KR100885877B1 - 기판 이송장치 - Google Patents
기판 이송장치 Download PDFInfo
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- KR100885877B1 KR100885877B1 KR1020080067805A KR20080067805A KR100885877B1 KR 100885877 B1 KR100885877 B1 KR 100885877B1 KR 1020080067805 A KR1020080067805 A KR 1020080067805A KR 20080067805 A KR20080067805 A KR 20080067805A KR 100885877 B1 KR100885877 B1 KR 100885877B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Filling Or Emptying Of Bunkers, Hoppers, And Tanks (AREA)
- Intermediate Stations On Conveyors (AREA)
Abstract
Description
Claims (4)
- 상부의 제1위치로 공급된 기판을 하부의 제2위치의 높이로 기판을 이송시키고, 제2위치로 이송된 기판을 이송레일로 이동시켜 배출시키는 기판 이송장치에 있어서,상기 이송레일(300)의 마주보는 양측에 제1위치로부터 제2위치에 이르는 구간에 마련되는 제1,2승강기구와;상기 제1위치에서 상기 제1승강기구에 인접한 고정구조물에 일정간격으로 세로로 세워져 고정되는 복수의 제1고정판(51)과;상기 제1고정판(51)들의 일단부를 나란하게 관통하여 회전가능하게 지지되는 제1,2회전축(41)(42)과;상기 제1,2회전축(41)(42)을 각각 회전구동시키는 제1,2회전모터(31)(32)와;일단이 상기 각 제1고정판(51)들에 회전가능하게 지지되며 각 수평위치에서 상기 공급된 기판을 지지하고 동일평면상에 마련되는 복수의 제1상부지지대(131)와, 상기 각 제1상부지지대(131)의 직하부에 위치되어 상기 각 제1고정판(51)에 각 일단이 회동가능하게 지지되며 각 수평위치에서 상기 공급된 기판을 지지하고 동일평면상에 마련되는 복수의 제1하부지지대(132)를 구비하며, 상기 각 제1상부지지대(131)의 회전축보다 상기 각 제1하부지지대(132)의 회전축은 상대적으로 상기 제1승강기구에 근접되게 마련되는 제1회동지지대(130)와;상기 제1회전축(41)과 상기 각 제1상부지지대(131)의 회전축을 연결시키는 복수의 제1벨트부재(61)와;상기 제2회전축(42)과 상기 각 제1하부지지대(132)의 회전축을 연결시키는 복수의 제2벨트부재(71)와;상기 제1위치에서 상기 제2승강기구에 인접한 고정구조물에 일정간격으로 세로로 세워져 고정되는 복수의 제2고정판(52)과;상기 제2고정판(52)들의 일단부를 나란하게 관통하여 회전가능하게 지지되는 제3,4회전축(43)(44)과;상기 제3,4회전축(43)(44)을 각각 회전구동시키는 제3,4회전모터(33)(34)와;일단이 상기 각 제2고정판(52)들에 회전가능하게 지지되며 각 수평위치에서 상기 공급된 기판을 지지하고 동일평면상에 마련되는 복수의 제2상부지지대(231)와, 상기 각 제2상부지지대(231)의 직하부에 위치되어 상기 각 제2고정판(52)에 각 일단이 회동가능하게 지지되며 각 수평위치에서 상기 공급된 기판을 지지하고 동일평면상에 마련되는 복수의 제2하부지지대(232)를 구비하고, 상기 각 제2상부지지대(231)의 회전축보다 상기 각 제2하부지지대(232)의 회전축은 상대적으로 상기 제2승강기구에 근접되게 마련되는 제2회동지지대(230)와;상기 제3회전축(43)과 상기 각 제2상부지지대(231)의 회전축을 연결시키는 복수의 제3벨트부재(62)와;상기 제4회전축(44)과 상기 각 제2하부지지대(232)의 회전축을 연결시키는 복수의 제4벨트부재(72)와;상기 제1,2승강기구에 지지되어 상하로 이동가능하고, 상기 제1,2승강기구에 대해 회동가능하고, 길이가 신축가능하며, 상기 제1,2회동지지대(130)(230)의 기판을 탑재하여 상기 이송레일(300)에 안착시키는 포크형 제1,2리프트(100)(200);를 구비하며,상기 이송레일(300)은 상기 포크형 제1,2리프트(100)(200)가 통과되도록 일정간격으로 마련되는 복수의 회전봉(301)을 구비한 것을 특징으로 하는 기판 이송장치.
- 제 1 항에 있어서, 상기 승강기구는 모터(110)(210)의 동력으로 회전되는 스크류봉(101)(201)인 것을 특징으로 하는 기판 이송장치.
- 제 2 항에 있어서, 상기 제1,2리프트(100)(200)는 각각 상기 스크류봉(101)(201)에 나사결합되어 승강되는 제1,2이동블럭(102)(202)과, 상기 제1,2이동블럭(102)(202)에 고정되는 제1,2승강몸체(103)(203)와, 상기 각 제1,2승강몸체(103)(203)에 일단이 회동가능하게 지지되는 제1,2회동바아(104)(204)와, 일단이 상기 제1,2회동바아(104)(204)의 타단부에 회전수단에 의해서 회전가능하게 연결되는 제1,2확장바아(105)(205)를 구비한 것을 특징으로 하는 기판 이송장치.
- 제 3 항에 있어서, 상기 회전수단은 상기 제1,2회동바아(104)(204)에 각각 소정간격 이격되어 회전가능하게 지지되는 제1,2풀리(141)(142)와, 상기 제1,2풀리(141)(142)에 권회되어 회전안내되는 벨트(143)와, 상기 제1,2회동바 아(104)(204)에 고정설치되며 그 로드(140a)가 상기 벨트(143)와 연결고정되는 실린더(140)를 구비하며,상기 각 제2풀리(142)를 상기 각 제1,2확장바아(105)(205)와 동축으로 연결하여 된 것을 특징으로 하는 기판 이송장치.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080067805A KR100885877B1 (ko) | 2008-07-11 | 2008-07-11 | 기판 이송장치 |
CN200980126390.4A CN102113108B (zh) | 2008-07-11 | 2009-07-09 | 基板转送装置 |
JP2011517350A JP2011527823A (ja) | 2008-07-11 | 2009-07-09 | 基板移送装置 |
TW098123225A TWI370798B (en) | 2008-07-11 | 2009-07-09 | Apparatus for transferring base plate |
PCT/KR2009/003759 WO2010005246A2 (ko) | 2008-07-11 | 2009-07-09 | 기판 이송장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080067805A KR100885877B1 (ko) | 2008-07-11 | 2008-07-11 | 기판 이송장치 |
Publications (1)
Publication Number | Publication Date |
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KR100885877B1 true KR100885877B1 (ko) | 2009-02-26 |
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ID=40682178
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080067805A KR100885877B1 (ko) | 2008-07-11 | 2008-07-11 | 기판 이송장치 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2011527823A (ko) |
KR (1) | KR100885877B1 (ko) |
CN (1) | CN102113108B (ko) |
TW (1) | TWI370798B (ko) |
WO (1) | WO2010005246A2 (ko) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011084972A2 (en) * | 2010-01-08 | 2011-07-14 | Kla-Tencor Corporation | Dual tray carrier unit |
KR101069154B1 (ko) | 2009-05-28 | 2011-09-30 | 주식회사 케이씨텍 | 기판 처리장치 |
KR101078487B1 (ko) | 2009-09-17 | 2011-10-31 | 김재석 | 패널용 진공흡착기 유닛 및 복수개의 고무패드가 장착된 진공흡착기 |
US9435826B2 (en) | 2012-05-08 | 2016-09-06 | Kla-Tencor Corporation | Variable spacing four-point probe pin device and method |
CN109160210A (zh) * | 2018-09-25 | 2019-01-08 | 中国建材国际工程集团有限公司 | 板材存储输送系统及其使用方法 |
CN111848218A (zh) * | 2020-07-30 | 2020-10-30 | 固安浩瀚光电科技有限公司 | 一种半导体陶瓷组装包装装置及其使用方法 |
CN109160210B (zh) * | 2018-09-25 | 2024-06-07 | 中国建材国际工程集团有限公司 | 板材存储输送系统及其使用方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150303090A1 (en) * | 2012-09-10 | 2015-10-22 | Applied Materials, Inc. | Substrate transfer device and method of moving substrates |
CN112239069A (zh) * | 2019-07-19 | 2021-01-19 | 亚智科技股份有限公司 | 牙叉式基板运输装置及其方法 |
CN116946487A (zh) * | 2023-09-20 | 2023-10-27 | 长春市景来科技有限公司 | 一种人工智能物流包裹包装装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100617453B1 (ko) | 2006-04-27 | 2006-09-01 | 주식회사 인아텍 | 기판 이송시스템 |
KR100617454B1 (ko) | 2006-02-23 | 2006-09-05 | 주식회사 인아텍 | 기판 이송시스템 및 이를 이용한 기판 이송방법 |
KR100839570B1 (ko) | 2007-12-31 | 2008-06-20 | 주식회사 인아텍 | 기판 이송방법 및 장치 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2913354B2 (ja) * | 1993-02-26 | 1999-06-28 | 東京エレクトロン株式会社 | 処理システム |
JP4476133B2 (ja) * | 2005-02-24 | 2010-06-09 | 東京エレクトロン株式会社 | 処理システム |
JP4440178B2 (ja) * | 2005-07-25 | 2010-03-24 | 東京エレクトロン株式会社 | 基板の搬送装置 |
JP4593461B2 (ja) * | 2005-12-27 | 2010-12-08 | 東京エレクトロン株式会社 | 基板搬送システム |
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2008
- 2008-07-11 KR KR1020080067805A patent/KR100885877B1/ko active IP Right Grant
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2009
- 2009-07-09 TW TW098123225A patent/TWI370798B/zh active
- 2009-07-09 JP JP2011517350A patent/JP2011527823A/ja not_active Ceased
- 2009-07-09 WO PCT/KR2009/003759 patent/WO2010005246A2/ko active Application Filing
- 2009-07-09 CN CN200980126390.4A patent/CN102113108B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100617454B1 (ko) | 2006-02-23 | 2006-09-05 | 주식회사 인아텍 | 기판 이송시스템 및 이를 이용한 기판 이송방법 |
KR100617453B1 (ko) | 2006-04-27 | 2006-09-01 | 주식회사 인아텍 | 기판 이송시스템 |
KR100839570B1 (ko) | 2007-12-31 | 2008-06-20 | 주식회사 인아텍 | 기판 이송방법 및 장치 |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101069154B1 (ko) | 2009-05-28 | 2011-09-30 | 주식회사 케이씨텍 | 기판 처리장치 |
KR101078487B1 (ko) | 2009-09-17 | 2011-10-31 | 김재석 | 패널용 진공흡착기 유닛 및 복수개의 고무패드가 장착된 진공흡착기 |
WO2011084972A2 (en) * | 2010-01-08 | 2011-07-14 | Kla-Tencor Corporation | Dual tray carrier unit |
WO2011084972A3 (en) * | 2010-01-08 | 2011-11-24 | Kla-Tencor Corporation | Dual tray carrier unit |
CN102939647A (zh) * | 2010-01-08 | 2013-02-20 | 克拉-坦科股份有限公司 | 双托盘托架单元 |
CN102939647B (zh) * | 2010-01-08 | 2015-09-02 | 克拉-坦科股份有限公司 | 双托盘托架单元 |
KR101803111B1 (ko) | 2010-01-08 | 2017-11-29 | 케이엘에이-텐코 코포레이션 | 이중 트레이 캐리어 유닛 |
US9435826B2 (en) | 2012-05-08 | 2016-09-06 | Kla-Tencor Corporation | Variable spacing four-point probe pin device and method |
CN109160210A (zh) * | 2018-09-25 | 2019-01-08 | 中国建材国际工程集团有限公司 | 板材存储输送系统及其使用方法 |
CN109160210B (zh) * | 2018-09-25 | 2024-06-07 | 中国建材国际工程集团有限公司 | 板材存储输送系统及其使用方法 |
CN111848218A (zh) * | 2020-07-30 | 2020-10-30 | 固安浩瀚光电科技有限公司 | 一种半导体陶瓷组装包装装置及其使用方法 |
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TWI370798B (en) | 2012-08-21 |
WO2010005246A9 (ko) | 2010-07-08 |
WO2010005246A3 (ko) | 2010-04-29 |
JP2011527823A (ja) | 2011-11-04 |
TW201006748A (en) | 2010-02-16 |
WO2010005246A2 (ko) | 2010-01-14 |
CN102113108A (zh) | 2011-06-29 |
CN102113108B (zh) | 2013-07-10 |
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