KR100787341B1 - 수지 조성물 및 그의 경화물 및 그것을 이용하여 얻어지는인쇄 배선판 - Google Patents

수지 조성물 및 그의 경화물 및 그것을 이용하여 얻어지는인쇄 배선판 Download PDF

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KR100787341B1
KR100787341B1 KR1020060085140A KR20060085140A KR100787341B1 KR 100787341 B1 KR100787341 B1 KR 100787341B1 KR 1020060085140 A KR1020060085140 A KR 1020060085140A KR 20060085140 A KR20060085140 A KR 20060085140A KR 100787341 B1 KR100787341 B1 KR 100787341B1
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South Korea
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resin composition
photocurable
carboxylic acid
resin
formula
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Korean (ko)
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KR20070027459A (ko
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요꼬 시바사끼
마사오 아리마
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다이요 잉키 세이조 가부시키가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
KR1020060085140A 2005-09-06 2006-09-05 수지 조성물 및 그의 경화물 및 그것을 이용하여 얻어지는인쇄 배선판 Active KR100787341B1 (ko)

Applications Claiming Priority (2)

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JPJP-P-2005-00257525 2005-09-06
JP2005257525 2005-09-06

Publications (2)

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KR20070027459A KR20070027459A (ko) 2007-03-09
KR100787341B1 true KR100787341B1 (ko) 2007-12-18

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KR1020060085140A Active KR100787341B1 (ko) 2005-09-06 2006-09-05 수지 조성물 및 그의 경화물 및 그것을 이용하여 얻어지는인쇄 배선판

Country Status (4)

Country Link
JP (1) JP5567543B2 (enrdf_load_stackoverflow)
KR (1) KR100787341B1 (enrdf_load_stackoverflow)
CN (1) CN1927944B (enrdf_load_stackoverflow)
TW (1) TW200728379A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101840584B1 (ko) 2017-01-17 2018-03-20 동우 화인켐 주식회사 착색 감광성 수지 조성물, 컬러필터 및 화상표시장치

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4663679B2 (ja) * 2007-05-08 2011-04-06 太陽ホールディングス株式会社 光硬化性樹脂組成物、ドライフィルム、硬化物、及びプリント配線板
JP5291893B2 (ja) * 2007-05-08 2013-09-18 太陽ホールディングス株式会社 光硬化性樹脂組成物およびその硬化物
JP4975579B2 (ja) * 2007-10-01 2012-07-11 太陽ホールディングス株式会社 組成物、ドライフィルム、硬化物及びプリント配線板
JP5513711B2 (ja) * 2007-10-01 2014-06-04 太陽ホールディングス株式会社 感光性樹脂組成物及びその硬化物
JP5376793B2 (ja) * 2007-11-07 2013-12-25 太陽ホールディングス株式会社 光硬化性樹脂組成物及びその硬化物パターン、並びに該硬化物パターンを具備するプリント配線板
KR20100009572A (ko) * 2007-12-19 2010-01-27 도요 잉키 세이조 가부시끼가이샤 착색 조성물, 컬러 필터의 제조방법 및 컬러 필터
WO2012165259A1 (ja) * 2011-05-31 2012-12-06 電気化学工業株式会社 エネルギー線硬化性樹脂組成物
WO2013084283A1 (ja) 2011-12-05 2013-06-13 日立化成株式会社 タッチパネル用電極の保護膜の形成方法、感光性樹脂組成物及び感光性エレメント
WO2013084282A1 (ja) 2011-12-05 2013-06-13 日立化成株式会社 樹脂硬化膜パターンの形成方法、感光性樹脂組成物及び感光性エレメント
JP2014006499A (ja) * 2012-05-29 2014-01-16 Taiyo Ink Mfg Ltd 感光性組成物及びその硬化層を有するプリント配線板
JP5523642B1 (ja) * 2013-07-26 2014-06-18 太陽インキ製造株式会社 プリント配線板製造用光硬化性組成物、その硬化物およびプリント配線板
KR101835500B1 (ko) * 2014-12-24 2018-03-07 삼성에스디아이 주식회사 감광성 수지 조성물 및 이를 이용한 컬러필터
JP6783600B2 (ja) * 2016-09-20 2020-11-11 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、プリント配線板、および、プリント配線板の製造方法
CN113025202B (zh) * 2021-02-25 2022-04-15 长沙市湘鼎涂料有限公司 一种丙烯酸改性环氧化有机硅光固化涂料及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62201859A (ja) 1986-02-28 1987-09-05 Asahi Chem Ind Co Ltd 新規なオキシムエステル化合物及びその合成法
JPS62286961A (ja) 1986-06-05 1987-12-12 Asahi Chem Ind Co Ltd 新規なオキシムエステル化合物及びその製造方法
KR20010082580A (ko) * 1999-12-15 2001-08-30 에프. 아. 프라저, 에른스트 알테르 (에. 알테르), 한스 페터 비틀린 (하. 페. 비틀린), 피. 랍 보프, 브이. 스펜글러, 페. 아에글러 옥심 에스테르 광개시제
KR20040007700A (ko) * 2001-06-11 2004-01-24 시바 스페셜티 케미칼스 홀딩 인크. 결합된 구조를 가지는 옥심 에스테르 광개시제

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* Cited by examiner, † Cited by third party
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JP3782134B2 (ja) * 1995-07-20 2006-06-07 旭化成エレクトロニクス株式会社 プリント配線板の製造方法
TW494276B (en) * 1999-05-06 2002-07-11 Solar Blak Water Co Ltd Solder resist ink composition
JP4008273B2 (ja) * 2002-03-26 2007-11-14 太陽インキ製造株式会社 アルカリ現像型感光性樹脂組成物及びそれを用いたプリント配線基板
JP4087650B2 (ja) * 2002-07-12 2008-05-21 太陽インキ製造株式会社 光硬化性・熱硬化性樹脂組成物及びその硬化物
TW200417294A (en) * 2002-11-28 2004-09-01 Taiyo Ink Mfg Co Ltd Photo- and thermo-setting resin composition and printed wiring boards made by using the same
JP4437651B2 (ja) * 2003-08-28 2010-03-24 新日鐵化学株式会社 感光性樹脂組成物及びそれを用いたカラーフィルター
JP4489566B2 (ja) * 2003-11-27 2010-06-23 太陽インキ製造株式会社 硬化性樹脂組成物、その硬化物、およびプリント配線板
JP2005232195A (ja) * 2004-02-05 2005-09-02 Taiyo Ink Mfg Ltd 熱硬化性樹脂組成物、及びその硬化塗膜
JP2005221739A (ja) * 2004-02-05 2005-08-18 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、フォトレジストパターンの製造法及びプリント配線板の製造法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62201859A (ja) 1986-02-28 1987-09-05 Asahi Chem Ind Co Ltd 新規なオキシムエステル化合物及びその合成法
JPS62286961A (ja) 1986-06-05 1987-12-12 Asahi Chem Ind Co Ltd 新規なオキシムエステル化合物及びその製造方法
KR20010082580A (ko) * 1999-12-15 2001-08-30 에프. 아. 프라저, 에른스트 알테르 (에. 알테르), 한스 페터 비틀린 (하. 페. 비틀린), 피. 랍 보프, 브이. 스펜글러, 페. 아에글러 옥심 에스테르 광개시제
KR20040007700A (ko) * 2001-06-11 2004-01-24 시바 스페셜티 케미칼스 홀딩 인크. 결합된 구조를 가지는 옥심 에스테르 광개시제

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101840584B1 (ko) 2017-01-17 2018-03-20 동우 화인켐 주식회사 착색 감광성 수지 조성물, 컬러필터 및 화상표시장치

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Publication number Publication date
TW200728379A (en) 2007-08-01
TWI333499B (enrdf_load_stackoverflow) 2010-11-21
JP2012103703A (ja) 2012-05-31
KR20070027459A (ko) 2007-03-09
CN1927944A (zh) 2007-03-14
CN1927944B (zh) 2010-05-12
JP5567543B2 (ja) 2014-08-06

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