KR100928386B1 - 불포화기 함유 다분지 화합물, 그것을 함유하는 경화성조성물 및 그 경화물 - Google Patents
불포화기 함유 다분지 화합물, 그것을 함유하는 경화성조성물 및 그 경화물 Download PDFInfo
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Abstract
Description
Claims (15)
- (1) (a) 분자 중에 2 개 이상의 에폭시기를 갖는 화합물과, (b) 분자 중에 2 개 이상 (단, 상기 (a) 성분이 2 개의 에폭시기를 갖는 화합물인 경우, 3 개 이상)의 카르복실기를 갖는 화합물과, (c') 1 개 이상의 불포화 이중 결합기를 갖는 화합물과의 반응에 의해 얻어진 화합물,(2) (a) 분자 중에 2 개 이상의 에폭시기를 갖는 화합물과, (b') 분자 중에 2 개 이상 (단, 상기 (a) 성분이 2 개의 에폭시기를 갖는 화합물인 경우, 3 개 이상)의 수산기를 갖는 페놀 화합물과, (c') 1 개 이상의 불포화 이중 결합기를 갖는 화합물과의 반응에 의해 얻어진 화합물, 또는(3) (a) 분자 중에 2 개 이상의 에폭시기를 갖는 화합물과, (b") 분자 중에 각각 1 개 이상 (단, 상기 (a) 성분이 2 개의 에폭시기를 갖는 화합물인 경우, 합계 관능기 수가 3 개 이상)의 카르복실기 및 페놀성 수산기를 갖는 화합물과, (c') 1 개 이상의 불포화 이중 결합기를 갖는 화합물과의 반응에 의해 얻어진 화합물 중 어느 하나이고, 말단부에 감광성의 불포화 이중 결합을 2 개 이상 갖는 다분지 구조를 갖는 것을 특징으로 하는 불포화기 함유 다분지 화합물.
- 제1항에 있어서, 상기 1 개 이상의 불포화 이중 결합기를 갖는 화합물 (c')가 (c) 불포화 모노카르복실산인 불포화기 함유 다분지 화합물.
- 삭제
- 삭제
- 삭제
- (1) (a) 분자 중에 2 개 이상의 에폭시기를 갖는 화합물과, (b) 분자 중에 2 개 이상 (단, 상기 (a) 성분이 2 개의 에폭시기를 갖는 화합물인 경우, 3 개 이상)의 카르복실기를 갖는 화합물과, (c') 1 개 이상의 불포화 이중 결합기를 갖는 화합물과의 반응에 의해 얻어지는 불포화기 함유 다분지 화합물의 수산기에, 추가로 (d) 다염기산 무수물을 반응시켜 얻어진 화합물,(2) (a) 분자 중에 2 개 이상의 에폭시기를 갖는 화합물과, (b') 분자 중에 2 개 이상 (단, 상기 (a) 성분이 2 개의 에폭시기를 갖는 화합물인 경우, 3 개 이상)의 수산기를 갖는 페놀 화합물과, (c') 1 개 이상의 불포화 이중 결합기를 갖는 화합물과의 반응에 의해 얻어지는 불포화기 함유 다분지 화합물의 수산기에, 추가로 (d) 다염기산 무수물을 반응시켜 얻어지는 화합물, 또는(3) (a) 분자 중에 2 개 이상의 에폭시기를 갖는 화합물과, (b") 분자 중에 각각 1 개 이상 (단, 상기 (a) 성분이 2 개의 에폭시기를 갖는 화합물인 경우, 합계 관능기 수가 3 개 이상)의 카르복실기 및 페놀성 수산기를 갖는 화합물과, (c') 1 개 이상의 불포화 이중 결합기를 갖는 화합물과의 반응에 의해 얻어진 불포화기 함유 다분지 화합물의 수산기에, 추가로 (d) 다염기산 무수물을 반응시켜 얻어진 화합물 중 어느 하나이고, 말단부에 감광성의 불포화 이중 결합을 2 개 이상 가지고, 또한 카르복실기를 1 개 이상 갖는 다분지 구조를 갖는 것을 특징으로 하는 불포화기 함유 다분지 화합물.
- 제6항에 있어서, 상기 1 개 이상의 불포화 이중 결합기를 갖는 화합물 (c')가 (c) 불포화 모노카르복실산인 불포화기 함유 다분지 화합물.
- 삭제
- 삭제
- 삭제
- (A) 제1항, 제2항, 제6항 및 제7항 중 어느 한 항에 기재된 불포화기 함유 다분지 화합물, 및 (B) 중합 개시제를 필수 성분으로서 함유하는 것을 특징으로 하는 경화성 조성물.
- 제11항에 있어서, 상기 불포화기 함유 다분지 화합물 (A) 성분을 2 종 이상 함유하는 것을 특징으로 하는 경화성 조성물.
- 제11항에 있어서, (C) 열경화성 성분을 더 함유하는 것을 특징으로 하는 경화성 조성물.
- 제11항에 기재된 경화성 조성물을 활성 에너지선 조사 및(또는) 가열에 의해 경화시켜 얻어지는 경화물.
- 소정의 회로 패턴의 도체층을 갖는 회로 기판 상에 영구 보호막으로서의 솔더 레지스트 피막이 형성된 인쇄 배선판으로서, 상기 솔더 레지스트 피막이 제11항에 기재된 경화성 조성물의 경화 도막을 포함하는 것을 특징으로 하는 인쇄 배선판.
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JPJP-P-2002-00097023 | 2002-03-29 | ||
JP2002097023 | 2002-03-29 | ||
JP2002360311 | 2002-12-12 | ||
JPJP-P-2002-00360311 | 2002-12-12 | ||
PCT/JP2003/004121 WO2003087186A1 (fr) | 2002-03-29 | 2003-03-31 | Composes insatures a ramifications multiples, compositions durcissables les contenant, et articles durcis qu'ils permettent de realiser |
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US (1) | US20050064336A1 (ko) |
JP (1) | JP3960971B2 (ko) |
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CN (1) | CN1318473C (ko) |
AU (1) | AU2003221053A1 (ko) |
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JP2005239817A (ja) * | 2004-02-25 | 2005-09-08 | Dainippon Ink & Chem Inc | 酸ペンダント型エポキシアクリレート樹脂の製造方法および硬化性樹脂組成物 |
JPWO2006025236A1 (ja) * | 2004-09-03 | 2008-05-08 | 東洋紡績株式会社 | 活性光線硬化型ハイパーブランチポリマーおよびそれを用いた活性光線硬化型樹脂組成物 |
JP4585843B2 (ja) * | 2004-12-14 | 2010-11-24 | 四国化成工業株式会社 | トリアジン化合物 |
JP2006182834A (ja) * | 2004-12-27 | 2006-07-13 | Shikoku Chem Corp | トリアジン化合物 |
US9244352B2 (en) * | 2009-05-20 | 2016-01-26 | Rohm And Haas Electronic Materials, Llc | Coating compositions for use with an overcoated photoresist |
TW201235783A (en) * | 2010-12-10 | 2012-09-01 | Sumitomo Chemical Co | Photosensitive resin composition |
JP6028360B2 (ja) * | 2011-06-29 | 2016-11-16 | 東洋インキScホールディングス株式会社 | 感光性樹脂組成物とその硬化物、及び感光性樹脂の製造方法 |
JP6181907B2 (ja) | 2011-11-15 | 2017-08-16 | 互応化学工業株式会社 | カルボキシル基含有樹脂及びソルダーレジスト用樹脂組成物 |
US9534140B2 (en) * | 2013-01-09 | 2017-01-03 | Nissan Chemical Industries, Ltd. | Resist underlayer film-forming composition |
WO2018173679A1 (ja) * | 2017-03-22 | 2018-09-27 | Dic株式会社 | 酸基含有(メタ)アクリレート樹脂及びソルダーレジスト用樹脂材料 |
JP7521814B2 (ja) | 2019-07-08 | 2024-07-24 | 日本ポリテック株式会社 | 硬化性組成物、硬化物、オーバーコート膜、並びにフレキシブル配線板及びその製造方法 |
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CA1091690A (en) * | 1976-01-19 | 1980-12-16 | Martin C. Cornell, Iii | Latent catalysts for promoting reaction of epoxides with phenols and/or carboxylic acids |
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EP0646845B1 (en) * | 1992-06-19 | 2001-03-14 | Nippon Steel Corporation | Color filter, material thereof and resin |
JP3580429B2 (ja) * | 1994-10-05 | 2004-10-20 | 互応化学工業株式会社 | フォトソルダーレジストインク、プリント回路基板及びその製造方法 |
SE503342C2 (sv) * | 1994-10-24 | 1996-05-28 | Perstorp Ab | Hyperförgrenad makromolekyl av polyestertyp samt förfarande för dess framställning |
US5858618A (en) * | 1996-12-02 | 1999-01-12 | Nan Ya Plastics Corporation | Photopolymerizable resinous composition |
JP2000330278A (ja) * | 1999-05-25 | 2000-11-30 | Taiyo Ink Mfg Ltd | 感光性樹脂組成物 |
JP4558178B2 (ja) * | 2000-11-30 | 2010-10-06 | 新日鐵化学株式会社 | 光又は熱硬化性樹脂組成物及びプリント配線基板 |
-
2003
- 2003-03-31 AU AU2003221053A patent/AU2003221053A1/en not_active Abandoned
- 2003-03-31 CN CNB038075512A patent/CN1318473C/zh not_active Expired - Lifetime
- 2003-03-31 TW TW092107428A patent/TW200306339A/zh unknown
- 2003-03-31 WO PCT/JP2003/004121 patent/WO2003087186A1/ja active Application Filing
- 2003-03-31 KR KR1020047015290A patent/KR100928386B1/ko active IP Right Grant
- 2003-03-31 JP JP2003584140A patent/JP3960971B2/ja not_active Expired - Lifetime
-
2004
- 2004-09-29 US US10/951,698 patent/US20050064336A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1006101A1 (en) * | 1997-08-18 | 2000-06-07 | Nippon Steel Chemical Co., Ltd. | Aromatic ester (meth)acrylate dendrimer and curable resin composition |
JPH11193321A (ja) | 1997-10-27 | 1999-07-21 | Toyo Ink Mfg Co Ltd | 多分岐化合物および硬化性組成物 |
Also Published As
Publication number | Publication date |
---|---|
KR20040094871A (ko) | 2004-11-10 |
CN1318473C (zh) | 2007-05-30 |
JPWO2003087186A1 (ja) | 2005-08-18 |
CN1646592A (zh) | 2005-07-27 |
WO2003087186A1 (fr) | 2003-10-23 |
JP3960971B2 (ja) | 2007-08-15 |
TW200306339A (en) | 2003-11-16 |
AU2003221053A1 (en) | 2003-10-27 |
US20050064336A1 (en) | 2005-03-24 |
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