JP2009104110A - Exposure device and control method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an exposure device and its control method for saving the production cost and improve the accuracy of exposure, by shortening the scanning time and scanning distance, and to obtain quick exposure to a substrate having an exposure region of various sizes. <P>SOLUTION: This exposure device includes a plurality of optical module assemblies which emit pattern light to the exposure regions, at mutually different positions where the mutual inter-spacing distance is adjusted. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an exposure apparatus and a control method thereof, and more specifically, reduces the scanning time and the scanning distance, thereby reducing the production cost and improving the accuracy of the exposure, thereby reducing the exposure area of various sizes. The present invention relates to an exposure apparatus that can rapidly expose a substrate having the same and a control method thereof.

  Conventionally, as a method of drawing a pattern by irradiating light to a photosensitive material formed on a semiconductor substrate, a glass substrate of a liquid crystal display device and a plasma display device (hereinafter referred to as “substrate”), a proximity exposure method and A method of transferring a mask pattern to a photosensitive material such as a step exposure method is known.

  In the proximity exposure method, a mask having the same size as the substrate on which an opening corresponding to the pattern to be drawn is formed is brought close to the substrate and irradiated with light, and the mask pattern is collectively transferred to the photosensitive material on the substrate. In the step exposure method, the pattern is drawn on the entire substrate by alternately repeating the projection of the mask pattern and the movement of the mask pattern.

  In the recent market of substrate manufacturing apparatuses such as panels of flat panel display devices and color filters, it is strongly required to cope with higher definition of patterns formed on the substrate and enlargement of the substrate. In the proximity exposure system that transfers the mask pattern to the photosensitive material at one time, the mask and the substrate are close to each other and the light is irradiated. Therefore, the size and size of the mask pattern are increased and the substrate size is increased. There is a disadvantage that expensive mask fabrication is required. The proximity exposure method and the step exposure method have a disadvantage that they cannot flexibly cope with changes in the pitch and width of a pattern to be drawn.

  Recently, as a method for overcoming the shortcomings of the proximity exposure method and the step exposure method described above, in Patent Document 1, a digital micromirror device disposed on the upper side of a substrate causes a laser beam emitted from a laser light source toward the substrate. A reflective drawing method is proposed.

On the other hand, the exposure apparatus presented in Patent Document 1 includes one optical module assembly. Such an exposure apparatus uses a single optical module assembly after the substrate is completely scanned by the overlay measurement unit so that the overlay measurement unit installed in the optical module assembly assembly measures the overlay of the substrate. To expose the substrate.
Korean Patent Publication No. 2005-0012163

  However, since the exposure apparatus presented in Patent Document 1 described above includes one optical module assembly and one overlay measurement unit, the scan time for measuring the overlay of the substrate becomes long, and scanning is performed. As the substrate moving distance increases, the cost for increasing the size of the installation table increases, resulting in an increase in production cost.

  In addition, since the error parameter increases with a long scanning distance, there is a disadvantage that the accuracy of exposure decreases.

  In addition, when exposure is performed on a substrate having exposure areas of various sizes (hereinafter, the exposure area means an area to be exposed on the substrate), it takes a long time. is there.

  Accordingly, an object of the present invention is to reduce the scanning time and the scanning distance, thereby reducing the production cost and improving the accuracy of the exposure, and the exposure that can perform the exposure quickly on the substrate having the exposure areas of various sizes. An apparatus and a control method thereof are provided.

  In order to solve the above-described problems of the present invention, an exposure apparatus according to the present invention irradiates pattern light to exposure regions at different positions, and a plurality of optical module assembly assemblies in which the separation distance is adjusted. including.

  Here, each of the plurality of optical module assembly assemblies is provided with an overlay measurement unit for overlay alignment of the substrates.

  The plurality of optical module assembly assemblies emit different pattern lights. And a separation distance adjusting unit configured to adjust separation distances of the plurality of gate structures on which the plurality of optical module assembly assemblies are installed such that the separation distances of the plurality of optical module assembly assemblies are adjusted.

  In another aspect, in order to solve the above-described problems of the present invention, an exposure apparatus according to the present invention includes a plurality of optical module assembly assemblies that irradiate pattern light to exposure regions at different positions; An exposure method including a separation distance adjusting unit that adjusts a separation distance of the optical module assembly assembly; separation distance data of the plurality of optical module assembly assemblies, and pattern light data irradiated by the plurality of optical module assembly assemblies is stored. Using the mask stack library; the separation distance data of the plurality of optical module assembly assemblies of the exposure method stored in the mask stack library; and the pattern light data irradiated by the plurality of optical module assembly assemblies. Optical module assembly assembly and separation Including; controls the adjusting unit and a control unit.

  Here, in the mask stack library, an optical module assembly assembly positioned in front of the plurality of optical module assembly assemblies with respect to a substrate transfer direction is positioned at a start point of a front exposure region in front of the substrate, Hybrid separation distance data defined as a distance between the plurality of optical module assembly assemblies when an optical module assembly assembly located rearward among the plurality of optical module assembly assemblies is located at a starting point of a rear exposure area behind the substrate. Is stored.

  On the other hand, in order to solve the above-described problems of the present invention, the control method of the exposure apparatus according to the present invention is a step of determining whether or not the exposure method has been changed; Adjusting the separation distance of the plurality of optical module assembly assemblies according to the exposure method.

  Here, when the exposure method is changed, the plurality of optical module assembly assemblies may irradiate pattern light according to the changed exposure method.

  Then, when the exposure method is changed, a substrate scanning step of measuring an overlay of the substrate by adjusting a separation distance of the plurality of optical module assembly assemblies.

  Here, in adjusting the separation distance of the plurality of optical module assembly assemblies, the separation distance of the plurality of optical module assembly assemblies is set to a separation distance obtained by dividing the long side of the substrate by the number of the plurality of optical module assembly assemblies. Adjust.

  In the exposure apparatus and the control method thereof according to the present invention, the scan time and the scan distance are shortened, thereby reducing the production cost and improving the accuracy of the exposure, so that the substrate having various sizes of exposure areas can be quickly obtained. There is an effect that exposure can be performed.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  1 to 4, an exposure apparatus 1 according to the present invention installed in a vacuum chamber has an installation table 10 supported by a support table 20 extended below the four corners, and a substrate W placed on the upper surface. The stage 40 is movably installed in the long side direction of the installation table 10, the stage drive unit 70 is installed on the upper surface of the installation table 10 and moves the stage 40, and is installed on the upper surface of the installation table 10. A plurality of gate structures 50a and 50b having a "U" shape and having both ends thereof movably mounted on guide rails 230 of the separation distance adjusting unit 200. In order to irradiate the pattern light onto the substrate W placed on the stage 40, a plurality of optical module assembly assemblies 100a respectively installed on one side of the plurality of gate structures 50a, 50b. , 100b and a plurality of optical module assembly assemblies 100a, 100b, respectively, and provide light to the plurality of overlay measurement units 60a, 60b for measuring the overlay of the substrate W and the plurality of optical module assembly assemblies 100a, 100b. The exposure light source 300, the separation distance adjusting unit 200 for adjusting the separation distance of the plurality of gate structures 50a and 50b so that the separation distance of the plurality of optical module assembly assemblies 100a and 100b is adjusted, and the exposure apparatus 1 in general. And a control unit 400 for controlling the operation.

  The plurality of overlay measurement units 60a and 60b measure the overlay formed on the substrate W and provide it to the control unit 400, and serve to irradiate the pattern light on an accurate position on the substrate W. That is, the overlay measurement units 60a and 60b measure the overlay formed on the upper surface of the substrate W that is placed on the stage 40 and moves while passing through the gate structures 50a and 50b. As a result, the control unit 400 can align the substrates W using the measured overlay.

  On the other hand, the plurality of overlay measurement units 60a and 60b are installed in the optical module assembly 100a and 100b, respectively, so that the moving distance of the stage 40 for scanning for measuring the overlay is shortened. Can be reduced.

  The light source 300 includes a semiconductor laser and an optical system that adjusts light emitted from the semiconductor laser, and uses an optical fiber 310 to provide laser light to the incident side of the optical module 105 of the optical module assembly 100a, 100b.

  The plurality of optical module assembly assemblies 100a and 100b are arranged in a matrix form, and include a plurality of optical modules 105 in which a pattern light emitting portion and a substrate W placed on the stage 40 face each other.

  The plurality of optical modules 105 correct the light emitted from the light emitting end 311 of the optical fiber 310 and emit the light to the mirror 120, and the light emitted from the correction lens system 110 to the optical modulator 130. The reflecting mirror 120, the light modulator 130 that reflects light reflected from the mirror 120 partially at different reflection angles and reflects pattern light having a certain pattern, and the pattern light reflected from the light modulator 130 And a condenser lens system 140 that forms an image on the exposure surface 160 of the substrate W.

  The correction lens system 110 includes a first correction lens 111 for making the light emitted from the light emitting end 311 uniform, a second correction lens 112 for condensing the light that has passed through the first correction lens 111 on the mirror 120, and Consists of. As a result, the light emitted from the light emitting end 311 enters the mirror 120 with a uniform light amount distribution.

  One surface of the mirror 120 is formed as a reflecting surface, and reflects light that has passed through the correction lens system 110 to the light modulator 130.

  The light modulator 130 includes a plurality of light modulation elements 131 arranged in a generally known matrix form.

  On the other hand, the light modulation element 131 includes a support part supported on the memory cell and a micro mirror installed on the upper end of the support part. The tilt angle of the micro mirror is changed by driving the memory cell, and the light modulation element 131 The reflection direction of the light incident on is adjusted. Thus, the light modulator 130 reflects the pattern light having a certain pattern to the condenser lens system 140 by changing the tilt angle of the micro mirror of the light modulation element 131.

  The condenser lens system 140 includes a first condenser lens 141 and a second condenser lens 142, and the distance between the first condenser lens 141 and the second condenser lens 142 is adjusted, thereby condensing the condenser lens system 140. The imaging position of the pattern light that has passed through the lens system 140 is adjusted. Such a condensing lens system 140 serves to cause the pattern light reflected from the light modulator 130 to enter the exposure surface 160 of the substrate W. As a result, the photosensitive material formed on the exposure surface 160 in the exposure area EW is cured or softened.

  On the other hand, the plurality of optical module assembly assemblies 100a and 100b described above are respectively controlled by the control unit 400, and the exposure area EW of the substrate W placed on the stage 40 is irradiated with different pattern lights, thereby exposing the exposure apparatus 1. Can perform divided exposure.

  The separation distance adjusting unit 200 includes a guide rail 230 that movably supports the legs 51a and 51b of the gate structures 50a and 50b, and a screw rod 220 that is rotatably coupled to the legs 51a and 51b of the gate structures 50a and 50b. And an isolation distance adjustment driving unit 210 that rotates the screw rod 220.

  The screw rod 220 is formed with a right-hand screw or a left-hand screw on one side and a screw having a direction different from that of the screw formed on the one side on the other side with respect to the substantially central portion. Screw holes 52a and 52b corresponding to both sides of the screw rod 220 are formed in the legs 51a and 51b of the gate structures 50a and 50b. When the screw rod 220 rotates in one direction, both sides of the screw rod 220 are tightened in the screw holes 52a and 52b, and when the screw rod 220 rotates in the other direction, both sides of the screw rod 220 are detached from the screw holes 52a and 52b. As a result, the separation distance between the gate structures 50a and 50b can be adjusted using the rotation direction and the rotation amount of the screw rod 220.

  Meanwhile, the above-described separation distance adjusting unit 200 is not limited to the configuration or means described above, and any means that can adjust the separation distance between the gate structures 50a and 50b can be used.

  On the input side of the control unit 400, an input unit 410 for inputting an exposure method selected by an operator, a mask stack library 420 for storing data by the exposure method, and an overlay of the substrate W are measured, and the measured overlay is measured. Are provided for the overlay measurement units 60a and 60b. A plurality of optical module assembly assemblies 100a and 100b, a stage driving unit 70, a separation distance adjusting unit 200, and a light source 300 are provided on the output side of the control unit 400.

  By using the input unit 410, the operator can input a command to the control unit 400.

  The mask stack library 420 stores the separation distance data of the plurality of optical module assembly assemblies 100a and 100b by the exposure method and the pattern light data to be irradiated by the plurality of optical module assembly assemblies 100a and 100b by the exposure method. Provided at the request of the control unit 400.

  On the other hand, the control unit 400 aligns the substrates W using the measured overlay of the substrates W input from the overlay measurement units 60a and 60b.

  Then, the control unit 400 provides the separation distance data of the plurality of optical module assembly assemblies 100a and 100b by the exposure method provided by the mask stack library 420, and the pattern light to be irradiated by the plurality of optical module assembly assemblies 100a and 100b by the exposure method. The plurality of optical module assembly assemblies 100a and 100b and the separation distance adjusting unit 200 are controlled using the data.

  Hereinafter, a method for controlling an exposure apparatus according to the present invention will be described with reference to the drawings.

  First, the control unit 400 determines whether or not the exposure method has been changed (510). That is, the operator selects a new exposure method through the input unit 410 and determines whether a new exposure method command is input from the input unit 410.

  Here, as an exposure method, a hybrid exposure method, a divided exposure method, and an overlap exposure method are proposed. In the hybrid exposure method, the width of the exposure area is considered so that the exposure apparatus 1 performs exposure on a substrate having a plurality of exposure areas having different widths, and the separation distances of the plurality of optical module assembly assemblies 100a and 100b are adjusted. In this method, exposure is performed. In the overlap exposure method, when a part of the plurality of optical module assembly assemblies 100a and 100b of the exposure apparatus 1 cannot sufficiently expose the exposure area on the substrate W, the exposure area on the substrate W is sufficiently exposed. As described above, the exposure is performed by increasing the number of optical module assembly assemblies that irradiate the exposure pattern with the same pattern light. In the divided exposure method, a part of the plurality of optical module assembly assemblies 100a and 100b of the exposure apparatus 1 irradiates the selected pattern light onto the exposure region, and the other part of the pattern light is different from the selected pattern light. Is an exposure method for irradiating the exposure area EW.

  At this time, if the exposure method has not been changed, the exposure apparatus 1 performs exposure using the existing exposure method (520).

  Next, the control unit 400 determines whether the exposure performance end condition is satisfied (540). If the exposure performance end condition is not satisfied, the controller 400 continuously determines whether the exposure performance end condition is satisfied. It ends when it is.

If the exposure method has been changed in step 510 above,
The exposure apparatus 1 performs exposure using the changed exposure method (530).

  That is, the control unit 400 determines whether or not the exposure apparatus 1 is performing exposure. When the exposure apparatus 1 is not performing exposure, the control unit 400 immediately proceeds to a subsequent stage, and when the exposure apparatus 1 is performing exposure, The exposure is stopped and the process proceeds to the subsequent stage (531).

  Next, the controller 400 requests the mask stack library 420 for the separation distance data and the pattern light data corresponding to the changed exposure method (531). Accordingly, the mask stack library 420 provides the changed exposure method separation distance data and pattern light data requested by the control unit 400 to the control unit 400, and the control unit 400 provides the changed exposure method separation distance data. Then, the pattern light data is received (532).

  Next, the control unit 400 moves the stage 40 for substrate alignment, and performs a scan for measuring the overlay of the substrate W through the overlay measurement units 60a and 60b (533). At this time, the control unit 400 supplies a control signal to the separation distance adjustment unit 200, sets the separation distance D of the plurality of optical module assembly assemblies 100a and 100b, and sets the long side of the substrate W to the plurality of optical module assembly assemblies 100a and 100b. The separation distance divided by the number of. As a result, the moving distance of the stage 40 is shortened. Then, the control unit 400 aligns the substrates W using the measured overlay (534).

  Next, the controller 400 controls the separation distance adjustment unit 200 to adjust the separation distance D of the plurality of optical module assembly assemblies 100a and 100b according to the changed separation data and pattern light data of the exposure method ( 535), control is performed so that the plurality of optical module assembly assemblies 100a and 100b emit pattern light based on the changed pattern light data of the exposure method (536).

  That is, if the changed exposure method is a hybrid exposure method, as shown in FIG. 6A, the control unit 400 supplies a control signal to the separation distance adjustment unit 200 to separate the plurality of optical module assembly assemblies 100a and 100b. The distance D is adjusted to the hybrid separation distance D1 by the hybrid exposure method (535).

  Here, the hybrid separation distance D1 is set such that the optical module assembly 100a positioned in front of the transport direction of the substrate W is positioned at the start point of the front exposure area EW10 in front of the substrate W, and is positioned behind. When the assembly 100b is located at the starting point of the rear exposure area EW20 behind the substrate W, the distance is defined as a distance between the plurality of optical module assembly assemblies 100a and 100b.

  Next, the control unit 400 moves the stage 40 and controls the plurality of optical module assembly assemblies 100a and 100b to emit the same pattern light while the stage 40 transfers the substrate W (536).

  If the changed exposure method is the divided exposure method, as shown in FIG. 6B, the controller 400 adjusts the separation distance D of the plurality of optical module assembly assemblies 100a and 100b to the shortest distance D2 (535). The plurality of optical module assembly assemblies 100a and 100b are controlled to emit different pattern lights (536).

  If the changed exposure method is the overlap exposure method, as shown in FIG. 6C, the controller 400 adjusts the separation distance D of the plurality of optical module assembly assemblies 100a and 100b to the shortest distance D3 (535). The plurality of optical module assembly assemblies 100a and 100b are controlled to emit the same pattern light (536).

It is the schematic which showed the exposure apparatus which concerns on this invention. 1 is a schematic view illustrating an optical module assembly according to the present invention. It is the schematic for demonstrating the structure and effect | action of the optical module which concerns on this invention. It is the block diagram which showed the control system of the exposure apparatus which concerns on this invention. 5 is a flowchart showing a control procedure of the exposure apparatus according to the present invention. It is a figure for demonstrating the effect | action of the exposure apparatus which concerns on this invention. It is a figure for demonstrating the effect | action of the exposure apparatus which concerns on this invention. It is a figure for demonstrating the effect | action of the exposure apparatus which concerns on this invention.

Explanation of symbols

50a, 50b Gate structure 200 Separation distance adjuster 100a, 100b Optical module assembly

Claims (10)

  An exposure apparatus comprising a plurality of optical module assembly assemblies that irradiate pattern light onto exposure areas at different positions and adjust a separation distance therebetween.   The exposure apparatus according to claim 1, wherein an overlay measurement unit for overlay alignment of the substrates is installed in each of the plurality of optical module assembly assemblies.   The exposure apparatus according to claim 1, wherein the plurality of optical module assembly assemblies irradiate different pattern lights.   And a separation distance adjusting unit configured to adjust separation distances of the plurality of gate structures on which the plurality of optical module assembly assemblies are installed so that the separation distances of the plurality of optical module assembly assemblies are adjusted. The exposure apparatus according to claim 1. A plurality of optical module assembly assemblies that irradiate pattern light onto exposure areas at different positions;
A separation distance adjusting unit for adjusting a separation distance of the plurality of optical module assembly assemblies;
A mask stack library in which an exposure method including separation distance data of the plurality of optical module assembly assemblies and pattern light data emitted by the plurality of optical module assembly assemblies is stored;
Using the separation distance data of the plurality of optical module assembly assemblies of the exposure method stored in the mask stack library and the pattern light data irradiated by the plurality of optical module assembly assemblies, the plurality of optical module assembly assemblies and An exposure apparatus comprising: a control unit that controls the separation distance adjusting unit;   In the mask stack library, an optical module assembly assembly positioned in front of the plurality of optical module assembly assemblies with respect to a substrate transfer direction is positioned at a start point of a front exposure area in front of the substrate, and the plurality of optical modules is assembled. A hybrid including hybrid separation distance data defined as a distance between the plurality of optical module assembly assemblies when an optical module assembly assembly located rearward among the module assembly assemblies is positioned at a starting point of a rear exposure area behind the substrate. 6. The exposure apparatus according to claim 5, wherein the exposure method is stored. Determining whether the exposure method has changed;
And adjusting the separation distance of the plurality of optical module assembly assemblies according to the changed exposure method when the exposure method is changed.   8. The method of controlling an exposure apparatus according to claim 7, further comprising the step of irradiating the plurality of optical module assembly assemblies with pattern light according to the changed exposure method when the exposure method is changed.   8. The method of controlling an exposure apparatus according to claim 7, further comprising a substrate scanning step of measuring an overlay of the substrate by adjusting a separation distance of the plurality of optical module assembly assemblies when an exposure method is changed. .   In adjusting the separation distance of the plurality of optical module assembly assemblies, the separation distance of the plurality of optical module assembly assemblies is adjusted to a separation distance obtained by dividing the long side of the substrate by the number of the plurality of optical module assembly assemblies. An exposure apparatus control method according to claim 9.

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