CN1927944B - 树脂组合物、其固化物及使用其制得的印刷电路板 - Google Patents
树脂组合物、其固化物及使用其制得的印刷电路板 Download PDFInfo
- Publication number
- CN1927944B CN1927944B CN2006101119009A CN200610111900A CN1927944B CN 1927944 B CN1927944 B CN 1927944B CN 2006101119009 A CN2006101119009 A CN 2006101119009A CN 200610111900 A CN200610111900 A CN 200610111900A CN 1927944 B CN1927944 B CN 1927944B
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- CN
- China
- Prior art keywords
- carboxylic acid
- resin
- compound
- unsaturated
- reaction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Polymerisation Methods In General (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
Claims (17)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005257525 | 2005-09-06 | ||
JP2005257525 | 2005-09-06 | ||
JP2005-257525 | 2005-09-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1927944A CN1927944A (zh) | 2007-03-14 |
CN1927944B true CN1927944B (zh) | 2010-05-12 |
Family
ID=37858091
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006101119009A Active CN1927944B (zh) | 2005-09-06 | 2006-09-06 | 树脂组合物、其固化物及使用其制得的印刷电路板 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5567543B2 (zh) |
KR (1) | KR100787341B1 (zh) |
CN (1) | CN1927944B (zh) |
TW (1) | TW200728379A (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4663679B2 (ja) * | 2007-05-08 | 2011-04-06 | 太陽ホールディングス株式会社 | 光硬化性樹脂組成物、ドライフィルム、硬化物、及びプリント配線板 |
JP5291893B2 (ja) * | 2007-05-08 | 2013-09-18 | 太陽ホールディングス株式会社 | 光硬化性樹脂組成物およびその硬化物 |
JP4975579B2 (ja) * | 2007-10-01 | 2012-07-11 | 太陽ホールディングス株式会社 | 組成物、ドライフィルム、硬化物及びプリント配線板 |
JP5513711B2 (ja) * | 2007-10-01 | 2014-06-04 | 太陽ホールディングス株式会社 | 感光性樹脂組成物及びその硬化物 |
JP5376793B2 (ja) * | 2007-11-07 | 2013-12-25 | 太陽ホールディングス株式会社 | 光硬化性樹脂組成物及びその硬化物パターン、並びに該硬化物パターンを具備するプリント配線板 |
WO2009078407A1 (ja) * | 2007-12-19 | 2009-06-25 | Toyo Ink Mfg. Co., Ltd. | 着色組成物、カラーフィルタの製造方法およびカラーフィルタ |
KR102006993B1 (ko) * | 2011-05-31 | 2019-08-02 | 덴카 주식회사 | 에너지선 경화성 수지 조성물 |
WO2013084282A1 (ja) | 2011-12-05 | 2013-06-13 | 日立化成株式会社 | 樹脂硬化膜パターンの形成方法、感光性樹脂組成物及び感光性エレメント |
WO2013084283A1 (ja) | 2011-12-05 | 2013-06-13 | 日立化成株式会社 | タッチパネル用電極の保護膜の形成方法、感光性樹脂組成物及び感光性エレメント |
JP2014006499A (ja) * | 2012-05-29 | 2014-01-16 | Taiyo Ink Mfg Ltd | 感光性組成物及びその硬化層を有するプリント配線板 |
JP5523642B1 (ja) * | 2013-07-26 | 2014-06-18 | 太陽インキ製造株式会社 | プリント配線板製造用光硬化性組成物、その硬化物およびプリント配線板 |
KR101835500B1 (ko) * | 2014-12-24 | 2018-03-07 | 삼성에스디아이 주식회사 | 감광성 수지 조성물 및 이를 이용한 컬러필터 |
JP6783600B2 (ja) * | 2016-09-20 | 2020-11-11 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、ドライフィルム、プリント配線板、および、プリント配線板の製造方法 |
KR101840584B1 (ko) | 2017-01-17 | 2018-03-20 | 동우 화인켐 주식회사 | 착색 감광성 수지 조성물, 컬러필터 및 화상표시장치 |
CN113025202B (zh) * | 2021-02-25 | 2022-04-15 | 长沙市湘鼎涂料有限公司 | 一种丙烯酸改性环氧化有机硅光固化涂料及其制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1364247A (zh) * | 1999-05-06 | 2002-08-14 | 太阳油墨制造株式会社 | 焊锡抗蚀剂油墨组合物 |
CN1472253A (zh) * | 2002-07-12 | 2004-02-04 | 太阳油墨制造株式会社 | 光固化性·热固化性树脂组合物及其固化物 |
CN1651510A (zh) * | 2004-02-05 | 2005-08-10 | 太阳油墨股份有限公司 | 热固性树脂组合物及其固化涂膜 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0755925B2 (ja) | 1986-02-28 | 1995-06-14 | 旭化成工業株式会社 | 新規なオキシムエステル化合物及びその合成法 |
JPS62286961A (ja) | 1986-06-05 | 1987-12-12 | Asahi Chem Ind Co Ltd | 新規なオキシムエステル化合物及びその製造方法 |
JP3782134B2 (ja) * | 1995-07-20 | 2006-06-07 | 旭化成エレクトロニクス株式会社 | プリント配線板の製造方法 |
NL1016815C2 (nl) * | 1999-12-15 | 2002-05-14 | Ciba Sc Holding Ag | Oximester-fotoinitiatoren. |
EP1395615B1 (en) * | 2001-06-11 | 2009-10-21 | Basf Se | Oxime ester photoinitiators having a combined structure |
JP4008273B2 (ja) * | 2002-03-26 | 2007-11-14 | 太陽インキ製造株式会社 | アルカリ現像型感光性樹脂組成物及びそれを用いたプリント配線基板 |
TW200417294A (en) * | 2002-11-28 | 2004-09-01 | Taiyo Ink Mfg Co Ltd | Photo- and thermo-setting resin composition and printed wiring boards made by using the same |
JP4437651B2 (ja) * | 2003-08-28 | 2010-03-24 | 新日鐵化学株式会社 | 感光性樹脂組成物及びそれを用いたカラーフィルター |
JP4489566B2 (ja) * | 2003-11-27 | 2010-06-23 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、その硬化物、およびプリント配線板 |
JP2005221739A (ja) * | 2004-02-05 | 2005-08-18 | Hitachi Chem Co Ltd | 感光性樹脂組成物、これを用いた感光性エレメント、フォトレジストパターンの製造法及びプリント配線板の製造法 |
-
2006
- 2006-09-05 TW TW095132758A patent/TW200728379A/zh unknown
- 2006-09-05 KR KR1020060085140A patent/KR100787341B1/ko active IP Right Grant
- 2006-09-06 CN CN2006101119009A patent/CN1927944B/zh active Active
-
2011
- 2011-11-28 JP JP2011259566A patent/JP5567543B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1364247A (zh) * | 1999-05-06 | 2002-08-14 | 太阳油墨制造株式会社 | 焊锡抗蚀剂油墨组合物 |
CN1472253A (zh) * | 2002-07-12 | 2004-02-04 | 太阳油墨制造株式会社 | 光固化性·热固化性树脂组合物及其固化物 |
CN1651510A (zh) * | 2004-02-05 | 2005-08-10 | 太阳油墨股份有限公司 | 热固性树脂组合物及其固化涂膜 |
Also Published As
Publication number | Publication date |
---|---|
KR20070027459A (ko) | 2007-03-09 |
TWI333499B (zh) | 2010-11-21 |
JP2012103703A (ja) | 2012-05-31 |
JP5567543B2 (ja) | 2014-08-06 |
CN1927944A (zh) | 2007-03-14 |
TW200728379A (en) | 2007-08-01 |
KR100787341B1 (ko) | 2007-12-18 |
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PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: TAIYO HOLDINGS CO., LTD. Free format text: FORMER NAME: TAIYO INK MANUFACTURING CO., LTD. |
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CP01 | Change in the name or title of a patent holder |
Address after: Japan Tokyo Nerima feather Ze 2 chome 7 No. 1 Patentee after: Taiyo Holding Co., Ltd. Address before: Japan Tokyo Nerima feather Ze 2 chome 7 No. 1 Patentee before: Taiyo Ink Manufacturing Co., Ltd. |
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EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20070314 Assignee: Taiyo Ink Mfg.Co., Ltd. Assignor: Taiyo Holding Co., Ltd. Contract record no.: 2011990000116 Denomination of invention: Resin composition, cured composition and printed circuit board using same Granted publication date: 20100512 License type: Common License Record date: 20110302 |
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LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model |