KR100722452B1 - 구동용 회로기판 본딩장치 및 그 방법 - Google Patents

구동용 회로기판 본딩장치 및 그 방법 Download PDF

Info

Publication number
KR100722452B1
KR100722452B1 KR1020060059523A KR20060059523A KR100722452B1 KR 100722452 B1 KR100722452 B1 KR 100722452B1 KR 1020060059523 A KR1020060059523 A KR 1020060059523A KR 20060059523 A KR20060059523 A KR 20060059523A KR 100722452 B1 KR100722452 B1 KR 100722452B1
Authority
KR
South Korea
Prior art keywords
tcp
alignment
head
circuit board
substrate
Prior art date
Application number
KR1020060059523A
Other languages
English (en)
Korean (ko)
Inventor
서지원
박영근
박병창
김만제
안정우
Original Assignee
주식회사 에스에프에이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 에스에프에이 filed Critical 주식회사 에스에프에이
Priority to KR1020060059523A priority Critical patent/KR100722452B1/ko
Application granted granted Critical
Publication of KR100722452B1 publication Critical patent/KR100722452B1/ko
Priority to CNB2007101086565A priority patent/CN100552513C/zh
Priority to TW96120504A priority patent/TWI363584B/zh
Priority to CN2009101355039A priority patent/CN101556391B/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
KR1020060059523A 2006-06-29 2006-06-29 구동용 회로기판 본딩장치 및 그 방법 KR100722452B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020060059523A KR100722452B1 (ko) 2006-06-29 2006-06-29 구동용 회로기판 본딩장치 및 그 방법
CNB2007101086565A CN100552513C (zh) 2006-06-29 2007-06-07 供应、接合驱动电路板用的设备、方法及其盒式外壳
TW96120504A TWI363584B (en) 2006-06-29 2007-06-07 Apparatus for supplying driving circuit board and cassette housing therefor, apparatus and method for bonding driving circuit board, and system having the same
CN2009101355039A CN101556391B (zh) 2006-06-29 2007-06-07 供应、接合驱动电路板用的设备、方法及其盒式外壳

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060059523A KR100722452B1 (ko) 2006-06-29 2006-06-29 구동용 회로기판 본딩장치 및 그 방법

Publications (1)

Publication Number Publication Date
KR100722452B1 true KR100722452B1 (ko) 2007-05-28

Family

ID=38278405

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060059523A KR100722452B1 (ko) 2006-06-29 2006-06-29 구동용 회로기판 본딩장치 및 그 방법

Country Status (2)

Country Link
KR (1) KR100722452B1 (zh)
CN (2) CN100552513C (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100983337B1 (ko) 2008-12-03 2010-09-20 주식회사 에스에프에이 구동용 회로기판 본딩 장치
KR101152411B1 (ko) 2009-02-10 2012-06-05 세메스 주식회사 필름 패키지 마운팅 장치
KR101400087B1 (ko) * 2012-05-18 2014-05-28 주식회사 성진하이메크 패널에 탭 아이씨를 가압착하는 가압착 장치

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102749727B (zh) * 2011-04-18 2014-12-03 京东方科技集团股份有限公司 一种异方性导电胶膜的贴附方法
JP6275818B2 (ja) * 2014-02-21 2018-02-07 富士機械製造株式会社 部品受渡装置及び部品実装機
CN109941747A (zh) * 2019-04-24 2019-06-28 无锡先导智能装备股份有限公司 垫片供给机

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030080876A (ko) * 2002-04-11 2003-10-17 한동희 평판디스플레이장치의 회로기판 본딩장치 및 방법
KR100558564B1 (ko) 2005-05-10 2006-03-13 주식회사 에스에프에이 회로기판 본딩장치

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030080876A (ko) * 2002-04-11 2003-10-17 한동희 평판디스플레이장치의 회로기판 본딩장치 및 방법
KR100558564B1 (ko) 2005-05-10 2006-03-13 주식회사 에스에프에이 회로기판 본딩장치

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100983337B1 (ko) 2008-12-03 2010-09-20 주식회사 에스에프에이 구동용 회로기판 본딩 장치
KR101152411B1 (ko) 2009-02-10 2012-06-05 세메스 주식회사 필름 패키지 마운팅 장치
KR101400087B1 (ko) * 2012-05-18 2014-05-28 주식회사 성진하이메크 패널에 탭 아이씨를 가압착하는 가압착 장치

Also Published As

Publication number Publication date
CN101126875A (zh) 2008-02-20
CN100552513C (zh) 2009-10-21
CN101556391B (zh) 2011-12-14
CN101556391A (zh) 2009-10-14

Similar Documents

Publication Publication Date Title
US8074351B2 (en) Part mounting device and part mounting method
JP4664366B2 (ja) 電子部品の実装装置及び実装方法
KR100722452B1 (ko) 구동용 회로기판 본딩장치 및 그 방법
KR100913579B1 (ko) 구동용 회로기판의 본딩장치 및 그 방법
KR102132094B1 (ko) 전자 부품 실장 장치 및 전자 부품 실장 방법
JP2012004143A (ja) 電子部品の実装装置および実装方法
KR101318178B1 (ko) 편광판 부착장치
KR102058364B1 (ko) 기판 본딩 접합장치
KR101141806B1 (ko) 도포 장치와 그 도포 위치 보정 방법
JPWO2013141388A1 (ja) 電子部品の実装装置及び実装方法
JP2014154791A (ja) 電子部品実装ヘッド及び電子部品実装装置
JP2003249794A (ja) カメラ装置、テーブル装置、部品実装方法及びその装置
JP3661564B2 (ja) 表示パネルの組立装置
JPH09186193A (ja) 電子部品の実装方法およびその装置
KR20090111254A (ko) 기판 이송 시스템 및 기판 이송 방법
KR100785507B1 (ko) 부품 실장장치 및 그 방법
KR101542865B1 (ko) 평판 디스플레이 패널용 가본딩장치
KR101351250B1 (ko) 기판 검사 장비용 얼라인 스테이지 장치
JP4291387B2 (ja) 電子部品実装方法
KR100900710B1 (ko) 디스플레이 패널과 피씨비의 접착장치
JP5510395B2 (ja) 部品実装装置及び部品実装方法
KR20030017440A (ko) 액정표시판의 칩온글래스 본딩장치
KR100983337B1 (ko) 구동용 회로기판 본딩 장치
JP7304505B2 (ja) 部品実装装置及び部品実装方法
JP2002111289A (ja) チップの供給装置および実装方法

Legal Events

Date Code Title Description
A201 Request for examination
A302 Request for accelerated examination
E902 Notification of reason for refusal
E90F Notification of reason for final refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20130417

Year of fee payment: 7

FPAY Annual fee payment

Payment date: 20140414

Year of fee payment: 8

FPAY Annual fee payment

Payment date: 20150417

Year of fee payment: 9

LAPS Lapse due to unpaid annual fee