KR100873835B1 - 프린트배선판 및 그 제조방법 - Google Patents
프린트배선판 및 그 제조방법 Download PDFInfo
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- KR100873835B1 KR100873835B1 KR1020067017008A KR20067017008A KR100873835B1 KR 100873835 B1 KR100873835 B1 KR 100873835B1 KR 1020067017008 A KR1020067017008 A KR 1020067017008A KR 20067017008 A KR20067017008 A KR 20067017008A KR 100873835 B1 KR100873835 B1 KR 100873835B1
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Abstract
Description
Claims (17)
- 절연기판의 표면에 도체회로를 형성하고,이어서, 상기 절연기판의 표면에 열경화형수지로 된 솔더레지스터를 인쇄하고,이어서, 그 솔더레지스터를 열경화시켜, 100 ppm/℃ 이하의 열팽장계수를 가지는 절연피막을 형성하고,계속해서, 그 절연피막에서의 개구부형성부분에 레이저를 조사해서, 상기 개구부형성부분의 절연피막을 달구어 끊어 개구부를 형성하는 것에 의해, 도체회로의 상면의 일부를 노출시키며,상기 레이저를 조사한 후에는 노출한 도체회로의 표면에 데스미어처리를 행하는 것을 특징으로 하는 프린트배선판의 제조방법.
- 제 1 항에 있어서,상기 솔더레지스터는 에폭시수지, 트리아진 수지, 폴리이미드수지, 또는 그들 변성물의 어느 것으로 되는 것을 특징으로 하는 프린트배선판의 제조방법.
- 제 1 항 또는 2 항에 있어서,상기 절연피막에서의 개구부 형성부분에 레이저를 조사한 후에는, 노출한 도체회로의 표면에 금속도금막을 형성하는 것을 특징으로 하는 프린트배선판의 제조방법.
- 삭제
- 제 1 항에 있어서,상기 솔더레지스터는 열경화성수지로부터 이루어지는 것을 특징으로 하는 프린트배선판의 제조방법.
- 절연기판의 상면에 도통용공형성부분을 둘러싸도록 그 주위에 상면패턴을 형성함과 동시에, 상기 절연기판의 하면에 상기 도통용공형성부분을 덮어씌우듯한 하면패턴을 형성하고,이어서, 상기 절연기판의 도통용공형성부분에 상기 절연기판을 관통하고 또한 상기 하면패턴의 상면에 달하는 도통용공을 형성하고,계속해서, 상기 도통용공의 내부에 금속을 충전해서 금속충전재를 형성함에 의하여, 그 금속충전재를 개재하여 상기 상면패턴과 상기 하면패턴을 전기적으로 도통시키는 것을 특징으로 하는 프린트배선판의 제조방법.
- 제 6 항에 있어서,상기 도통용공의 형성은 절연기판의 도통용공형성부분에 레이저광을 조사함에 의하여 행해지는 것을 특징으로 하는 프린트배선판의 제조방법.
- 제 6 항에 있어서,상기 도통용공의 내부에 금속을 충전하기 전에는, 상기 절연기판의 상면에 상기 도통용공을 제외하고 레지스터막을 피복하는 것을 특징으로 하는 프린트배선판의 제조방법.
- 삭제
- 제 6 항에 있어서,상기 도통용공의 내부로의 금속충전은, 상기 도통용공의 내부에 있어서, 상기 하면패턴의 상면에 전기적으로 도금층을 퇴적시키는 것에 의해 행하는 것을 특징으로 하는 프린트배선판의 제조방법.
- 제 8 항에 있어서,상기 레지스터막은 열경화형 수지로 이루어지는 것을 특징으로 하는 프린트배선판의 제조방법.
- 절연기판;상기 절연기판의 표면에 형성된 도체회로;상기 절연기판의 표면에 인쇄된 열경화형수지로 된 솔더레지스터;상기 솔더레지스터를 열경화시켜 형성되며, 100 ppm/℃ 이하의 열팽장계수를 가지는 절연피막; 및상기 절연피막에 레이저의 조사에 의하여 형성되는 개구부를 포함하고,상기 개구부를 통하여 상기 도체회로의 상면의 일부가 노출되며,상기 개구부는 개구부형성부분에 레이저를 조사해서, 상기 절연피막에서의 개구부형성부분의 절연피막을 달구어 끊어 형성되고,상기 레이저를 조사한 후에는 노출한 도체회로의 표면에 데스미어처리를 행하여 형성되는 것을 특징으로 하는 프린트배선판.
- 절연기판;상기 절연기판의 상면에 도통용공형성부분을 둘러싸도록 그 주위에 형성되는 상면패턴;상기 절연기판의 하면에 상기 도통용공형성부분을 덮어씌우는 듯이 형성되는 하면패턴;상기 절연기판의 도통용공형성부분에 상기 절연기판을 관통하고 또한 상기 하면패턴의 상면에 도달하도록 형성되는 도통용공; 및상기 도통용공의 내부에 금속을 충전하여 형성되는 금속충전재를 포함하고,상기 금속충전재를 개재하여 상기 상면패턴과 상기 하면패턴이 전기적으로 도통되며,상기 상면패턴과 상기 하면패턴은 동시에 형성되는 것을 특징으로 하는 프린트배선판.
- 제 13 항에 있어서,상기 도통용공은 상기 절연기판의 도통용공형성부분에 레이저광을 조사함에 의하여 형성되는 것을 특징으로 하는 프린트배선판.
- 제 13 항에 있어서,상기 금속충전재는,상기 도통용공의 내부에 금속을 충전하기 전에, 상기 절연기판의 상면에 상기 도통용공을 제외하고 레지스터막을 피복하여 형성되는 것을 특징으로 하는 프린트배선판.
- 제 13 항에 있어서,상기 금속충전재는,상기 도통용공의 내부에 있어서, 상기 하면패턴의 상면에 전기적으로 도금층을 퇴적시키는 것에 의해 형성되는 것을 특징으로 하는 프린트배선판.
- 제 15 항에 있어서,상기 레지스터막은 열경화형 수지로 이루어지는 것을 특징으로 하는 프린트 배선판.
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
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JP6213197 | 1997-02-28 | ||
JPJP-P-1997-00062131 | 1997-02-28 | ||
JP6550997 | 1997-03-03 | ||
JPJP-P-1997-00065509 | 1997-03-03 | ||
JPJP-P-1997-00361961 | 1997-12-09 | ||
JP36196197A JP3633252B2 (ja) | 1997-01-10 | 1997-12-09 | プリント配線板及びその製造方法 |
PCT/JP1998/000007 WO1998031204A1 (en) | 1997-01-10 | 1998-01-05 | Printed wiring board and method of manufacturing the same |
Related Parent Applications (1)
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KR1019997006199A Division KR100691297B1 (ko) | 1997-02-28 | 1998-01-05 | 프린트배선판및 그 제조방법 |
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KR20060103351A KR20060103351A (ko) | 2006-09-28 |
KR100873835B1 true KR100873835B1 (ko) | 2008-12-15 |
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KR1020067017008A KR100873835B1 (ko) | 1997-02-28 | 1998-01-05 | 프린트배선판 및 그 제조방법 |
KR1019997006199A KR100691297B1 (ko) | 1997-02-28 | 1998-01-05 | 프린트배선판및 그 제조방법 |
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KR1019997006199A KR100691297B1 (ko) | 1997-02-28 | 1998-01-05 | 프린트배선판및 그 제조방법 |
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EP (2) | EP0966185B1 (ko) |
KR (2) | KR100873835B1 (ko) |
DE (1) | DE69837840T2 (ko) |
Families Citing this family (8)
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KR100855530B1 (ko) | 1998-09-03 | 2008-09-01 | 이비덴 가부시키가이샤 | 다층프린트배선판 및 그 제조방법 |
JP2002359459A (ja) * | 2001-06-01 | 2002-12-13 | Nec Corp | 電子部品の実装方法、プリント配線基板および実装構造体 |
KR100791353B1 (ko) * | 2005-05-20 | 2008-01-07 | 삼성전기주식회사 | 영구보호피막의 형성방법 및 영구보호피막이 형성된인쇄회로기판 |
KR100633855B1 (ko) * | 2005-09-22 | 2006-10-16 | 삼성전기주식회사 | 캐비티가 형성된 기판 제조 방법 |
CN106856651A (zh) * | 2016-12-20 | 2017-06-16 | 太仓市天丝利塑化有限公司 | 一种环保型高上粉性液晶显示器金属外壳及静电喷涂工艺 |
CN112911819A (zh) * | 2019-11-19 | 2021-06-04 | 同扬光电(江苏)有限公司 | 线路板及其制作方法、发光装置及其制作方法 |
CN112055458A (zh) * | 2020-10-13 | 2020-12-08 | 深圳光富照明有限公司 | 一种led电路板制造方法 |
CN113660790B (zh) * | 2021-08-13 | 2022-09-13 | 博敏电子股份有限公司 | 一种采用激光烧蚀返工阻焊显影不良的方法 |
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US3385773A (en) * | 1965-05-28 | 1968-05-28 | Buckbee Mears Co | Process for making solid electrical connection through a double-sided printed circuitboard |
US4290195A (en) * | 1978-09-01 | 1981-09-22 | Rippere Ralph E | Methods and articles for making electrical circuit connections employing composition material |
FR2498873A1 (fr) * | 1981-01-23 | 1982-07-30 | Sev Alternateurs | Procede de fabrication de circuits imprimes |
DE3430290A1 (de) * | 1984-08-17 | 1986-02-27 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zur selektiven metallisierung |
JPH0716094B2 (ja) * | 1986-03-31 | 1995-02-22 | 日立化成工業株式会社 | 配線板の製造法 |
US4935584A (en) * | 1988-05-24 | 1990-06-19 | Tektronix, Inc. | Method of fabricating a printed circuit board and the PCB produced |
JPH03173497A (ja) * | 1989-12-01 | 1991-07-26 | Hitachi Cable Ltd | 多層配線基板およびその製造方法 |
JPH045844A (ja) * | 1990-04-23 | 1992-01-09 | Nippon Mektron Ltd | Ic搭載用多層回路基板及びその製造法 |
JPH05152750A (ja) * | 1991-09-26 | 1993-06-18 | Nec Corp | 多層配線基板の製造方法 |
US5315072A (en) * | 1992-01-27 | 1994-05-24 | Hitachi Seiko, Ltd. | Printed wiring board having blind holes |
EP0568313A2 (en) * | 1992-05-01 | 1993-11-03 | Nippon CMK Corp. | A method of manufacturing a multilayer printed wiring board |
JPH0828580B2 (ja) * | 1993-04-21 | 1996-03-21 | 日本電気株式会社 | 配線基板構造及びその製造方法 |
US5567295A (en) * | 1994-01-11 | 1996-10-22 | Dell Usa L.P. | Method and apparatus for making staggered blade edge connectors |
GB9401869D0 (en) * | 1994-02-01 | 1994-03-30 | Heinze Dyconex Patente | Improvements in and relating to printed circuit boards |
JP3400067B2 (ja) * | 1994-03-16 | 2003-04-28 | 富士通株式会社 | 印刷配線板の導体切断方法及び装置 |
JPH08279678A (ja) * | 1995-04-04 | 1996-10-22 | Matsushita Electric Works Ltd | 多層プリント配線板の製造方法 |
-
1998
- 1998-01-05 KR KR1020067017008A patent/KR100873835B1/ko not_active IP Right Cessation
- 1998-01-05 DE DE69837840T patent/DE69837840T2/de not_active Expired - Lifetime
- 1998-01-05 EP EP98900044A patent/EP0966185B1/en not_active Expired - Lifetime
- 1998-01-05 EP EP06003856A patent/EP1667502B1/en not_active Expired - Lifetime
- 1998-01-05 KR KR1019997006199A patent/KR100691297B1/ko not_active IP Right Cessation
Also Published As
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EP0966185A4 (en) | 2004-08-25 |
EP1667502B1 (en) | 2013-03-13 |
EP0966185B1 (en) | 2007-05-30 |
KR100691297B1 (ko) | 2007-03-12 |
KR20000069984A (ko) | 2000-11-25 |
DE69837840D1 (de) | 2007-07-12 |
DE69837840T2 (de) | 2008-01-24 |
EP1667502A3 (en) | 2007-07-25 |
EP1667502A2 (en) | 2006-06-07 |
EP0966185A1 (en) | 1999-12-22 |
KR20060103351A (ko) | 2006-09-28 |
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