KR100765004B1 - 질화물 반도체 발광소자 및 그 제조방법 - Google Patents
질화물 반도체 발광소자 및 그 제조방법 Download PDFInfo
- Publication number
- KR100765004B1 KR100765004B1 KR1020040111086A KR20040111086A KR100765004B1 KR 100765004 B1 KR100765004 B1 KR 100765004B1 KR 1020040111086 A KR1020040111086 A KR 1020040111086A KR 20040111086 A KR20040111086 A KR 20040111086A KR 100765004 B1 KR100765004 B1 KR 100765004B1
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- nitride semiconductor
- gan
- light emitting
- semiconductor layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
- H10H20/812—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biophysics (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Led Devices (AREA)
- Semiconductor Lasers (AREA)
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020040111086A KR100765004B1 (ko) | 2004-12-23 | 2004-12-23 | 질화물 반도체 발광소자 및 그 제조방법 |
| CNB200580041795XA CN100568551C (zh) | 2004-12-23 | 2005-12-05 | 氮化物半导体发光器件及其制备方法 |
| PCT/KR2005/004119 WO2006068375A1 (en) | 2004-12-23 | 2005-12-05 | Nitride semiconductor light emitting device and fabrication method thereof |
| JP2007548056A JP2008526013A (ja) | 2004-12-23 | 2005-12-05 | 窒化物半導体発光素子及びその製造方法 |
| US11/722,658 US7902561B2 (en) | 2004-12-23 | 2005-12-05 | Nitride semiconductor light emitting device |
| EP05821286.1A EP1829121B1 (en) | 2004-12-23 | 2005-12-05 | Nitride semiconductor light emitting device and fabrication method thereof |
| US12/981,023 US8704250B2 (en) | 2004-12-23 | 2010-12-29 | Nitride semiconductor light emitting device and fabrication method thereof |
| JP2012286886A JP2013065897A (ja) | 2004-12-23 | 2012-12-28 | 窒化物半導体発光素子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020040111086A KR100765004B1 (ko) | 2004-12-23 | 2004-12-23 | 질화물 반도체 발광소자 및 그 제조방법 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20060072445A KR20060072445A (ko) | 2006-06-28 |
| KR100765004B1 true KR100765004B1 (ko) | 2007-10-09 |
Family
ID=36601936
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020040111086A Expired - Fee Related KR100765004B1 (ko) | 2004-12-23 | 2004-12-23 | 질화물 반도체 발광소자 및 그 제조방법 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US7902561B2 (enExample) |
| EP (1) | EP1829121B1 (enExample) |
| JP (2) | JP2008526013A (enExample) |
| KR (1) | KR100765004B1 (enExample) |
| CN (1) | CN100568551C (enExample) |
| WO (1) | WO2006068375A1 (enExample) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9524869B2 (en) | 2004-03-11 | 2016-12-20 | Epistar Corporation | Nitride-based semiconductor light-emitting device |
| KR100765004B1 (ko) | 2004-12-23 | 2007-10-09 | 엘지이노텍 주식회사 | 질화물 반도체 발광소자 및 그 제조방법 |
| KR100821220B1 (ko) * | 2006-06-29 | 2008-04-10 | 서울옵토디바이스주식회사 | 다층의 버퍼층을 가지는 질화물 반도체 발광 소자 및 그제조방법 |
| KR101316492B1 (ko) | 2007-04-23 | 2013-10-10 | 엘지이노텍 주식회사 | 질화물 반도체 발광소자 및 그 제조 방법 |
| KR100910365B1 (ko) * | 2007-06-11 | 2009-08-04 | 고려대학교 산학협력단 | 수직형 질화물계 발광소자 및 그 제조방법 |
| KR101017396B1 (ko) * | 2008-08-20 | 2011-02-28 | 서울옵토디바이스주식회사 | 변조도핑층을 갖는 발광 다이오드 |
| KR101011757B1 (ko) | 2010-04-09 | 2011-02-07 | 엘지이노텍 주식회사 | 발광 소자, 발광 소자의 제조방법 및 발광 소자 패키지 |
| KR101778159B1 (ko) * | 2011-02-01 | 2017-09-26 | 엘지이노텍 주식회사 | 발광소자 및 발광소자 패키지 |
| KR101913387B1 (ko) | 2012-03-23 | 2018-10-30 | 삼성전자주식회사 | Ⅲ족 질화물 이종 접합 구조 소자의 선택적 저온 오믹 콘택 형성 방법 |
| CN108615725A (zh) * | 2012-07-11 | 2018-10-02 | 亮锐控股有限公司 | 降低或者消除ⅲ-氮化物结构中的纳米管缺陷 |
| CN102738325B (zh) * | 2012-07-17 | 2014-12-17 | 大连理工常州研究院有限公司 | 金属基片垂直GaN基LED芯片及其制备方法 |
| DE102012217631B4 (de) | 2012-09-27 | 2022-05-25 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Bauelement mit einer Schichtstruktur |
| CN103187497B (zh) * | 2013-01-28 | 2015-11-25 | 上海博恩世通光电股份有限公司 | 一种提高大尺寸芯片光效的外延结构及其生长方法 |
| FR3003397B1 (fr) | 2013-03-15 | 2016-07-22 | Soitec Silicon On Insulator | Structures semi-conductrices dotées de régions actives comprenant de l'INGAN |
| TWI593135B (zh) | 2013-03-15 | 2017-07-21 | 索泰克公司 | 具有含氮化銦鎵之主動區域之半導體結構,形成此等半導體結構之方法,以及應用此等半導體結構形成之發光元件 |
| JP2016517627A (ja) * | 2013-03-15 | 2016-06-16 | ソイテックSoitec | InGaNを含んでいる活性領域を有している半導体構造、このような半導体構造を形成する方法、及びこのような半導体構造から形成された発光デバイス |
| TWI648872B (zh) | 2013-03-15 | 2019-01-21 | 法商梭意泰科公司 | 具有包含InGaN之作用區域之半導體結構、形成此等半導體結構之方法及由此等半導體結構所形成之發光裝置 |
| FR3004585B1 (fr) * | 2013-04-12 | 2017-12-29 | Soitec Silicon On Insulator | Structures semi-conductrices dotees de regions actives comprenant de l'ingan |
| CN103236477B (zh) * | 2013-04-19 | 2015-08-12 | 安徽三安光电有限公司 | 一种led外延结构及其制备方法 |
| EP2988339B1 (en) * | 2014-08-20 | 2019-03-27 | LG Innotek Co., Ltd. | Light emitting device |
| JP6380172B2 (ja) * | 2015-03-06 | 2018-08-29 | 豊田合成株式会社 | Iii族窒化物半導体発光素子とその製造方法 |
| CN105514234A (zh) * | 2015-12-14 | 2016-04-20 | 安徽三安光电有限公司 | 一种氮化物发光二极管及其生长方法 |
| CN105957935A (zh) * | 2016-05-28 | 2016-09-21 | 湘能华磊光电股份有限公司 | 一种led外延层及其生长方法 |
| CN107579432B (zh) * | 2017-08-25 | 2019-11-05 | 华南师范大学 | InGaN/AlInN量子阱激光器及其制作方法 |
| EP3707756B1 (en) * | 2017-11-07 | 2022-08-24 | Gallium Enterprises Pty Ltd | Buried activated p-(al,in)gan layers |
| CN115377262B (zh) * | 2021-07-22 | 2025-08-29 | 厦门三安光电有限公司 | 一种外延结构和发光二极管 |
| CN115377258B (zh) * | 2022-08-26 | 2025-10-28 | 江西兆驰半导体有限公司 | Led外延结构及其制备方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09232629A (ja) * | 1996-02-26 | 1997-09-05 | Toshiba Corp | 半導体素子 |
| WO2004017431A1 (en) * | 2002-08-19 | 2004-02-26 | Lg Innotek Co., Ltd | Nitride semiconductor led and fabrication method thereof |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2795294B2 (ja) | 1991-10-12 | 1998-09-10 | 日亜化学工業株式会社 | 窒化ガリウムアルミニウム半導体の結晶成長方法。 |
| JP3307669B2 (ja) | 1992-04-06 | 2002-07-24 | 日本電信電話株式会社 | 化合物半導体超格子 |
| JP3441329B2 (ja) | 1996-02-26 | 2003-09-02 | 株式会社東芝 | 窒化ガリウム系半導体素子 |
| JPH1051070A (ja) * | 1996-07-29 | 1998-02-20 | Fujitsu Ltd | 半導体レーザ |
| JP3688843B2 (ja) * | 1996-09-06 | 2005-08-31 | 株式会社東芝 | 窒化物系半導体素子の製造方法 |
| WO1998031055A1 (en) | 1997-01-09 | 1998-07-16 | Nichia Chemical Industries, Ltd. | Nitride semiconductor device |
| JP3620292B2 (ja) * | 1997-09-01 | 2005-02-16 | 日亜化学工業株式会社 | 窒化物半導体素子 |
| JP3744211B2 (ja) | 1997-09-01 | 2006-02-08 | 日亜化学工業株式会社 | 窒化物半導体素子 |
| DE69835216T2 (de) | 1997-07-25 | 2007-05-31 | Nichia Corp., Anan | Halbleitervorrichtung aus einer nitridverbindung |
| JPH1168158A (ja) | 1997-08-20 | 1999-03-09 | Sanyo Electric Co Ltd | 窒化ガリウム系化合物半導体装置 |
| US6266355B1 (en) * | 1997-09-12 | 2001-07-24 | Sdl, Inc. | Group III-V nitride laser devices with cladding layers to suppress defects such as cracking |
| JP3680558B2 (ja) | 1998-05-25 | 2005-08-10 | 日亜化学工業株式会社 | 窒化物半導体素子 |
| JP3545197B2 (ja) | 1998-03-23 | 2004-07-21 | 三洋電機株式会社 | 半導体素子およびその製造方法 |
| JPH11274555A (ja) | 1998-03-26 | 1999-10-08 | Showa Denko Kk | 半導体素子 |
| US6078064A (en) * | 1998-05-04 | 2000-06-20 | Epistar Co. | Indium gallium nitride light emitting diode |
| US6657300B2 (en) * | 1998-06-05 | 2003-12-02 | Lumileds Lighting U.S., Llc | Formation of ohmic contacts in III-nitride light emitting devices |
| JP2000031591A (ja) | 1998-07-08 | 2000-01-28 | Toshiba Corp | 半導体発光素子 |
| JP3946427B2 (ja) * | 2000-03-29 | 2007-07-18 | 株式会社東芝 | エピタキシャル成長用基板の製造方法及びこのエピタキシャル成長用基板を用いた半導体装置の製造方法 |
| JP2002009335A (ja) | 2000-06-19 | 2002-01-11 | Hitachi Cable Ltd | 発光ダイオード |
| KR100369821B1 (ko) * | 2000-12-27 | 2003-02-05 | 삼성전자 주식회사 | 디스플레이장치 |
| JP2002319703A (ja) | 2001-04-20 | 2002-10-31 | Ricoh Co Ltd | 半導体装置およびその作製方法 |
| US6724013B2 (en) | 2001-12-21 | 2004-04-20 | Xerox Corporation | Edge-emitting nitride-based laser diode with p-n tunnel junction current injection |
| TWI271877B (en) * | 2002-06-04 | 2007-01-21 | Nitride Semiconductors Co Ltd | Gallium nitride compound semiconductor device and manufacturing method |
| KR100497127B1 (ko) * | 2002-09-05 | 2005-06-28 | 삼성전기주식회사 | 질화갈륨계 반도체 엘이디 소자 |
| TWI234915B (en) | 2002-11-18 | 2005-06-21 | Pioneer Corp | Semiconductor light-emitting element and method of manufacturing the same |
| JP4127045B2 (ja) | 2002-12-17 | 2008-07-30 | 日立電線株式会社 | 半導体発光素子 |
| KR100765004B1 (ko) | 2004-12-23 | 2007-10-09 | 엘지이노텍 주식회사 | 질화물 반도체 발광소자 및 그 제조방법 |
| KR20070079659A (ko) | 2006-02-03 | 2007-08-08 | 김태형 | Mp3 플레이어 |
-
2004
- 2004-12-23 KR KR1020040111086A patent/KR100765004B1/ko not_active Expired - Fee Related
-
2005
- 2005-12-05 CN CNB200580041795XA patent/CN100568551C/zh not_active Expired - Fee Related
- 2005-12-05 US US11/722,658 patent/US7902561B2/en not_active Expired - Fee Related
- 2005-12-05 WO PCT/KR2005/004119 patent/WO2006068375A1/en not_active Ceased
- 2005-12-05 JP JP2007548056A patent/JP2008526013A/ja active Pending
- 2005-12-05 EP EP05821286.1A patent/EP1829121B1/en not_active Ceased
-
2010
- 2010-12-29 US US12/981,023 patent/US8704250B2/en active Active
-
2012
- 2012-12-28 JP JP2012286886A patent/JP2013065897A/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09232629A (ja) * | 1996-02-26 | 1997-09-05 | Toshiba Corp | 半導体素子 |
| WO2004017431A1 (en) * | 2002-08-19 | 2004-02-26 | Lg Innotek Co., Ltd | Nitride semiconductor led and fabrication method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1829121B1 (en) | 2018-11-07 |
| US7902561B2 (en) | 2011-03-08 |
| CN100568551C (zh) | 2009-12-09 |
| JP2013065897A (ja) | 2013-04-11 |
| JP2008526013A (ja) | 2008-07-17 |
| WO2006068375A1 (en) | 2006-06-29 |
| EP1829121A1 (en) | 2007-09-05 |
| EP1829121A4 (en) | 2010-12-01 |
| US20110121261A1 (en) | 2011-05-26 |
| KR20060072445A (ko) | 2006-06-28 |
| CN101073159A (zh) | 2007-11-14 |
| US20080128678A1 (en) | 2008-06-05 |
| US8704250B2 (en) | 2014-04-22 |
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