KR100686657B1 - PROCESS FOR PRODUCING Al-Mg-Si ALLOY PLATE, Al-Mg-Si ALLOY PLATE AND Al-Mg-Si ALLOY MATERIAL - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To produce an Al-Mg-Si alloy plate having excellent thermal conductivity, electric conductivity and strength by simple and minimal steps. <P>SOLUTION: The process for producing the alloy plate comprises a step of hot rolling an Al-Mg-Si alloy ingot which has a composition consisting of, by mass, 0.2 to 0.8% Si, 0.3 to 1% Mg, ≤0.5% Fe, ≤0.5% Cu, further at least either of ≤0.1% Ti, and ≤0.1% B, and the balance Al with inevitable impurities and a step of cold rolling the resultant alloy plate. In the course between the completion of the hot rolling and the completion of the cold rolling, heat treatment is carried out by holding the rolled matter at 200 to 400°C for ≥1 h. <P>COPYRIGHT: (C)2004,JPO

Description

Process for producing Al-Mg-Si-based alloy plate, Al-Mg-Si-based alloy plate and Al-Mg-Si-based alloy material {PROCESS FOR PRODUCING Al-Mg-Si ALLOY PLATE, Al-Mg-Si ALLOY PLATE AND Al -Mg-Si ALLOY MATERIAL}

This application is directed to Japanese Patent Application No. 2002-55392, filed March 1, 2002, US Patent Application No. 60 / 374,500, filed April 28, 2002, and Japanese Patent Application, filed February 28, 2003. It is accompanied by the priority claim of the application 2003-52621, The content of which is what constitutes a part of this application as it is.

The present invention relates to a method for producing an Al-Mg-Si alloy plate and an Al-Mg-Si alloy plate produced by the method.

The present invention also relates to an Al-Mg-Si-based alloy plate, in particular, an Al-Mg-Si-based alloy plate having excellent thermal conductivity, conductivity, strength, and workability, a method of manufacturing the same, and an Al-Mg-Si-based alloy material.

In a member material in which a heating element is built or mounted, such as a PDP (plasma display), an LCD (liquid crystal display), a notebook personal computer, or a metal base printed circuit board, excellent thermal conductivity is required for rapid heat dissipation as well as strength. In addition, due to the high performance, complexity, miniaturization, and high heat generation of these products, the amount of heat generated is dramatically increased, and heat conductivity and processability are increasingly desired.

By the way, when the member is made of aluminum, a pure aluminum alloy such as JIS 1100, 1050, 1070 is suitable as a material having high thermal conductivity. However, these alloys have difficulty in strength. On the other hand, JIS 5052 alloy employed as a high strength material is significantly lower in thermal conductivity than pure aluminum alloy. In addition, the Al-Mg-Si-based alloy has good thermal conductivity, and thus high strength can be obtained by aging hardening. However, a complicated process of aging after solution treatment at high temperature after rolling is required. Moreover, even if high strength is obtained, there is a drawback that the molding workability such as bending workability and protrusion workability is extremely reduced (for example, JP-A-8-209279, JP-A-9-1343644, Japan Patent Publication No. 2000-144294).

In such a situation, the present applicant has proposed a technique capable of realizing both thermal conductivity and strength by specifying the rolling conditions of the hot rolling process at the time of manufacturing the Al-Mg-Si-based alloy plate, and solution treatment and aging treatment. The required strength can be obtained even without performing the above (for example, Japanese Patent Application Laid-Open No. 2000-87198 and Japanese Patent Application Laid-Open No. 2000-226628).

However, in the above technique, in any pass step of the hot rolling step, the material temperature before the pass, the cooling rate between the pass, the pass end temperature, and the end plate thickness are controlled, and further, the degree of workability in the subsequent cold rolling. It required complex condition management to control.

In addition, the workability of the manufactured alloy sheet did not sufficiently satisfy the demands of the market, and when forming and processing under strict conditions, special consideration was required for processing facilities and processing methods.

By the way, in the aluminum alloy of JIS1000-7000 system, it is known that thermal conductivity and electrical conductivity show the favorable correlation. Regression analysis of the relationship between the thermal conductivity and the electrical conductivity in the aluminum alloy shown in Fig. 2 shows that a regression equation: y = 3.5335x + 13.525 and a crystal coefficient: R ² = 0.981 are obtained, indicating a very high correlation. have. Therefore, the aluminum alloy plate which shows the outstanding thermal conductivity simultaneously has excellent electroconductivity, and can be used suitably also as a conductive member material besides being used as a heat radiating member material.

SUMMARY OF THE INVENTION In view of the above technical background, an object of the present invention is to provide an Al-Mg-Si-based alloy sheet produced by this method while using a method for producing an Al-Mg-Si-based alloy sheet in a simple and small process. .

In addition, in view of the above technical background, the present invention utilizes a method for producing an Al-Mg-Si alloy plate having excellent thermal conductivity, conductivity, strength, and workability in a simple and small process, and at the same time, Al-Mg produced by this method. An object of the present invention is to provide an Si-based alloy plate. Moreover, an object of this invention is to provide the Al-Mg-Si type alloy material excellent in thermal conductivity, electroconductivity, strength, and workability.

In order to achieve the above object, the manufacturing method of the Al-Mg-Si-based alloy plate of the present invention is to have the following configuration.

(1) Si: 0.2-0.8 mass%, Mg: 0.3-1 mass%, Fe: 0.5 mass% or less, Cu: 0.5 mass% or less, Ti: 0.1 mass% or less, or B: 0.1 mass% or less It is a manufacturing method of the alloy plate containing the process of hot-rolling and cold-rolling the Al-Mg-Si type alloy ingot which consists of at least 1 sort (s) of remainder part Al and an unavoidable impurity, and finishes cold rolling after hot rolling. A method of producing an Al-Mg-Si-based alloy plate, characterized by performing heat treatment by maintaining the temperature at 200 to 400 ° C. for at least 1 hour.

(2) The method for producing an Al-Mg-Si alloy plate according to (1), wherein in the alloy ingot, Mn and Cr as impurities are regulated to Mn: 0.1 mass% or less and Cr: 0.1 mass% or less.

(3) The method for producing an Al-Mg-Si alloy sheet according to (1) or (2), wherein the heat treatment is performed after hot rolling and before cold rolling.

(4) The method for producing an Al-Mg-Si alloy plate according to (1) or (2), wherein the heat treatment is performed during cold rolling.

(5) The method for producing an Al-Mg-Si alloy plate according to any one of (1) to (4), which is performed by maintaining the heat treatment at 220 to 280 ° C for 1 to 10 hours.

(6) The manufacturing method of the Al-Mg-Si type alloy plate in any one of (1)-(5) which homogenizes at 500 degreeC or more with respect to an alloy ingot.

(7) The manufacturing method of the Al-Mg-Si type alloy plate in any one of (1)-(6) which performs cold rolling after heat processing at 20% or more of workability.

(8) The manufacturing method of the Al-Mg-Si type-alloy plate as described in (7) which is 30% or more.

(9) The manufacturing method of the Al-Mg-Si type alloy plate in any one of (1)-(8) which performs final annealing at 200 degrees C or less after completion of cold rolling.

(10) The method of producing the Al-Mg-Si alloy plate according to (9), wherein the final annealing is performed at 110 to 150 ° C.

(11) The method for producing an Al-Mg-Si alloy plate according to any one of (1) to (10), wherein the material temperature is preheated to 450 to 580 ° C before hot rolling.

(12) In any pass step of hot rolling, the material temperature before the pass is set to 450 to 350 ° C, and the cooling rate after the pass is set to 50 ° C / min or more, any one of items (1) to (11). The manufacturing method of the Al-Mg-Si type alloy plate of description.

(13) The method for producing an Al-Mg-Si alloy sheet according to any one of (1) to (12), wherein the Si content in the alloy ingot is 0.32 to 0.6 mass%.

(14) The method for producing an Al-Mg-Si alloy plate according to any one of (1) to (12), wherein the Mg content in the alloy ingot is 0.35 to 0.55 mass%.

(15) The manufacturing method of the Al-Mg-Si type alloy plate in any one of (1)-(12) whose Fe content in an alloy ingot is 0.1-0.25 mass%.

(16) The manufacturing method of the Al-Mg-Si type alloy plate in any one of (1)-(12) whose Cu content in an alloy ingot is 0.1 mass% or less.

(17) The manufacturing method of the Al-Mg-Si type alloy plate in any one of (1)-(12) whose Ti content in an alloy ingot is 0.005-0.05 mass%.

(18) The method for producing an Al-Mg-S alloy plate according to any one of (1) to (12), wherein the B content in the alloy ingot is 0.06 mass% or less.

(19) The manufacturing method of the Al-Mg-Si type alloy plate in any one of (1)-(12) whose Mn content in an alloy ingot is regulated to 0.05 mass% or less.

(20) The manufacturing method of the Al-Mg-Si type alloy plate in any one of (1)-(12) whose Cr content in an alloy ingot is regulated to 0.05 mass% or less.

(21) Si: 0.2-0.8 mass%, Mg: 0.3-1 mass%, Fe: 0.5 mass% or less, Cu: 0.5 mass% or less, Ti: 0.1 mass% or less, or B: 0.1 mass% or less Al-Mg-Si type alloy material containing at least 1 type, Comprising: It consists of remainder part Al and an unavoidable impurity, and electrical conductivity is 55 to 60% (IACS).

(22) The Al-Mg-Si-based alloy material according to (21), wherein the tensile strength is 140 to 240 N / mm 2.

(23) The Al-Mg-Si-based alloy material according to (21) or (22), wherein Mn and Cr as impurities are regulated to Mn: 0.1% by mass or less and Cr: 0.1% by mass or less.

The Al-Mg-Si type alloy plate of this invention has the following structures.

(24) An Al-Mg-Si alloy plate produced by the method described in (1) to (20).

(25) The Al-Mg-Si-based alloy plate according to (21) to (24), which is an Al-Mg-Si-based alloy plate, a heat dissipation member material, a conductive member material, a case material, or a reflecting plate or a supporting member thereof.

(26) The Al-Mg-Si-based alloy plate according to (21) to (24), wherein the Al-Mg-Si-based alloy plate is a plasma display back chassis material, a plasma display housing, or a plasma display exterior member.

(27) The items of (21) to (24), wherein the Al-Mg-Si-based alloy plate is a liquid crystal display back chassis material, a liquid crystal display bezel material, a liquid crystal display reflection sheet material, a liquid crystal display reflection sheet support material, or a liquid crystal display housing. Al-Mg-Si type alloy plate as described.

1A and 1B are flowcharts showing a series of processes in the method for producing an Al-Mg-Si-based alloy plate of the present invention, and FIG. 1A is a heat treatment before hot rolling after hot rolling. The figure which shows the case performed in cold rolling.

2 is a correlation diagram showing the relationship between electrical conductivity and thermal conductivity in an aluminum alloy.

In the Al-Mg-Si alloy composition which the method of this invention makes object, the meaning of addition and content of each element is as follows.

Mg and Si are elements required for the expression of strength, and are Si: 0.2 to 0.8% by mass and Mg: 0.3 to 1% by mass. If the Si content is less than 0.2 mass% or the Mg content is less than 0.3 mass%, sufficient strength cannot be obtained. On the other hand, when Si content is 0.8 mass% and Mg content exceeds 1 mass%, the rolling load in hot rolling will become high, productivity will fall, edge crack will become large, and trimming is needed in the middle process. In addition, moldability deteriorates. Preferable Si content is 0.32-0.6 mass%. Moreover, preferable Mg content is 0.35 to 0.55 mass%.

Fe and Cu are necessary components for molding, but when contained in a large amount, the corrosion resistance is lowered and the practicality as an alloy plate is insufficient. Therefore, the Fe content is regulated to 0.5% by mass or less, preferably 0.35% by mass or less, and the Cu content is 0.5. It is necessary to regulate to mass% or less, Preferably it is 0.2 mass% or less. More preferable Fe content is 0.1 to 0.25 mass%, and preferable Cu content is 0.1 mass% or less.

Ti and B have an effect of miniaturizing crystal grains and preventing solidification cracks when casting an alloy into a slab. The said effect can be obtained by addition of at least 1 sort (s) of Ti or B, and you may add both. However, when it contains a large amount, since the amount of crystallized substance increases, and large crystallized substance is formed, workability to a product falls. In addition, thermal conductivity and conductivity decrease. For these reasons, Ti content is made into 0.1 mass% or less. Preferable Ti content is 0.005-0.05 mass%. In addition, B content is made into 0.1 mass% or less. Preferable B content is 0.06 mass% or less.

In addition, although various impurity elements are inevitably contained in the alloy ingot, Mn and Cr are preferably as small as possible because they cause a decrease in thermal conductivity and conductivity. It is preferable to regulate Mn content as 0.1 mass% or less and Cr content to 0.1 mass% or less as an impurity. Especially preferable Mn content is 0.05 mass% or less, Especially preferable Cr content is 0.05 mass% or less. More preferable Mn content is 0.04 mass% or less, and more preferable Cr content is 0.03 mass% or less. Moreover, it is preferable that other impurity elements are 0.05 mass% or less as individual content.

Next, a series of processing steps in the method of the present invention will be described in detail with reference to Figs. 1A and 1B.

In a normal rolling process, an alloy ingot is processed into the alloy plate of required thickness through hot rolling and cold rolling, and various heat processing is performed between these processes or during a process. In the method of this invention, heat processing of predetermined conditions is performed after hot rolling until completion | finish of cold rolling. Specifically, the heat treatment is performed between hot rolling passes and before cold rolling (FIG. 1A) or during cold rolling, in other words, between cold rolling passes (FIG. 1B). 1A and 1B, the heat treatment is represented by a double line block, the essential processing is represented by a solid line block, and the processing performed arbitrarily is represented by a broken line block.

The purpose of the heat treatment is to deposit Mg ₂ Si finely and uniformly, while reducing processing distortion present in the rolled material. And a high-strength alloy plate can be obtained in the range which does not harden work hardening by subsequent cold work and does not impair moldability. It is preferable to perform this heat treatment in a state where work distortion exists in the material, and as shown in FIG. 1B, it is recommended to perform at least one pass cold rolling after hot rolling to ensure that work distortion exists in a sure state. .

The heat treatment is carried out by maintaining the temperature at 200 to 400 ° C for at least 1 hour. If it is less than 200 degreeC, long time is required in order to acquire the said effect, and if it exceeds 400 degreeC, coarse precipitate will be formed and high strength and good moldability in a final product cannot be obtained. Further, at 450 ° C. or higher, coarsening of the recrystallized particles occurs, adversely affecting the molding processability of the final product. Moreover, even if the processing time is less than 1 hour, the above effects cannot be obtained. Preferable heat treatment conditions are 1 hour or more at 200-300 degreeC, More preferably, it is 1 to 10 hours at 220-280 degreeC.

Next, the process and rolling which are performed arbitrarily other than the said heat processing are demonstrated.

Homogenization treatment to an alloy ingot is optionally performed. It is preferable to perform a homogenization process at 500 degreeC or more, and it can homogenize an alloy structure.

At the time of hot rolling, it is preferable to carry out solid melting of crystallized substance, Mg, and Si in material by preheating, and to make it into a uniform metal structure. By starting rolling with a uniform metal structure, quality stability of the final product is ensured. It is preferable to perform preheating at 450 degreeC or more, and 500 degreeC or more is especially preferable. On the other hand, when it exceeds 580 degreeC, process fusion will generate | occur | produce, and it is preferable to carry out to 580 degreeC or less.

The conditions of hot rolling are not limited, According to normal methods, such as hot rough rolling and subsequent hot finishing rolling. However, in any pass process, it is preferable that the material temperature before a pass shall be 450-350 degreeC, and the cooling rate after a pass shall be 50 degreeC / min or more. As a result, the path prior to Mg and Si and is solid-state generation of coarse precipitates of Mg ₂ Si after the pass from the molten state suppressed, it is possible to obtain the same effect as the hardening stabilize the quality of the final product. In the material temperature before the pass it is less than 350 ℃ at this point can not be obtained after the quenching effect Mg ₂ Si precipitates are coarse. In addition, since the temperature is low, the rolling property of subsequent passes is significantly worsened, and the pass end temperature is too low, and the surface quality is lowered. On the other hand, when it exceeds 450 degreeC, the material temperature will not fall enough by the completion | finish of a pass, and the effect of hardening is lacking. As for the material temperature before a pass, the range of 420-380 degreeC is especially preferable.

In the cold rolling carried out after the heat treatment, the workability is preferably 20% or more in order to obtain a predetermined strength by work hardening. Especially preferable workability is 30% or more. In addition, about the workability of the cold rolling before heat processing shown in FIG. 1B, it is an objective to produce work distortion in the material used for heat processing, and it is not necessary to follow the said workability.

If necessary, the cold rolled alloy plate is finally annealed to 200 ° C or lower. By performing heat treatment at low temperature, the solid-melted Mg and Si remaining in the material can be precipitated as Mg ₂ Si, and the strength can be improved, and the elongation can also be improved. It also has the effect of stabilizing all mechanical properties. Particularly preferred annealing temperatures are 110 to 150 ° C.

According to the manufacturing method of the Al-Mg-Si type alloy plate of this invention, high intensity | strength and favorable workability can be obtained by heat processing on predetermined conditions, and subsequent cold rolling. Since this heat treatment is only a process of maintaining at a predetermined temperature, it can be processed within a rolling process control range, so that a complicated process such as conventional solution treatment, quenching, and tempering is not required. In addition, since the Al-Mg-Si-based alloy has good thermal conductivity and conductivity, an alloy plate having both thermal conductivity, conductivity, strength, and workability can be manufactured in a simple and small process.

The Al-Mg-Si-based alloy sheet produced by the method of the present invention is excellent in all the above-described characteristics, and thus is used in various molding processes. For example, it is suitably used as a heat dissipation member material, a conductive member material, a case material, or a reflecting plate or its supporting member. The heat dissipation member herein refers to a heat dissipation member, an aluminum base printed circuit board or a metal core printed circuit board, as well as a member for which heat dissipation is originally intended, such as a heat exchanger, a heat sink, and a heat dissipation fin. As such, it includes a member that requires heat dissipation in addition to the main purpose by embedding or mounting a heating element. Examples of the conductive member include bus bar materials, various battery terminal materials, capacitor terminal materials for fuel cell vehicles and hybrid vehicles, terminal materials for various electric devices, and terminal materials for various mechanical equipments. Examples of the case include battery cases and housings such as mobile phones and PDAs, and housings of various electronic devices. Since the alloy sheet of the present invention has high strength and excellent workability, even if thin, there is sufficient strength as the case, and the case can be made lighter in weight and smaller in size. As a reflecting plate, the light reflection board for liquid crystal direct type backlights, the light reflection board for liquid crystal edge light type units, and the reflecting plate for electric decoration signboards can be illustrated. Moreover, it is used also as a support member in the case of using materials other than aluminum as these reflecting plates. For example, the reflecting plate which laminated | stacked the porous resin sheet which foamed the resin composition containing inorganic fillers, such as an olefin type polymer, barium sulfate, calcium carbonate, titanium oxide, on the Al-Mg-Si type alloy plate of this invention is illustrated. Can be. The porous resin sheet is laminated on the support member by lamination processing, adhesive tape, or the like. In addition, a white paint may be used as a material of the reflecting plate, and a white coating is applied to the support member by a white paint using the alloy plate of the present invention as a supporting member, and the reflecting plate is used. Moreover, as a member which requires heat dissipation, strength, and light weight, a keyboard board, a heat spreader plate, and a housing of a computer, in particular, a notebook computer requiring strict small size and weight can be exemplified. Moreover, it is used suitably as various strength members.

In addition, as a specific use, a plasma display related member such as a plasma display back chassis material, a plasma display housing or a plasma display exterior member, a liquid crystal display back chassis material, a liquid crystal display bezel material, a liquid crystal display reflection sheet material, a liquid crystal display reflection sheet support material or The material of liquid crystal display related members, such as a liquid crystal display housing, can be illustrated. The plasma display back chassis also serves as a heat sink.

The Al-Mg-Si-based alloying material of the present invention has the same alloy composition as that of the Al-Mg-Si-based alloying plate described above, and has excellent conductivity with 55 to 60% (IACS) of electrical conductivity. In addition, as described above, the electrical conductivity and the thermal conductivity exhibit high correlation, and thus have excellent thermal conductivity. Alternatively, the tensile strength of 140 to 240 N / mm 2 combines strength and workability. If the tensile strength is less than 140 N / mm 2, the strength is insufficient even if the workability is good. If the tensile strength is more than 240 N / mm 2, even if the strength is improved, the workability is deteriorated and the balance of both is lowered. Such Al-Mg-Si type alloy material is manufactured by the manufacturing method of the Al-Mg-Si type alloy plate of this invention, for example, and is contained by performing predetermined | prescribed heat processing from after hot rolling to completion | finish of cold rolling. The tensile strength in the above range is achieved by the effect of properly depositing Fe, Mg, and Si of the element and the subsequent reduction in cold workability by recovery recrystallization by the heat treatment.

As described above, the Al-Mg-Si-based alloy targeted by the method of the present invention has a composition of Si: 0.2 to 0.8% by mass, Mg: 0.3 to 1% by mass, Fe: 0.5% by mass or less, and Cu: 0.5% by mass. It contains% or less, and contains at least one of Ti: 0.1% by mass or less and B: 0.1% by mass or less, and is made of the remaining portion Al and unavoidable impurities, and thus is excellent in thermal conductivity and conductivity. And in the manufacturing method of the alloy plate which includes the process of hot-rolling and cold-rolling this Al-Mg-Si type alloy ingot, it is 1 hour or more at 200-400 degreeC from the time after hot rolling to completion | finish of cold rolling. Since the heat treatment is carried out by holding, Mg ₂ Si precipitates finely and uniformly during heat treatment, and at the same time, processing distortion existing in the rolling material is reduced. And high intensity | strength can be obtained in the range which does not work harden by subsequent cold work and does not impair moldability. Since this heat treatment is only a process of maintaining at a predetermined temperature, it can be processed within the rolling process control range, and does not require complicated processing of separate processes such as conventional solution treatment, quenching, and tempering, and does not require thermal conductivity, conductivity, and strength. And alloy plate combines with workability can be produced in a simple and small process.

Moreover, in the alloy ingot, when Mn and Cr as impurities are regulated to Mn: 0.1 mass% or less and Cr: 0.1 mass% or less, it can become the alloy plate excellent in thermal conductivity and electroconductivity further.

The said heat treatment can exhibit the said effect even if it carries out after hot rolling, before cold rolling, or any time of cold rolling.

When the heat treatment is carried out at 220 to 280 ° C. for 1 to 10 hours, the effect can be exhibited most efficiently.

Further, when the homogenizing treatment is performed at 500 ° C. or higher on the alloy ingot, the alloy structure can be homogenized.

Moreover, when cold rolling after the said heat processing is performed with 20% or more, especially 30% or more of workability, sufficient strength improvement by work hardening is achieved.

Further, after the end of the cold rolling, the final annealing is carried out at 200 ° C. or lower, particularly 110 to 150 ° C., whereby the strength can be further improved and the elongation can be improved. It can also stabilize all mechanical properties.

In addition, when preheating a material temperature to 450-580 degreeC before the said hot rolling, crystallization substance, Mg, and Si melt | dissolve in a material, and it becomes a uniform metal structure, and rolling starts in this state, and the quality of a final product is carried out. Stability is secured.

Further, in any pass process of the hot rolling, when the material temperature before the pass to 450 to 350 ℃, cooled to 50 ℃ / min or more later passes, the generation of coarse precipitates of Mg ₂ Si is suppressed, and quenched The same effect can be obtained to stabilize the quality of the final product.

In the alloy ingot, in the case where the Si content is 0.32 to 0.6 mass%, it may be an alloy plate in which strength and workability are in particular balanced.

Moreover, when Mg content is 0.35 to 0.55 mass%, it can become an alloy plate especially which the balance of strength and workability was balanced.

Moreover, when Fe content is 0.10 to 0.25 mass%, it is excellent in workability and also good corrosion resistance is ensured.

Moreover, when Cu content is 0.1 mass% or less, it is excellent in workability and also favorable corrosion resistance is ensured.

In addition, when Ti content is 0.005 to 0.05 mass%, especially favorable workability, thermal conductivity, and electroconductivity are ensured.

Moreover, when B content is 0.06 mass% or less, especially favorable workability, thermal conductivity, and electroconductivity are ensured.

In addition, when Mn content as an impurity is regulated to 0.05 mass% or less, especially excellent thermal conductivity and electroconductivity are ensured.

Moreover, when Cr content as an impurity is regulated to 0.05 mass% or less, especially the outstanding thermal conductivity and electroconductivity are ensured.                 

The Al-Mg-Si-based alloying material of the present invention is an alloy having the above composition, and has an excellent thermal conductivity and conductivity because the electrical conductivity is 55 to 60% (IACS).

Moreover, when tensile strength is 140-240 N / mm <2>, it combines strength and workability.

Further, in the alloy, when Mn and Cr as impurities are regulated to Mn: 0.1% by mass or less and Cr: 0.1% by mass or less, the alloy plate can be further excellent in thermal conductivity and conductivity.

Since the Al-Mg-Si type alloy plate of this invention was manufactured by the above-mentioned method, it is excellent in thermal conductivity, electroconductivity, strength, and workability.

In addition, the Al-Mg-Si-based alloy plate is suitably used as a heat dissipation member material, a conductive member material, a case material, a reflector or a support member thereof, and various molding processes are performed to exhibit all the above-described characteristics.

In addition, the Al-Mg-Si-based alloy plate is suitably used as the plasma display back chassis material, the plasma display housing, or the plasma display exterior member, and various molding processes are performed to exhibit all the above-described characteristics.

Moreover, Al-Mg-Si type alloy plate is suitably used as a liquid crystal display back chassis material, a liquid crystal display bezel material, a liquid crystal display reflection sheet material, a liquid crystal display reflection sheet support material, or a liquid crystal display housing, and various molding processes are performed, It exhibits all the above-mentioned characteristics.

First, each composition alloy shown in Tables 1-5 shown later was continuously cast by the normal method, and the slab was produced. The slab was subjected to a homogenization treatment at 580 ° C. for 10 hours, or faced without performing the homogenization treatment. In the alloy compositions shown in these tables, in Examples 1 to 55 and Comparative Examples 1 to 10, both the Mn content and the Cr content as impurities are less than 0.1 mass%, and all other impurity elements are 0.05 mass% or less. In addition, in Example 60A and 60B of Table 4, only Mn content and Cr content differ, content of other elements is common, and the manufacturing process mentioned later is also common. Similarly, the 61A and 61B, 62A and 62B, 63A and 63B embodiments differ only in Mn content and Cr content. In addition, all the other impurity elements in each Example of Table 4 were 0.1 mass% or less.

1, 3 to 9, 11 to 19, 21 to 24, 26, 28 to 34, 36 to 44, 46 to 49, 51, 52, 54, 55, 60A to 62B Examples and 6 to 9 Comparative Examples In the process shown in Fig. 1A, an alloy plate was produced to obtain a test material.

That is, the slab was preheated to the temperature shown in Tables 1 to 5, and hot rolling was started at the temperature. And in the final pass process of hot rough rolling, the material temperature before a pass was made into 400 degreeC, and it cooled at the speed of 80 degreeC / min after a pass.

Subsequently, heat treatment was performed for the hot rolled sheet at the temperature and time shown in Tables 1 to 5, and cold rolling was performed to the workability shown in Tables 1 to 5.

In addition, in the 3rd and 28th Examples, final annealing was carried out at 130 ° C. for 4 hours, and final annealing was not performed elsewhere.

In addition, about the 2nd, 10, 20, 25, 27, 35, 45, 50, 53, 63A, 63B Example, and the 10th comparative example, the alloy plate was produced at the process shown in FIG. 1B.

That is, the slab was preheated to the temperature shown in Tables 1 to 5, and hot rolling was started at the temperature. And in the final pass process of hot rough rolling, the material temperature before a pass was made into 400 degreeC, and it cooled at the speed of 80 degreeC / min after a pass.

Subsequently, after performing 3-pass cold rolling with respect to the said hot rolled sheet, it heat-processed, maintaining at the temperature and time shown to Tables 1-4. Then, it cold-rolled to the workability shown in Tables 1-5.

In the tenth and thirty-fifth embodiments, the final annealing was carried out at 130 ° C. for 4 hours, and the final annealing was not performed elsewhere.

In Comparative Examples 1 to 5, a commercially available rolled plate or an extruded shape member was used as a test material.

About each test material thus obtained, tensile strength, thermal conductivity, electrical conductivity, and workability were evaluated by the following method. The evaluation results are combined with Tables 1-5.

Tensile strength was measured by the normal method at the normal temperature with respect to the JIS No. 5 test member.

The thermal conductivity was measured at 25 ° C. by the laser flash method.

Electrical conductivity was measured based on IACS (20 degreeC). IACS refers to interworking with internationally adopted annealing standards. Its volume resistivity is 1.7241 × 10 ⁻² μΩm, which is expressed as 100% IACS.

Workability was 90 degree bending by the 5.3V block method of JISZ2248 metal material bending test method, and was determined by bending inner radius r = 0mm. Judgment classification is as follows.

○: good

△: slight cracking

X: A crack generate | occur | produces.                 

From the results of Tables 1 to 5, it was confirmed that by heat treatment under the conditions of the present invention, an aluminum alloy plate having high thermal conductivity and conductivity comparable to pure aluminum and high strength comparable to JIS 5052 alloy and 6063 alloy can be obtained. Could. Moreover, workability was also favorable.

The terms and expressions used herein are for the purpose of description and are not intended to be limiting, and do not exclude any equivalents of the features shown and described herein, and are intended to be within the scope of the claimed subject matter. It should also be appreciated that various variations of.

According to the production method of the present invention, an Al-Mg-Si alloy plate having excellent thermal conductivity, conductivity, strength, and workability can be produced by a simple step of performing heat treatment from after hot rolling to the end of cold rolling. For this reason, in the manufacture of the various members for which these characteristics are calculated | required, the performance improvement of these members can be aimed at by a simple process. Moreover, the Al-Mg-Si type alloy material of this invention is excellent in thermal conductivity, electroconductivity, strength, and workability, and can be used extensively as a material of various members for which these characteristics are calculated | required.

Claims (27)

Si: 0.32-0.6 mass%, Mg: 0.3-1 mass%, Fe: 0.5 mass% or less, Cu: 0.5 mass% or less, and Ti: 0.1 mass% or less or B: 0.1 mass% or less at least 1 It is a manufacturing method of the alloy plate containing the kind, including the process of hot-rolling and cold-rolling the Al-Mg-Si type alloy ingot which consists of remainder part Al and an unavoidable impurity, The heat treatment is carried out by maintaining the temperature at 200 to 400 ° C. for at least 1 hour after the hot rolling to the end of the cold rolling to precipitate Mg ₂ Si finely and uniformly while reducing processing distortion and not performing solution treatment after cold rolling. The manufacturing method of the Al-Mg-Si type alloy plate characterized by the above-mentioned. The method for producing an Al-Mg-Si alloy plate according to claim 1, wherein Mn and Cr as impurities in the alloy ingot are regulated to Mn: 0.1 mass% or less and Cr: 0.1 mass% or less. The method for producing an Al-Mg-Si alloy plate according to claim 1 or 2, wherein the heat treatment is performed after hot rolling and before cold rolling. The method for producing an Al-Mg-Si alloy plate according to claim 1 or 2, wherein the heat treatment is performed during cold rolling. The method for producing an Al-Mg-Si alloy plate according to claim 1 or 2, wherein the heat treatment is performed by maintaining the temperature at 220 to 280 ° C for 1 to 10 hours. The manufacturing method of the Al-Mg-Si type alloy plate of Claim 1 or 2 which homogenizes at 500 degreeC or more with respect to an alloy ingot. The manufacturing method of the Al-Mg-Si type alloy plate of Claim 1 or 2 which performs cold rolling after heat processing with 20% or more of workability. The manufacturing method of the Al-Mg-Si type alloy plate of Claim 7 whose workability is 30% or more. The manufacturing method of the Al-Mg-Si type alloy plate of Claim 1 or 2 which performs final annealing at 200 degrees C or less after completion | finish of cold rolling. The method for producing an Al-Mg-Si alloy plate according to claim 9, wherein the final annealing is performed at 110 to 150 ° C. The manufacturing method of the Al-Mg-Si type-alloy plate of Claim 1 or 2 which preheats a material temperature to 450-580 degreeC before hot rolling. The Al-Mg-Si system according to claim 1 or 2, wherein in any pass step of hot rolling, the material temperature before the pass is 450 to 350 ° C and the cooling rate after the pass is 50 ° C / min or more. Method for producing an alloy plate. delete The method for producing an Al-Mg-Si alloy plate according to claim 1 or 2, wherein the Mg content in the alloy ingot is 0.35 to 0.55 mass%. The manufacturing method of the Al-Mg-Si type alloy plate of Claim 1 or 2 whose Fe content in an alloy ingot is 0.1-0.25 mass%. The manufacturing method of the Al-Mg-Si type alloy plate of Claim 1 or 2 whose Cu content in an alloy ingot is 0.1 mass% or less. The manufacturing method of the Al-Mg-Si type alloy plate of Claim 1 or 2 whose Ti content in an alloy ingot is 0.005-0.05 mass%. The manufacturing method of the Al-Mg-Si type alloy plate of Claim 1 or 2 whose B content in an alloy ingot is 0.06 mass% or less. The manufacturing method of the Al-Mg-Si type alloy plate of Claim 2 whose Mn content in an alloy ingot is regulated to 0.05 mass% or less. The manufacturing method of the Al-Mg-Si type alloy plate of Claim 2 whose Cr content in an alloy ingot is regulated to 0.05 mass% or less. Si: 0.32-0.6 mass%, Mg: 0.3-1 mass%, Fe: 0.5 mass% or less, Cu: 0.5 mass% or less, and Ti: 0.1 mass% or less or B: 0.1 mass% or less at least 1 An Al-Mg-Si-based alloy material containing a kind, comprising a remainder part Al and unavoidable impurities, and having a conductivity of 55 to 60% (IACS). The Al-Mg-Si-based alloy material according to claim 21, wherein the tensile strength is 140 to 240 N / mm 2. The Al-Mg-Si-based alloy material according to claim 21 or 22, wherein Mn and Cr as impurities are regulated to Mn: 0.1 mass% or less and Cr: 0.1 mass% or less. The Al-Mg-Si type alloy plate manufactured by the method of Claim 1 or 2. The Al-Mg-Si-based alloy plate according to claim 24, wherein the Al-Mg-Si-based alloy plate is a heat radiating member material, a conductive member material, a case material, or a reflecting plate or a supporting member thereof. The Al-Mg-Si-based alloy plate according to claim 24, wherein the Al-Mg-Si-based alloy plate is a plasma display back chassis material, a plasma display housing, or a plasma display exterior member. The Al-Mg-Si-based alloy according to claim 24, wherein the Al-Mg-Si-based alloy plate is a liquid crystal display back chassis material, a liquid crystal display bezel material, a liquid crystal display reflection sheet material, a liquid crystal display reflection sheet support material, or a liquid crystal display housing. plate.

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