KR100865835B1 - 발광다이오드 반사 커버 성형 방법, 그 구조, 및 상기 반사커버를 이용한 발광다이오드 적재장치 - Google Patents

발광다이오드 반사 커버 성형 방법, 그 구조, 및 상기 반사커버를 이용한 발광다이오드 적재장치

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Publication number
KR100865835B1
KR100865835B1 KR1020070024553A KR20070024553A KR100865835B1 KR 100865835 B1 KR100865835 B1 KR 100865835B1 KR 1020070024553 A KR1020070024553 A KR 1020070024553A KR 20070024553 A KR20070024553 A KR 20070024553A KR 100865835 B1 KR100865835 B1 KR 100865835B1
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KR
South Korea
Prior art keywords
opening pattern
green sheet
ceramic
opening
sheet structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020070024553A
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English (en)
Korean (ko)
Other versions
KR20070094480A (ko
Inventor
첸 싱 창
정 쉬우 쉬에
쿠오 후 첸
민 리 리
Original Assignee
엘리트 파인 세라믹스 컴퍼니 리미티드
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Publication of KR20070094480A publication Critical patent/KR20070094480A/ko
Application granted granted Critical
Publication of KR100865835B1 publication Critical patent/KR100865835B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
    • F21S41/37—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors characterised by their material, surface treatment or coatings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
    • F21V7/24—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
    • F21V7/28—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
KR1020070024553A 2006-03-17 2007-03-13 발광다이오드 반사 커버 성형 방법, 그 구조, 및 상기 반사커버를 이용한 발광다이오드 적재장치 Expired - Fee Related KR100865835B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
TW095109289 2006-03-17
TW95109289 2006-03-17
TW095136209A TW200737430A (en) 2006-03-17 2006-09-29 Method for forming light emitting diode reflector, structure thereof, and light emitting diode mounting device using reflector
TW095136209 2006-09-29

Publications (2)

Publication Number Publication Date
KR20070094480A KR20070094480A (ko) 2007-09-20
KR100865835B1 true KR100865835B1 (ko) 2008-10-29

Family

ID=38375093

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070024553A Expired - Fee Related KR100865835B1 (ko) 2006-03-17 2007-03-13 발광다이오드 반사 커버 성형 방법, 그 구조, 및 상기 반사커버를 이용한 발광다이오드 적재장치

Country Status (5)

Country Link
US (1) US7695581B2 (enrdf_load_stackoverflow)
JP (1) JP2007251154A (enrdf_load_stackoverflow)
KR (1) KR100865835B1 (enrdf_load_stackoverflow)
DE (1) DE102007008108B4 (enrdf_load_stackoverflow)
TW (1) TW200737430A (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200930948A (en) * 2007-10-09 2009-07-16 Koninkl Philips Electronics Nv Light emitting device package, light output system and light output method
CN102163655A (zh) * 2010-12-31 2011-08-24 东莞市万丰纳米材料有限公司 Led封装模块制备方法
JP5700544B2 (ja) * 2011-04-14 2015-04-15 日東電工株式会社 発光ダイオード装置の製造方法
CN103035813B (zh) * 2011-10-09 2015-10-28 官淑燕 高温元件用电路基板及具该基板的led组件及其制法
DE102012109139A1 (de) * 2012-09-27 2014-03-27 Osram Opto Semiconductors Gmbh Gehäuse für ein optoelektronisches Bauelement, Elektronische Baugruppe, Verfahren zum Herstellen von Gehäusen und Verfahren zum Herstellen elektronischer Baugruppen
JP2016184653A (ja) * 2015-03-26 2016-10-20 京セラ株式会社 発光素子収納用パッケージおよび発光装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070087751A (ko) * 2005-10-17 2007-08-29 주식회사 아이엠텍 곡면으로 된 반사면을 구비한 발광다이오드용 패키지 및 그제조방법
KR20070090062A (ko) * 2006-03-01 2007-09-05 엘리트 파인 세라믹스 컴퍼니 리미티드 발광 다이오드 반사 커버의 형성 방법과 그 구조 및 상기반사 커버를 바탕으로 하는 발광 다이오드 탑재 장치

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5538582A (en) * 1994-09-14 1996-07-23 International Business Machines Corporation Method for forming cavities without using an insert
JP3832877B2 (ja) * 1995-07-26 2006-10-11 日亜化学工業株式会社 セラミックスｌｅｄパッケージおよびその製造方法
EP0926744B8 (en) * 1997-12-15 2008-05-21 Philips Lumileds Lighting Company, LLC. Light emitting device
KR100419611B1 (ko) * 2001-05-24 2004-02-25 삼성전기주식회사 발광다이오드 및 이를 이용한 발광장치와 그 제조방법
US6531328B1 (en) * 2001-10-11 2003-03-11 Solidlite Corporation Packaging of light-emitting diode
KR100439402B1 (ko) * 2001-12-24 2004-07-09 삼성전기주식회사 발광다이오드 패키지
US7095053B2 (en) * 2003-05-05 2006-08-22 Lamina Ceramics, Inc. Light emitting diodes packaged for high temperature operation
JP2006032804A (ja) * 2004-07-20 2006-02-02 Koha Co Ltd 発光装置およびその製造方法
JP4659421B2 (ja) * 2004-09-30 2011-03-30 株式会社トクヤマ 発光素子収納用パッケージの製造方法
KR101154801B1 (ko) * 2004-12-03 2012-07-03 엔지케이 스파크 플러그 캄파니 리미티드 세라믹 기판 및 발광 소자 수납용 세라믹 패키지
JP2006181779A (ja) * 2004-12-27 2006-07-13 Sumitomo Metal Electronics Devices Inc セラミック基板の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070087751A (ko) * 2005-10-17 2007-08-29 주식회사 아이엠텍 곡면으로 된 반사면을 구비한 발광다이오드용 패키지 및 그제조방법
KR20070090062A (ko) * 2006-03-01 2007-09-05 엘리트 파인 세라믹스 컴퍼니 리미티드 발광 다이오드 반사 커버의 형성 방법과 그 구조 및 상기반사 커버를 바탕으로 하는 발광 다이오드 탑재 장치

Also Published As

Publication number Publication date
US7695581B2 (en) 2010-04-13
US20070263389A1 (en) 2007-11-15
JP2007251154A (ja) 2007-09-27
DE102007008108A1 (de) 2007-09-20
TWI329912B (enrdf_load_stackoverflow) 2010-09-01
KR20070094480A (ko) 2007-09-20
TW200737430A (en) 2007-10-01
DE102007008108B4 (de) 2011-07-14

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