JP5567543B2 - 樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板 - Google Patents

樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板 Download PDF

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JP5567543B2
JP5567543B2 JP2011259566A JP2011259566A JP5567543B2 JP 5567543 B2 JP5567543 B2 JP 5567543B2 JP 2011259566 A JP2011259566 A JP 2011259566A JP 2011259566 A JP2011259566 A JP 2011259566A JP 5567543 B2 JP5567543 B2 JP 5567543B2
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carboxylic acid
mass
resin composition
resin
photocurable
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Japanese (ja)
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JP2012103703A (ja
Inventor
陽子 柴▲崎▼
聖夫 有馬
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Taiyo Holdings Co Ltd
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Taiyo Holdings Co Ltd
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP2011259566A 2005-09-06 2011-11-28 樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板 Active JP5567543B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011259566A JP5567543B2 (ja) 2005-09-06 2011-11-28 樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005257525 2005-09-06
JP2005257525 2005-09-06
JP2011259566A JP5567543B2 (ja) 2005-09-06 2011-11-28 樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板

Related Parent Applications (1)

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JP2006240556A Division JP5384785B2 (ja) 2005-09-06 2006-09-05 樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板

Publications (2)

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JP2012103703A JP2012103703A (ja) 2012-05-31
JP5567543B2 true JP5567543B2 (ja) 2014-08-06

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JP2011259566A Active JP5567543B2 (ja) 2005-09-06 2011-11-28 樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板

Country Status (4)

Country Link
JP (1) JP5567543B2 (enrdf_load_stackoverflow)
KR (1) KR100787341B1 (enrdf_load_stackoverflow)
CN (1) CN1927944B (enrdf_load_stackoverflow)
TW (1) TW200728379A (enrdf_load_stackoverflow)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5291893B2 (ja) * 2007-05-08 2013-09-18 太陽ホールディングス株式会社 光硬化性樹脂組成物およびその硬化物
JP4663679B2 (ja) * 2007-05-08 2011-04-06 太陽ホールディングス株式会社 光硬化性樹脂組成物、ドライフィルム、硬化物、及びプリント配線板
JP4975579B2 (ja) * 2007-10-01 2012-07-11 太陽ホールディングス株式会社 組成物、ドライフィルム、硬化物及びプリント配線板
JP5513711B2 (ja) * 2007-10-01 2014-06-04 太陽ホールディングス株式会社 感光性樹脂組成物及びその硬化物
JP5376793B2 (ja) * 2007-11-07 2013-12-25 太陽ホールディングス株式会社 光硬化性樹脂組成物及びその硬化物パターン、並びに該硬化物パターンを具備するプリント配線板
CN101681102B (zh) * 2007-12-19 2014-04-02 东洋油墨制造株式会社 着色组合物、滤色器的制造方法和滤色器
CN103562267B (zh) * 2011-05-31 2018-11-06 电化株式会社 能量线固化性树脂组合物
WO2013084282A1 (ja) 2011-12-05 2013-06-13 日立化成株式会社 樹脂硬化膜パターンの形成方法、感光性樹脂組成物及び感光性エレメント
WO2013084283A1 (ja) 2011-12-05 2013-06-13 日立化成株式会社 タッチパネル用電極の保護膜の形成方法、感光性樹脂組成物及び感光性エレメント
JP2014006499A (ja) * 2012-05-29 2014-01-16 Taiyo Ink Mfg Ltd 感光性組成物及びその硬化層を有するプリント配線板
JP5523642B1 (ja) * 2013-07-26 2014-06-18 太陽インキ製造株式会社 プリント配線板製造用光硬化性組成物、その硬化物およびプリント配線板
KR101835500B1 (ko) * 2014-12-24 2018-03-07 삼성에스디아이 주식회사 감광성 수지 조성물 및 이를 이용한 컬러필터
JP6783600B2 (ja) * 2016-09-20 2020-11-11 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、プリント配線板、および、プリント配線板の製造方法
KR101840584B1 (ko) 2017-01-17 2018-03-20 동우 화인켐 주식회사 착색 감광성 수지 조성물, 컬러필터 및 화상표시장치
CN113025202B (zh) * 2021-02-25 2022-04-15 长沙市湘鼎涂料有限公司 一种丙烯酸改性环氧化有机硅光固化涂料及其制备方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0755925B2 (ja) 1986-02-28 1995-06-14 旭化成工業株式会社 新規なオキシムエステル化合物及びその合成法
JPS62286961A (ja) 1986-06-05 1987-12-12 Asahi Chem Ind Co Ltd 新規なオキシムエステル化合物及びその製造方法
JP3782134B2 (ja) * 1995-07-20 2006-06-07 旭化成エレクトロニクス株式会社 プリント配線板の製造方法
TW494276B (en) * 1999-05-06 2002-07-11 Solar Blak Water Co Ltd Solder resist ink composition
NL1016815C2 (nl) * 1999-12-15 2002-05-14 Ciba Sc Holding Ag Oximester-fotoinitiatoren.
DE60234095D1 (de) * 2001-06-11 2009-12-03 Basf Se Oxim ester photoinitiatoren mit kombinierter struktur
JP4008273B2 (ja) * 2002-03-26 2007-11-14 太陽インキ製造株式会社 アルカリ現像型感光性樹脂組成物及びそれを用いたプリント配線基板
JP4087650B2 (ja) * 2002-07-12 2008-05-21 太陽インキ製造株式会社 光硬化性・熱硬化性樹脂組成物及びその硬化物
TW200417294A (en) * 2002-11-28 2004-09-01 Taiyo Ink Mfg Co Ltd Photo- and thermo-setting resin composition and printed wiring boards made by using the same
JP4437651B2 (ja) * 2003-08-28 2010-03-24 新日鐵化学株式会社 感光性樹脂組成物及びそれを用いたカラーフィルター
JP4489566B2 (ja) * 2003-11-27 2010-06-23 太陽インキ製造株式会社 硬化性樹脂組成物、その硬化物、およびプリント配線板
JP2005221739A (ja) * 2004-02-05 2005-08-18 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、フォトレジストパターンの製造法及びプリント配線板の製造法
JP2005232195A (ja) * 2004-02-05 2005-09-02 Taiyo Ink Mfg Ltd 熱硬化性樹脂組成物、及びその硬化塗膜

Also Published As

Publication number Publication date
CN1927944B (zh) 2010-05-12
KR100787341B1 (ko) 2007-12-18
KR20070027459A (ko) 2007-03-09
CN1927944A (zh) 2007-03-14
TW200728379A (en) 2007-08-01
JP2012103703A (ja) 2012-05-31
TWI333499B (enrdf_load_stackoverflow) 2010-11-21

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