wavefronts by a large number of lens elements, and a secondary light source composed of the same number of light source images as the number of lens elements is formed on the rear focal plane (that is, near the exit surface). Form. That is, a substantial surface light source is formed on the rear focal plane of the fly-eye integrator 12b.
[0053]
Light beams from a number of secondary light sources formed on the rear focal plane of the fly-eye integrator 12b are limited by an aperture stop 13b disposed near the rear focal plane of the fly-eye integrator 12b, The light enters the condenser lens system 15b via the splitter 14b. The aperture stop 13b is disposed at a position optically substantially conjugate with the pupil plane of the corresponding projection optical unit PL1, and has a variable aperture for defining the range of the secondary light source that contributes to illumination. The aperture stop 13b changes the aperture diameter of the variable aperture, thereby determining the σ value (the pupil plane relative to the aperture diameter of the pupil plane of each of the projection optical units PL1 to PL5 constituting the projection optical system PL). The ratio of the aperture diameter of the secondary light source image above is set to a desired value.
[0054]
The light flux through the condenser lens system 15b illuminates the mask M on which the pattern DP is formed in weight. Similarly, the divergent light beams emitted from the other four exit ends of the light guide 9 are respectively weighted through the mask M through the collimator lens, fly eye integrator, aperture stop, beam splitter, and condenser lens in this order. Irradiate. That is, the illumination optical system IL illuminates a plurality of trapezoidal regions (illumination field of view) aligned in the Y-axis direction on the mask M (five in total in FIG. 1). The light source provided in the illumination optical system IL may be an ultraviolet radiation type LED or LD.
[0055]
On the other hand, light passing through the beam splitter 14b provided in the illumination optical system IL is received by an integrator sensor 17b made of a photoelectric conversion element via a condenser lens 16b as shown in FIG. The photoelectric conversion signal of the integral overnight sensor 17b is supplied to the main control system 20 via a peak hold circuit and an A / D converter (not shown). The correlation coefficient between the output of the integrator sensor 17b and the energy (exposure amount) per unit area of the light irradiated on the surface of the plate P is obtained in advance and stored in the main control system 20.
[0056]
The main control system 20 is synchronized with the operation information of the stage system from a stage controller (not shown) that controls the plate stage (second stage) on which the plate P is placed and the mask stage MS on which the mask M is placed. Timing for controlling the opening / closing operation of the shutter 4 and outputting a control signal to the driving device 19 in accordance with the photoelectric conversion signal output from the integrator sensor 17b, and irradiating the mask M with illumination light from the illumination optical system IL And control the intensity of the illumination light.
[0057]
The illumination optical system IL is configured so that its illumination optical characteristics (telecentricity and illuminance unevenness) can be varied. For details of the method for adjusting the illumination optical characteristics, see, for example, Japanese Patent Application Laid-Open Nos. 2001-305743, 2001-313250, and 10-189427. In addition, for adjustment of illuminance unevenness, the opening width in the scanning direction is orthogonal to the scanning direction (non-scanning) in the vicinity of the mask surface (plate surface) or in the optical conjugate with the mask surface (plate surface) or in the vicinity thereof. It is also possible to correct by arranging a field stop that is different in (direction). For details of this correction method, refer to, for example, JP-A-7-142313. In such a correction method, a configuration may be provided in which a density distribution filter having a distribution in which the transmission characteristics can correct illuminance unevenness in the non-scanning direction is used instead of changing the width of the aperture of the field stop.
[0058]
The light from each illumination area on the mask M is a projection optical system composed of a plurality (five in total, FIG. 1) of projection optical units PL1 to PL5 arranged along the Y-axis direction so as to correspond to each illumination area Incident on the system PL. The light passing through the projection optical system PL forms an image of the pattern DP on the plate P supported in parallel with the XY plane via a plate holder (not shown) on a plate stage (not shown). That is, as described above, each of the projection optical units PL1 to PL5 is configured as an equal-magnification erecting system, so that the trapezoidal exposure arranged in the Y-axis direction so as to correspond to each illumination area on the plate P. An equal-magnification erect image of the pattern DP is formed in the region.
[0059]
Returning to FIG. 1, the above-described mask stage MS is provided with a scanning drive system (not shown) having a long stroke for moving the mask stage MS along the X-axis direction which is the scanning direction. In addition, a pair of alignment drive systems (not shown) are provided for moving the mask stage MS by a minute amount along the Y-axis direction, which is the direction orthogonal to the scan, and rotating the mask stage MS by a minute amount around the Z-axis. The position coordinate of the mask stage MS is measured by a laser interferometer (not shown) using the movable mirror 25 and the position is controlled. Further, the mask stage MS is configured such that the position in the Z direction is variable.
[0060]
A similar drive system is also provided for the plate stage. That is, a scanning drive system (not shown) having a long stroke for moving the plate stage along the X-axis direction, which is the scanning direction, and moving the plate stage by a minute amount along the Y-axis direction, which is the orthogonal direction of scanning. In addition, a pair of alignment drive systems (not shown) are provided for rotating by a minute amount around the Z axis. The position coordinate of the plate stage is measured and controlled by a laser interferometer (not shown) using the movable mirror 26. Similarly to the mask stage MS, the plate stage is also configured to be movable in the Z direction. The positions of the mask stage MS and the plate stage in the Z direction are controlled by the main control system 20.
[0061]
The above-described projection optical units PL1, PL3, and PL5 are arranged as a first row at a predetermined interval in a direction orthogonal to the scanning direction. Similarly, the projection optical system units PL2 and PL4 are arranged in the second row with a predetermined interval in a direction orthogonal to the scanning direction. Between the projection optical unit of the first row and the projection optical unit of the second row, an off-axis alignment system 52 for aligning the plate P and an auto for focusing the mask M and the plate P are provided. A focus system 54 is arranged.
[0062]
Further, an illuminance measuring unit 29 for measuring the illuminance of light irradiated on the plate P via the projection optical system PL is provided on the plate stage, and light (image) irradiated on the plate P is provided. An aerial image measuring device 24 is provided for measuring the spatial distribution.
[0063]
FIG. 3 is a diagram showing a configuration of the projection optical unit PL1 according to the embodiment of the present invention. The configuration of the projection optical units PL2 to PL5 is the same as that of PL1. The projection optical unit PL1 shown in the figure has a first imaging optical system K1 that forms a primary image of the mask pattern based on the light from the mask M, and an erect image (2) of the mask pattern based on the light from the primary image. And a second imaging optical system K2 that forms a next image) on a glass substrate (plate) P. In the vicinity of the primary image formation position of the mask pattern, a field area (illumination area) of the projection optical unit PL1 on the mask M and a projection area (exposure area) of the projection optical unit PL1 on the glass substrate P are defined. A field stop FS is provided.
[0064]
The first imaging optical system K1 is a first deflection that is obliquely provided at an angle of 45 ° with respect to the mask surface (XY plane) so that light incident along the −Z direction from the mask M is reflected in the + X direction. A first reflecting surface P1r of a member (first deflection member) is provided. The first imaging optical system K1 includes, in order from the first reflecting surface P1r side, a first refractive optical system G1P having a positive refractive power, and a first concave reflecting mirror having a concave surface facing the first reflecting surface P1r side. M1. The first refractive optical system G1P and the first concave reflecting mirror M1 are arranged along the X direction, and constitute the first catadioptric optical system HK1 as a whole. Further, the first imaging optical system K1 has an angle of 45 ° with respect to the mask surface (XY plane) so as to reflect the light incident along the −X direction from the first catadioptric optical system HK1 in the −Z direction. The second reflecting surface P2r of the second deflecting member (third deflecting member) that is obliquely provided is provided.
[0065]
On the other hand, the second imaging optical system K2 is inclined at an angle of 45 ° with respect to the glass substrate surface (XY plane) so that light incident along the −Z direction from the second reflecting surface P2r is reflected in the + X direction. A third reflecting surface P3r of the provided third deflecting member (fourth deflecting member) is provided. The second imaging optical system K2 includes, in order from the third reflecting surface P3r side, a second refractive optical system G2P having a positive refractive power and a second concave reflecting mirror having a concave surface directed to the third reflecting surface P3r side. M2. The second refractive optical system G2P and the second concave reflecting mirror M2 are disposed along the X direction, and constitute a second catadioptric optical system HK2 as a whole. Further, the second imaging optical system K2 is 45 ° with respect to the glass substrate surface (XY plane surface) so as to reflect the light incident along the −X direction from the second catadioptric optical system HK2 in the −Z direction. The fourth reflecting surface P4r of the fourth deflecting member (second deflecting member) inclined at an angle of is provided. The second concave reflecting mirror M2 is configured to be able to change the direction of the concave reflecting surface. That is, the direction of the reflecting surface can be changed by changing the thickness of the washer for attaching the second concave reflecting mirror M2 to the housing or the like.
[0066]
A magnification adjusting member 44 is provided in the optical path between the fourth reflecting surface P4r of the fourth deflecting member and the glass substrate P. The magnification adjusting member 44 also functions as a distortion adjusting member and an image plane adjusting member. Furthermore, it also functions as a decentration aberration adjusting member for adjusting decentration distortion, decentered image surface aberration, decentration coma aberration, and decentration chromatic aberration.
[0067]
Further, the magnification adjustment by the magnification adjustment member 44, the distortion adjustment by the magnification adjustment member 44 that functions as a distortion adjustment member, the image surface adjustment by the magnification adjustment member 44 that functions as an image surface adjustment member, and the magnification adjustment member that functions as an eccentric aberration adjustment member In order to correct the image displacement in the XYZ directions caused by the decentration aberration adjustment by 44, the parallel flats constituting the wedge lens 40 and the image shifter in the optical path between the mask M and the first reflecting surface P1r of the first deflecting member. A face plate 42 is provided. Here, the wedge lens 40 constitutes a focal position correcting means for correcting the imaging position. The plane parallel plate 42 constitutes an image shift means for correcting (shifting) the imaging position.
[0068]
As described above, the pattern formed on the mask M is illuminated with substantially uniform illuminance by illumination light (exposure light) from an illumination optical system generally used in this technical field. The light traveling along the −Z direction from the mask pattern formed in each illumination area on the mask M enters the first reflecting surface P1r via the wedge lens 40 and the parallel plane plate 42, and the first reflecting surface. It is deflected by 90 ° by P1r and enters the first catadioptric optical system HK1 along the + X direction. The light incident on the first catadioptric optical system HK1 reaches the first concave reflecting mirror M1 via the first refractive optical system G1P. The light reflected by the first concave reflecting mirror M1 is incident on the second reflecting surface P2r along the −X direction again via the first refractive optical system G1P. The light that is deflected by 90 ° at the second reflecting surface P2r and travels along the −Z direction forms a primary image of the mask pattern in the vicinity of the field stop FS. The lateral magnification in the X direction of the primary image is +1 times, and the lateral magnification in the Y direction is -1.
[0069]
The light traveling along the −Z direction from the primary image of the mask pattern is deflected by 90 ° by the third reflecting surface P3r and enters the second catadioptric optical system HK2 along the + X direction. The light incident on the second catadioptric optical system HK2 reaches the second concave reflecting mirror M2 via the second refractive optical system G2P. The light reflected by the second concave reflecting mirror M2 is incident on the fourth reflecting surface Pr4 along the −X direction again through the second refractive optical system G2P. The light that is deflected by 90 ° on the fourth reflecting surface Pr4 and travels along the −Z direction forms a secondary image of the mask pattern in the corresponding exposure region on the glass substrate P via the magnification adjusting member 44. . Here, the lateral magnification in the X direction and the lateral magnification in the Y direction of the secondary image are both +1 times. In other words, the mask pattern image formed on the glass substrate P via the projection optical unit PL is an equal magnification erect image, and the projection optical unit PL constitutes an equal magnification erect system.
[0070]
In the above-described first catadioptric optical system HK1, the first concave reflecting mirror M1 is disposed at the rear focal position of the first refractive optical system G1P, so that it becomes telecentric on the mask M side and the field stop FS side. . Also in the second catadioptric optical system HK2, the second concave reflecting mirror M2 is disposed at the rear focal position of the second refractive optical system G2P, and therefore telecentric on the field stop FS side and the glass substrate P side. . As a result, the projection optical unit PL is a telecentric optical system on both sides (the mask M side and the glass substrate P side).
[0071]
As described above, the mask pattern image formed on the glass substrate P through the projection optical unit PL is an equal-size erect image. Therefore, the desired scanning exposure can be performed by moving the mask M held on the mask stage MS and the glass substrate P held on the substrate stage integrally in the same direction (X direction). it can.
[0072]
FIG. 4 is a system configuration diagram of each projection optical unit. The control device 20 controls the first drive unit 30 to relatively move the wedge lens 40, thereby changing the thickness of the wedge lens 40 and correcting the image shift in the optical axis direction of the projection optical unit. In addition, the control device 20 corrects the image shift in the direction perpendicular to the optical axis of the projection optical unit by controlling the second drive unit 32 to tilt the plane-parallel plate 42. Further, the control device 20 controls the third driving unit 34 to rotate the second right-angle prism 38 having the third reflecting surface P3r of the third deflecting member and the fourth reflecting surface P4r of the fourth deflecting member on the plate P. The rotational position of the image formed on the screen is adjusted. That is, the second right angle prism 38 is configured to function as an image rotator. Furthermore, the control device 20 adjusts the magnification of the projection optical unit by controlling the fourth driving unit 36 to change the lens interval of the magnification adjusting member 44.
[0073]
Next, the magnification adjustment of the projection optical units PL1 to PL5, that is, the adjustment of the projection magnification from the mask M to the glass substrate P will be described. The projection optical system according to the present embodiment is an erect image formed by a plurality of projection optical units PL1 to PL5, and an equal magnification projection optical system. However, when the projection optical system is assembled, a manufacturing error, etc. As a result, an error may occur in the magnification in each of the projection optical units PL1 to PL5. In such a case, in order to make the magnification of each projection optical unit PL1-PL5 equal, magnification adjustment is performed in each projection optical unit PL1-PL5.
[0074]
Here, in FIG. 3, the optical axis of the first catadioptric optical system HK1 is represented by AX1, and the optical axis of the second catadioptric optical system HK2 is represented by AX2. Further, the center of the field of view on the mask M defined by the field stop FS advances in the −Z direction, passes through the center of the field stop FS, and the center of the exposure region on the glass substrate P similarly defined by the field stop FS. The path of the light beam reaching the line is represented by the axis AXFC. As shown in FIG. 3, the visual field center axis AXFC is between the mask M and the first reflecting surface P1r of the first deflecting member, and the second reflecting surface P2r of the second deflecting member and the third reflecting surface of the third deflecting member. It extends along the Z direction in the optical path between P3r and the fourth reflecting surface P4r of the fourth deflecting member and the glass substrate P.
[0075]
Further, the axis AXFC is between the first catadioptric optical system HK1 and the first reflecting surface P1r of the first deflecting member, between the first catadioptric optical system HK1 and the second reflecting surface P2r of the second deflecting member, X direction in the optical path between the second catadioptric optical system HK2 and the third reflecting surface P3r of the third deflecting member and between the second catadioptric optical system HK2 and the fourth reflecting surface P4r of the fourth deflecting member. It extends along. Further, the axis AXFC is folded back symmetrically with respect to the optical axis AX1 at the center of the reflecting surface of the first concave reflecting mirror M1 (that is, the intersection with the optical axis AX1), and the center of the reflecting surface of the second concave reflecting mirror M2 (that is, the light) It is folded back symmetrically with respect to the optical axis AX2 at the intersection point with the axis AX2.
[0076]
In the optical path between the fourth reflecting surface P4r and the glass substrate P, the magnification adjusting member 44 and the optical axis of the lens constituting the magnification adjusting member 44 and the optical axis of the lens constituting the projection optical units PL1 to PL5 (optical axis). AX1 and optical axis AX2) are arranged so as to coincide with each other. That is, the magnification adjusting member 44 is arranged in order from the fourth reflecting surface P4r side along the optical axis AX1 and the optical axis AX2, and is a plano-concave lens (first plano-concave lens), a biconvex lens, and a plano-concave lens (second plano-concave lens). The concave surface of the plano-concave lens (first plano-concave lens) and one convex surface of the biconvex lens, and the other convex surface of the biconvex lens and the concave surface of the plano-concave lens (second plano-concave lens) face each other at a predetermined interval.
[0077]
The magnification adjustment of each of the projection optical units PL1 to PL5 is performed by changing the interval between the plano-concave lens, the biconvex lens and the plano-concave lens constituting the magnification adjustment member 44, for example, by moving the biconvex lens in the optical axis direction. In each of the projection optical units PL1 to PL5, the optical axis of the lens that constitutes the projection optical unit PL1 to PL5 and the optical axis of the lens that constitutes the magnification adjustment member 44 coincide with each other, so that the magnification adjustment member 44 is configured. Even when the magnification is adjusted by changing the distance between the plano-concave lens, the biconvex lens, and the plano-concave lens, decentration aberration does not occur. However, as shown in FIG. 5, since the center of the exposure area (exposure center) and the optical axis of the lens constituting the magnification adjusting member 44 do not coincide with each other, the plano-concave lens and biconvex lens constituting the magnification adjusting member 44 In addition, when the magnification is adjusted by changing the interval between the plano-concave lenses, image shift occurs.
[0078]
Therefore, the image shift caused by the magnification adjustment by the magnification adjustment member 44 is corrected by the wedge lens 40 and the parallel flat plate 42 constituting the image shift correction means. That is, the image displacement in the direction perpendicular to the optical axis of the lenses constituting the projection optical units PL1 to PL5 is corrected by tilting the plane parallel plate 42, and the image displacement in the optical axis direction of the lenses constituting the projection optical unit ( (Focal position shift) is corrected by moving the wedge lens 40 relatively.
[0079]
Note that the image plane shape is controlled by using the magnification adjusting member 44 according to the present embodiment (for example, adjustment of Petzval image plane, that is, correction of curvature of the image plane in which the meridional image plane and the sagittal image plane are matched). Is also possible. That is, in this case, the magnification adjustment member 44 constitutes an image plane shape control member and functions as an image plane adjustment member. To do. 6 (a) and 6 (b) both show an example of the magnification adjusting member 44, the magnification adjusting member shown in FIG. 6 (b) is the magnification adjusting member shown in FIG. 6 (a). This biconvex lens is changed to a biconvex lens having a large curvature radius on the lens surface. By changing the curvature of the lens surface in this way, the image plane can be controlled, that is, the image plane can be curved.
[0080]
In the example shown in FIG. 6, the radius of curvature of both lens surfaces of the biconvex lens is changed, but the radius of curvature of one lens surface may be changed. Furthermore, the imaging plane may be controlled by changing the radius of curvature of any one or more of the plano-concave lens, the biconvex lens, and the plano-concave lens constituting the magnification adjusting member 44. When changing the radius of curvature of the lens surface, the lens whose radius of curvature of the lens surface is to be changed may be taken out from the magnification adjusting member 44, processed, and returned to the magnification adjusting member 44. The lens whose radius of curvature is changed is taken out from the magnification adjusting member 44, and another lens having a lens surface having a different radius of curvature (or a lens made of a glass material having the same radius of curvature and a different refractive index) is taken as the magnification adjusting member 44. You may return to.
[0081]
In the above-described embodiment, the magnification adjusting member 44 is constituted by a plano-concave lens, a biconvex lens, and a plano-concave lens. However, the magnification adjusting member 44 is a plano-convex lens (first plano-convex lens), a biconcave lens, and a plano-convex lens (first (2 plano-convex lens). Even in this case, the magnification adjustment can be performed by moving the biconcave lens in the optical axis direction, for example, by changing the intervals of the planoconvex lens, the biconcave lens, and the planoconvex lens constituting the magnification adjustment member 44. In each of the projection optical units PL1 to PL5, the optical axis of the lens that constitutes the projection optical unit PL1 to PL5 and the optical axis of the lens that constitutes the magnification adjustment member 44 coincide with each other, so that the magnification adjustment member 44 is configured. Even when the magnification is adjusted by changing the interval between the plano-convex lens, the biconcave lens, and the plano-convex lens, decentration aberration does not occur. However, since the center of the exposure area and the optical axis of the lens constituting the magnification adjusting member 44 do not coincide with each other, the magnification is obtained by changing the spacing between the plano-convex lens, the biconcave lens and the plano-convex lens constituting the magnification adjusting member 44. Image misalignment occurs when the adjustment is performed. Therefore, the image shift caused by the magnification adjustment by the magnification adjustment member 44 is corrected by the wedge lens 40 and the parallel flat plate 42 constituting the image shift correction means.
[0082]
It is also possible to adjust the Petzval image plane using the magnification adjusting member 44 constituted by the planoconvex lens, the biconcave lens, and the planoconvex lens. That is, it is possible to control the image plane by changing one or more radii of curvature among the lens surfaces of the plano-convex lens, the biconcave lens, and the plano-convex lens constituting the magnification adjusting member 44.
[0083]
In the above-described embodiment, the magnification adjusting member 44 is disposed in the optical path between the fourth reflecting surface P4r of the fourth deflecting member and the glass substrate P. However, the magnification adjusting member 44 is connected to the mask M. In the optical path between the first reflecting surface P1r of the first deflecting member, in the optical path between the mask M and the first reflecting surface P1r of the first deflecting member, and the fourth reflecting surface P4r of the fourth deflecting member and the glass substrate. You may make it provide in both in the optical path between P.
[0084]
In the above-described embodiment, the magnification adjusting member 44 is located between the fourth reflecting surface P4r of the fourth deflecting member and the glass substrate P in the optical path between the mask M and the first reflecting surface P1r of the first deflecting member. Since it is disposed in the optical path, that is, since the magnification adjustment member 44 is disposed outside the imaging optical system, the distance between the lenses constituting the magnification adjustment member 44 can be adjusted very easily. The magnification adjustment of the units PL1 to PL5 can be easily performed.
[0085]
Further, when the magnification adjusting member 44 constitutes an image plane shape control member, the image plane shape control member is disposed outside the imaging optical system, and therefore, at least one lens constituting the image plane shape control member Can be exchanged very easily, and the shape of the image plane formed on the second substrate can be easily controlled.
[0086]
In the above-described embodiment, the wedge lens 40 and the plane parallel plate 42 are provided in the optical path between the mask M and the first reflecting surface P1r of the first deflecting member. You may make it provide in the optical path between the 4th reflective surface P4r and the glass substrate P. FIG.
[0087]
In the above-described embodiment, the wedge lens 40 and the plane parallel plate 42 are in the optical path between the mask M and the first reflecting surface P1r of the first deflecting member, and the fourth reflecting surface P4r of the fourth deflecting member and the glass substrate P. Since the wedge lens 40 and the plane parallel plate 42 are arranged outside the imaging optical system, the image shift can be corrected very easily.
[0088]
In the above-described embodiment, the second right-angle prism 38 is configured to function as an image rotator. However, the first right-angle prism 37 instead of the second right-angle prism 38 is configured to function as an image rotator. It may be configured. Further, both the second right-angle prism 38 and the first right-angle prism 37 may be configured to function as an image rotator. In the above-described embodiment, the direction of the reflecting surface of the second concave reflecting mirror M2 is configured to be changeable. However, the thickness of the washer for attaching the first concave reflecting mirror M1 to the housing or the like is set. You may comprise so that the direction of the reflective surface of the 1st concave reflective mirror M1 can be changed by changing.
[0089]
As described above, the magnification adjusting member 44 also functions as a distortion adjusting member, an image plane adjusting member, and a decentration aberration adjusting member. That is, when the magnification adjusting member 44 is configured by a plano-concave lens (first plano-concave lens), a biconvex lens, and a plano-concave lens (second plano-concave lens), that is, when configured by a lens having power, for example, By tilting the first plano-concave lens, which is a plano-concave lens, distortion occurs in the image formed on the plate P and image shift occurs. However, since the image shift can be adjusted by the plane parallel plate 42 constituting the image shifter, the distortion of the image formed on the plate P is adjusted by tilting the lens constituting the magnification adjusting member 44. Can do.
[0090]
When the magnification adjusting member 44 is composed of a plano-convex lens (first plano-convex lens), a biconcave lens, and a plano-convex lens (second plano-convex lens), it is formed on the plate P even if the first plano-convex lens is tilted. The distortion of the image can be adjusted.
[0091]
Further, when the magnification adjusting member 44 is constituted by a plano-concave lens (first plano-concave lens), a biconvex lens, and a plano-concave lens (second plano-concave lens), that is, a lens having power, By shifting the first plano-concave lens, which is a plano-concave lens, a slight distortion occurs in the image formed on the plate P, and an inclination of the image plane occurs. Therefore, the image plane formed on the plate P can be adjusted by shifting the lens constituting the magnification adjusting member 44.
[0092]
When the magnification adjusting member 44 is composed of a plano-convex lens (first plano-convex lens), a biconcave lens, and a plano-convex lens (second plano-convex lens), it is formed on the plate P even if the first plano-convex lens is shifted. Image plane can be adjusted.
[0093]
Further, when the magnification adjusting member 44 is constituted by a plano-concave lens (first plano-concave lens), a biconvex lens, and a plano-concave lens (second plano-concave lens), that is, when constituted by a lens having power, for example, the first If the plano-concave lens and the second plano-concave lens are tilted by the same amount in different directions, the first plano-concave lens, the biconvex lens and the second plano-concave lens constituting the magnification adjusting member 44 can be regarded as wedge-shaped glass. . Therefore, the distortion generated in the image formed on the plate P hardly changes, but the image plane is inclined. In this case, since the first plano-concave lens and the second plano-concave lens are tilted by the same amount in different directions, compared to the case where only the first plano-concave lens is tilted, the image plane is tilted twice as much. Inclination occurs.
[0094]
When the magnification adjusting member 44 is constituted by a plano-convex lens (first plano-convex lens), a biconcave lens, and a plano-convex lens (second plano-convex lens), the same amount of the first plano-convex lens and the second plano-convex lens in different directions. Even if it is tilted, the image plane can be tilted.
[0095]
Further, when the magnification adjusting member 44 is constituted by a plano-concave lens (first plano-concave lens), a biconvex lens, and a plano-concave lens (second plano-concave lens), that is, when constituted by a lens having power, for example, the first If the plano-concave lens and the second plano-concave lens are tilted in the same direction by the same amount, the same effect as tilting of the plane-parallel plate is obtained, and only the image position is shifted and the aberration is hardly changed. In addition, when the magnification adjusting member 44 includes a plano-convex lens (first plano-convex lens), a biconcave lens, and a plano-convex lens (second plano-convex lens), the same amount of the first plano-convex lens and the second plano-convex lens in the same direction. Even when tilted, only the image position is shifted and the aberration hardly changes.
[0096]
Further, when the magnification adjusting member 44 is composed of a plano-concave lens (first plano-concave lens), a biconvex lens, and a plano-concave lens (second plano-concave lens), that is, a magnification adjusting member. When the entire lens 44 is tilted with respect to the optical axis of the partial projection optical system, it is possible to adjust decentration aberrations such as decentration coma and decentration chromatic aberration.
[0097]
Note that the magnification adjusting member 44 is constituted by a plano-convex lens (first plano-convex lens), a biconcave lens, and a plano-convex lens (second plano-convex lens), and the entire magnification adjusting member 44 is light of the partial projection optical system. Even when tilted with respect to the axis, decentration aberrations such as decentration coma and chromatic aberration can be adjusted.
[0098]
Further, when the magnification adjusting member 44 is constituted by a plano-concave lens (first plano-concave lens), a biconvex lens and a plano-concave lens (second plano-concave lens), that is, constituted by a lens having power, When the biconvex lens is replaced with a lens having a different radius of curvature, low-order distortion (rotationally symmetric distortion) different from the distortion of the eccentric component can be adjusted. Here, when the curvature radius of the lens is changed only on one surface, the Petzval image surface changes slightly, so that field curvature occurs. However, the power of the lens is not changed by combining the curvature radii of both surfaces of the lens. That is, only the distortion can be changed without changing the Petzval image plane. Further, if the air gap is changed so as not to change the magnification and distortion, only the field curvature and astigmatism can be corrected.
[0099]
When the magnification adjusting member 44 is composed of a plano-convex lens (first plano-convex lens), a biconcave lens, and a plano-convex lens (second plano-convex lens), the central biconcave lens is replaced with a lens having a different curvature radius. Can adjust a low-order distortion (a rotationally symmetric distortion) different from the distortion of the eccentric component.
[0100]
When adjusting the distortion and the image plane of the projection optical units PL1 to PL5, first, the magnification adjusting member 44 composed of the first plano-concave lens, the biconvex lens and the second plano-concave lens is used as the projection optical units PL1 to PL1. Distortion and image plane measurements are performed while mounted on PL5. The air distance, tilt amount, and shift amount of the lens constituting the magnification adjusting member 44 are determined based on the measured distortion and the aberration amount of the image plane.
[0101]
Next, only the magnification adjusting member 44 is removed from the projection optical units PL1 to PL5, and the mounting position of the first plano-concave lens is adjusted by a washer or the like so that the tilt amount and shift amount of the first plano-concave lens become the calculated values. To do. At this time, for example, when it is desired to tilt the first plano-concave lens, the plane side of the first plano-concave lens and the plane side of the second plano-concave lens are measured by a collimator, and the amount to be changed with respect to the measured value is a washer. It is adjusted by exchanging and is measured again with the collimator to confirm that the desired inclination is obtained. In this way, it is possible to confirm whether or not the adjustment can be performed by a calculation amount, and it is possible to reduce the adjustment error.
[0102]
In the exposure apparatus according to this embodiment, since the magnification adjustment member itself is used for distortion and image plane adjustment, a new space for arranging the distortion adjustment member and image plane adjustment member is not required. Moreover, there is no need to add new parts, which is a great merit in terms of cost. The magnification adjusting member 44 is disposed in the optical path between the mask M and the first reflecting surface P1r of the first deflecting member, and in the optical path between the fourth reflecting surface P4r of the fourth deflecting member and the glass substrate P. In other words, since the magnification adjusting member 44 is disposed outside the imaging optical system, it is possible to adjust the distortion and the image plane with the magnification adjusting member 44 very easily.
[0103]
In the first and second imaging optical systems K1 and K2 of the above-described embodiment, typically, the first refractive optical system G1P as the main lens group and a reflecting member coaxial with the main lens group are used. The first concave reflecting mirror M1 is housed in one main lens barrel (not shown), the second refractive optical system G2P as the main lens group, and the second concave reflecting as a reflecting member coaxial with the main lens group. The mirror M2 is housed in a separate main lens barrel (not shown). In this case, it becomes difficult to adjust the eccentric distortion after the projection optical system is incorporated into the scanning exposure apparatus.
[0104]
Here, if the inclination (posture) of the first or second concave reflecting mirror with respect to the optical axis or the position in the direction crossing the optical axis is changed, the eccentric distortion can be adjusted. In the first and second imaging optical systems K1 and K2 as in the above-described embodiment, the optical path passing through the main lens group (first and second refractive optical systems G1P and G2P) is reflected from the main lens group to the reflecting member. Since it is almost symmetrical with respect to the optical axis when going to (first and second concave reflecting mirrors M1, M2) and when going from the reflecting member to the main lens group, lateral aberration can be canceled out. If the inclination of the reflecting member with respect to the optical axis or the position in the direction crossing the optical axis is changed, the reciprocating optical path that is symmetric with respect to the optical axis is made asymmetric (the optical path in the forward path and the optical path in the backward path are Eccentric distortion can be generated by changing the incident height. Note that when the concave reflecting mirrors M1 and M2 are tilted (tilted with respect to the optical axis), image rotation (around the Z axis) occurs. This image rotation functions as the first and / or first functioning as an image rotator. Alternatively, it can be corrected by adjusting the rotation of the second right-angle prisms 37 and 38. That is, if the concave reflecting mirrors M1 and M2 and the right-angle prisms 37 and 38 are interlocked, only the eccentric distortion can be adjusted. Specifically, the amount of inclination and / or eccentricity of the concave reflecting mirror is determined based on the distortion value measured by the measurement system, and the correction amount of the right-angle prism as an image rotator is determined based on the amount of image rotation that occurs as a side effect. And the concave reflecting mirror and the prism are automatically (or manually) adjusted based on these calculation results. In the above-described embodiment, the concave reflecting mirrors M1 and M2 are attached to the end of the main barrel (not shown), so that it is easy to adjust the positions and postures of the concave reflecting mirrors M1 and M2.
[0105]
For example, the distortion of the projection optical units PL1 to PL5 can be adjusted by changing the direction of the second concave reflecting mirror M2 of the second imaging optical system K2 of the projection optical units PL1 to PL5. In this case, the image formed on the plate P is rotated, but is generated by changing the direction of the second concave reflecting mirror M2 by rotating the second right-angle prism 38 functioning as an image rotator. Image rotation can be corrected. That is, since each projection optical unit PL1 to PL5 has the second concave reflecting mirror M2 functioning as a distortion adjusting member and the second right-angle prism 38 functioning as an image rotator, the distortion is adjusted in each projection optical unit PL1 to PL5. be able to.
[0106]
Also, the distortion of the projection optical units PL1 to PL5 can be adjusted by changing the direction of the first concave reflecting mirror M1 of the first imaging optical system K1. In this case, the image formed on the plate P is rotated, but is generated by changing the direction of the second concave reflecting mirror M2 by rotating the second right-angle prism 38 functioning as an image rotator. Image rotation can be corrected. The first right-angle prism 37 may be rotated to function as an image rotator, and the rotation of the image generated by changing the direction of the first concave reflecting mirror M1 may be corrected.
[0107]
In the above example, the concave reflecting mirror is used as the reflecting member, but a flat reflecting mirror may be used instead of the concave reflecting mirror. In the above example, a catadioptric imaging optical system having a main lens group and a concave reflecting mirror is used as the first and second imaging optical systems, but the first and second imaging optical systems are used. One of them may be a refractive optical system. In the above example, a so-called two-time imaging optical system including two imaging optical systems has been described as an example. However, a one-time imaging optical system (an intermediate image is provided with one imaging optical system). The present invention can also be applied to an optical system that is not formed) or a three-fold imaging type optical system that includes three imaging optical systems.
[0108]
Next, a manufacturing method of a micro device using the exposure apparatus according to the embodiment of the present invention in the lithography process will be described. In the exposure apparatus according to the embodiment of the present invention, a liquid crystal display element as a micro device can be obtained by forming a predetermined pattern (circuit pattern, electrode pattern, etc.) on a plate (glass substrate).
[0109]
FIG. 7 is a flowchart for explaining a method of manufacturing a liquid crystal display element as a micro device. In the pattern formation step S50 of FIG. 7, a so-called photolithography step is performed in which the mask pattern is transferred and exposed to a photosensitive substrate (such as a glass substrate coated with a resist) using the scanning projection exposure apparatus of the present embodiment. The In this optical lithography process, the mask is illuminated using an illumination device, and the mask pattern is projected and exposed on the plate while moving the mask and the plate with respect to the plurality of projection optical units. A predetermined pattern including the electrodes is formed.
[0110]
Thereafter, the exposed substrate undergoes steps such as a developing step, an etching step, and a resist stripping step, whereby a predetermined pattern is formed on the substrate, and the process proceeds to the next color filter forming step S52.
[0111]
Next, in the color filter forming step S52, a large number of sets of three dots corresponding to R (Red), G (Green), and B (Blue) are arranged in a matrix or three of R, G, and B A color filter is formed by arranging a plurality of stripe filter sets in the horizontal scanning line direction. And cell assembly process S54 is performed after color filter formation process S52. In the cell assembly step S54, a liquid crystal panel (liquid crystal cell) is assembled using the substrate having the predetermined pattern obtained in the pattern formation step S50 and the color filter obtained in the color filter formation step S52.
[0112]
In the cell assembly step S54, for example, liquid crystal is injected between the substrate having the predetermined pattern obtained in the pattern formation step S50 and the color filter obtained in the color filter formation step S52, and a liquid crystal panel (liquid crystal cell ). Thereafter, in a module assembling step S56, components such as an electric circuit and a backlight for performing a display operation of the assembled liquid crystal panel (liquid crystal cell) are attached to complete a liquid crystal display element. According to the above-described method for manufacturing a liquid crystal display element, a liquid crystal display element having an extremely fine circuit pattern can be obtained with high throughput.
[0113]
In the exposure apparatus according to the above-described embodiment, since a distortion adjustment member and an image plane adjustment member having a function as a magnification adjustment member are provided at a location accessible on the mask side or the plate side, the number of parts is increased. Therefore, the distortion and the image plane can be adjusted easily and inexpensively. In the distortion adjustment, the decentration component and the low-order rotational symmetry component can be corrected. In the image plane adjustment, the decentering component, field curvature, and astigmatism can be corrected. Therefore, even when the aberration of the projection optical unit fluctuates, the adjustment can be easily performed, and the performance as the exposure apparatus can be kept high.
[0114]
Next, examples of the projection optical units PL1 to PL5 of the present invention will be described. In the embodiment, i-line (λ = 365 nm), h-line (λ = 405 nm), and g-line (λ = 436 nm), which are reference wavelengths, are used as exposure wavelengths. Table 1 lists the values of the specifications of each projection optical unit PL of the example. In (Table 1), the surface number is the order of the surfaces from the mask side along the direction in which the light beam travels along the axis AXFC from the mask surface that is the object surface to the glass substrate surface that is the image surface. The radius of curvature, d, indicates the axial distance between the surfaces, that is, the surface distance.
[0115]
In Table 1, the on-axis interval d of each surface changes its sign every time it is reflected. Accordingly, the sign of the surface interval d is negative in the optical path from the first reflecting surface P1r to the first concave reflecting mirror M1, negative in the optical path from the second reflecting surface P2r to the third reflecting surface P3r, and the second It is negative in the optical path from the concave reflecting mirror M2 to the fourth reflecting surface P4r, and positive in the other optical paths. In the optical path in which the axial distance d between the surfaces is positive, the radius of curvature of the convex surface is positive and the radius of curvature of the concave surface is negative toward the light incident side. Conversely, in the optical path in which the axial distance d between the surfaces is negative, the radius of curvature of the concave surface is positive and the radius of curvature of the convex surface is negative toward the light incident side. Further, in (Table 1), n (i), n (h), and n (g) are refractive indexes with respect to i-line (λ = 365 nm), h-line (λ = 405 nm), and g-line (λ = 436 nm). Respectively. In the optical path where the axial distance d between the surfaces is negative, the sign of the refractive index is negative.
[0116]
[Table 1]
[0117]
Table 2 shows the amount of aberration change when the plano-concave lens on the magnification adjusting member of the projection optical unit is tilted 0.05 ° in the θx direction. An image diagram of the exposure field is shown in FIG. At this time, an image shift of about 5 μm occurs, but this image shift can be adjusted by an image shifter. Therefore, the distortion can be adjusted by tilting the lens constituting the magnification adjusting member.
[0118]
[Table 2]
[0119]
Table 3 shows the amount of aberration change when the plano-concave lens on the magnification adjusting member of the projection optical unit is tilted by 0.1 ° in the θy direction. Further, FIG. 9 shows an image diagram of the exposure field. At this time, an image shift of about 10 μm occurs. This image shift can be adjusted by an image shifter. Therefore, the distortion can be adjusted by tilting the lens constituting the magnification adjusting member.
[0120]
[Table 3]
[0121]
Next, FIG. 10 shows a change in distortion when the plano-concave lens on the magnification adjusting member of the projection optical unit is shifted by 0.5 mm in the X direction. Although the amount of distortion generated is small as shown in FIG. 10, an inclination in the X direction occurs on the image plane as shown in FIG. That is, image plane adjustment is possible by using this. Even in the case of a shift in the Y direction, it is possible to similarly adjust the inclination of the image plane in the Y direction.
[0122]
Next, FIG. 12 shows a change in distortion when the biconvex lens at the center of the magnification adjusting member is replaced with a lens having a different curvature radius. Since field curvature occurs due to lens replacement, the air spacing is changed to an optimal value in order to correct field curvature. By doing so, it is possible to adjust low-order distortion (rotationally symmetric) different from the distortion of the eccentric component.
[0123]
In addition, when the biconvex lens at the center of the magnification adjustment member is replaced with a lens having a different radius of curvature, if the air spacing is changed so as not to change the magnification and distortion, only the field curvature and astigmatism can be corrected. it can. Table 4 shows the lens data of the magnification adjustment member portion of the projection optical unit, and Table 5 shows the air gap so that the double convex lens in the center of the magnification adjustment member is replaced with a lens having a different radius of curvature and the magnification and distortion are not changed. The lens data of the part of the magnification adjustment member of the changed projection optical unit is shown. In this case, the change amount of the M image is about 3 μm.
[0124]
[Table 4]
[0125]
[Table 5]
[0126]
【The invention's effect】
According to the scanning projection exposure apparatus of the present invention, it is possible to easily adjust the distortion and the image plane even after the partial projection optical system is installed in the exposure apparatus main body.
[0127]
Further, according to the exposure method of the present invention, since the distortion adjustment and image plane adjustment of the partial projection optical system are performed satisfactorily, the pattern formed on the first substrate is excellent on the second substrate. Projection exposure.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an overall schematic configuration of a scanning exposure apparatus according to an embodiment of the present invention.
FIG. 2 is a side view of the illumination optical system configuration according to the embodiment of the present invention.
FIG. 3 is a diagram showing a configuration of each projection optical unit according to the embodiment of the present invention.
FIG. 4 is a diagram showing a system configuration of each projection optical unit according to the embodiment of the present invention.
FIG. 5 is a diagram for explaining image shift that occurs due to magnification adjustment of each projection optical unit according to the embodiment of the present invention;
FIG. 6 is a diagram for explaining image plane control performed in the magnification adjusting member according to the embodiment of the present invention.
FIG. 7 is a flowchart of a method of manufacturing a liquid crystal display element as a micro device according to an embodiment of the present invention.
FIG. 8 is an image view of an exposure field when the lens of the magnification adjusting member according to the embodiment of the present invention is tilted.
FIG. 9 is an image view of an exposure field when the magnification adjusting member according to the embodiment of the present invention is tilted.
FIG. 10 is an image view of an exposure field when the lens of the magnification adjusting member according to the embodiment of the present invention is shifted.
FIG. 11 is a diagram illustrating a state of an image plane when the lens of the magnification adjusting member according to the embodiment of the present invention is shifted.
FIG. 12 is an image view of an exposure field when the curvature of the center lens of the magnification adjusting member according to the embodiment of the present invention is changed.
[Explanation of symbols]
M ... Mask, MS ... Mask stage, P ... Glass substrate, 40 ... Wedge lens, 42 ... Parallel plane plate, 44 ... Magnification adjusting member, PL ... Projection optical system, PL1-PL5 ... Projection optical unit, K1 ... First connection Image optical system, K2 ... second imaging optical system, FS ... field stop, HK1 ... first catadioptric optical system, HK2 ... second catadioptric optical system, G1P ... first refractive optical system, G2P ... second refractive optical System, M1 ... first concave reflector, M2 ... second concave reflector.

Claims (17)

  1. An illumination optical system that illuminates the first substrate with a light beam emitted from a light source, a plurality of partial projection optical systems that respectively project a partial image of the pattern on the first substrate onto the second substrate, and the first substrate Scanning projection exposure comprising: a first stage for mounting a second stage; and a second stage for mounting the second substrate, wherein the first stage and the second stage are moved synchronously in a scanning direction. In the device
    Each of the plurality of partial projection optical systems includes an imaging optical system including a refractive optical system and a concave reflecting mirror;
    A first deflecting member for guiding light from the first substrate to the imaging optical system;
    A second deflecting member for guiding light through the imaging optical system to the second substrate;
    A distortion adjusting member disposed in at least one of an optical path between the first substrate and the first deflecting member and an optical path between the second deflecting member and the second substrate. A scanning projection exposure apparatus.
  2. Each of the plurality of partial projection optical systems is disposed in at least one of an optical path between the first substrate and the first deflection member and an optical path between the second deflection member and the second substrate. 2. The scanning projection exposure apparatus according to claim 1, further comprising an image plane adjusting member.
  3. An illumination optical system that illuminates the first substrate with a light beam emitted from a light source, a plurality of partial projection optical systems that respectively project a partial image of the pattern on the first substrate onto the second substrate, and the first substrate Scanning projection exposure comprising: a first stage for mounting a second stage; and a second stage for mounting the second substrate, wherein the first stage and the second stage are moved synchronously in a scanning direction. In the device
    Each of the plurality of partial projection optical systems includes an imaging optical system including a refractive optical system and a concave reflecting mirror;
    A first deflecting member for guiding light from the first substrate to the imaging optical system;
    A second deflecting member for guiding light through the imaging optical system to the second substrate;
    A decentering aberration adjusting member disposed in at least one of an optical path between the first substrate and the first deflecting member and an optical path between the second deflecting member and the second substrate. A scanning projection exposure apparatus.
  4. 4. The scanning projection exposure apparatus according to claim 3, wherein the decentering aberration adjusting member adjusts at least one of decentering distortion, decentering field aberration, decentering coma aberration, and decentering chromatic aberration.
  5. The imaging optical system includes a first catadioptric optical system including a first refractive optical system and a first concave reflecting mirror for condensing light from the pattern of the first substrate to form a primary image of the pattern. The system,
    A second catadioptric optical system including a second refractive optical system and a second concave reflecting mirror for condensing light from the primary image to form a secondary image of the pattern on the second substrate;
    A third deflecting member for guiding light through the first catadioptric optical system to the primary image;
    5. The scanning projection exposure according to claim 1, further comprising: a fourth deflecting member for guiding light from the primary image to the second catadioptric optical system. apparatus.
  6. The distortion adjusting member includes a lens having power, and the lens is configured to be capable of shifting or tilting with respect to the optical axis of the partial projection optical system in a plane orthogonal to the optical axis of the partial projection optical system. A scanning projection exposure apparatus according to any one of claims 1, 2, and 5.
  7. The distortion adjustment member includes a lens having power, and the lens is configured to be exchangeable with a lens having a different radius of curvature. The scanning projection exposure apparatus according to any one of the above.
  8. The image plane adjustment member includes a lens having power, and the lens is configured to be able to shift or tilt with respect to the optical axis of the partial projection optical system in a plane orthogonal to the optical axis of the partial projection optical system. 6. A scanning projection exposure apparatus according to claim 2, wherein
  9. The distortion adjustment member includes at least two lenses, and adjusts the magnification of the partial projection optical system by moving at least one of the lenses in the optical axis direction of the partial projection optical system. A scanning projection exposure apparatus according to any one of claims 1, 2, and 5 to 7.
  10. The image plane adjustment member includes at least two lenses, and adjusts the magnification of the partial projection optical system by moving at least one of the lenses in the optical axis direction of the partial projection optical system. A scanning projection exposure apparatus according to any one of claims 2, 5, and 8.
  11. Each of the plurality of partial projection optical systems includes a focus position adjustment mechanism that adjusts a focus position of the partial projection optical system, an image position adjustment mechanism that adjusts an image position of the partial projection optical system, and an image of the partial projection optical system. 11. The apparatus according to claim 1, further comprising at least one of an image rotation position adjustment mechanism that adjusts a rotation position of the image forming apparatus and a magnification adjustment mechanism that adjusts a magnification of the partial projection optical system. The scanning projection exposure apparatus described.
  12. An illumination optical system that illuminates the first substrate with a light beam emitted from a light source, a plurality of partial projection optical systems that respectively project a partial image of the pattern on the first substrate onto the second substrate, and the first substrate Scanning projection exposure comprising: a first stage for mounting a second stage; and a second stage for mounting the second substrate, wherein the first stage and the second stage are moved synchronously in a scanning direction. In the device
    Each of the plurality of partial projection optical systems includes a distortion adjustment member that adjusts distortion of the partial projection optical system, and an image rotation position adjustment mechanism that adjusts the rotation position of an image formed by the partial projection optical system. A scanning projection exposure apparatus characterized by the above.
  13. Each of the plurality of partial projection optical systems includes an imaging optical system including a refractive optical system and a concave reflecting mirror, a first deflecting member for guiding light from the first substrate to the imaging optical system, A second deflection member for guiding light through the imaging optical system to the second substrate,
    The distortion adjustment member includes the concave reflecting mirror provided in the imaging optical system, and the image rotation position adjustment mechanism includes the first deflecting member and the second deflection member provided in the partial projection optical system. The scanning projection exposure apparatus according to claim 12, comprising a member.
  14. An illumination optical system that illuminates the first substrate with a light beam emitted from a light source, a projection optical system that projects a partial image of the pattern on the first substrate onto the second substrate, and the first substrate are mounted. In a scanning projection exposure apparatus comprising a first stage and a second stage on which the second substrate is placed, and performing scanning exposure by synchronously moving the first stage and the second stage in a scanning direction,
    The projection optical system includes: a first imaging optical system that forms an intermediate image of the first substrate; a second imaging optical system that forms an image of the intermediate image; the first substrate and the second substrate; A first deflecting member disposed in the optical path between the first substrate and the second deflecting member disposed in the optical path between the first substrate and the second substrate, and deflecting the light.
    At least one of the first and second imaging optical systems is arranged along a predetermined optical axis and reflects light through the main lens group arranged along the optical axis. A reflection member that returns to the main lens group again,
    The reflection member is configured to adjust at least one of an inclination with respect to the optical axis and a position in a direction crossing the optical axis in order to adjust distortion of the projection optical system. Type projection exposure apparatus.
  15. The at least one of the first deflection member and the second deflection member is configured to be rotatable in order to correct image rotation caused by adjustment of the reflecting member. Scanning projection exposure apparatus.
  16. The first deflection member is disposed in an optical path between the first substrate and the first imaging optical system, and the second deflection member is disposed between the second imaging optical system and the second substrate. 16. The scanning projection exposure apparatus according to claim 14, wherein the scanning projection exposure apparatus is arranged.
  17. The scanning exposure is performed by synchronously moving the first substrate and the second substrate with respect to the partial projection optical system provided in the scanning projection exposure apparatus according to any one of claims 1 to 16. An exposure method comprising a step.
JP2003186655A 2003-06-30 2003-06-30 Scanning projection aligner and exposure method Pending JP2005024584A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013250556A (en) * 2012-05-30 2013-12-12 Ultratech Inc Equal-magnification large-sized cata-dioptric lens for microlithography
JP2013546186A (en) * 2010-12-08 2013-12-26 エーエスエムエル ネザーランズ ビー.ブイ. Lithographic apparatus and device manufacturing method
JP2014032278A (en) * 2012-08-02 2014-02-20 Canon Inc Projection exposure apparatus
JP2017534918A (en) * 2014-10-29 2017-11-24 シャンハイ マイクロ エレクトロニクス イクイプメント(グループ)カンパニー リミティド Exposure apparatus adjustment apparatus and adjustment method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013546186A (en) * 2010-12-08 2013-12-26 エーエスエムエル ネザーランズ ビー.ブイ. Lithographic apparatus and device manufacturing method
JP2013250556A (en) * 2012-05-30 2013-12-12 Ultratech Inc Equal-magnification large-sized cata-dioptric lens for microlithography
JP2014032278A (en) * 2012-08-02 2014-02-20 Canon Inc Projection exposure apparatus
JP2017534918A (en) * 2014-10-29 2017-11-24 シャンハイ マイクロ エレクトロニクス イクイプメント(グループ)カンパニー リミティド Exposure apparatus adjustment apparatus and adjustment method
US10197919B2 (en) 2014-10-29 2019-02-05 Shanghai Micro Electronics Equipment (Group) Co., Ltd. Adjusting device and adjusting method for exposure device

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