KR100838434B1 - 프로브 카드 - Google Patents

프로브 카드 Download PDF

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Publication number
KR100838434B1
KR100838434B1 KR1020060094797A KR20060094797A KR100838434B1 KR 100838434 B1 KR100838434 B1 KR 100838434B1 KR 1020060094797 A KR1020060094797 A KR 1020060094797A KR 20060094797 A KR20060094797 A KR 20060094797A KR 100838434 B1 KR100838434 B1 KR 100838434B1
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KR
South Korea
Prior art keywords
probe
wafer
contact
electrode
contact terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020060094797A
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English (en)
Korean (ko)
Other versions
KR20070038410A (ko
Inventor
스스무 가스까베
데루오 쇼지
아끼오 하세베
요시노리 데구찌
야스노리 나리즈까
Original Assignee
가부시끼가이샤 르네사스 테크놀로지
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of KR20070038410A publication Critical patent/KR20070038410A/ko
Application granted granted Critical
Publication of KR100838434B1 publication Critical patent/KR100838434B1/ko
Expired - Fee Related legal-status Critical Current
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
KR1020060094797A 2005-10-05 2006-09-28 프로브 카드 Expired - Fee Related KR100838434B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2005-00291886 2005-10-05
JP2005291886A JP2007101373A (ja) 2005-10-05 2005-10-05 プローブシート接着ホルダ、プローブカード、半導体検査装置および半導体装置の製造方法

Publications (2)

Publication Number Publication Date
KR20070038410A KR20070038410A (ko) 2007-04-10
KR100838434B1 true KR100838434B1 (ko) 2008-06-16

Family

ID=38003119

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060094797A Expired - Fee Related KR100838434B1 (ko) 2005-10-05 2006-09-28 프로브 카드

Country Status (5)

Country Link
US (1) US7423439B2 (https=)
JP (1) JP2007101373A (https=)
KR (1) KR100838434B1 (https=)
CN (1) CN1952667A (https=)
TW (1) TW200730828A (https=)

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JP2005136246A (ja) * 2003-10-31 2005-05-26 Renesas Technology Corp 半導体集積回路装置の製造方法
JP5005195B2 (ja) * 2005-07-13 2012-08-22 東京エレクトロン株式会社 プローブカード製造方法
JP2007101373A (ja) * 2005-10-05 2007-04-19 Renesas Technology Corp プローブシート接着ホルダ、プローブカード、半導体検査装置および半導体装置の製造方法
JP4800007B2 (ja) 2005-11-11 2011-10-26 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法およびプローブカード
TWI276806B (en) * 2005-11-15 2007-03-21 Wintek Corp Thin-film probe card
US8248091B2 (en) * 2006-10-20 2012-08-21 Taiwan Semiconductor Manufacturing Co., Ltd. Universal array type probe card design for semiconductor device testing
JP2008151573A (ja) * 2006-12-15 2008-07-03 Micronics Japan Co Ltd 電気的接続装置およびその製造方法
JP5065674B2 (ja) * 2006-12-28 2012-11-07 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
JP2009204393A (ja) * 2008-02-27 2009-09-10 Renesas Technology Corp プローブカード、プローブカードの製造方法、半導体検査装置および半導体装置の製造方法
KR101232691B1 (ko) * 2008-02-29 2013-02-13 니혼 하츠쵸 가부시키가이샤 배선기판 및 프로브 카드
JP5503189B2 (ja) * 2009-05-14 2014-05-28 東京エレクトロン株式会社 プローブカード
DE202009007039U1 (de) 2009-05-15 2010-10-14 Stabilo International Gmbh Verschlusskappe
JP5381609B2 (ja) * 2009-10-20 2014-01-08 日本電産リード株式会社 検査用治具及び接触子
DE202010006061U1 (de) * 2010-04-23 2010-07-22 Helmut Fischer GmbH Institut für Elektronik und Messtechnik Messsonde zur zerstörungsfreien Messung der Dicke dünner Schichten
TWI435083B (zh) * 2010-07-27 2014-04-21 Mpi Corp Combination probe head for vertical probe card and its assembly alignment method
US8814601B1 (en) 2011-06-06 2014-08-26 Nuvotronics, Llc Batch fabricated microconnectors
JP6040530B2 (ja) * 2012-01-17 2016-12-07 セイコーエプソン株式会社 ハンドラーおよび検査装置
US9685717B2 (en) * 2012-03-14 2017-06-20 R+D Sockets, Inc. Apparatus and method for a conductive elastomer on a coaxial cable or a microcable to improve signal integrity probing
TWI510788B (zh) * 2014-01-13 2015-12-01 Taiwan Elite Nano Technology Corp 探針結構及其製造方法
WO2015109208A2 (en) 2014-01-17 2015-07-23 Nuvotronics, Llc Wafer scale test interface unit: low loss and high isolation devices and methods for high speed and high density mixed signal interconnects and contactors
CN103901240B (zh) * 2014-03-24 2017-05-24 上海华力微电子有限公司 探针卡识别芯片安装方法
US10003149B2 (en) 2014-10-25 2018-06-19 ComponentZee, LLC Fluid pressure activated electrical contact devices and methods
US9577358B2 (en) * 2014-10-25 2017-02-21 ComponentZee, LLC Fluid pressure activated electrical contact devices and methods
JP6626254B2 (ja) * 2015-02-03 2019-12-25 株式会社テセック 半導体デバイス測定方法
KR101726399B1 (ko) * 2016-03-17 2017-04-13 주식회사 오킨스전자 바텀 메탈 플레이트 범프를 포함하는 테스트 소켓 및 그 제조 방법
DE102017209443A1 (de) * 2017-06-02 2018-12-06 Feinmetall Gmbh Kontaktmodul zur elektrischen Berührungskontaktierung eines Bauteils und Kontaktsystem
EP3651561B1 (en) * 2017-07-04 2022-02-09 Fuji Corporation Component mounting device
NL2021552B1 (en) * 2018-09-03 2020-04-30 Besi Netherlands Bv Method and device for selective separating electronic components from a frame with electronic components
KR102062471B1 (ko) * 2018-12-26 2020-01-03 고기돈 Ｒｆ 칩 테스트를 위한 버티컬 프루브를 구비한 필름 타입 프루브 카드
JP1666045S (https=) 2019-01-25 2020-08-17
WO2020191295A1 (en) * 2019-03-20 2020-09-24 Celadon Systems, Inc. Portable probe card assembly
CN112649711B (zh) * 2019-10-12 2022-04-15 成都辰显光电有限公司 微发光二极管的检测装置及方法
WO2023032036A1 (ja) * 2021-08-31 2023-03-09 信越エンジニアリング株式会社 通電検査装置及び通電検査方法
US12052830B2 (en) 2021-12-06 2024-07-30 Advantest America, Inc. Method and process for creating high-performance coax sockets
US20250237697A1 (en) * 2024-01-22 2025-07-24 Essai, Inc. Systems and methods for tool-less, quick change elastomeric contact interfaces for integrated circuit testing

Citations (5)

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US5818246A (en) * 1996-05-07 1998-10-06 Zhong; George Guozhen Automatic multi-probe PWB tester
US5825192A (en) * 1995-07-14 1998-10-20 Tokyo Electron Limited Probe card device used in probing apparatus
KR20000035254A (ko) * 1998-11-05 2000-06-26 가나이 쓰토무 접속 장치 및 압착 부재가 부착된 배선 필름의 제조 방법및 검사 시스템 및 반도체 소자의 제조 방법
US6215321B1 (en) * 1997-11-25 2001-04-10 Matsushita Electric Industrial Co., Ltd. Probe card for wafer-level measurement, multilayer ceramic wiring board, and fabricating methods therefor
US6586955B2 (en) * 2000-03-13 2003-07-01 Tessera, Inc. Methods and structures for electronic probing arrays

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US4774462A (en) * 1984-06-11 1988-09-27 Black Thomas J Automatic test system
US4696849A (en) * 1985-09-16 1987-09-29 The Dow Chemical Company Process for preparing polyurethane-backed textiles
JP2539453B2 (ja) 1987-09-11 1996-10-02 株式会社日立製作所 半導体素子検査装置
US5012187A (en) * 1989-11-03 1991-04-30 Motorola, Inc. Method for parallel testing of semiconductor devices
JP2966671B2 (ja) 1991-11-18 1999-10-25 東京エレクトロン株式会社 プローブカード
JP3502874B2 (ja) 1994-06-03 2004-03-02 株式会社ルネサステクノロジ 接続装置およびその製造方法
EP0707214A3 (en) * 1994-10-14 1997-04-16 Hughes Aircraft Co Multiport membrane probe to test complete semiconductor plates
US5642054A (en) * 1995-08-08 1997-06-24 Hughes Aircraft Company Active circuit multi-port membrane probe for full wafer testing
JPH1038924A (ja) 1996-07-25 1998-02-13 Advantest Corp プローブカード
JP3315339B2 (ja) 1997-05-09 2002-08-19 株式会社日立製作所 半導体素子の製造方法並びに半導体素子へのプロービング方法およびその装置
DE10039336C2 (de) * 2000-08-04 2003-12-11 Infineon Technologies Ag Verfahren zum Testen von Halbleiterschaltungen und Testvorrichtung zur Durchführung des Verfahrens
US6690184B1 (en) * 2000-08-31 2004-02-10 Micron Technology, Inc. Air socket for testing integrated circuits
TWI236723B (en) * 2002-10-02 2005-07-21 Renesas Tech Corp Probe sheet, probe card, semiconductor inspection device, and manufacturing method for semiconductor device
JP4465995B2 (ja) 2003-07-02 2010-05-26 株式会社日立製作所 プローブシート、プローブカード、半導体検査装置および半導体装置の製造方法
JP2007101373A (ja) * 2005-10-05 2007-04-19 Renesas Technology Corp プローブシート接着ホルダ、プローブカード、半導体検査装置および半導体装置の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5825192A (en) * 1995-07-14 1998-10-20 Tokyo Electron Limited Probe card device used in probing apparatus
US5818246A (en) * 1996-05-07 1998-10-06 Zhong; George Guozhen Automatic multi-probe PWB tester
US6215321B1 (en) * 1997-11-25 2001-04-10 Matsushita Electric Industrial Co., Ltd. Probe card for wafer-level measurement, multilayer ceramic wiring board, and fabricating methods therefor
KR20000035254A (ko) * 1998-11-05 2000-06-26 가나이 쓰토무 접속 장치 및 압착 부재가 부착된 배선 필름의 제조 방법및 검사 시스템 및 반도체 소자의 제조 방법
US6586955B2 (en) * 2000-03-13 2003-07-01 Tessera, Inc. Methods and structures for electronic probing arrays

Also Published As

Publication number Publication date
CN1952667A (zh) 2007-04-25
TWI313752B (https=) 2009-08-21
TW200730828A (en) 2007-08-16
JP2007101373A (ja) 2007-04-19
US20070103178A1 (en) 2007-05-10
KR20070038410A (ko) 2007-04-10
US7423439B2 (en) 2008-09-09

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