KR100800612B1 - 반도체 재료 처리 시스템 - Google Patents

반도체 재료 처리 시스템 Download PDF

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Publication number
KR100800612B1
KR100800612B1 KR1020047003085A KR20047003085A KR100800612B1 KR 100800612 B1 KR100800612 B1 KR 100800612B1 KR 1020047003085 A KR1020047003085 A KR 1020047003085A KR 20047003085 A KR20047003085 A KR 20047003085A KR 100800612 B1 KR100800612 B1 KR 100800612B1
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South Korea
Prior art keywords
wafer
efem
frame
port door
delete delete
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Expired - Lifetime
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KR1020047003085A
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English (en)
Korean (ko)
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KR20040040447A (ko
Inventor
안소니 씨. 보노라
리차드 에이치. 고울드
로저 지. 하인
마이클 크로락
제리 에이. 스피즐
Original Assignee
어사이스트 테크놀로지스, 인코포레이티드
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Publication of KR20040040447A publication Critical patent/KR20040040447A/ko
Application granted granted Critical
Publication of KR100800612B1 publication Critical patent/KR100800612B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020047003085A 2001-08-31 2002-08-30 반도체 재료 처리 시스템 Expired - Lifetime KR100800612B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US31672201P 2001-08-31 2001-08-31
US60/316,722 2001-08-31
US10/087,092 US7217076B2 (en) 2001-08-31 2002-03-01 Semiconductor material handling system
US10/087,092 2002-03-01
PCT/US2002/027769 WO2003021643A2 (en) 2001-08-31 2002-08-30 Semiconductor material handling system

Publications (2)

Publication Number Publication Date
KR20040040447A KR20040040447A (ko) 2004-05-12
KR100800612B1 true KR100800612B1 (ko) 2008-02-05

Family

ID=26776585

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020047003085A Expired - Lifetime KR100800612B1 (ko) 2001-08-31 2002-08-30 반도체 재료 처리 시스템

Country Status (6)

Country Link
US (1) US7217076B2 (enExample)
JP (1) JP4309264B2 (enExample)
KR (1) KR100800612B1 (enExample)
CN (1) CN1327477C (enExample)
DE (1) DE10297169T5 (enExample)
WO (1) WO2003021643A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230157459A (ko) * 2021-03-18 2023-11-16 어플라이드 머티어리얼스, 인코포레이티드 트랙 상에서 이동하는 로봇을 갖는 팩토리 인터페이스 상의 증가된 수의 로드 포트들

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US7607879B2 (en) * 2004-06-15 2009-10-27 Brooks Automation, Inc. Substrate processing apparatus with removable component module
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DE102004057057A1 (de) * 2004-11-25 2006-06-01 Leica Microsystems Cms Gmbh Substrat-Arbeitsstation und Zusatzmodul für eine Substrat-Arbeitsstation
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7819079B2 (en) 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US7371022B2 (en) 2004-12-22 2008-05-13 Sokudo Co., Ltd. Developer endpoint detection in a track lithography system
US7651306B2 (en) 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
CN100511630C (zh) * 2005-03-08 2009-07-08 株式会社安川电机 装载口及装载口的控制方法
US7357256B2 (en) * 2005-03-31 2008-04-15 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer pod with working sheet holder
US9457442B2 (en) * 2005-06-18 2016-10-04 Futrfab, Inc. Method and apparatus to support process tool modules in a cleanspace fabricator
US8821099B2 (en) 2005-07-11 2014-09-02 Brooks Automation, Inc. Load port module
US7762755B2 (en) * 2005-07-11 2010-07-27 Brooks Automation, Inc. Equipment storage for substrate processing apparatus
ITBO20060244A1 (it) * 2006-04-05 2007-10-06 Ima Spa Sistema e metodo per trasferire e movimentare elementi di una macchina automatica confezionatrice.
ITBO20060245A1 (it) * 2006-04-05 2007-10-06 Ima Spa Apparato per trasferire e movimentare elementi di una macchina operatrice.
KR100818044B1 (ko) * 2006-05-04 2008-03-31 위순임 기판 지지대와 기판 반송 장치 및 이를 이용한 기판 처리시스템
JP4606388B2 (ja) * 2006-06-12 2011-01-05 川崎重工業株式会社 基板移載装置の搬送系ユニット
DE102006029003A1 (de) * 2006-06-24 2008-01-03 Vistec Semiconductor Systems Gmbh Waferhandhabungsvorrichtung
JP2008032335A (ja) * 2006-07-31 2008-02-14 Hitachi High-Technologies Corp ミニエンバイロメント装置、検査装置、製造装置、及び空間の清浄化方法
US9117859B2 (en) 2006-08-31 2015-08-25 Brooks Automation, Inc. Compact processing apparatus
US8920097B2 (en) * 2006-11-02 2014-12-30 Globalfoundries Singapore Pte. Ltd. Wafer handling system for a loadlock
KR100847888B1 (ko) * 2006-12-12 2008-07-23 세메스 주식회사 반도체 소자 제조 장치
US8500382B2 (en) * 2007-05-22 2013-08-06 Axcelis Technologies Inc. Airflow management for particle abatement in semiconductor manufacturing equipment
TWI379748B (en) * 2007-07-20 2012-12-21 Applied Materials Inc Dual-mode robot systems,substrate transfer apparatus and methods for electronic device manufacturing, and method of calibrating
US8757026B2 (en) 2008-04-15 2014-06-24 Dynamic Micro Systems, Semiconductor Equipment Gmbh Clean transfer robot
JP5168329B2 (ja) * 2010-08-31 2013-03-21 Ｔｄｋ株式会社 ロードポート装置
DE102010048909A1 (de) * 2010-10-11 2012-04-12 Ekra Automatisierungssysteme Gmbh Prozessmaschine, insbesondere zum Bearbeiten und/oder Inspizieren von Substraten
US9184078B2 (en) * 2011-05-07 2015-11-10 Brooks Automation, Inc. Narrow width loadport mechanism for cleanroom material transfer systems
JP5364769B2 (ja) * 2011-09-26 2013-12-11 株式会社安川電機 搬送ロボットおよび基板処理装置
US8944739B2 (en) * 2012-06-01 2015-02-03 Taiwan Semiconductor Manufacturing Co., Ltd. Loadport bridge for semiconductor fabrication tools
JP6219402B2 (ja) * 2012-12-03 2017-10-25 エーエスエム イーペー ホールディング ベー．フェー． モジュール式縦型炉処理システム
CN104375293B (zh) * 2014-11-20 2017-05-17 武汉精测电子技术股份有限公司 基于机器视觉的lcd屏自动检测机台
CN105668143B (zh) * 2016-03-23 2017-08-25 北京轩宇智能科技有限公司 一种密封操作系统及其磁耦合式密封输料装置
JP7177333B2 (ja) * 2018-07-04 2022-11-24 シンフォニアテクノロジー株式会社 ロードポート、および、ｅｆｅｍ
US11031265B2 (en) * 2018-11-28 2021-06-08 Brooks Automation, Inc. Load port module
US10916464B1 (en) * 2019-07-26 2021-02-09 Applied Materials, Inc. Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency
WO2022015863A1 (en) * 2020-07-14 2022-01-20 Vicarious Fpc, Inc. Method and system for monitoring a container fullness
US11545379B2 (en) * 2020-07-31 2023-01-03 Nanya Technology Corporation System and method for controlling semiconductor manufacturing equipment
US11735455B2 (en) 2021-03-12 2023-08-22 Taiwan Semiconductor Manufacturing Company, Ltd. Systems, devices, and methods for air flow optimization including adjacent a FOUP
JP7660006B2 (ja) * 2021-03-24 2025-04-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、教示情報生成方法および教示セット
JP2024078532A (ja) * 2022-11-30 2024-06-11 株式会社安川電機 基板搬送ロボットシステムおよび基板搬送ロボットの教示方法
US20250069926A1 (en) * 2023-08-22 2025-02-27 Applied Materials, Inc. Integrated substrate processing system with advanced substrate handling robot
CN117116817B (zh) * 2023-09-22 2024-10-29 上海广川科技有限公司 一种尺寸兼容的晶圆缓存装置
CN117612986A (zh) * 2023-11-27 2024-02-27 上海诺银机电科技有限公司 一种晶圆传片机
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230157459A (ko) * 2021-03-18 2023-11-16 어플라이드 머티어리얼스, 인코포레이티드 트랙 상에서 이동하는 로봇을 갖는 팩토리 인터페이스 상의 증가된 수의 로드 포트들
KR102771668B1 (ko) 2021-03-18 2025-02-20 어플라이드 머티어리얼스, 인코포레이티드 트랙 상에서 이동하는 로봇을 갖는 팩토리 인터페이스 상의 증가된 수의 로드 포트들

Also Published As

Publication number Publication date
US7217076B2 (en) 2007-05-15
DE10297169T5 (de) 2004-07-29
CN1327477C (zh) 2007-07-18
US20030044261A1 (en) 2003-03-06
JP2005508570A (ja) 2005-03-31
WO2003021643A2 (en) 2003-03-13
KR20040040447A (ko) 2004-05-12
CN1572013A (zh) 2005-01-26
JP4309264B2 (ja) 2009-08-05
WO2003021643A3 (en) 2003-08-07

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