KR100821115B1 - 메모리 링크 처리용 온 더 플라이 빔 경로 에러 정정 방법 - Google Patents

메모리 링크 처리용 온 더 플라이 빔 경로 에러 정정 방법 Download PDF

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Publication number
KR100821115B1
KR100821115B1 KR1020037010793A KR20037010793A KR100821115B1 KR 100821115 B1 KR100821115 B1 KR 100821115B1 KR 1020037010793 A KR1020037010793 A KR 1020037010793A KR 20037010793 A KR20037010793 A KR 20037010793A KR 100821115 B1 KR100821115 B1 KR 100821115B1
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KR
South Korea
Prior art keywords
axis
processing
laser beam
high speed
link
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KR1020037010793A
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English (en)
Korean (ko)
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KR20030091990A (ko
Inventor
언래스마크
부룰랜드켈리
스와링겐스테펜
로호와이
Original Assignee
엘렉트로 사이언티픽 인더스트리즈 인코포레이티드
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Publication of KR20030091990A publication Critical patent/KR20030091990A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/101—Scanning systems with both horizontal and vertical deflecting means, e.g. raster or XY scanners
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
    • H01L23/5258—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive the change of state resulting from the use of an external beam, e.g. laser beam or ion beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Optical Scanning Systems (AREA)
  • Lasers (AREA)
KR1020037010793A 2001-02-16 2002-02-15 메모리 링크 처리용 온 더 플라이 빔 경로 에러 정정 방법 KR100821115B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US26964601P 2001-02-16 2001-02-16
US60/269,646 2001-02-16
PCT/US2002/004561 WO2002067180A1 (en) 2001-02-16 2002-02-15 On-the-fly beam path error correction for memory link processing

Publications (2)

Publication Number Publication Date
KR20030091990A KR20030091990A (ko) 2003-12-03
KR100821115B1 true KR100821115B1 (ko) 2008-04-11

Family

ID=23028100

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020037010793A KR100821115B1 (ko) 2001-02-16 2002-02-15 메모리 링크 처리용 온 더 플라이 빔 경로 에러 정정 방법

Country Status (8)

Country Link
JP (3) JP4397163B2 (zh)
KR (1) KR100821115B1 (zh)
CN (2) CN101172319A (zh)
CA (1) CA2438566A1 (zh)
DE (1) DE10296339T5 (zh)
GB (1) GB2390699B (zh)
TW (1) TW535199B (zh)
WO (1) WO2002067180A1 (zh)

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US6706999B1 (en) * 2003-02-24 2004-03-16 Electro Scientific Industries, Inc. Laser beam tertiary positioner apparatus and method
US7363180B2 (en) * 2005-02-15 2008-04-22 Electro Scientific Industries, Inc. Method for correcting systematic errors in a laser processing system
US7297972B2 (en) * 2005-08-26 2007-11-20 Electro Scientific Industries, Inc. Methods and systems for positioning a laser beam spot relative to a semiconductor integrated circuit using a processing target as a metrology target
US8026158B2 (en) * 2007-06-01 2011-09-27 Electro Scientific Industries, Inc. Systems and methods for processing semiconductor structures using laser pulses laterally distributed in a scanning window
US8378259B2 (en) * 2008-06-17 2013-02-19 Electro Scientific Industries, Inc. Eliminating head-to-head offsets along common chuck travel direction in multi-head laser machining systems
TWI523720B (zh) 2009-05-28 2016-03-01 伊雷克托科學工業股份有限公司 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法
WO2012054927A2 (en) * 2010-10-22 2012-04-26 Electro Scientific Industries, Inc. Laser processing systems and methods for beam dithering and skiving
JP6516722B2 (ja) 2013-03-15 2019-05-22 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド ビームポジショナのレーザ出射に基づく制御
KR102245812B1 (ko) * 2013-03-15 2021-04-30 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 Aod 이동 저감을 위한 aod 툴 정착을 위한 레이저 시스템 및 방법
CN111266741A (zh) * 2018-11-19 2020-06-12 深圳市圭华智能科技有限公司 激光加工系统及激光加工方法
JP7442351B2 (ja) * 2020-03-12 2024-03-04 株式会社ディスコ レーザー加工装置
EP4201577A4 (en) * 2020-08-18 2024-05-29 Nikon Corporation OPTICAL DEVICE AND PROCESSING DEVICE

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JPH089110B2 (ja) * 1988-03-03 1996-01-31 株式会社ニコン レーザ加工装置のレーザビーム制御方法
JP2942804B2 (ja) * 1988-03-03 1999-08-30 株式会社ニコン レーザ加工装置及びレーザ加工装置のレーザビーム制御方法
DE4000166A1 (de) * 1990-01-05 1991-07-11 Hell Rudolf Dr Ing Gmbh Verfahren und einrichtung zur korrektur von positionsfehlern eines abgelenkten lichtstrahls
US5673110A (en) * 1993-01-26 1997-09-30 Phase Metrics, Inc. Multiplexed laser interferometer for non-dispersed spectrum detection in a dynamic flying height tester
JPH08195461A (ja) * 1995-01-18 1996-07-30 Hitachi Constr Mach Co Ltd ダムバー加工方法及びダムバー加工装置
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JPH08316396A (ja) * 1995-05-16 1996-11-29 Hitachi Constr Mach Co Ltd ダムバー切断方法及びダムバー切断装置
JPH0970679A (ja) * 1995-09-07 1997-03-18 Nikon Corp レーザ加工装置の制御方法
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JP3769942B2 (ja) * 1997-09-02 2006-04-26 セイコーエプソン株式会社 レーザー加工方法及び装置、並びに非導電性透明基板の回路形成方法及び装置
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Also Published As

Publication number Publication date
JP4833909B2 (ja) 2011-12-07
JP4397163B2 (ja) 2010-01-13
JP2004527376A (ja) 2004-09-09
CN1317667C (zh) 2007-05-23
CA2438566A1 (en) 2002-08-29
JP2011098394A (ja) 2011-05-19
KR20030091990A (ko) 2003-12-03
CN1491398A (zh) 2004-04-21
DE10296339T5 (de) 2004-04-15
CN101172319A (zh) 2008-05-07
GB2390699B (en) 2004-10-13
GB0318352D0 (en) 2003-09-10
JP2007203375A (ja) 2007-08-16
WO2002067180A1 (en) 2002-08-29
TW535199B (en) 2003-06-01
GB2390699A (en) 2004-01-14
JP5055443B2 (ja) 2012-10-24

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