KR100770852B1 - 화학 기계적 평탄화용 그루브형 연마 패드 - Google Patents

화학 기계적 평탄화용 그루브형 연마 패드 Download PDF

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Publication number
KR100770852B1
KR100770852B1 KR1020027016049A KR20027016049A KR100770852B1 KR 100770852 B1 KR100770852 B1 KR 100770852B1 KR 1020027016049 A KR1020027016049 A KR 1020027016049A KR 20027016049 A KR20027016049 A KR 20027016049A KR 100770852 B1 KR100770852 B1 KR 100770852B1
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KR
South Korea
Prior art keywords
pad
groove
polishing
polishing pad
pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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KR1020027016049A
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English (en)
Korean (ko)
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KR20030005405A (ko
Inventor
제임스데이빗비.
비쉬와네이썬애런
쿡리멜번
버크피터에이.
쉬드너데이빗
소조셉케이.
로버츠존브이.에이치.
Original Assignee
롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26902748&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR100770852(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 filed Critical 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드
Publication of KR20030005405A publication Critical patent/KR20030005405A/ko
Application granted granted Critical
Publication of KR100770852B1 publication Critical patent/KR100770852B1/ko
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020027016049A 2000-05-27 2001-05-24 화학 기계적 평탄화용 그루브형 연마 패드 Ceased KR100770852B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US20793800P 2000-05-27 2000-05-27
US60/207,938 2000-05-27
US22209900P 2000-07-28 2000-07-28
US60/222,099 2000-07-28
PCT/US2001/016870 WO2001091972A1 (en) 2000-05-27 2001-05-24 Grooved polishing pads for chemical mechanical planarization

Publications (2)

Publication Number Publication Date
KR20030005405A KR20030005405A (ko) 2003-01-17
KR100770852B1 true KR100770852B1 (ko) 2007-10-26

Family

ID=26902748

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020027016049A Ceased KR100770852B1 (ko) 2000-05-27 2001-05-24 화학 기계적 평탄화용 그루브형 연마 패드
KR1020027015966A Ceased KR100571449B1 (ko) 2000-05-27 2001-05-24 화학 기계적 평탄화용 연마 패드

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020027015966A Ceased KR100571449B1 (ko) 2000-05-27 2001-05-24 화학 기계적 평탄화용 연마 패드

Country Status (6)

Country Link
EP (2) EP1284842B1 (https=)
JP (12) JP4959901B2 (https=)
KR (2) KR100770852B1 (https=)
DE (2) DE60109601T2 (https=)
TW (2) TW528646B (https=)
WO (2) WO2001091972A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112207710A (zh) * 2019-07-10 2021-01-12 Fns科技有限公司 用于抛光晶片的背面的高强度抛光垫

Families Citing this family (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3097658B2 (ja) 1998-05-21 2000-10-10 松下電器産業株式会社 洗濯機
JP4959901B2 (ja) * 2000-05-27 2012-06-27 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 化学機械平坦化用溝付き研磨パッド
US6838149B2 (en) * 2001-12-13 2005-01-04 3M Innovative Properties Company Abrasive article for the deposition and polishing of a conductive material
US20050276967A1 (en) * 2002-05-23 2005-12-15 Cabot Microelectronics Corporation Surface textured microporous polishing pads
TWI250572B (en) * 2002-06-03 2006-03-01 Jsr Corp Polishing pad and multi-layer polishing pad
KR100666726B1 (ko) * 2002-12-28 2007-01-09 에스케이씨 주식회사 Cmp 공정용 컨디셔너 및 이들을 이용한 연마 방법
JP3910921B2 (ja) * 2003-02-06 2007-04-25 株式会社東芝 研磨布および半導体装置の製造方法
US7238097B2 (en) 2003-04-11 2007-07-03 Nihon Microcoating Co., Ltd. Polishing pad and method of producing same
SG111222A1 (en) * 2003-10-09 2005-05-30 Rohm & Haas Elect Mat Polishing pad
US7074115B2 (en) 2003-10-09 2006-07-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad
JP4606730B2 (ja) * 2003-12-11 2011-01-05 東洋ゴム工業株式会社 研磨パッドおよびその製造方法
US20050171224A1 (en) * 2004-02-03 2005-08-04 Kulp Mary J. Polyurethane polishing pad
JP2006114885A (ja) * 2004-09-17 2006-04-27 Jsr Corp 化学機械研磨パッド及び化学機械研磨方法
TWI385050B (zh) * 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
JP2006231429A (ja) * 2005-02-22 2006-09-07 Inoac Corp 研磨パッドおよびその製造方法
US7357703B2 (en) 2005-12-28 2008-04-15 Jsr Corporation Chemical mechanical polishing pad and chemical mechanical polishing method
US7789738B2 (en) 2006-07-03 2010-09-07 San Fang Chemical Industry Co., Ltd. Sheet for mounting polishing workpiece and method for making the same
US7316605B1 (en) 2006-07-03 2008-01-08 San Fang Chemical Industry Co., Ltd. Sheet for mounting polishing workpiece and method for making the same
JP5415700B2 (ja) * 2007-02-01 2014-02-12 株式会社クラレ 研磨パッド及び研磨パッドの製造方法
KR101146966B1 (ko) 2007-02-01 2012-05-23 가부시키가이샤 구라레 연마 패드 및 연마 패드의 제조 방법
JP2008258574A (ja) * 2007-03-14 2008-10-23 Jsr Corp 化学機械研磨パッドおよび化学機械研磨方法
US8491360B2 (en) * 2007-10-26 2013-07-23 Innopad, Inc. Three-dimensional network in CMP pad
JP5393434B2 (ja) 2008-12-26 2014-01-22 東洋ゴム工業株式会社 研磨パッド及びその製造方法
JP2009148891A (ja) * 2009-04-02 2009-07-09 Nitta Haas Inc 研磨パッド
SG177625A1 (en) * 2009-07-16 2012-02-28 Cabot Microelectronics Corp Grooved cmp polishing pad
US8222145B2 (en) * 2009-09-24 2012-07-17 Dupont Air Products Nanomaterials, Llc Method and composition for chemical mechanical planarization of a metal-containing substrate
JP5426469B2 (ja) 2010-05-10 2014-02-26 東洋ゴム工業株式会社 研磨パッドおよびガラス基板の製造方法
CN104093525A (zh) * 2012-04-10 2014-10-08 旭硝子株式会社 玻璃基板的研磨方法
US9067299B2 (en) * 2012-04-25 2015-06-30 Applied Materials, Inc. Printed chemical mechanical polishing pad
US9597769B2 (en) * 2012-06-04 2017-03-21 Nexplanar Corporation Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer
JP6196858B2 (ja) * 2012-09-24 2017-09-13 株式会社荏原製作所 研磨方法および研磨装置
JP5836992B2 (ja) 2013-03-19 2015-12-24 株式会社東芝 半導体装置の製造方法
US20140370788A1 (en) * 2013-06-13 2014-12-18 Cabot Microelectronics Corporation Low surface roughness polishing pad
TWI599447B (zh) 2013-10-18 2017-09-21 卡博特微電子公司 具有偏移同心溝槽圖樣之邊緣排除區的ｃｍｐ拋光墊
US10252396B2 (en) * 2014-04-03 2019-04-09 3M Innovative Properties Company Polishing pads and systems and methods of making and using the same
US9731398B2 (en) 2014-08-22 2017-08-15 Rohm And Haas Electronic Materials Cmp Holding, Inc. Polyurethane polishing pad
TWI669360B (zh) * 2015-04-03 2019-08-21 日商富士紡控股股份有限公司 Abrasive pad
JP2016196067A (ja) * 2015-04-03 2016-11-24 富士紡ホールディングス株式会社 研磨パッド
JP6600149B2 (ja) * 2015-04-03 2019-10-30 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
JP6513455B2 (ja) * 2015-04-03 2019-05-15 富士紡ホールディングス株式会社 研磨パッド
US10086494B2 (en) * 2016-09-13 2018-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High planarization efficiency chemical mechanical polishing pads and methods of making
SG11201906131WA (en) * 2017-01-20 2019-08-27 Applied Materials Inc A thin plastic polishing article for cmp applications
CN110431011B (zh) 2017-03-28 2021-12-24 Ａｇｃ株式会社 层叠体、印刷物及其制造方法
JP6968651B2 (ja) * 2017-10-12 2021-11-17 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
JP7349774B2 (ja) * 2018-03-09 2023-09-25 富士紡ホールディングス株式会社 研磨パッド、研磨パッドの製造方法、被研磨物の表面を研磨する方法、被研磨物の表面を研磨する際のスクラッチを低減する方法
JP7141230B2 (ja) * 2018-03-30 2022-09-22 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
JP7141283B2 (ja) * 2018-09-06 2022-09-22 富士紡ホールディングス株式会社 研磨パッド、研磨パッドの製造方法、及び被研磨物の表面を研磨する方法
EP4177008A1 (en) 2018-09-28 2023-05-10 Fujibo Holdings, Inc. Polishing pad and method for producing polished product
JP7384608B2 (ja) * 2018-09-28 2023-11-21 富士紡ホールディングス株式会社 研磨パッド及び研磨加工物の製造方法
KR102674027B1 (ko) * 2019-01-29 2024-06-12 삼성전자주식회사 재생 연마패드
CN114450127B (zh) * 2019-07-12 2024-05-28 Cmc材料有限责任公司 采用多胺及环己烷二甲醇固化剂的抛光垫
WO2022071205A1 (ja) 2020-09-30 2022-04-07 富士紡ホールディングス株式会社 研磨パッド、及び研磨加工物の製造方法
JP7759179B2 (ja) 2020-09-30 2025-10-23 富士紡ホールディングス株式会社 研磨パッド
KR102488115B1 (ko) * 2020-11-06 2023-01-12 에스케이엔펄스 주식회사 연마 패드, 연마 패드의 제조 방법 및 이를 이용한 반도체 소자의 제조 방법
CN112480639B (zh) * 2020-12-09 2023-03-24 金旸（厦门）新材料科技有限公司 一种高效超韧导电pc材料及其制备方法
KR102561824B1 (ko) * 2021-06-02 2023-07-31 에스케이엔펄스 주식회사 연마패드 및 이를 이용한 반도체 소자의 제조방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4569982A (en) 1984-02-02 1986-02-11 Bayer Aktiengesellschaft Process for the production of polyurea-elastomers and corresponding elastomers having an idealized segment structure
US6017265A (en) 1995-06-07 2000-01-25 Rodel, Inc. Methods for using polishing pads

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6128573A (ja) * 1984-07-18 1986-02-08 Mitsubishi Mining & Cement Co Ltd 研磨パツド及びその製造方法
US4568611A (en) * 1985-04-03 1986-02-04 Morton Thiokol, Inc. Polyester-polyurethane composition and use thereof
US5271964A (en) * 1991-06-26 1993-12-21 Minnesota Mining And Manufacturing Company Process for manufacturing abrasive tape
US5216843A (en) * 1992-09-24 1993-06-08 Intel Corporation Polishing pad conditioning apparatus for wafer planarization process
US5446085A (en) * 1993-06-15 1995-08-29 International Business Machines Corporation Polymeric compositions containing inorganic fillers and use thereof
JPH07138340A (ja) * 1993-11-15 1995-05-30 Epozoole:Kk 耐熱性の熱可塑性ポリウレタンエラストマー及びその製造法
US5580647A (en) * 1993-12-20 1996-12-03 Minnesota Mining And Manufacturing Company Abrasive articles incorporating addition polymerizable resins and reactive diluents
US5489233A (en) * 1994-04-08 1996-02-06 Rodel, Inc. Polishing pads and methods for their use
JP3100905B2 (ja) * 1995-08-24 2000-10-23 松下電器産業株式会社 半導体基板の研磨方法及びその装置
JP3552845B2 (ja) * 1996-04-25 2004-08-11 株式会社ルネサステクノロジ 半導体装置の製造方法
US5692950A (en) * 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
EP0984846B1 (en) * 1997-01-13 2004-11-24 Rodel, Inc. Method of manufacturing a polymeric polishing pad having photolithographically induced surface pattern
JPH10217112A (ja) * 1997-02-06 1998-08-18 Speedfam Co Ltd Ｃｍｐ装置
EP1015176B1 (en) * 1997-04-04 2003-03-12 Rodel Holdings, Inc. Improved polishing pads and methods relating thereto
US6022268A (en) * 1998-04-03 2000-02-08 Rodel Holdings Inc. Polishing pads and methods relating thereto
KR20010005993A (ko) * 1997-04-04 2001-01-15 오브시디안 인코포레이티드 향상된 폴리싱을 위한 폴리싱 미디어 매거진
US5921855A (en) * 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
US6165239A (en) * 1997-07-28 2000-12-26 3M Innovative Properties Company Aqueous sulfopolyurea colloidal dispersions, films and abrasive articles
DE69827147T2 (de) * 1997-08-06 2006-03-02 Rohm and Haas Electronic Materials CMP Holdings, Inc., Newark Verfahren zum herstellen von einem polierkissen
JP2000061818A (ja) * 1998-08-26 2000-02-29 Nikon Corp 研磨パッド
CN1137013C (zh) * 1999-01-21 2004-02-04 罗德尔控股公司 改进的抛光垫及其抛光方法
JP2000263423A (ja) * 1999-03-16 2000-09-26 Toray Ind Inc 研磨パッドおよび研磨装置
JP4959901B2 (ja) * 2000-05-27 2012-06-27 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 化学機械平坦化用溝付き研磨パッド

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4569982A (en) 1984-02-02 1986-02-11 Bayer Aktiengesellschaft Process for the production of polyurea-elastomers and corresponding elastomers having an idealized segment structure
US6017265A (en) 1995-06-07 2000-01-25 Rodel, Inc. Methods for using polishing pads

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112207710A (zh) * 2019-07-10 2021-01-12 Fns科技有限公司 用于抛光晶片的背面的高强度抛光垫
KR20210007124A (ko) * 2019-07-10 2021-01-20 에프엔에스테크 주식회사 웨이퍼 후면 연마용 고경도 연마패드
KR102345784B1 (ko) * 2019-07-10 2022-01-03 에프엔에스테크 주식회사 웨이퍼 후면 연마용 고경도 연마패드

Also Published As

Publication number Publication date
JP2018117150A (ja) 2018-07-26
DE60114183T2 (de) 2006-07-13
KR20030004421A (ko) 2003-01-14
JP2018157220A (ja) 2018-10-04
WO2001091972A1 (en) 2001-12-06
EP1284842A1 (en) 2003-02-26
JP5016576B2 (ja) 2012-09-05
JP5544381B2 (ja) 2014-07-09
JP6375352B2 (ja) 2018-08-15
JP2012114454A (ja) 2012-06-14
JP2013239737A (ja) 2013-11-28
JP2009033193A (ja) 2009-02-12
TW508284B (en) 2002-11-01
JP6141359B2 (ja) 2017-06-07
JP2012023387A (ja) 2012-02-02
JP2014078723A (ja) 2014-05-01
JP6655848B2 (ja) 2020-02-26
JP5584666B2 (ja) 2014-09-03
JP5767280B2 (ja) 2015-08-19
JP2015092610A (ja) 2015-05-14
DE60109601T2 (de) 2006-02-09
EP1284841B1 (en) 2005-03-23
JP2004507077A (ja) 2004-03-04
TW528646B (en) 2003-04-21
DE60109601D1 (de) 2005-04-28
JP5993360B2 (ja) 2016-09-14
JP4615813B2 (ja) 2011-01-19
JP2015188108A (ja) 2015-10-29
JP2017063211A (ja) 2017-03-30
EP1284841A1 (en) 2003-02-26
DE60114183D1 (de) 2006-03-02
KR100571449B1 (ko) 2006-04-17
WO2001091971A1 (en) 2001-12-06
JP2004507076A (ja) 2004-03-04
KR20030005405A (ko) 2003-01-17
EP1284842B1 (en) 2005-10-19
JP4959901B2 (ja) 2012-06-27

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