KR100875338B1 - 처리액 공급장치 - Google Patents
처리액 공급장치 Download PDFInfo
- Publication number
- KR100875338B1 KR100875338B1 KR1020070059321A KR20070059321A KR100875338B1 KR 100875338 B1 KR100875338 B1 KR 100875338B1 KR 1020070059321 A KR1020070059321 A KR 1020070059321A KR 20070059321 A KR20070059321 A KR 20070059321A KR 100875338 B1 KR100875338 B1 KR 100875338B1
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- South Korea
- Prior art keywords
- processing liquid
- nozzle
- pump
- time
- liquid supply
- Prior art date
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- 239000012530 fluid Substances 0.000 title description 2
- 239000007788 liquid Substances 0.000 claims abstract description 50
- 238000012545 processing Methods 0.000 claims abstract description 36
- 238000000034 method Methods 0.000 claims description 19
- 230000000630 rising effect Effects 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 238000007599 discharging Methods 0.000 claims description 3
- 238000003860 storage Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 7
- 230000008859 change Effects 0.000 abstract description 3
- 230000010354 integration Effects 0.000 abstract description 3
- 238000004064 recycling Methods 0.000 abstract description 2
- 230000004044 response Effects 0.000 abstract description 2
- 238000005259 measurement Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000006872 improvement Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000011550 stock solution Substances 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000010865 sewage Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
Description
초기값 | 1000장째 | |
종래의 장치 | 2500~3000 | 2000~2500 |
본 발명 | 2985~3015 | 2985~3015 |
Claims (5)
- 처리액 저류탱크, 처리액을 공급하는 펌프, 처리액을 토출하는 노즐을 가지는 처리액 공급장치에 있어서, 이 처리액 공급장치는 상기 노즐로부터의 처리액의 토출량을 정량화하기 위해, 디스펜스의 ON/OFF 실행시에 ON 초기 토출시부터 토출되는 처리액의 토출량을 적산하는 유량 적산이 가능한 유량계를 구비하고, 이 유량계는 노즐로부터의 토출량에 따라서 펌프의 회전수를 가변시키는 피드백 시스템을 가지며,상기 피드백 시스템은 서보모터 제어에 의해서 펌프 상승시의 유량제어를 행할 때, 기정 시간까지는 PID 고정수 제어를 사용하고, 그 후에 적산유량이 일정해지도록 서보모터의 회전수를 제어하며, 토출시의 펌프 회전수를 제어하는 경우에, 상승, 일정속, 하강시에 있어서 일정 속도의 순시 유량과 전체 토출량의 적산량을 인식 및 계수하는 것을 특징으로 하는 처리액 공급장치.
- 삭제
- 삭제
- 처리액 저류탱크, 처리액을 공급하는 펌프, 처리액을 토출하는 노즐을 가지는 처리액 공급장치에 있어서, 이 처리액 공급장치는 상기 노즐로부터의 처리액의 토출량을 정량화하기 위해, 디스펜스의 ON/OFF 실행시에 ON 초기 토출시부터 토출되는 처리액의 토출량을 적산하는 유량 적산이 가능한 유량계를 구비하고, 이 유량계는 노즐로부터의 토출량에 따라서 펌프의 회전수를 가변시키는 피드백 시스템을 가지며,상기 피드백 시스템은 서보모터 제어에 의해서 펌프 상승시의 유량제어를 행할 때, 기정 시간까지는 PID 고정수 제어를 사용하고, 그 후에 적산유량이 일정해지도록 서보모터의 회전수를 제어하며, 탱크와 노즐 사이에 필터를 설치하고, 상기 필터에 처리액 통과시의 저항이 변동되어 디스펜스량이 변동되었을 때, 필터 등의 교환시기를 자동 인식할 수 있는 시스템을 병용한 것을 특징으로 하는 처리액 공급장치.
- 제1항의 처리액 공급장치에 있어서, 상기 유량계는 전자식, 초음파식, 회전식 중 어느 하나인 것을 특징으로 하는 처리액 공급장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2006-00168365 | 2006-06-19 | ||
JP2006168365A JP4863782B2 (ja) | 2006-06-19 | 2006-06-19 | 処理液供給装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070120434A KR20070120434A (ko) | 2007-12-24 |
KR100875338B1 true KR100875338B1 (ko) | 2008-12-22 |
Family
ID=38860344
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070059321A KR100875338B1 (ko) | 2006-06-19 | 2007-06-18 | 처리액 공급장치 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7717295B2 (ko) |
JP (1) | JP4863782B2 (ko) |
KR (1) | KR100875338B1 (ko) |
CN (1) | CN101092957B (ko) |
TW (1) | TW200804682A (ko) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101639633B (zh) * | 2008-07-29 | 2012-02-29 | 和舰科技(苏州)有限公司 | 一种显影液供给管路 |
CN101738868B (zh) * | 2008-11-14 | 2012-07-25 | 沈阳芯源微电子设备有限公司 | 一种高精度光刻胶分配泵控制装置及其控制方法 |
WO2010146928A1 (ja) * | 2009-06-19 | 2010-12-23 | タツモ株式会社 | 基板用塗布装置 |
JP5533246B2 (ja) * | 2010-05-19 | 2014-06-25 | トヨタ自動車株式会社 | 塗布装置 |
JP5255660B2 (ja) * | 2011-01-18 | 2013-08-07 | 東京エレクトロン株式会社 | 薬液供給方法及び薬液供給システム |
US20180325342A1 (en) * | 2011-04-12 | 2018-11-15 | Diversey, Inc. | Cleaning device with single tank recycling system |
JP6074356B2 (ja) | 2013-12-18 | 2017-02-01 | 日東電工株式会社 | 塗工装置及び塗工膜の製造方法 |
CN104826775B (zh) * | 2015-03-09 | 2017-07-07 | 佛山市锦德机械设备有限公司 | 一种自动化制鞋生产线上的智能注胶供料方法及其系统 |
JP6007281B1 (ja) | 2015-04-16 | 2016-10-12 | 日東電工株式会社 | 塗工装置及び塗工膜の製造方法 |
JP6450650B2 (ja) * | 2015-06-16 | 2019-01-09 | 東京エレクトロン株式会社 | 処理装置、処理方法および記憶媒体 |
JP6915498B2 (ja) * | 2017-10-23 | 2021-08-04 | 東京エレクトロン株式会社 | ノズル待機装置、液処理装置及び液処理装置の運転方法並びに記憶媒体 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003053244A (ja) | 2001-08-17 | 2003-02-25 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
Family Cites Families (19)
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JPS5840170A (ja) * | 1981-08-31 | 1983-03-09 | Matsushita Electric Works Ltd | フロ−コ−タ−塗装機 |
JPS61147256A (ja) * | 1984-12-20 | 1986-07-04 | Fujitsu Ltd | スプレ−現像装置 |
CN85205330U (zh) * | 1985-12-09 | 1987-01-14 | 武汉市自动化研究所 | 插入式超声流量计 |
JPH03248330A (ja) * | 1990-02-26 | 1991-11-06 | Hitachi Maxell Ltd | 磁気記録媒体の製造方法 |
JP2580408B2 (ja) * | 1991-05-28 | 1997-02-12 | 橋本電機工業株式会社 | 接着剤混和物自動塗布装置 |
US5647386A (en) * | 1994-10-04 | 1997-07-15 | Entropic Systems, Inc. | Automatic precision cleaning apparatus with continuous on-line monitoring and feedback |
JP3426447B2 (ja) * | 1996-09-26 | 2003-07-14 | 敏弘 大海 | 自動給水装置 |
JPH10216605A (ja) * | 1997-01-31 | 1998-08-18 | Sony Corp | 薬液回転塗布装置 |
JPH11108708A (ja) * | 1997-09-30 | 1999-04-23 | Dainippon Screen Mfg Co Ltd | 流量測定装置および基板処理装置 |
CA2306973C (en) * | 1997-10-15 | 2004-12-07 | Mitsui Mining & Smelting Co., Ltd. | Flow rate sensor, flow meter, and discharge rate control apparatus for liquid discharge machines |
CN2367378Y (zh) * | 1999-03-30 | 2000-03-08 | 林庆雄 | 具有滤芯更换显示机构的过滤装置 |
JP4486222B2 (ja) * | 2000-06-02 | 2010-06-23 | 本田技研工業株式会社 | 粘性材料の塗布装置 |
US6524463B2 (en) * | 2001-07-16 | 2003-02-25 | Technic, Inc. | Method of processing wafers and other planar articles within a processing cell |
JP4894109B2 (ja) * | 2001-08-27 | 2012-03-14 | 大日本印刷株式会社 | ダイコート制御方法 |
US7654414B2 (en) * | 2002-02-07 | 2010-02-02 | Pall Corporation | Liquids dispensing systems and methods |
JP3866194B2 (ja) | 2002-12-20 | 2007-01-10 | 株式会社ハルテック | 鋼トラスウエブpc橋の格点構造 |
JP2006007075A (ja) * | 2004-06-24 | 2006-01-12 | Nagase & Co Ltd | 薬液供給管理装置 |
JP4422006B2 (ja) * | 2004-12-08 | 2010-02-24 | 東京エレクトロン株式会社 | 処理装置及び処理液供給方法及び処理液供給プログラム |
US7431015B2 (en) * | 2006-01-31 | 2008-10-07 | Honeywell International Inc. | Fuel metering system proportional bypass valve error compensation system and method |
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2006
- 2006-06-19 JP JP2006168365A patent/JP4863782B2/ja active Active
-
2007
- 2007-05-29 TW TW096119177A patent/TW200804682A/zh not_active IP Right Cessation
- 2007-06-14 CN CN2007101111849A patent/CN101092957B/zh active Active
- 2007-06-18 KR KR1020070059321A patent/KR100875338B1/ko active IP Right Grant
- 2007-06-19 US US11/820,430 patent/US7717295B2/en active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003053244A (ja) | 2001-08-17 | 2003-02-25 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
Also Published As
Publication number | Publication date |
---|---|
CN101092957A (zh) | 2007-12-26 |
JP4863782B2 (ja) | 2012-01-25 |
TWI336370B (ko) | 2011-01-21 |
US20070289529A1 (en) | 2007-12-20 |
KR20070120434A (ko) | 2007-12-24 |
US7717295B2 (en) | 2010-05-18 |
JP2007330935A (ja) | 2007-12-27 |
CN101092957B (zh) | 2011-06-15 |
TW200804682A (en) | 2008-01-16 |
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