KR100888539B1 - 피처리체의 산화 방법 및 산화 장치 - Google Patents

피처리체의 산화 방법 및 산화 장치 Download PDF

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Publication number
KR100888539B1
KR100888539B1 KR1020050012519A KR20050012519A KR100888539B1 KR 100888539 B1 KR100888539 B1 KR 100888539B1 KR 1020050012519 A KR1020050012519 A KR 1020050012519A KR 20050012519 A KR20050012519 A KR 20050012519A KR 100888539 B1 KR100888539 B1 KR 100888539B1
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South Korea
Prior art keywords
gas
reducing gas
wafer
processing container
oxidizing
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Expired - Lifetime
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KR1020050012519A
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English (en)
Korean (ko)
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KR20060041970A (ko
Inventor
게이스께 스즈끼
도시유끼 이께우찌
고오따 우메자와
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도쿄엘렉트론가부시키가이샤
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Publication of KR20060041970A publication Critical patent/KR20060041970A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
    • H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02551—Group 12/16 materials
    • H01L21/02554—Oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/0223—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate
    • H01L21/02233—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer
    • H01L21/02236—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor
    • H01L21/02238—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor silicon in uncombined form, i.e. pure silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/02255—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by thermal treatment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Formation Of Insulating Films (AREA)
KR1020050012519A 2004-02-17 2005-02-16 피처리체의 산화 방법 및 산화 장치 Expired - Lifetime KR100888539B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2004-00040637 2004-02-17
JP2004040637 2004-02-17
JP2005009631A JP4586544B2 (ja) 2004-02-17 2005-01-17 被処理体の酸化方法、酸化装置及び記憶媒体
JPJP-P-2005-00009631 2005-01-17

Publications (2)

Publication Number Publication Date
KR20060041970A KR20060041970A (ko) 2006-05-12
KR100888539B1 true KR100888539B1 (ko) 2009-03-11

Family

ID=35092926

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050012519A Expired - Lifetime KR100888539B1 (ko) 2004-02-17 2005-02-16 피처리체의 산화 방법 및 산화 장치

Country Status (4)

Country Link
US (2) US7419550B2 (enExample)
JP (1) JP4586544B2 (enExample)
KR (1) KR100888539B1 (enExample)
TW (1) TW200539350A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190048278A (ko) * 2017-10-31 2019-05-09 에스케이실트론 주식회사 실리콘 웨이퍼의 산화물층의 두께 예측 방법
KR20230120755A (ko) * 2022-02-10 2023-08-17 에스케이실트론 주식회사 실리콘 웨이퍼의 산화물층의 두께 예측 방법

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JP3985899B2 (ja) * 2002-03-28 2007-10-03 株式会社日立国際電気 基板処理装置
JP4609098B2 (ja) * 2004-03-24 2011-01-12 東京エレクトロン株式会社 被処理体の酸化方法、酸化装置及び記憶媒体
KR100609065B1 (ko) * 2004-08-04 2006-08-10 삼성전자주식회사 산화막 형성 장치 및 방법
JP4455225B2 (ja) * 2004-08-25 2010-04-21 Ｎｅｃエレクトロニクス株式会社 半導体装置の製造方法
JP4899744B2 (ja) * 2006-09-22 2012-03-21 東京エレクトロン株式会社 被処理体の酸化装置
US20090197424A1 (en) * 2008-01-31 2009-08-06 Hitachi Kokusai Electric Inc. Substrate processing apparatus and method for manufacturing semiconductor device
JP5665289B2 (ja) * 2008-10-29 2015-02-04 株式会社日立国際電気 半導体装置の製造方法、基板処理方法および基板処理装置
US8409352B2 (en) * 2010-03-01 2013-04-02 Hitachi Kokusai Electric Inc. Method of manufacturing semiconductor device, method of manufacturing substrate and substrate processing apparatus
KR101427726B1 (ko) * 2011-12-27 2014-08-07 가부시키가이샤 히다치 고쿠사이 덴키 기판 처리 장치 및 반도체 장치의 제조 방법
CN104520975B (zh) * 2012-07-30 2018-07-31 株式会社日立国际电气 衬底处理装置及半导体器件的制造方法
US11756794B2 (en) * 2019-11-01 2023-09-12 Texas Instruments Incorporated IC with deep trench polysilicon oxidation
WO2022065163A1 (ja) * 2020-09-25 2022-03-31 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法、基板処理方法、及びプログラム

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KR20010100932A (ko) * 2000-05-02 2001-11-14 히가시 데쓰로 산화방법 및 산화시스템
KR20020087311A (ko) * 2001-05-15 2002-11-22 삼성전자 주식회사 반도체 제조용 수직 확산로 설비
US6869892B1 (en) 2004-01-30 2005-03-22 Tokyo Electron Limited Method of oxidizing work pieces and oxidation system

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JP2902012B2 (ja) 1989-10-27 1999-06-07 国際電気株式会社 低圧酸化装置
US5043299B1 (en) * 1989-12-01 1997-02-25 Applied Materials Inc Process for selective deposition of tungsten on semiconductor wafer
JPH0418727A (ja) 1990-05-11 1992-01-22 Kokusai Electric Co Ltd 縦型拡散装置
SE510612C2 (sv) * 1996-11-08 1999-06-07 Ericsson Telefon Ab L M Förfarande och anordning för att Likströmsmässigt anpassa en första krets till minst en andra krets
US6037273A (en) 1997-07-11 2000-03-14 Applied Materials, Inc. Method and apparatus for insitu vapor generation
CN1161814C (zh) * 1997-09-16 2004-08-11 佳能株式会社 电子源与图象形成装置的制造方法,以及电子源制造装置
JP3567070B2 (ja) * 1997-12-27 2004-09-15 東京エレクトロン株式会社 熱処理装置及び熱処理方法
JPH11345777A (ja) * 1998-05-29 1999-12-14 Tokyo Electron Ltd 成膜装置
US6383300B1 (en) * 1998-11-27 2002-05-07 Tokyo Electron Ltd. Heat treatment apparatus and cleaning method of the same
JP4232307B2 (ja) * 1999-03-23 2009-03-04 東京エレクトロン株式会社 バッチ式熱処理装置の運用方法
JP3436256B2 (ja) 2000-05-02 2003-08-11 東京エレクトロン株式会社 被処理体の酸化方法及び酸化装置
KR100421036B1 (ko) * 2001-03-13 2004-03-03 삼성전자주식회사 웨이퍼 처리 장치 및 이를 이용한 웨이퍼 처리 방법
JP4792180B2 (ja) * 2001-07-31 2011-10-12 株式会社日立国際電気 半導体デバイスの製造方法、基板処理方法および基板処理装置
JP2003318172A (ja) * 2002-04-19 2003-11-07 Tokyo Electron Ltd 成膜方法、成膜処理時間補正式の導出方法、成膜装置、およびプログラム
JP3578155B2 (ja) * 2002-07-05 2004-10-20 東京エレクトロン株式会社 被処理体の酸化方法
JP4164092B2 (ja) * 2003-08-26 2008-10-08 株式会社日立国際電気 半導体装置の製造方法および基板処理装置
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US20050056219A1 (en) * 2003-09-16 2005-03-17 Tokyo Electron Limited Formation of a metal-containing film by sequential gas exposure in a batch type processing system

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KR20010100932A (ko) * 2000-05-02 2001-11-14 히가시 데쓰로 산화방법 및 산화시스템
KR20020087311A (ko) * 2001-05-15 2002-11-22 삼성전자 주식회사 반도체 제조용 수직 확산로 설비
US6869892B1 (en) 2004-01-30 2005-03-22 Tokyo Electron Limited Method of oxidizing work pieces and oxidation system

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190048278A (ko) * 2017-10-31 2019-05-09 에스케이실트론 주식회사 실리콘 웨이퍼의 산화물층의 두께 예측 방법
KR102014926B1 (ko) * 2017-10-31 2019-08-27 에스케이실트론 주식회사 실리콘 웨이퍼의 산화물층의 두께 예측 방법
US10615085B2 (en) 2017-10-31 2020-04-07 Sk Siltron Co., Ltd. Method for predicting thickness of oxide layer of silicon wafer
KR20230120755A (ko) * 2022-02-10 2023-08-17 에스케이실트론 주식회사 실리콘 웨이퍼의 산화물층의 두께 예측 방법
KR102719439B1 (ko) 2022-02-10 2024-10-21 에스케이실트론 주식회사 실리콘 웨이퍼의 산화물층의 두께 예측 방법

Also Published As

Publication number Publication date
JP2005268755A (ja) 2005-09-29
KR20060041970A (ko) 2006-05-12
US20060183343A1 (en) 2006-08-17
JP4586544B2 (ja) 2010-11-24
US7419550B2 (en) 2008-09-02
TW200539350A (en) 2005-12-01
TWI379357B (enExample) 2012-12-11
US20080268654A1 (en) 2008-10-30
US7674724B2 (en) 2010-03-09

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