KR100934729B1 - 무전해 주석도금액 불순물 제거장치 및 방법 - Google Patents

무전해 주석도금액 불순물 제거장치 및 방법 Download PDF

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Publication number
KR100934729B1
KR100934729B1 KR1020070108846A KR20070108846A KR100934729B1 KR 100934729 B1 KR100934729 B1 KR 100934729B1 KR 1020070108846 A KR1020070108846 A KR 1020070108846A KR 20070108846 A KR20070108846 A KR 20070108846A KR 100934729 B1 KR100934729 B1 KR 100934729B1
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KR
South Korea
Prior art keywords
tin plating
electroless tin
plating solution
electroless
electrode plate
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Application number
KR1020070108846A
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English (en)
Korean (ko)
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KR20090043146A (ko
Inventor
이강
홍석표
장종관
박광자
최민정
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(주)화백엔지니어링
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Priority to KR1020070108846A priority Critical patent/KR100934729B1/ko
Priority to JP2008109128A priority patent/JP2009108399A/ja
Priority to CNA2008100984151A priority patent/CN101423939A/zh
Publication of KR20090043146A publication Critical patent/KR20090043146A/ko
Application granted granted Critical
Publication of KR100934729B1 publication Critical patent/KR100934729B1/ko

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1689After-treatment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1619Apparatus for electroless plating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1619Apparatus for electroless plating
    • C23C18/1628Specific elements or parts of the apparatus
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1675Process conditions
    • C23C18/1683Control of electrolyte composition, e.g. measurement, adjustment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Water Treatment By Electricity Or Magnetism (AREA)
KR1020070108846A 2007-10-29 2007-10-29 무전해 주석도금액 불순물 제거장치 및 방법 KR100934729B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020070108846A KR100934729B1 (ko) 2007-10-29 2007-10-29 무전해 주석도금액 불순물 제거장치 및 방법
JP2008109128A JP2009108399A (ja) 2007-10-29 2008-04-18 無電解錫めっき液の不純物除去装置及び方法
CNA2008100984151A CN101423939A (zh) 2007-10-29 2008-05-26 用于化学镀锡溶液的杂质清除装置及清除方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070108846A KR100934729B1 (ko) 2007-10-29 2007-10-29 무전해 주석도금액 불순물 제거장치 및 방법

Publications (2)

Publication Number Publication Date
KR20090043146A KR20090043146A (ko) 2009-05-06
KR100934729B1 true KR100934729B1 (ko) 2009-12-30

Family

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KR1020070108846A KR100934729B1 (ko) 2007-10-29 2007-10-29 무전해 주석도금액 불순물 제거장치 및 방법

Country Status (3)

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JP (1) JP2009108399A (zh)
KR (1) KR100934729B1 (zh)
CN (1) CN101423939A (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101114887B1 (ko) * 2011-10-11 2012-03-06 주식회사 삼원알텍 금속의 아노다이징 처리과정에서 발생되는 금속성 불순물 제거용 여과장치
US20190345624A1 (en) * 2018-05-09 2019-11-14 Applied Materials, Inc. Systems and methods for removing contaminants in electroplating systems
WO2021021786A1 (en) * 2019-08-01 2021-02-04 Aqua Metals Inc. Metal recovery from lead containing electrolytes

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10317154A (ja) * 1997-05-07 1998-12-02 Km Europ Metal Ag 錫メッキ用溶液の再生方法およびその装置
KR20050024184A (ko) * 2003-09-02 2005-03-10 가부시키가이샤 아루멕쿠스 도금처리장치와 도금처리방법
KR20060035347A (ko) * 2004-10-22 2006-04-26 박수복 에이비에스 성형품 도금시스템 및 그 도금시스템의 도금액조절방법

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05320926A (ja) * 1992-05-19 1993-12-07 Mitsubishi Electric Corp 無電解めっき液の再生方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10317154A (ja) * 1997-05-07 1998-12-02 Km Europ Metal Ag 錫メッキ用溶液の再生方法およびその装置
KR20050024184A (ko) * 2003-09-02 2005-03-10 가부시키가이샤 아루멕쿠스 도금처리장치와 도금처리방법
KR20060035347A (ko) * 2004-10-22 2006-04-26 박수복 에이비에스 성형품 도금시스템 및 그 도금시스템의 도금액조절방법

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Publication number Publication date
KR20090043146A (ko) 2009-05-06
JP2009108399A (ja) 2009-05-21
CN101423939A (zh) 2009-05-06

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