KR100919391B1 - 스테이지장치 - Google Patents

스테이지장치

Info

Publication number
KR100919391B1
KR100919391B1 KR1020070059427A KR20070059427A KR100919391B1 KR 100919391 B1 KR100919391 B1 KR 100919391B1 KR 1020070059427 A KR1020070059427 A KR 1020070059427A KR 20070059427 A KR20070059427 A KR 20070059427A KR 100919391 B1 KR100919391 B1 KR 100919391B1
Authority
KR
South Korea
Prior art keywords
pair
stage
temporary
guide
supported
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020070059427A
Other languages
English (en)
Korean (ko)
Other versions
KR20070120441A (ko
Inventor
마코토 하라다
다츠야 고하라
유지 고바야시
Original Assignee
스미도모쥬기가이고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스미도모쥬기가이고교 가부시키가이샤 filed Critical 스미도모쥬기가이고교 가부시키가이샤
Publication of KR20070120441A publication Critical patent/KR20070120441A/ko
Application granted granted Critical
Publication of KR100919391B1 publication Critical patent/KR100919391B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Machine Tool Units (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020070059427A 2006-06-19 2007-06-18 스테이지장치 Expired - Fee Related KR100919391B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006169422A JP4402078B2 (ja) 2006-06-19 2006-06-19 ステージ装置
JPJP-P-2006-00169422 2006-06-19

Publications (2)

Publication Number Publication Date
KR20070120441A KR20070120441A (ko) 2007-12-24
KR100919391B1 true KR100919391B1 (ko) 2009-09-29

Family

ID=38931053

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070059427A Expired - Fee Related KR100919391B1 (ko) 2006-06-19 2007-06-18 스테이지장치

Country Status (4)

Country Link
JP (1) JP4402078B2 (enrdf_load_stackoverflow)
KR (1) KR100919391B1 (enrdf_load_stackoverflow)
CN (1) CN100521143C (enrdf_load_stackoverflow)
TW (1) TW200818217A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230106381A (ko) * 2022-01-06 2023-07-13 에스케이실트론 주식회사 하정반 마모도 자동 보정 시스템 및 이를 구비한 웨이퍼 래핑 장치

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101339914B (zh) * 2008-08-27 2010-06-16 中国科学院长春光学精密机械与物理研究所 二维电动位移平台
JP4964853B2 (ja) * 2008-09-24 2012-07-04 住友重機械工業株式会社 ステージ装置
KR102482124B1 (ko) * 2016-01-25 2022-12-27 한화정밀기계 주식회사 칩 부품 마운터의 오차 최소화 방법
CN107580413A (zh) * 2016-07-05 2018-01-12 翔庆精密工业有限公司 平台水平自动校正装置
JP6771160B2 (ja) * 2018-08-21 2020-10-21 パナソニックＩｐマネジメント株式会社 搬送ステージとそれを使用したインクジェット装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003316440A (ja) * 2002-04-24 2003-11-07 Mejiro Precision:Kk ステージ装置
JP2005128783A (ja) * 2003-10-23 2005-05-19 Sumitomo Heavy Ind Ltd ステージ装置
KR20060047978A (ko) * 2004-05-20 2006-05-18 스미도모쥬기가이고교 가부시키가이샤 스테이지장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003316440A (ja) * 2002-04-24 2003-11-07 Mejiro Precision:Kk ステージ装置
JP2005128783A (ja) * 2003-10-23 2005-05-19 Sumitomo Heavy Ind Ltd ステージ装置
KR20060047978A (ko) * 2004-05-20 2006-05-18 스미도모쥬기가이고교 가부시키가이샤 스테이지장치

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230106381A (ko) * 2022-01-06 2023-07-13 에스케이실트론 주식회사 하정반 마모도 자동 보정 시스템 및 이를 구비한 웨이퍼 래핑 장치
KR102704356B1 (ko) * 2022-01-06 2024-09-09 에스케이실트론 주식회사 하정반 마모도 자동 보정 시스템 및 이를 구비한 웨이퍼 래핑 장치
US12285841B2 (en) 2022-01-06 2025-04-29 Sk Siltron Co., Ltd. Automatic abrasion compensation system of lower plate and wafer lapping apparatus having the same

Also Published As

Publication number Publication date
JP4402078B2 (ja) 2010-01-20
CN100521143C (zh) 2009-07-29
TW200818217A (en) 2008-04-16
TWI360133B (enrdf_load_stackoverflow) 2012-03-11
JP2007331087A (ja) 2007-12-27
CN101093813A (zh) 2007-12-26
KR20070120441A (ko) 2007-12-24

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