KR100801022B1 - 리모콘 수신 모듈 및 그 제조방법 - Google Patents
리모콘 수신 모듈 및 그 제조방법 Download PDFInfo
- Publication number
- KR100801022B1 KR100801022B1 KR1020060061136A KR20060061136A KR100801022B1 KR 100801022 B1 KR100801022 B1 KR 100801022B1 KR 1020060061136 A KR1020060061136 A KR 1020060061136A KR 20060061136 A KR20060061136 A KR 20060061136A KR 100801022 B1 KR100801022 B1 KR 100801022B1
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- South Korea
- Prior art keywords
- molding
- remote control
- receiving module
- ground
- control receiving
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000000465 moulding Methods 0.000 claims abstract description 56
- 238000004519 manufacturing process Methods 0.000 claims abstract description 29
- 238000007747 plating Methods 0.000 claims abstract description 29
- 238000007598 dipping method Methods 0.000 claims abstract description 22
- 239000007788 liquid Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 238000009792 diffusion process Methods 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910001128 Sn alloy Inorganic materials 0.000 claims 1
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 abstract description 11
- 238000005476 soldering Methods 0.000 abstract description 11
- 239000004065 semiconductor Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
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- 239000007769 metal material Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q9/00—Arrangements in telecontrol or telemetry systems for selectively calling a substation from a main station, in which substation desired apparatus is selected for applying a control signal thereto or for obtaining measured values therefrom
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02162—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors
- H01L31/02164—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors for shielding light, e.g. light blocking layers, cold shields for infrared detectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
- H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Light Receiving Elements (AREA)
Abstract
Description
Claims (6)
- 수광 소자 및 신호처리소자를 안착된 리드프레임을 수지로 몰딩하여 리드단자가 돌출된 몰딩부를 제조하는 단계;몰딩부를 따라 돌출 절곡된 접지부가 형성된 쉴드케이스를 장착하는 단계;및쉴드케이스가 장착된 몰딩부를 디핑도금하여 상기 접지부를 리드단자에 접지시키는 단계를 포함하는 것을 특징으로 하는 리모콘 수신 모듈 제조 방법.
- 제1항에 있어서, 상기 리드단자와 접지부만 디핑도금 되는 것을 특징으로 하는 리모콘 수신 모듈 제조 방법.
- 제1항에 있어서, 상기 디핑도금은 니켈, 주석 또는 니켈-주석 합금인 것을 특징으로 하는 리모콘 수신모듈 제조 방법.
- 수광 소자 및 신호처리소자를 안착된 리드프레임을 수지로 몰딩하여 리드단자가 돌출된 몰딩부; 상기 리드단자와 접지부가 몰딩부과 이격되어 접지되도록 상기 몰딩부를 따라 돌출 절곡된 접지부가 형성된 쉴드케이스; 및 상기 접지부위까지 도금된 리드단자로 이루어진 리모콘 수신모듈 패키지.
- 제4항에 있어서, 상기 몰딩부에는 도금액의 확산 방지용 요철이 형성된 것을 특징으로 하는 리모콘 수신 모듈 패키지.
- 수광소자 및 신호처리 소자가 장착된 리드프레임이 리드단자를 통해서 상호연결되도록 일렬로 나란히 배치한 후, 각각의 리드단자가 돌출되도록 수지로 몰딩하여 각각의 리모콘 수신모듈의 몰딩부를 형성하는 단계;각각의 몰딩부에 몰딩부를 따라 돌출 절곡된 접지부가 형성된 쉴드케이스를 장착하는 단계;쉴드케이스가 장착된 몰딩부를 동시에 디핑도금하여 상기 접지부를 리드단자에 접지시키는 단계; 및상호 연결된 리드단자를 분리하여 각각의 리모콘 수신모듈을 분리하는 단계를 포함하는 것을 특징으로 하는 다수의 리모콘 수신 모듈 제조 방법.
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KR1020060061136A KR100801022B1 (ko) | 2006-06-30 | 2006-06-30 | 리모콘 수신 모듈 및 그 제조방법 |
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KR1020060061136A KR100801022B1 (ko) | 2006-06-30 | 2006-06-30 | 리모콘 수신 모듈 및 그 제조방법 |
Publications (2)
Publication Number | Publication Date |
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KR20080002349A KR20080002349A (ko) | 2008-01-04 |
KR100801022B1 true KR100801022B1 (ko) | 2008-02-04 |
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KR1020060061136A KR100801022B1 (ko) | 2006-06-30 | 2006-06-30 | 리모콘 수신 모듈 및 그 제조방법 |
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Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR102144736B1 (ko) | 2017-07-14 | 2020-08-14 | 한국항공우주산업 주식회사 | 항공기용 모의엔진 정비훈련 방법 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07273356A (ja) * | 1994-03-29 | 1995-10-20 | New Japan Radio Co Ltd | 赤外リモコン受光ユニット |
KR100336319B1 (ko) | 1999-09-10 | 2002-05-22 | 전도학 | 수정 진동자 베이스 리드의 도금방법 및 그 장치 |
KR200367044Y1 (ko) | 2004-08-18 | 2004-11-09 | 한국 고덴시 주식회사 | 리모콘 수신모듈의 쉴드케이스 결합구조 |
KR20050025561A (ko) * | 2004-03-08 | 2005-03-14 | 문광호 | 적외선 리모콘 수신 모듈 |
-
2006
- 2006-06-30 KR KR1020060061136A patent/KR100801022B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07273356A (ja) * | 1994-03-29 | 1995-10-20 | New Japan Radio Co Ltd | 赤外リモコン受光ユニット |
KR100336319B1 (ko) | 1999-09-10 | 2002-05-22 | 전도학 | 수정 진동자 베이스 리드의 도금방법 및 그 장치 |
KR20050025561A (ko) * | 2004-03-08 | 2005-03-14 | 문광호 | 적외선 리모콘 수신 모듈 |
KR200367044Y1 (ko) | 2004-08-18 | 2004-11-09 | 한국 고덴시 주식회사 | 리모콘 수신모듈의 쉴드케이스 결합구조 |
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KR20080002349A (ko) | 2008-01-04 |
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