CN1327477C - 半导体材料处理系统 - Google Patents

半导体材料处理系统 Download PDF

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Publication number
CN1327477C
CN1327477C CNB028204883A CN02820488A CN1327477C CN 1327477 C CN1327477 C CN 1327477C CN B028204883 A CNB028204883 A CN B028204883A CN 02820488 A CN02820488 A CN 02820488A CN 1327477 C CN1327477 C CN 1327477C
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CN
China
Prior art keywords
load port
wafer
port door
efem
door
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB028204883A
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English (en)
Chinese (zh)
Other versions
CN1572013A (zh
Inventor
安东尼·C·博诺拉
理查德·H·古尔德
罗杰·G·海纳
迈克尔·克罗拉克
杰里·A·斯皮斯尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Azenta Inc
Original Assignee
Asyst Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asyst Technologies Inc filed Critical Asyst Technologies Inc
Publication of CN1572013A publication Critical patent/CN1572013A/zh
Application granted granted Critical
Publication of CN1327477C publication Critical patent/CN1327477C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CNB028204883A 2001-08-31 2002-08-30 半导体材料处理系统 Expired - Lifetime CN1327477C (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US31672201P 2001-08-31 2001-08-31
US60/316,722 2001-08-31
US10/087,092 US7217076B2 (en) 2001-08-31 2002-03-01 Semiconductor material handling system
US10/087,092 2002-03-01
PCT/US2002/027769 WO2003021643A2 (en) 2001-08-31 2002-08-30 Semiconductor material handling system

Publications (2)

Publication Number Publication Date
CN1572013A CN1572013A (zh) 2005-01-26
CN1327477C true CN1327477C (zh) 2007-07-18

Family

ID=26776585

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB028204883A Expired - Lifetime CN1327477C (zh) 2001-08-31 2002-08-30 半导体材料处理系统

Country Status (6)

Country Link
US (1) US7217076B2 (enExample)
JP (1) JP4309264B2 (enExample)
KR (1) KR100800612B1 (enExample)
CN (1) CN1327477C (enExample)
DE (1) DE10297169T5 (enExample)
WO (1) WO2003021643A2 (enExample)

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US7145643B2 (en) * 2003-08-07 2006-12-05 Asml Netherlands B.V. Interface unit, lithographic projection apparatus comprising such an interface unit and a device manufacturing method
US7607879B2 (en) * 2004-06-15 2009-10-27 Brooks Automation, Inc. Substrate processing apparatus with removable component module
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DE102004057057A1 (de) * 2004-11-25 2006-06-01 Leica Microsystems Cms Gmbh Substrat-Arbeitsstation und Zusatzmodul für eine Substrat-Arbeitsstation
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7819079B2 (en) 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US7371022B2 (en) 2004-12-22 2008-05-13 Sokudo Co., Ltd. Developer endpoint detection in a track lithography system
US7651306B2 (en) 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
CN100511630C (zh) * 2005-03-08 2009-07-08 株式会社安川电机 装载口及装载口的控制方法
US7357256B2 (en) * 2005-03-31 2008-04-15 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer pod with working sheet holder
US9457442B2 (en) * 2005-06-18 2016-10-04 Futrfab, Inc. Method and apparatus to support process tool modules in a cleanspace fabricator
US8821099B2 (en) 2005-07-11 2014-09-02 Brooks Automation, Inc. Load port module
US7762755B2 (en) * 2005-07-11 2010-07-27 Brooks Automation, Inc. Equipment storage for substrate processing apparatus
ITBO20060244A1 (it) * 2006-04-05 2007-10-06 Ima Spa Sistema e metodo per trasferire e movimentare elementi di una macchina automatica confezionatrice.
ITBO20060245A1 (it) * 2006-04-05 2007-10-06 Ima Spa Apparato per trasferire e movimentare elementi di una macchina operatrice.
KR100818044B1 (ko) * 2006-05-04 2008-03-31 위순임 기판 지지대와 기판 반송 장치 및 이를 이용한 기판 처리시스템
JP4606388B2 (ja) * 2006-06-12 2011-01-05 川崎重工業株式会社 基板移載装置の搬送系ユニット
DE102006029003A1 (de) * 2006-06-24 2008-01-03 Vistec Semiconductor Systems Gmbh Waferhandhabungsvorrichtung
JP2008032335A (ja) * 2006-07-31 2008-02-14 Hitachi High-Technologies Corp ミニエンバイロメント装置、検査装置、製造装置、及び空間の清浄化方法
US9117859B2 (en) 2006-08-31 2015-08-25 Brooks Automation, Inc. Compact processing apparatus
US8920097B2 (en) * 2006-11-02 2014-12-30 Globalfoundries Singapore Pte. Ltd. Wafer handling system for a loadlock
KR100847888B1 (ko) * 2006-12-12 2008-07-23 세메스 주식회사 반도체 소자 제조 장치
US8500382B2 (en) * 2007-05-22 2013-08-06 Axcelis Technologies Inc. Airflow management for particle abatement in semiconductor manufacturing equipment
TWI379748B (en) * 2007-07-20 2012-12-21 Applied Materials Inc Dual-mode robot systems,substrate transfer apparatus and methods for electronic device manufacturing, and method of calibrating
US8757026B2 (en) 2008-04-15 2014-06-24 Dynamic Micro Systems, Semiconductor Equipment Gmbh Clean transfer robot
JP5168329B2 (ja) * 2010-08-31 2013-03-21 Ｔｄｋ株式会社 ロードポート装置
DE102010048909A1 (de) * 2010-10-11 2012-04-12 Ekra Automatisierungssysteme Gmbh Prozessmaschine, insbesondere zum Bearbeiten und/oder Inspizieren von Substraten
US9184078B2 (en) * 2011-05-07 2015-11-10 Brooks Automation, Inc. Narrow width loadport mechanism for cleanroom material transfer systems
JP5364769B2 (ja) * 2011-09-26 2013-12-11 株式会社安川電機 搬送ロボットおよび基板処理装置
US8944739B2 (en) * 2012-06-01 2015-02-03 Taiwan Semiconductor Manufacturing Co., Ltd. Loadport bridge for semiconductor fabrication tools
JP6219402B2 (ja) * 2012-12-03 2017-10-25 エーエスエム イーペー ホールディング ベー．フェー． モジュール式縦型炉処理システム
CN104375293B (zh) * 2014-11-20 2017-05-17 武汉精测电子技术股份有限公司 基于机器视觉的lcd屏自动检测机台
CN105668143B (zh) * 2016-03-23 2017-08-25 北京轩宇智能科技有限公司 一种密封操作系统及其磁耦合式密封输料装置
JP7177333B2 (ja) * 2018-07-04 2022-11-24 シンフォニアテクノロジー株式会社 ロードポート、および、ｅｆｅｍ
US11031265B2 (en) * 2018-11-28 2021-06-08 Brooks Automation, Inc. Load port module
US10916464B1 (en) * 2019-07-26 2021-02-09 Applied Materials, Inc. Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency
WO2022015863A1 (en) * 2020-07-14 2022-01-20 Vicarious Fpc, Inc. Method and system for monitoring a container fullness
US11545379B2 (en) * 2020-07-31 2023-01-03 Nanya Technology Corporation System and method for controlling semiconductor manufacturing equipment
US11735455B2 (en) 2021-03-12 2023-08-22 Taiwan Semiconductor Manufacturing Company, Ltd. Systems, devices, and methods for air flow optimization including adjacent a FOUP
US12076854B2 (en) * 2021-03-18 2024-09-03 Applied Materials, Inc. Increased number of load ports on factory interface with robot that moves on track
JP7660006B2 (ja) * 2021-03-24 2025-04-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、教示情報生成方法および教示セット
JP2024078532A (ja) * 2022-11-30 2024-06-11 株式会社安川電機 基板搬送ロボットシステムおよび基板搬送ロボットの教示方法
US20250069926A1 (en) * 2023-08-22 2025-02-27 Applied Materials, Inc. Integrated substrate processing system with advanced substrate handling robot
CN117116817B (zh) * 2023-09-22 2024-10-29 上海广川科技有限公司 一种尺寸兼容的晶圆缓存装置
CN117612986A (zh) * 2023-11-27 2024-02-27 上海诺银机电科技有限公司 一种晶圆传片机
CN119275144B (zh) * 2024-12-10 2025-02-25 北京和崎精密科技有限公司 晶片存储器

Citations (5)

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Publication number Priority date Publication date Assignee Title
JPH11220001A (ja) * 1998-01-30 1999-08-10 Hitachi Ltd 半導体基板処理装置におけるロードポート及びロードポート搬送台車
US6013920A (en) * 1997-11-28 2000-01-11 Fortrend Engineering Coirporation Wafer-mapping load post interface having an effector position sensing device
US6220808B1 (en) * 1998-07-13 2001-04-24 Asyst Technologies, Inc. Ergonomic, variable size, bottom opening system compatible with a vertical interface
US6281516B1 (en) * 1998-07-13 2001-08-28 Newport Corporation FIMS transport box load interface
US6305500B1 (en) * 1999-08-25 2001-10-23 Maxtor Corporation Material delivery system for clean room-like environments

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Publication number Priority date Publication date Assignee Title
US6013920A (en) * 1997-11-28 2000-01-11 Fortrend Engineering Coirporation Wafer-mapping load post interface having an effector position sensing device
JPH11220001A (ja) * 1998-01-30 1999-08-10 Hitachi Ltd 半導体基板処理装置におけるロードポート及びロードポート搬送台車
US6220808B1 (en) * 1998-07-13 2001-04-24 Asyst Technologies, Inc. Ergonomic, variable size, bottom opening system compatible with a vertical interface
US6281516B1 (en) * 1998-07-13 2001-08-28 Newport Corporation FIMS transport box load interface
US6305500B1 (en) * 1999-08-25 2001-10-23 Maxtor Corporation Material delivery system for clean room-like environments

Also Published As

Publication number Publication date
US7217076B2 (en) 2007-05-15
DE10297169T5 (de) 2004-07-29
US20030044261A1 (en) 2003-03-06
JP2005508570A (ja) 2005-03-31
WO2003021643A2 (en) 2003-03-13
KR100800612B1 (ko) 2008-02-05
KR20040040447A (ko) 2004-05-12
CN1572013A (zh) 2005-01-26
JP4309264B2 (ja) 2009-08-05
WO2003021643A3 (en) 2003-08-07

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: CROSSIN AUTOMATION CORPORATION

Free format text: FORMER OWNER: ASYST TECHNOLOGIES INC.

Effective date: 20120201

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20120201

Address after: American California

Patentee after: Crossing Automation, Inc.

Address before: California, USA

Patentee before: ASYST TECHNOLOGIES, Inc.

CX01 Expiry of patent term

Granted publication date: 20070718

CX01 Expiry of patent term