KR100702284B1 - 박막 트랜지스터 회로 장치 및 상기 박막 트랜지스터 회로 장치를 이용한 액정 표시 장치 - Google Patents

박막 트랜지스터 회로 장치 및 상기 박막 트랜지스터 회로 장치를 이용한 액정 표시 장치 Download PDF

Info

Publication number
KR100702284B1
KR100702284B1 KR1020040057114A KR20040057114A KR100702284B1 KR 100702284 B1 KR100702284 B1 KR 100702284B1 KR 1020040057114 A KR1020040057114 A KR 1020040057114A KR 20040057114 A KR20040057114 A KR 20040057114A KR 100702284 B1 KR100702284 B1 KR 100702284B1
Authority
KR
South Korea
Prior art keywords
thin film
film transistor
wiring
molybdenum alloy
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1020040057114A
Other languages
English (en)
Korean (ko)
Other versions
KR20050011725A (ko
Inventor
타나카히로아키
야스다쿄우네이
스즈키세이지
Original Assignee
엔이씨 엘씨디 테크놀로지스, 엘티디.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엔이씨 엘씨디 테크놀로지스, 엘티디. filed Critical 엔이씨 엘씨디 테크놀로지스, 엘티디.
Publication of KR20050011725A publication Critical patent/KR20050011725A/ko
Application granted granted Critical
Publication of KR100702284B1 publication Critical patent/KR100702284B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136286Wiring, e.g. gate line, drain line
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1345Conductors connecting electrodes to cell terminals
    • G02F1/13458Terminal pads
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136286Wiring, e.g. gate line, drain line
    • G02F1/13629Multilayer wirings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • H10D30/0312Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes
    • H10D30/0316Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes of lateral bottom-gate TFTs comprising only a single gate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • H10D30/0321Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H10D30/6732Bottom-gate only TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/6737Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
    • H10D30/6739Conductor-insulator-semiconductor electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6741Group IV materials, e.g. germanium or silicon carbide
    • H10D30/6743Silicon
    • H10D30/6745Polycrystalline or microcrystalline silicon
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6741Group IV materials, e.g. germanium or silicon carbide
    • H10D30/6743Silicon
    • H10D30/6746Amorphous silicon
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/60Electrodes characterised by their materials
    • H10D64/62Electrodes ohmically coupled to a semiconductor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441Interconnections, e.g. scanning lines
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thin Film Transistor (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
KR1020040057114A 2003-07-22 2004-07-22 박막 트랜지스터 회로 장치 및 상기 박막 트랜지스터 회로 장치를 이용한 액정 표시 장치 Expired - Lifetime KR100702284B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2003277459 2003-07-22
JPJP-P-2003-00277459 2003-07-22
JP2004212977A JP2005057260A (ja) 2003-07-22 2004-07-21 薄膜トランジスタ回路装置およびその製造方法および薄膜トランジスタ回路装置を用いた液晶表示装置
JPJP-P-2004-00212977 2004-07-21

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020060110237A Division KR20070003719A (ko) 2003-07-22 2006-11-09 박막 트랜지스터 회로 장치의 제조 방법

Publications (2)

Publication Number Publication Date
KR20050011725A KR20050011725A (ko) 2005-01-29
KR100702284B1 true KR100702284B1 (ko) 2007-03-30

Family

ID=34277594

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020040057114A Expired - Lifetime KR100702284B1 (ko) 2003-07-22 2004-07-22 박막 트랜지스터 회로 장치 및 상기 박막 트랜지스터 회로 장치를 이용한 액정 표시 장치
KR1020060110237A Withdrawn KR20070003719A (ko) 2003-07-22 2006-11-09 박막 트랜지스터 회로 장치의 제조 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020060110237A Withdrawn KR20070003719A (ko) 2003-07-22 2006-11-09 박막 트랜지스터 회로 장치의 제조 방법

Country Status (5)

Country Link
US (2) US7105896B2 (enExample)
JP (1) JP2005057260A (enExample)
KR (2) KR100702284B1 (enExample)
CN (1) CN100370349C (enExample)
TW (1) TWI253618B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10510900B2 (en) 2016-09-07 2019-12-17 Samsung Display Co., Ltd. Display device

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005062802A (ja) * 2003-07-28 2005-03-10 Advanced Display Inc 薄膜トランジスタアレイ基板の製法
KR101061850B1 (ko) * 2004-09-08 2011-09-02 삼성전자주식회사 박막 트랜지스터 표시판 및 그 제조방법
TWI252587B (en) * 2004-12-14 2006-04-01 Quanta Display Inc Method for manufacturing a pixel electrode contact of a thin-film transistors liquid crystal display
JP2007048878A (ja) * 2005-08-09 2007-02-22 Mitsubishi Electric Corp 半導体装置
US20070259190A1 (en) * 2006-05-02 2007-11-08 Jau-Jier Chu ITO transparent substrate with high resistance at low-temperature sputtering process and method for producing the same
US20070262311A1 (en) * 2006-05-11 2007-11-15 Toppoly Optoelectronics Corp. Flat panel display and fabrication method and thereof
JP2008133529A (ja) * 2006-08-29 2008-06-12 Rohm & Haas Electronic Materials Llc 剥離方法
KR101326128B1 (ko) * 2006-09-29 2013-11-06 삼성디스플레이 주식회사 표시 장치용 배선, 식각액, 박막 트랜지스터 표시판 및 그제조 방법
TW200820444A (en) * 2006-10-27 2008-05-01 Chunghwa Picture Tubes Ltd Thin film transistor and fabrication method thereof
TWI374510B (en) 2008-04-18 2012-10-11 Au Optronics Corp Gate driver on array of a display and method of making device of a display
KR101909139B1 (ko) * 2011-02-07 2018-12-19 삼성디스플레이 주식회사 박막 트랜지스터 표시판 및 그 제조 방법
US9666482B1 (en) * 2016-09-14 2017-05-30 Infineon Technologies Ag Self aligned silicon carbide contact formation using protective layer
CN110928085B (zh) 2019-11-26 2021-01-15 Tcl华星光电技术有限公司 阵列基板及显示面板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0926598A (ja) * 1995-07-10 1997-01-28 Hitachi Ltd アクティブマトリクス型液晶ディスプレイ装置
JP2000284326A (ja) * 1999-03-30 2000-10-13 Hitachi Ltd 液晶表示装置とその製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3009438B2 (ja) * 1989-08-14 2000-02-14 株式会社日立製作所 液晶表示装置
US5530573A (en) * 1993-05-27 1996-06-25 Sharp Kabushiki Kaisha Multiple domain liquid crystal display having a cell thickness divided by helical pitch equal to 1/8 or less
KR100239778B1 (ko) * 1996-12-03 2000-01-15 구본준 액정표시장치 및 그 제조방법
JPH10293321A (ja) * 1997-04-17 1998-11-04 Mitsubishi Electric Corp 液晶表示装置およびその製造方法
JPH1187068A (ja) * 1997-07-15 1999-03-30 Tdk Corp 有機el素子およびその製造方法
JPH1138440A (ja) * 1997-07-17 1999-02-12 Sharp Corp アクティブマトリクス型液晶表示装置およびその製造方法
JPH11259016A (ja) * 1998-03-13 1999-09-24 Toshiba Corp 表示装置用アレイ基板の製造方法
TWI255957B (en) * 1999-03-26 2006-06-01 Hitachi Ltd Liquid crystal display device and method of manufacturing the same
JP2000307118A (ja) * 1999-04-21 2000-11-02 Matsushita Electric Ind Co Ltd 薄膜トランジスタおよびその製造方法
KR100857719B1 (ko) * 2001-03-26 2008-09-08 엘지디스플레이 주식회사 액정표시장치 및 그 제조방법
JP4432015B2 (ja) * 2001-04-26 2010-03-17 日立金属株式会社 薄膜配線形成用スパッタリングターゲット

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0926598A (ja) * 1995-07-10 1997-01-28 Hitachi Ltd アクティブマトリクス型液晶ディスプレイ装置
JP2000284326A (ja) * 1999-03-30 2000-10-13 Hitachi Ltd 液晶表示装置とその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10510900B2 (en) 2016-09-07 2019-12-17 Samsung Display Co., Ltd. Display device

Also Published As

Publication number Publication date
CN1601360A (zh) 2005-03-30
KR20070003719A (ko) 2007-01-05
TWI253618B (en) 2006-04-21
US7341898B2 (en) 2008-03-11
US20060175611A1 (en) 2006-08-10
US7105896B2 (en) 2006-09-12
CN100370349C (zh) 2008-02-20
KR20050011725A (ko) 2005-01-29
JP2005057260A (ja) 2005-03-03
US20050056839A1 (en) 2005-03-17
TW200515355A (en) 2005-05-01

Similar Documents

Publication Publication Date Title
US7420209B2 (en) Semiconductor device
US7576394B2 (en) Thin film transistor including low resistance conductive thin films and manufacturing method thereof
KR100476622B1 (ko) 몰리브덴-텅스턴합금을사용한배선을이용한액정표시장치및그제조방법
JP5324111B2 (ja) 薄膜トランジスタ表示板及びその製造方法
KR100698950B1 (ko) 박막 트랜지스터 어레이 기판의 제조방법
US20090098673A1 (en) Thin film transistor array panel and method for manufacturing the same
KR100340308B1 (ko) 표시패널 및 그 제조방법
KR100702284B1 (ko) 박막 트랜지스터 회로 장치 및 상기 박막 트랜지스터 회로 장치를 이용한 액정 표시 장치
CN100413077C (zh) 薄膜晶体管阵列面板
US20040140575A1 (en) Contact structure of a wiring and a thin film transistor array panel including the same
KR20080106900A (ko) 반사형 tft 기판 및 반사형 tft 기판의 제조 방법
KR20050079429A (ko) Tft lcd 기판의 알루미늄 배선 형성방법과 이에의한 tft lcd 기판
JP7284613B2 (ja) アクティブマトリクス基板およびその製造方法
JP4166486B2 (ja) 薄膜トランジスタ基板
JP2574837B2 (ja) 薄膜トランジスタマトリクスとその製造方法
JP2003161954A (ja) 液晶表示装置の製造方法
JPH0933949A (ja) 液晶表示装置及びその製造方法
JP2000180890A (ja) Tftアレイ基板及びこれを用いた液晶表示装置並びにtftアレイ基板の製造方法
JPH0720491A (ja) 液晶表示装置とその製造方法
KR20050079430A (ko) Tft lcd 기판의 알루미늄 배선 형성방법과 이에의한 tft lcd 기판
JPH04324977A (ja) 液晶表示装置
KR20030048327A (ko) 박막 트랜지스터 기판의 제조 방법

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20040722

PA0201 Request for examination
PG1501 Laying open of application
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20060213

Patent event code: PE09021S01D

AMND Amendment
E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20060821

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20060213

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I

A107 Divisional application of patent
AMND Amendment
J201 Request for trial against refusal decision
PA0107 Divisional application

Comment text: Divisional Application of Patent

Patent event date: 20061109

Patent event code: PA01071R01D

PJ0201 Trial against decision of rejection

Patent event date: 20061109

Comment text: Request for Trial against Decision on Refusal

Patent event code: PJ02012R01D

Patent event date: 20060821

Comment text: Decision to Refuse Application

Patent event code: PJ02011S01I

Appeal kind category: Appeal against decision to decline refusal

Decision date: 20061228

Appeal identifier: 2006101009861

Request date: 20061109

PB0901 Examination by re-examination before a trial

Comment text: Amendment to Specification, etc.

Patent event date: 20061109

Patent event code: PB09011R02I

Comment text: Request for Trial against Decision on Refusal

Patent event date: 20061109

Patent event code: PB09011R01I

Comment text: Amendment to Specification, etc.

Patent event date: 20060412

Patent event code: PB09011R02I

B701 Decision to grant
PB0701 Decision of registration after re-examination before a trial

Patent event date: 20061228

Comment text: Decision to Grant Registration

Patent event code: PB07012S01D

Patent event date: 20061219

Comment text: Transfer of Trial File for Re-examination before a Trial

Patent event code: PB07011S01I

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20070326

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20070326

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20100310

Start annual number: 4

End annual number: 4

PR1001 Payment of annual fee

Payment date: 20110223

Start annual number: 5

End annual number: 5

PR1001 Payment of annual fee

Payment date: 20120302

Start annual number: 6

End annual number: 6

FPAY Annual fee payment

Payment date: 20130321

Year of fee payment: 7

PR1001 Payment of annual fee

Payment date: 20130321

Start annual number: 7

End annual number: 7

FPAY Annual fee payment

Payment date: 20140228

Year of fee payment: 8

PR1001 Payment of annual fee

Payment date: 20140228

Start annual number: 8

End annual number: 8

FPAY Annual fee payment

Payment date: 20150223

Year of fee payment: 9

PR1001 Payment of annual fee

Payment date: 20150223

Start annual number: 9

End annual number: 9

FPAY Annual fee payment

Payment date: 20160304

Year of fee payment: 10

PR1001 Payment of annual fee

Payment date: 20160304

Start annual number: 10

End annual number: 10

FPAY Annual fee payment

Payment date: 20170217

Year of fee payment: 11

PR1001 Payment of annual fee

Payment date: 20170217

Start annual number: 11

End annual number: 11

FPAY Annual fee payment

Payment date: 20180221

Year of fee payment: 12

PR1001 Payment of annual fee

Payment date: 20180221

Start annual number: 12

End annual number: 12

FPAY Annual fee payment

Payment date: 20190221

Year of fee payment: 13

PR1001 Payment of annual fee

Payment date: 20190221

Start annual number: 13

End annual number: 13

FPAY Annual fee payment

Payment date: 20200305

Year of fee payment: 14

PR1001 Payment of annual fee

Payment date: 20200305

Start annual number: 14

End annual number: 14

PR1001 Payment of annual fee

Payment date: 20210302

Start annual number: 15

End annual number: 15

PR1001 Payment of annual fee

Payment date: 20220302

Start annual number: 16

End annual number: 16

PR1001 Payment of annual fee

Payment date: 20240308

Start annual number: 18

End annual number: 18

PC1801 Expiration of term

Termination date: 20250122

Termination category: Expiration of duration