KR100934729B1 - 무전해 주석도금액 불순물 제거장치 및 방법 - Google Patents
무전해 주석도금액 불순물 제거장치 및 방법 Download PDFInfo
- Publication number
- KR100934729B1 KR100934729B1 KR1020070108846A KR20070108846A KR100934729B1 KR 100934729 B1 KR100934729 B1 KR 100934729B1 KR 1020070108846 A KR1020070108846 A KR 1020070108846A KR 20070108846 A KR20070108846 A KR 20070108846A KR 100934729 B1 KR100934729 B1 KR 100934729B1
- Authority
- KR
- South Korea
- Prior art keywords
- tin plating
- electroless tin
- plating solution
- electroless
- electrode plate
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1689—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1628—Specific elements or parts of the apparatus
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Chemically Coating (AREA)
- Water Treatment By Electricity Or Magnetism (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070108846A KR100934729B1 (ko) | 2007-10-29 | 2007-10-29 | 무전해 주석도금액 불순물 제거장치 및 방법 |
JP2008109128A JP2009108399A (ja) | 2007-10-29 | 2008-04-18 | 無電解錫めっき液の不純物除去装置及び方法 |
CNA2008100984151A CN101423939A (zh) | 2007-10-29 | 2008-05-26 | 用于化学镀锡溶液的杂质清除装置及清除方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070108846A KR100934729B1 (ko) | 2007-10-29 | 2007-10-29 | 무전해 주석도금액 불순물 제거장치 및 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20090043146A KR20090043146A (ko) | 2009-05-06 |
KR100934729B1 true KR100934729B1 (ko) | 2009-12-30 |
Family
ID=40614811
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070108846A KR100934729B1 (ko) | 2007-10-29 | 2007-10-29 | 무전해 주석도금액 불순물 제거장치 및 방법 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2009108399A (zh) |
KR (1) | KR100934729B1 (zh) |
CN (1) | CN101423939A (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101114887B1 (ko) * | 2011-10-11 | 2012-03-06 | 주식회사 삼원알텍 | 금속의 아노다이징 처리과정에서 발생되는 금속성 불순물 제거용 여과장치 |
US20190345624A1 (en) * | 2018-05-09 | 2019-11-14 | Applied Materials, Inc. | Systems and methods for removing contaminants in electroplating systems |
WO2021021786A1 (en) * | 2019-08-01 | 2021-02-04 | Aqua Metals Inc. | Metal recovery from lead containing electrolytes |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10317154A (ja) * | 1997-05-07 | 1998-12-02 | Km Europ Metal Ag | 錫メッキ用溶液の再生方法およびその装置 |
KR20050024184A (ko) * | 2003-09-02 | 2005-03-10 | 가부시키가이샤 아루멕쿠스 | 도금처리장치와 도금처리방법 |
KR20060035347A (ko) * | 2004-10-22 | 2006-04-26 | 박수복 | 에이비에스 성형품 도금시스템 및 그 도금시스템의 도금액조절방법 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05320926A (ja) * | 1992-05-19 | 1993-12-07 | Mitsubishi Electric Corp | 無電解めっき液の再生方法 |
-
2007
- 2007-10-29 KR KR1020070108846A patent/KR100934729B1/ko active IP Right Grant
-
2008
- 2008-04-18 JP JP2008109128A patent/JP2009108399A/ja active Pending
- 2008-05-26 CN CNA2008100984151A patent/CN101423939A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10317154A (ja) * | 1997-05-07 | 1998-12-02 | Km Europ Metal Ag | 錫メッキ用溶液の再生方法およびその装置 |
KR20050024184A (ko) * | 2003-09-02 | 2005-03-10 | 가부시키가이샤 아루멕쿠스 | 도금처리장치와 도금처리방법 |
KR20060035347A (ko) * | 2004-10-22 | 2006-04-26 | 박수복 | 에이비에스 성형품 도금시스템 및 그 도금시스템의 도금액조절방법 |
Also Published As
Publication number | Publication date |
---|---|
KR20090043146A (ko) | 2009-05-06 |
JP2009108399A (ja) | 2009-05-21 |
CN101423939A (zh) | 2009-05-06 |
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