KR100902339B1 - 열경화성 수지 조성물 - Google Patents

열경화성 수지 조성물 Download PDF

Info

Publication number
KR100902339B1
KR100902339B1 KR1020047008660A KR20047008660A KR100902339B1 KR 100902339 B1 KR100902339 B1 KR 100902339B1 KR 1020047008660 A KR1020047008660 A KR 1020047008660A KR 20047008660 A KR20047008660 A KR 20047008660A KR 100902339 B1 KR100902339 B1 KR 100902339B1
Authority
KR
South Korea
Prior art keywords
resin composition
resin
group
parts
carbon atoms
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1020047008660A
Other languages
English (en)
Korean (ko)
Other versions
KR20040068192A (ko
Inventor
살빈로저피에레-엘리
로쓰마르틴
호시노마사토
노지마야스하루
Original Assignee
훈츠만 어드밴스트 머티리얼스(스위처랜드)게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 훈츠만 어드밴스트 머티리얼스(스위처랜드)게엠베하 filed Critical 훈츠만 어드밴스트 머티리얼스(스위처랜드)게엠베하
Publication of KR20040068192A publication Critical patent/KR20040068192A/ko
Application granted granted Critical
Publication of KR100902339B1 publication Critical patent/KR100902339B1/ko
Assigned to 훈츠만 어드밴스트 머티리얼스 라이센싱 (스위처랜드) 게엠베하 reassignment 훈츠만 어드밴스트 머티리얼스 라이센싱 (스위처랜드) 게엠베하 권리의 전부이전등록 Assignors: 훈츠만 어드밴스트 머티리얼스(스위처랜드)게엠베하
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/12—Powdering or granulating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/26—Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/04—Polymers provided for in subclasses C08C or C08F
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F291/00—Macromolecular compounds obtained by polymerising monomers on to macromolecular compounds according to more than one of the groups C08F251/00 - C08F289/00
    • C08F291/02—Macromolecular compounds obtained by polymerising monomers on to macromolecular compounds according to more than one of the groups C08F251/00 - C08F289/00 on to elastomers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F297/00—Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer
    • C08F297/02—Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer using a catalyst of the anionic type
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/08—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds
    • C08L51/085—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds on to polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L19/00—Compositions of rubbers not provided for in groups C08L7/00 - C08L17/00
    • C08L19/006—Rubber characterised by functional groups, e.g. telechelic diene polymers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Graft Or Block Polymers (AREA)
  • Polymerisation Methods In General (AREA)
  • Laminated Bodies (AREA)
KR1020047008660A 2001-12-06 2002-11-21 열경화성 수지 조성물 Expired - Lifetime KR100902339B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH2229/01 2001-12-06
CH22292001 2001-12-06
PCT/EP2002/013047 WO2003048235A1 (en) 2001-12-06 2002-11-21 Heat-curable resin composition

Publications (2)

Publication Number Publication Date
KR20040068192A KR20040068192A (ko) 2004-07-30
KR100902339B1 true KR100902339B1 (ko) 2009-06-12

Family

ID=4568114

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020047008660A Expired - Lifetime KR100902339B1 (ko) 2001-12-06 2002-11-21 열경화성 수지 조성물

Country Status (11)

Country Link
US (1) US7387812B2 (https=)
EP (1) EP1458794B1 (https=)
JP (1) JP4509561B2 (https=)
KR (1) KR100902339B1 (https=)
CN (1) CN1267478C (https=)
AT (1) ATE302231T1 (https=)
AU (1) AU2002352080A1 (https=)
BR (1) BR0214724B1 (https=)
CA (1) CA2466611C (https=)
DE (1) DE60205664T2 (https=)
WO (1) WO2003048235A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9880467B2 (en) 2012-08-01 2018-01-30 Lg Chem, Ltd. Photo-curable and thermo-curable resin composition and dry film solder resist

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8524838B2 (en) * 2004-09-21 2013-09-03 Showa Denko K.K. Heat-curable urethane resin composition
US8029889B1 (en) 2004-12-03 2011-10-04 Henkel Corporation Prepregs, towpregs and preforms
US7649060B2 (en) * 2005-12-02 2010-01-19 Henkel Corporation Curable compositions
US20090065244A1 (en) * 2006-04-28 2009-03-12 Showa Denko K.K. Thermosetting resin compositions and uses thereof
TWI419949B (zh) * 2006-09-28 2013-12-21 Jsr Corp 黏著劑組成物及撓性印刷電路板用基板
US7537827B1 (en) 2006-12-13 2009-05-26 Henkel Corporation Prepreg laminates
KR101130377B1 (ko) * 2007-10-18 2012-03-27 히다치 가세고교 가부시끼가이샤 접착제 조성물 및 이것을 이용한 회로 접속 재료, 및 회로 부재의 접속 방법 및 회로 접속체
JP2009192632A (ja) * 2008-02-12 2009-08-27 Fujifilm Corp 絶縁材料用樹脂組成物、感光性フィルム、及び感光性積層体
JP5239446B2 (ja) * 2008-03-26 2013-07-17 日立化成株式会社 ポジ型感光性樹脂組成物、レジストパターンの製造方法及び電子部品
DE102008023076A1 (de) 2008-05-09 2009-11-12 Henkel Ag & Co. Kgaa Polymerisierbare Zusammensetzung
JP5270994B2 (ja) * 2008-07-25 2013-08-21 パナソニック株式会社 ミクロフィブリル化セルロース／エラストマー／樹脂複合材の製造方法および成形品の製造方法
SG177615A1 (en) * 2009-07-10 2012-03-29 Dow Global Technologies Llc Core/shell rubbers for use in electrical laminate compositions
TW201213433A (en) * 2010-09-28 2012-04-01 Dow Global Technologies Llc Epoxy composition with crystallization inhibition
DE102012200855A1 (de) * 2012-01-20 2013-07-25 Tesa Se Vernetzer-Beschleuniger-System für Polyacrylate
JP6075763B2 (ja) * 2013-03-22 2017-02-08 日本化薬株式会社 活性エネルギー線硬化型樹脂組成物、及びそれを用いた表示素子用着色スペーサー及び／またはブラックマトリックス
JP2015031849A (ja) * 2013-08-02 2015-02-16 日立化成株式会社 感光性樹脂組成物
JP5700166B1 (ja) * 2014-08-01 2015-04-15 東洋インキＳｃホールディングス株式会社 接着剤組成物、積層体、蓄電デバイス用包装材、蓄電デバイス用容器および蓄電デバイス
TWI679497B (zh) * 2015-11-06 2019-12-11 日商鐘化股份有限公司 附有黑色樹脂硬化膜之聚醯亞胺之製造方法
JP6456313B2 (ja) * 2016-01-26 2019-01-23 株式会社タムラ製作所 感光性樹脂組成物
KR102040225B1 (ko) * 2016-11-11 2019-11-06 주식회사 엘지화학 절연층 제조방법 및 다층인쇄회로기판 제조방법
JP6944073B2 (ja) * 2020-01-27 2021-10-06 株式会社タムラ製作所 感光性樹脂組成物
CN113176705B (zh) * 2020-01-27 2024-11-12 株式会社田村制作所 感光性树脂组合物
JP7229304B2 (ja) * 2020-08-06 2023-02-27 株式会社タムラ製作所 感光性樹脂組成物及び感光性樹脂組成物を塗布したプリント配線板
US20260022241A1 (en) * 2024-07-19 2026-01-22 Canon Kabushiki Kaisha Curable composition and coated superstrate

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4977220A (en) 1988-11-21 1990-12-11 Hughes Aircraft Company Epoxy end-capped diolefin derivatives, polymers thereof, and processes for forming same
US5051469A (en) 1985-12-13 1991-09-24 Monsanto Company Rubber modified reaction molded nylon-6 block copolymers
US5360836A (en) 1986-10-02 1994-11-01 Societe Nationale Des Poudres Et Explosifs Process for the production of coatings by radiation cross-linking
KR20000029738A (ko) * 1996-08-01 2000-05-25 스타르크, 카르크 내충격성열가소성성형재료

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3134123A1 (de) * 1981-08-28 1983-03-17 Hoechst Ag, 6000 Frankfurt Durch strahlung polymerisierbares gemisch und daraushergestelltes photopolymerisierbares kopiermaterial
JPS6162511A (ja) * 1984-09-05 1986-03-31 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物
JPS63258975A (ja) * 1986-12-26 1988-10-26 Toshiba Corp ソルダーレジストインキ組成物
US4801680A (en) * 1987-12-30 1989-01-31 Ppg Industries, Inc. Hydroxyalkylamide powder coating curing system
US4894315A (en) * 1988-08-30 1990-01-16 E. I. Du Pont De Nemours And Company Process for making flexographic printing plates with increased flexibility
DE69326853T2 (de) * 1992-04-07 2000-06-15 Alcatel, Paris Polyurethanacrylat-Polymermaterial für die Beschichtung von optischen Fasern oder für Bandkabel aus optischen Fasern
BE1006097A3 (nl) * 1992-07-29 1994-05-10 Dsm Nv Poederverf op basis van een polymeer met vrije carbonzuurgroepen als bindmiddel en een beta-hydroxyalkylamidegroepen bevattende verbinding als crosslinker.
JP3329877B2 (ja) * 1993-03-02 2002-09-30 互応化学工業株式会社 プリント回路基板製造用レジストインク組成物、それを用いたレジスト膜及びプリント回路基板
JPH07314603A (ja) * 1993-12-28 1995-12-05 Nippon Denkai Kk 銅張積層体、多層プリント回路板及びそれらの処理方法
EP0662501A1 (en) 1994-01-07 1995-07-12 Gencorp Inc. Polymeric compositions, their preparation and use
JP3580445B2 (ja) 1994-09-13 2004-10-20 日本化薬株式会社 フレキシブルプリント配線板用レジストインキ組成物及びその硬化物
US5576388A (en) * 1994-10-11 1996-11-19 Shell Oil Company Telechelic polymers and heterotelechelic polydiene block polymers with dual cure systems
US6127094A (en) * 1997-10-02 2000-10-03 Napp Systems Inc. Acrylate copolymer-containing water-developable photosensitive resins and printing plates prepared therefrom
US6583198B2 (en) * 1997-11-28 2003-06-24 Hitachi Chemical Company, Ltd. Photo curable resin composition and photosensitive element
EP0938026B1 (en) * 1998-02-18 2009-05-27 DSM IP Assets B.V. Photocurable liquid resin composition
JP2000072986A (ja) * 1998-08-31 2000-03-07 Sumitomo Durez Co Ltd エポキシ樹脂粉体塗料
JP4081217B2 (ja) * 1999-03-17 2008-04-23 互応化学工業株式会社 紫外線硬化性樹脂組成物、フォトソルダーレジストインク、予備乾燥被膜、基板及びプリント配線板
JP2001168536A (ja) * 1999-12-06 2001-06-22 Idemitsu Petrochem Co Ltd 多層プリント配線板
JP2001188340A (ja) * 2000-01-04 2001-07-10 Toagosei Co Ltd 硬化性組成物およびソルダーレジスト
FR2809741B1 (fr) * 2000-05-31 2002-08-16 Atofina Materiaux thermodurs a tenue au choc amelioree
BR0214764B1 (pt) * 2001-12-06 2012-09-04 composição de resina e seu uso, circuito impresso e unidade de acondicionamento.
US20030198824A1 (en) * 2002-04-19 2003-10-23 Fong John W. Photocurable compositions containing reactive polysiloxane particles

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5051469A (en) 1985-12-13 1991-09-24 Monsanto Company Rubber modified reaction molded nylon-6 block copolymers
US5360836A (en) 1986-10-02 1994-11-01 Societe Nationale Des Poudres Et Explosifs Process for the production of coatings by radiation cross-linking
US4977220A (en) 1988-11-21 1990-12-11 Hughes Aircraft Company Epoxy end-capped diolefin derivatives, polymers thereof, and processes for forming same
KR20000029738A (ko) * 1996-08-01 2000-05-25 스타르크, 카르크 내충격성열가소성성형재료

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9880467B2 (en) 2012-08-01 2018-01-30 Lg Chem, Ltd. Photo-curable and thermo-curable resin composition and dry film solder resist

Also Published As

Publication number Publication date
US20050032935A1 (en) 2005-02-10
DE60205664T2 (de) 2006-03-02
EP1458794A1 (en) 2004-09-22
WO2003048235A1 (en) 2003-06-12
CN1599770A (zh) 2005-03-23
KR20040068192A (ko) 2004-07-30
JP4509561B2 (ja) 2010-07-21
CA2466611A1 (en) 2003-06-12
ATE302231T1 (de) 2005-09-15
JP2005512117A (ja) 2005-04-28
AU2002352080A1 (en) 2003-06-17
US7387812B2 (en) 2008-06-17
DE60205664D1 (de) 2005-09-22
CN1267478C (zh) 2006-08-02
CA2466611C (en) 2011-09-27
BR0214724A (pt) 2004-08-31
EP1458794B1 (en) 2005-08-17
BR0214724B1 (pt) 2012-09-04

Similar Documents

Publication Publication Date Title
KR100902339B1 (ko) 열경화성 수지 조성물
JP5882510B2 (ja) 感光性ドライフィルムおよびそれを用いたプリント配線板の製造方法
US6399277B1 (en) Photopolymerizable thermosetting resin composition
KR101178308B1 (ko) 광가교성 폴리우레탄
JP6258547B2 (ja) 感光性ドライフィルムおよびそれを用いたプリント配線板の製造方法
CN102272677B (zh) 光固化性树脂组合物、其干膜及固化物以及使用它们的印刷电路板
CN103460134B (zh) 正型感光性树脂组合物、干膜、固化物及印刷电路板
JP6215497B1 (ja) 感光性フィルム積層体およびそれを用いて形成された硬化物
JP2002296776A (ja) プリント配線板用光硬化性・熱硬化性樹脂組成物及びプリント配線板
KR100926738B1 (ko) 수지 조성물
TW202103923A (zh) 層合結構體、硬化物、印刷配線板及電子零件
CA2253242C (en) Photopolymerizable thermosetting resin composition
KR20240047321A (ko) 경화성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판
WO2023190456A1 (ja) 硬化物、感光性樹脂組成物、ドライフィルムおよびプリント配線板
KR100499836B1 (ko) 광중합성열경화성수지조성물
WO2003070800A1 (fr) Resine durcissable et composition contenant la resine durcissable
JP6603442B1 (ja) 硬化性樹脂組成物、ドライフィルムおよびその硬化物、並びにプリント配線板
JP2000290327A (ja) 変性共重合体及び樹脂組成物
WO2023054523A1 (ja) 感光性樹脂組成物、ドライフィルム、硬化物、およびプリント配線板

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20040604

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20071119

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20080925

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20090520

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20090604

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20090605

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20120530

Start annual number: 4

End annual number: 4

FPAY Annual fee payment

Payment date: 20130531

Year of fee payment: 5

PR1001 Payment of annual fee

Payment date: 20130531

Start annual number: 5

End annual number: 5

FPAY Annual fee payment

Payment date: 20140529

Year of fee payment: 6

PR1001 Payment of annual fee

Payment date: 20140529

Start annual number: 6

End annual number: 6

FPAY Annual fee payment

Payment date: 20160330

Year of fee payment: 8

PR1001 Payment of annual fee

Payment date: 20160330

Start annual number: 8

End annual number: 8

FPAY Annual fee payment

Payment date: 20180329

Year of fee payment: 10

PR1001 Payment of annual fee

Payment date: 20180329

Start annual number: 10

End annual number: 10

FPAY Annual fee payment

Payment date: 20190327

Year of fee payment: 11

PR1001 Payment of annual fee

Payment date: 20190327

Start annual number: 11

End annual number: 11

PR1001 Payment of annual fee

Payment date: 20200324

Start annual number: 12

End annual number: 12

PR1001 Payment of annual fee

Payment date: 20210329

Start annual number: 13

End annual number: 13

PC1801 Expiration of term

Termination date: 20230521

Termination category: Expiration of duration