KR100704534B1 - 개선된 내연성을 갖는 테이프 캐리어 패키지용 가요성배선판 - Google Patents
개선된 내연성을 갖는 테이프 캐리어 패키지용 가요성배선판 Download PDFInfo
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- KR100704534B1 KR100704534B1 KR1020050102641A KR20050102641A KR100704534B1 KR 100704534 B1 KR100704534 B1 KR 100704534B1 KR 1020050102641 A KR1020050102641 A KR 1020050102641A KR 20050102641 A KR20050102641 A KR 20050102641A KR 100704534 B1 KR100704534 B1 KR 100704534B1
- Authority
- KR
- South Korea
- Prior art keywords
- resin composition
- tape carrier
- wiring board
- carrier package
- flexible wiring
- Prior art date
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- 239000010410 layer Substances 0.000 claims abstract description 132
- 229920005989 resin Polymers 0.000 claims abstract description 63
- 239000011347 resin Substances 0.000 claims abstract description 63
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Abstract
Description
Claims (10)
- 굴곡 슬릿을 갖는 절연 필름,상기 절연 필름 위에 형성되고 굴곡 슬릿을 가로지르는 배선 패턴,상기 배선 패턴을 상기 절연 필름에 부착하는 접착제층,상기 굴곡 슬릿에서 상기 배선 패턴의 적어도 일면을 보호하는 플렉스 수지층,상기 배선 패턴이 형성된 영역을 보호하는 오버코팅층을 포함하는 개선된 내연성을 갖는 테이프 캐리어 패키지용 가요성 배선판으로서,상기 오버코팅층은, 필름의 형상으로 경화될 때, 상기 필름이 25℃에서 초기 탄성율 (initial modulus) 이 10 ~ 1,500 MPA 이고 , 충분한 정도의 전기 절연성을 가지며, 260℃에서 10초의 내납땜성 (soldering resistance) 을 갖고, 그리고 산소 지수 (oxygen index) 가 22.0 을 초과하는 특성을 갖는 경화성 수지 조성물의 경화재층인 것을 특징으로 하는 테이프 캐리어 패키지용 가요성 배선판.
- 제 1 항에 있어서,플렉스 수지층, 상기 절연 필름, 상기 접착제층 및 상기 오버코팅층을 이 순서로 적층하여 이루어진 적층체가 UL 94 V-0 기준을 만족하는 내연성을 갖는 것을 특징으로 하는 테이프 캐리어 패키지용 가요성 배선판.
- 제 1 항에 있어서,상기 오버코팅층은 변성 폴리이미드 수지 조성물 및 변성 폴리아미드이미드 수지 조성물 중의 어느 하나로부터 얻어진 경화 필름인 것을 특징으로 하는 테이프 캐리어 패키지용 가요성 배선판.
- 제 3 항에 있어서,상기 오버코팅층은 변성 폴리이미드 수지 조성물 및 변성 폴리아미드이미드 수지 조성물 중의 어느 하나로부터 얻어진 경화 필름이며,상기 변성 폴리이미드 수지 조성물 및 변성 폴리아미드이미드 수지 조성물 각각은 폴리실록산 세그먼트, 수소화 폴리부타디엔 세그먼트 및 폴리카보네이트 세그먼트 중에서 선택된 세그먼트를 갖는 폴리머를 포함하는 것을 특징으로 하는 테이프 캐리어 패키지용 가요성 배선판.
- 제 1 항에 있어서,상기 오버코팅층은 분자에 폴리실록산 세그먼트를 갖는 폴리머를 포함하는 것을 특징으로 하는 테이프 캐리어 패키지용 가요성 배선판.
- 제 3 항에 있어서,상기 오버코팅층은 분자에 폴리실록산 세크먼트를 갖는 폴리머를 포함하는 것을 특징으로 하는 테이프 캐리어 패키지용 가요성 배선판.
- 제 3 항에 있어서,상기 오버코팅층은 변성 폴리이미드 수지 조성물 및 변성 폴리아미드이미드 수지 조성물 중의 어느 하나로부터 얻어진 경화 필름이고,상기 변성 폴리이미드 수지 조성물은 이미드기 및 폴리실록산 세그먼트를 갖는 폴리이미드실록산을 포함하고, 상기 변성 폴리아미드이미드 수지 조성물은 아미드기, 이미드기 및 폴리실록산 세그먼트를 갖는 폴리아미드이미드실록산을 포함하는 것을 특징으로 하는 테이프 캐리어 패키지용 가요성 배선판.
- 제 1 항 내지 제 7 항 중 어느 한 항에 있어서,상기 오버코팅층은 적어도 탈크 (talc), 미카 (mica) 및 황산바륨 중에서 선택된 무기 필러를 수지 고형분 100 중량부에 대해 10 ~ 150 중량부의 양으로 함유하는 경화성 수지 조성물로부터 얻어진 경화 필름인 것을 특징으로 하는 캐리어 패키지용 가요성 배선판.
- 제 1 항에 따른 테이프 캐리어 패키지용 가요성 배선판을 포함하는 테이프 캐리어 패키지.
- 제 1 항에 따른 테이프 캐리어 패키지용 가요성 배선판의 오버코팅층을 위한 경화성 수지 조성물로서, 필름의 형태로 경화할 때 상기 필름은 25℃에서 초기 탄 성율이 10 ~ 1,500 MPa 이고, 충분한 정도의 전기 절연성을 가지며, 260℃에서 10초의 내납땜성을 가지며, 그리고 산소 지수가 22.0 을 초과하는 특성을 갖는 것을 특징으로 하는 경화성 수지 조성물.
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KR20020069411A (ko) * | 2001-02-26 | 2002-09-04 | 산양전기주식회사 | 절연성 고분자를 이용한 연성인쇄회로기판의 제조방법 |
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US4795693A (en) * | 1983-07-13 | 1989-01-03 | American Telephone And Telegraph Company, At&T Technologies, Inc. | Multilayer circuit board fabrication process |
JPS6356992A (ja) * | 1986-08-28 | 1988-03-11 | イビデン株式会社 | プリント配線板及びその製造方法 |
JP3424523B2 (ja) * | 1997-09-29 | 2003-07-07 | 日立電線株式会社 | Tab用テープキャリア及びその製造方法 |
JP3442978B2 (ja) * | 1997-10-15 | 2003-09-02 | シャープ株式会社 | テープキャリアパッケージ半導体装置及びそれを用いた液晶パネル表示装置 |
JP4016226B2 (ja) * | 1998-01-14 | 2007-12-05 | 味の素株式会社 | 変成ポリイミド樹脂及びこれを含有する熱硬化性樹脂組成物 |
JP2003209330A (ja) * | 2002-01-15 | 2003-07-25 | Ube Ind Ltd | 両面回路基板及びその製造方法 |
JP4211569B2 (ja) * | 2002-12-16 | 2009-01-21 | 宇部興産株式会社 | ポリイミドシロキサン絶縁膜用組成物、絶縁膜、および、絶縁膜の形成方法 |
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