JP4309264B2 - 半導体材料取扱い装置 - Google Patents

半導体材料取扱い装置 Download PDF

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Publication number
JP4309264B2
JP4309264B2 JP2003525891A JP2003525891A JP4309264B2 JP 4309264 B2 JP4309264 B2 JP 4309264B2 JP 2003525891 A JP2003525891 A JP 2003525891A JP 2003525891 A JP2003525891 A JP 2003525891A JP 4309264 B2 JP4309264 B2 JP 4309264B2
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Japan
Prior art keywords
wafer
foup
efem
vertical strut
door
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Expired - Lifetime
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JP2003525891A
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English (en)
Japanese (ja)
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JP2005508570A5 (enExample
JP2005508570A (ja
Inventor
アンソニー シー ボノラ
リチャード エイチ ゴールド
ロジャー ジー ハイン
マイケル クロラック
ジェリー エイ スピースル
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Asyst Technologies Inc
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Asyst Technologies Inc
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Publication of JP2005508570A5 publication Critical patent/JP2005508570A5/ja
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Publication of JP4309264B2 publication Critical patent/JP4309264B2/ja
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Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2003525891A 2001-08-31 2002-08-30 半導体材料取扱い装置 Expired - Lifetime JP4309264B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US31672201P 2001-08-31 2001-08-31
US10/087,092 US7217076B2 (en) 2001-08-31 2002-03-01 Semiconductor material handling system
PCT/US2002/027769 WO2003021643A2 (en) 2001-08-31 2002-08-30 Semiconductor material handling system

Publications (3)

Publication Number Publication Date
JP2005508570A JP2005508570A (ja) 2005-03-31
JP2005508570A5 JP2005508570A5 (enExample) 2006-02-09
JP4309264B2 true JP4309264B2 (ja) 2009-08-05

Family

ID=26776585

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003525891A Expired - Lifetime JP4309264B2 (ja) 2001-08-31 2002-08-30 半導体材料取扱い装置

Country Status (6)

Country Link
US (1) US7217076B2 (enExample)
JP (1) JP4309264B2 (enExample)
KR (1) KR100800612B1 (enExample)
CN (1) CN1327477C (enExample)
DE (1) DE10297169T5 (enExample)
WO (1) WO2003021643A2 (enExample)

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DE102004057057A1 (de) * 2004-11-25 2006-06-01 Leica Microsystems Cms Gmbh Substrat-Arbeitsstation und Zusatzmodul für eine Substrat-Arbeitsstation
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US7819079B2 (en) 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
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US7651306B2 (en) 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
CN100511630C (zh) * 2005-03-08 2009-07-08 株式会社安川电机 装载口及装载口的控制方法
US7357256B2 (en) * 2005-03-31 2008-04-15 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer pod with working sheet holder
US9457442B2 (en) * 2005-06-18 2016-10-04 Futrfab, Inc. Method and apparatus to support process tool modules in a cleanspace fabricator
US8821099B2 (en) 2005-07-11 2014-09-02 Brooks Automation, Inc. Load port module
US7762755B2 (en) * 2005-07-11 2010-07-27 Brooks Automation, Inc. Equipment storage for substrate processing apparatus
ITBO20060244A1 (it) * 2006-04-05 2007-10-06 Ima Spa Sistema e metodo per trasferire e movimentare elementi di una macchina automatica confezionatrice.
ITBO20060245A1 (it) * 2006-04-05 2007-10-06 Ima Spa Apparato per trasferire e movimentare elementi di una macchina operatrice.
KR100818044B1 (ko) * 2006-05-04 2008-03-31 위순임 기판 지지대와 기판 반송 장치 및 이를 이용한 기판 처리시스템
JP4606388B2 (ja) * 2006-06-12 2011-01-05 川崎重工業株式会社 基板移載装置の搬送系ユニット
DE102006029003A1 (de) * 2006-06-24 2008-01-03 Vistec Semiconductor Systems Gmbh Waferhandhabungsvorrichtung
JP2008032335A (ja) * 2006-07-31 2008-02-14 Hitachi High-Technologies Corp ミニエンバイロメント装置、検査装置、製造装置、及び空間の清浄化方法
US9117859B2 (en) 2006-08-31 2015-08-25 Brooks Automation, Inc. Compact processing apparatus
US8920097B2 (en) * 2006-11-02 2014-12-30 Globalfoundries Singapore Pte. Ltd. Wafer handling system for a loadlock
KR100847888B1 (ko) * 2006-12-12 2008-07-23 세메스 주식회사 반도체 소자 제조 장치
US8500382B2 (en) * 2007-05-22 2013-08-06 Axcelis Technologies Inc. Airflow management for particle abatement in semiconductor manufacturing equipment
TWI379748B (en) * 2007-07-20 2012-12-21 Applied Materials Inc Dual-mode robot systems,substrate transfer apparatus and methods for electronic device manufacturing, and method of calibrating
US8757026B2 (en) 2008-04-15 2014-06-24 Dynamic Micro Systems, Semiconductor Equipment Gmbh Clean transfer robot
JP5168329B2 (ja) * 2010-08-31 2013-03-21 Ｔｄｋ株式会社 ロードポート装置
DE102010048909A1 (de) * 2010-10-11 2012-04-12 Ekra Automatisierungssysteme Gmbh Prozessmaschine, insbesondere zum Bearbeiten und/oder Inspizieren von Substraten
US9184078B2 (en) * 2011-05-07 2015-11-10 Brooks Automation, Inc. Narrow width loadport mechanism for cleanroom material transfer systems
JP5364769B2 (ja) * 2011-09-26 2013-12-11 株式会社安川電機 搬送ロボットおよび基板処理装置
US8944739B2 (en) * 2012-06-01 2015-02-03 Taiwan Semiconductor Manufacturing Co., Ltd. Loadport bridge for semiconductor fabrication tools
JP6219402B2 (ja) * 2012-12-03 2017-10-25 エーエスエム イーペー ホールディング ベー．フェー． モジュール式縦型炉処理システム
CN104375293B (zh) * 2014-11-20 2017-05-17 武汉精测电子技术股份有限公司 基于机器视觉的lcd屏自动检测机台
CN105668143B (zh) * 2016-03-23 2017-08-25 北京轩宇智能科技有限公司 一种密封操作系统及其磁耦合式密封输料装置
JP7177333B2 (ja) * 2018-07-04 2022-11-24 シンフォニアテクノロジー株式会社 ロードポート、および、ｅｆｅｍ
US11031265B2 (en) * 2018-11-28 2021-06-08 Brooks Automation, Inc. Load port module
US10916464B1 (en) * 2019-07-26 2021-02-09 Applied Materials, Inc. Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency
WO2022015863A1 (en) * 2020-07-14 2022-01-20 Vicarious Fpc, Inc. Method and system for monitoring a container fullness
US11545379B2 (en) * 2020-07-31 2023-01-03 Nanya Technology Corporation System and method for controlling semiconductor manufacturing equipment
US11735455B2 (en) 2021-03-12 2023-08-22 Taiwan Semiconductor Manufacturing Company, Ltd. Systems, devices, and methods for air flow optimization including adjacent a FOUP
US12076854B2 (en) * 2021-03-18 2024-09-03 Applied Materials, Inc. Increased number of load ports on factory interface with robot that moves on track
JP7660006B2 (ja) * 2021-03-24 2025-04-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、教示情報生成方法および教示セット
JP2024078532A (ja) * 2022-11-30 2024-06-11 株式会社安川電機 基板搬送ロボットシステムおよび基板搬送ロボットの教示方法
US20250069926A1 (en) * 2023-08-22 2025-02-27 Applied Materials, Inc. Integrated substrate processing system with advanced substrate handling robot
CN117116817B (zh) * 2023-09-22 2024-10-29 上海广川科技有限公司 一种尺寸兼容的晶圆缓存装置
CN117612986A (zh) * 2023-11-27 2024-02-27 上海诺银机电科技有限公司 一种晶圆传片机
CN119275144B (zh) * 2024-12-10 2025-02-25 北京和崎精密科技有限公司 晶片存储器

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Also Published As

Publication number Publication date
US7217076B2 (en) 2007-05-15
DE10297169T5 (de) 2004-07-29
CN1327477C (zh) 2007-07-18
US20030044261A1 (en) 2003-03-06
JP2005508570A (ja) 2005-03-31
WO2003021643A2 (en) 2003-03-13
KR100800612B1 (ko) 2008-02-05
KR20040040447A (ko) 2004-05-12
CN1572013A (zh) 2005-01-26
WO2003021643A3 (en) 2003-08-07

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