DE10297169T5 - Handhabungssystem für Halbleitermaterial - Google Patents
Handhabungssystem für Halbleitermaterial Download PDFInfo
- Publication number
- DE10297169T5 DE10297169T5 DE10297169T DE10297169T DE10297169T5 DE 10297169 T5 DE10297169 T5 DE 10297169T5 DE 10297169 T DE10297169 T DE 10297169T DE 10297169 T DE10297169 T DE 10297169T DE 10297169 T5 DE10297169 T5 DE 10297169T5
- Authority
- DE
- Germany
- Prior art keywords
- wafer
- carrier
- access
- axis
- door
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 18
- 239000000463 material Substances 0.000 title description 19
- 235000012431 wafers Nutrition 0.000 claims abstract description 365
- 230000008878 coupling Effects 0.000 claims abstract description 35
- 238000010168 coupling process Methods 0.000 claims abstract description 35
- 238000005859 coupling reaction Methods 0.000 claims abstract description 35
- 230000007246 mechanism Effects 0.000 claims abstract description 34
- 238000003860 storage Methods 0.000 claims abstract description 21
- 238000002955 isolation Methods 0.000 claims abstract description 14
- 238000009413 insulation Methods 0.000 claims abstract description 13
- 230000007613 environmental effect Effects 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract 5
- 239000012636 effector Substances 0.000 claims description 80
- 238000012545 processing Methods 0.000 claims description 54
- 238000004519 manufacturing process Methods 0.000 claims description 23
- 101000873785 Homo sapiens mRNA-decapping enzyme 1A Proteins 0.000 claims description 11
- 102100035856 mRNA-decapping enzyme 1A Human genes 0.000 claims description 11
- 230000013011 mating Effects 0.000 abstract 1
- 238000003754 machining Methods 0.000 description 30
- 239000002245 particle Substances 0.000 description 23
- 238000012546 transfer Methods 0.000 description 22
- 230000008901 benefit Effects 0.000 description 16
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 238000012423 maintenance Methods 0.000 description 13
- 230000006870 function Effects 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 238000010276 construction Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 238000001914 filtration Methods 0.000 description 5
- 230000036961 partial effect Effects 0.000 description 5
- 239000000969 carrier Substances 0.000 description 4
- 230000032258 transport Effects 0.000 description 4
- 238000009423 ventilation Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000003749 cleanliness Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 230000014759 maintenance of location Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- -1 but not limited to Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- RRNIZKPFKNDSRS-UHFFFAOYSA-N Bensulide Chemical compound CC(C)OP(=S)(OC(C)C)SCCNS(=O)(=O)C1=CC=CC=C1 RRNIZKPFKNDSRS-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910000746 Structural steel Inorganic materials 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
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- 239000002537 cosmetic Substances 0.000 description 1
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- 238000001125 extrusion Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
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- 238000003032 molecular docking Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052756 noble gas Inorganic materials 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
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- 238000005096 rolling process Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000036962 time dependent Effects 0.000 description 1
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- 239000012780 transparent material Substances 0.000 description 1
- 238000013024 troubleshooting Methods 0.000 description 1
- 238000007514 turning Methods 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US31672201P | 2001-08-31 | 2001-08-31 | |
| US60/316722 | 2001-08-31 | ||
| US10/087,092 US7217076B2 (en) | 2001-08-31 | 2002-03-01 | Semiconductor material handling system |
| US10/087,092 | 2002-03-01 | ||
| PCT/US2002/027769 WO2003021643A2 (en) | 2001-08-31 | 2002-08-30 | Semiconductor material handling system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE10297169T5 true DE10297169T5 (de) | 2004-07-29 |
Family
ID=26776585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE10297169T Withdrawn DE10297169T5 (de) | 2001-08-31 | 2002-08-30 | Handhabungssystem für Halbleitermaterial |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7217076B2 (enExample) |
| JP (1) | JP4309264B2 (enExample) |
| KR (1) | KR100800612B1 (enExample) |
| CN (1) | CN1327477C (enExample) |
| DE (1) | DE10297169T5 (enExample) |
| WO (1) | WO2003021643A2 (enExample) |
Families Citing this family (47)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7293571B2 (en) * | 2002-09-30 | 2007-11-13 | Lam Research Corporation | Substrate proximity processing housing and insert for generating a fluid meniscus |
| US7145643B2 (en) * | 2003-08-07 | 2006-12-05 | Asml Netherlands B.V. | Interface unit, lithographic projection apparatus comprising such an interface unit and a device manufacturing method |
| US7607879B2 (en) * | 2004-06-15 | 2009-10-27 | Brooks Automation, Inc. | Substrate processing apparatus with removable component module |
| GB2415291B (en) * | 2004-06-15 | 2008-08-13 | Nanobeam Ltd | Charged particle beam system |
| DE102004057057A1 (de) * | 2004-11-25 | 2006-06-01 | Leica Microsystems Cms Gmbh | Substrat-Arbeitsstation und Zusatzmodul für eine Substrat-Arbeitsstation |
| US7798764B2 (en) | 2005-12-22 | 2010-09-21 | Applied Materials, Inc. | Substrate processing sequence in a cartesian robot cluster tool |
| US7819079B2 (en) | 2004-12-22 | 2010-10-26 | Applied Materials, Inc. | Cartesian cluster tool configuration for lithography type processes |
| US7371022B2 (en) | 2004-12-22 | 2008-05-13 | Sokudo Co., Ltd. | Developer endpoint detection in a track lithography system |
| US7651306B2 (en) | 2004-12-22 | 2010-01-26 | Applied Materials, Inc. | Cartesian robot cluster tool architecture |
| CN100511630C (zh) * | 2005-03-08 | 2009-07-08 | 株式会社安川电机 | 装载口及装载口的控制方法 |
| US7357256B2 (en) * | 2005-03-31 | 2008-04-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer pod with working sheet holder |
| US9457442B2 (en) * | 2005-06-18 | 2016-10-04 | Futrfab, Inc. | Method and apparatus to support process tool modules in a cleanspace fabricator |
| US8821099B2 (en) | 2005-07-11 | 2014-09-02 | Brooks Automation, Inc. | Load port module |
| US7762755B2 (en) * | 2005-07-11 | 2010-07-27 | Brooks Automation, Inc. | Equipment storage for substrate processing apparatus |
| ITBO20060244A1 (it) * | 2006-04-05 | 2007-10-06 | Ima Spa | Sistema e metodo per trasferire e movimentare elementi di una macchina automatica confezionatrice. |
| ITBO20060245A1 (it) * | 2006-04-05 | 2007-10-06 | Ima Spa | Apparato per trasferire e movimentare elementi di una macchina operatrice. |
| KR100818044B1 (ko) * | 2006-05-04 | 2008-03-31 | 위순임 | 기판 지지대와 기판 반송 장치 및 이를 이용한 기판 처리시스템 |
| JP4606388B2 (ja) * | 2006-06-12 | 2011-01-05 | 川崎重工業株式会社 | 基板移載装置の搬送系ユニット |
| DE102006029003A1 (de) * | 2006-06-24 | 2008-01-03 | Vistec Semiconductor Systems Gmbh | Waferhandhabungsvorrichtung |
| JP2008032335A (ja) * | 2006-07-31 | 2008-02-14 | Hitachi High-Technologies Corp | ミニエンバイロメント装置、検査装置、製造装置、及び空間の清浄化方法 |
| US9117859B2 (en) | 2006-08-31 | 2015-08-25 | Brooks Automation, Inc. | Compact processing apparatus |
| US8920097B2 (en) * | 2006-11-02 | 2014-12-30 | Globalfoundries Singapore Pte. Ltd. | Wafer handling system for a loadlock |
| KR100847888B1 (ko) * | 2006-12-12 | 2008-07-23 | 세메스 주식회사 | 반도체 소자 제조 장치 |
| US8500382B2 (en) * | 2007-05-22 | 2013-08-06 | Axcelis Technologies Inc. | Airflow management for particle abatement in semiconductor manufacturing equipment |
| TWI379748B (en) * | 2007-07-20 | 2012-12-21 | Applied Materials Inc | Dual-mode robot systems,substrate transfer apparatus and methods for electronic device manufacturing, and method of calibrating |
| US8757026B2 (en) | 2008-04-15 | 2014-06-24 | Dynamic Micro Systems, Semiconductor Equipment Gmbh | Clean transfer robot |
| JP5168329B2 (ja) * | 2010-08-31 | 2013-03-21 | Ｔｄｋ株式会社 | ロードポート装置 |
| DE102010048909A1 (de) * | 2010-10-11 | 2012-04-12 | Ekra Automatisierungssysteme Gmbh | Prozessmaschine, insbesondere zum Bearbeiten und/oder Inspizieren von Substraten |
| US9184078B2 (en) * | 2011-05-07 | 2015-11-10 | Brooks Automation, Inc. | Narrow width loadport mechanism for cleanroom material transfer systems |
| JP5364769B2 (ja) * | 2011-09-26 | 2013-12-11 | 株式会社安川電機 | 搬送ロボットおよび基板処理装置 |
| US8944739B2 (en) * | 2012-06-01 | 2015-02-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Loadport bridge for semiconductor fabrication tools |
| JP6219402B2 (ja) * | 2012-12-03 | 2017-10-25 | エーエスエム イーペー ホールディング ベー．フェー． | モジュール式縦型炉処理システム |
| CN104375293B (zh) * | 2014-11-20 | 2017-05-17 | 武汉精测电子技术股份有限公司 | 基于机器视觉的lcd屏自动检测机台 |
| CN105668143B (zh) * | 2016-03-23 | 2017-08-25 | 北京轩宇智能科技有限公司 | 一种密封操作系统及其磁耦合式密封输料装置 |
| JP7177333B2 (ja) * | 2018-07-04 | 2022-11-24 | シンフォニアテクノロジー株式会社 | ロードポート、および、ｅｆｅｍ |
| US11031265B2 (en) * | 2018-11-28 | 2021-06-08 | Brooks Automation, Inc. | Load port module |
| US10916464B1 (en) * | 2019-07-26 | 2021-02-09 | Applied Materials, Inc. | Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency |
| WO2022015863A1 (en) * | 2020-07-14 | 2022-01-20 | Vicarious Fpc, Inc. | Method and system for monitoring a container fullness |
| US11545379B2 (en) * | 2020-07-31 | 2023-01-03 | Nanya Technology Corporation | System and method for controlling semiconductor manufacturing equipment |
| US11735455B2 (en) | 2021-03-12 | 2023-08-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Systems, devices, and methods for air flow optimization including adjacent a FOUP |
| US12076854B2 (en) * | 2021-03-18 | 2024-09-03 | Applied Materials, Inc. | Increased number of load ports on factory interface with robot that moves on track |
| JP7660006B2 (ja) * | 2021-03-24 | 2025-04-10 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置、教示情報生成方法および教示セット |
| JP2024078532A (ja) * | 2022-11-30 | 2024-06-11 | 株式会社安川電機 | 基板搬送ロボットシステムおよび基板搬送ロボットの教示方法 |
| US20250069926A1 (en) * | 2023-08-22 | 2025-02-27 | Applied Materials, Inc. | Integrated substrate processing system with advanced substrate handling robot |
| CN117116817B (zh) * | 2023-09-22 | 2024-10-29 | 上海广川科技有限公司 | 一种尺寸兼容的晶圆缓存装置 |
| CN117612986A (zh) * | 2023-11-27 | 2024-02-27 | 上海诺银机电科技有限公司 | 一种晶圆传片机 |
| CN119275144B (zh) * | 2024-12-10 | 2025-02-25 | 北京和崎精密科技有限公司 | 晶片存储器 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2867194B2 (ja) | 1992-02-05 | 1999-03-08 | 東京エレクトロン株式会社 | 処理装置及び処理方法 |
| JP3030160B2 (ja) | 1992-04-28 | 2000-04-10 | 東京エレクトロン株式会社 | 真空処理装置 |
| KR940006241A (ko) | 1992-06-05 | 1994-03-23 | 이노우에 아키라 | 기판이재장치 및 이재방법 |
| US6091498A (en) | 1996-07-15 | 2000-07-18 | Semitool, Inc. | Semiconductor processing apparatus having lift and tilt mechanism |
| US6053983A (en) * | 1997-05-08 | 2000-04-25 | Tokyo Electron, Ltd. | Wafer for carrying semiconductor wafers and method detecting wafers on carrier |
| US6138721A (en) | 1997-09-03 | 2000-10-31 | Asyst Technologies, Inc. | Tilt and go load port interface alignment system |
| WO1999028952A2 (en) | 1997-11-28 | 1999-06-10 | Fortrend Engineering Corporation | Wafer-mapping load port interface |
| JPH11220001A (ja) | 1998-01-30 | 1999-08-10 | Hitachi Ltd | 半導体基板処理装置におけるロードポート及びロードポート搬送台車 |
| US6155768A (en) | 1998-01-30 | 2000-12-05 | Kensington Laboratories, Inc. | Multiple link robot arm system implemented with offset end effectors to provide extended reach and enhanced throughput |
| FR2778496B1 (fr) | 1998-05-05 | 2002-04-19 | Recif Sa | Procede et dispositif de changement de position d'une plaque de semi-conducteur |
| US6142722A (en) | 1998-06-17 | 2000-11-07 | Genmark Automation, Inc. | Automated opening and closing of ultra clean storage containers |
| US6220808B1 (en) | 1998-07-13 | 2001-04-24 | Asyst Technologies, Inc. | Ergonomic, variable size, bottom opening system compatible with a vertical interface |
| US6281516B1 (en) * | 1998-07-13 | 2001-08-28 | Newport Corporation | FIMS transport box load interface |
| US6261044B1 (en) | 1998-08-06 | 2001-07-17 | Asyst Technologies, Inc. | Pod to port door retention and evacuation system |
| US6188323B1 (en) | 1998-10-15 | 2001-02-13 | Asyst Technologies, Inc. | Wafer mapping system |
| US6135698A (en) * | 1999-04-30 | 2000-10-24 | Asyst Technologies, Inc. | Universal tool interface and/or workpiece transfer apparatus for SMIF and open pod applications |
| JP2001031211A (ja) | 1999-07-26 | 2001-02-06 | Murata Mach Ltd | 搬送システム |
| US6428262B1 (en) | 1999-08-11 | 2002-08-06 | Proteros, Llc | Compact load lock system for ion beam processing of foups |
| US6305500B1 (en) * | 1999-08-25 | 2001-10-23 | Maxtor Corporation | Material delivery system for clean room-like environments |
| US6520727B1 (en) * | 2000-04-12 | 2003-02-18 | Asyt Technologies, Inc. | Modular sorter |
-
2002
- 2002-03-01 US US10/087,092 patent/US7217076B2/en not_active Expired - Lifetime
- 2002-08-30 CN CNB028204883A patent/CN1327477C/zh not_active Expired - Lifetime
- 2002-08-30 WO PCT/US2002/027769 patent/WO2003021643A2/en not_active Ceased
- 2002-08-30 DE DE10297169T patent/DE10297169T5/de not_active Withdrawn
- 2002-08-30 KR KR1020047003085A patent/KR100800612B1/ko not_active Expired - Lifetime
- 2002-08-30 JP JP2003525891A patent/JP4309264B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US7217076B2 (en) | 2007-05-15 |
| CN1327477C (zh) | 2007-07-18 |
| US20030044261A1 (en) | 2003-03-06 |
| JP2005508570A (ja) | 2005-03-31 |
| WO2003021643A2 (en) | 2003-03-13 |
| KR100800612B1 (ko) | 2008-02-05 |
| KR20040040447A (ko) | 2004-05-12 |
| CN1572013A (zh) | 2005-01-26 |
| JP4309264B2 (ja) | 2009-08-05 |
| WO2003021643A3 (en) | 2003-08-07 |
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