KR100814211B1 - 반도체 기반형 x-y 어드레싱 가능 이미저 및 반도체 기반형 x-y 어드레싱 가능 mos 이미저 - Google Patents
반도체 기반형 x-y 어드레싱 가능 이미저 및 반도체 기반형 x-y 어드레싱 가능 mos 이미저 Download PDFInfo
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- KR100814211B1 KR100814211B1 KR1020010002678A KR20010002678A KR100814211B1 KR 100814211 B1 KR100814211 B1 KR 100814211B1 KR 1020010002678 A KR1020010002678 A KR 1020010002678A KR 20010002678 A KR20010002678 A KR 20010002678A KR 100814211 B1 KR100814211 B1 KR 100814211B1
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- photodetector
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- 230000035945 sensitivity Effects 0.000 title description 13
- 230000007246 mechanism Effects 0.000 claims abstract description 17
- 238000012546 transfer Methods 0.000 claims abstract description 13
- 239000004065 semiconductor Substances 0.000 claims abstract description 7
- 238000003384 imaging method Methods 0.000 claims abstract description 5
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- 230000005540 biological transmission Effects 0.000 claims description 5
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/30—Transforming light or analogous information into electric information
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14645—Colour imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14621—Colour filter arrangements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/50—Control of the SSIS exposure
- H04N25/57—Control of the dynamic range
- H04N25/571—Control of the dynamic range involving a non-linear response
- H04N25/575—Control of the dynamic range involving a non-linear response with a response composed of multiple slopes
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/50—Control of the SSIS exposure
- H04N25/57—Control of the dynamic range
- H04N25/59—Control of the dynamic range by controlling the amount of charge storable in the pixel, e.g. modification of the charge conversion ratio of the floating node capacitance
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
- H04N25/62—Detection or reduction of noise due to excess charges produced by the exposure, e.g. smear, blooming, ghost image, crosstalk or leakage between pixels
- H04N25/621—Detection or reduction of noise due to excess charges produced by the exposure, e.g. smear, blooming, ghost image, crosstalk or leakage between pixels for the control of blooming
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- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nonlinear Science (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
Description
Claims (3)
- 다수의 픽셀로 이루어진 이미징 배열(an imaging array)을 갖는 반도체 기반형 X-Y 어드레싱 가능 이미저(a semiconductor based X-Y addressable imager)로서,상기 X-Y 어드레싱 가능 이미저 내부의 적어도 하나의 픽셀은,제 1 대역폭의 광선을 감지하도록 구성된 광검출기(a photodetector)와,제 2 대역폭의 광선을 감지하도록 구성된 상기 픽셀 내 센스 노드(a sense node)와,상기 광검출기 및 상기 센스 노드에 대해 작동하도록 구성되어, 상기 광검출기 및 상기 센스 노드 각각이 사전 결정된 포텐셜(a predetermined potential)로 리세팅되게 하는 리셋 메카니즘과,상기 광검출기로부터 상기 센스 노드로 전하를 운송하도록 구성된 상기 픽셀 내전송 메카니즘을 포함하되,상기 센스 노드는 차광부(a light shield)를 가지지 않고 제 2 광검출기로 동작할 수 있도록 형성되는반도체 기반형 X-Y 어드레싱 가능 이미저.
- 다수의 픽셀로 이루어진 반도체 기반형 X-Y 어드레싱 가능 MOS 이미저로서,상기 X-Y 어드레싱 가능 MOS 이미저 내부의 적어도 하나의 픽셀은,제 1 통합 시간(a first integration time) 동안 전하를 통합하도록 동작가능한 광검출기와,전송 메카니즘을 통하여 상기 광검출기에 결합된 상기 픽셀 내의 센스 노드와,상기 광검출기 및 상기 센스 노드에 대해 작동하도록 구성되어 상기 광검출기 및 상기 센스 노드 각각이 사전 결정된 포텐셜로 리세팅되게 하는 리셋 메카니즘과,상기 광검출기로부터 상기 센스 노드로 전하를 운송하도록 구성된 전송 메카니즘을 포함하되상기 센스 노드는 차광부를 가지지 않고 제 2 광검출기로 동작할 수 있도록 형성되며,상기 제 2 광 검출기는 상기 제 통합 1 시간과는 상이한 제 2 통합 시간 동안 전하를 통합하도록 동작가능한반도체 기반형 X-Y 어드레싱 가능 MOS 이미저.
- 제 2 항에 있어서,상기 이미저가 시스템 내에 놓이되, 상기 시스템은,상기 광검출기에 축적된 전하에 관련된 신호 레벨을 저장하는 데 이용되는 제 1 저장 메카니즘과,상기 센스 노드에 축적된 전하에 관련된 신호 레벨을 저장하는 데 이용되는 제 2 저장 메카니즘과,상기 픽셀의 통합 및 전송 타이밍을 제어하는 타이밍 회로를 더 포함하는반도체 기반형 X-Y 어드레싱 가능 MOS 이미저.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/484,156 US6710804B1 (en) | 2000-01-18 | 2000-01-18 | CMOS active pixel image sensor with extended dynamic range and sensitivity |
US09/484,156 | 2000-01-18 |
Publications (2)
Publication Number | Publication Date |
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KR20010076314A KR20010076314A (ko) | 2001-08-11 |
KR100814211B1 true KR100814211B1 (ko) | 2008-03-17 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020010002678A KR100814211B1 (ko) | 2000-01-18 | 2001-01-17 | 반도체 기반형 x-y 어드레싱 가능 이미저 및 반도체 기반형 x-y 어드레싱 가능 mos 이미저 |
Country Status (5)
Country | Link |
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US (1) | US6710804B1 (ko) |
EP (1) | EP1119188B1 (ko) |
JP (1) | JP4614545B2 (ko) |
KR (1) | KR100814211B1 (ko) |
TW (1) | TW497355B (ko) |
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2000
- 2000-01-18 US US09/484,156 patent/US6710804B1/en not_active Expired - Lifetime
- 2000-11-28 TW TW089125214A patent/TW497355B/zh not_active IP Right Cessation
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2001
- 2001-01-08 EP EP01200017.0A patent/EP1119188B1/en not_active Expired - Lifetime
- 2001-01-15 JP JP2001006218A patent/JP4614545B2/ja not_active Expired - Lifetime
- 2001-01-17 KR KR1020010002678A patent/KR100814211B1/ko active IP Right Grant
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JP2001203940A (ja) | 2001-07-27 |
EP1119188A3 (en) | 2002-09-04 |
JP4614545B2 (ja) | 2011-01-19 |
US6710804B1 (en) | 2004-03-23 |
EP1119188A2 (en) | 2001-07-25 |
KR20010076314A (ko) | 2001-08-11 |
EP1119188B1 (en) | 2015-04-01 |
TW497355B (en) | 2002-08-01 |
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