KR100659684B1 - 2성분계 경화형 발포 지석용 폴리올 조성물, 2성분계 경화형 발포 지석용 조성물, 발포 지석 및 발포 지석의 제조 방법 - Google Patents
2성분계 경화형 발포 지석용 폴리올 조성물, 2성분계 경화형 발포 지석용 조성물, 발포 지석 및 발포 지석의 제조 방법 Download PDFInfo
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- KR100659684B1 KR100659684B1 KR1020057010894A KR20057010894A KR100659684B1 KR 100659684 B1 KR100659684 B1 KR 100659684B1 KR 1020057010894 A KR1020057010894 A KR 1020057010894A KR 20057010894 A KR20057010894 A KR 20057010894A KR 100659684 B1 KR100659684 B1 KR 100659684B1
- Authority
- KR
- South Korea
- Prior art keywords
- polyol
- composition
- grindstone
- component curable
- foamed
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
- C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
- C08G18/6666—Compounds of group C08G18/48 or C08G18/52
- C08G18/667—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38
- C08G18/6681—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/32 or C08G18/3271 and/or polyamines of C08G18/38
- C08G18/6685—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/32 or C08G18/3271 and/or polyamines of C08G18/38 with compounds of group C08G18/3225 or polyamines of C08G18/38
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/38—Low-molecular-weight compounds having heteroatoms other than oxygen
- C08G18/3802—Low-molecular-weight compounds having heteroatoms other than oxygen having halogens
- C08G18/3814—Polyamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
- C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2110/00—Foam properties
- C08G2110/0083—Foam properties prepared using water as the sole blowing agent
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polyurethanes Or Polyureas (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
실시예 3 | 실시예 4 | |
프리폴리머 ① 폴리올 조성물 이온 교환수 발포 안정제 도레이 실리콘 SH-193 촉매 토요캣 ET 지석 입자 HF-210 | 260 100 0.5 0.3 0.3 - | 270 100 0.7 0.3 0.3 79.3 |
비중(g/㎤) 경도(shore A) 인장 강도(MPa) 25% modulus(Mpa) 50% modulus(Mpa) 파괴 신도(%) 인열 강도(kN/m) | 0.52 92 7.5 5.9 7 58 32.6 | 0.41 81 3.7 2.6 3.1 75 22.4 |
Claims (8)
- 폴리아미노클로로페닐메탄(polyaminochlorophenylmethane) 혼합물(A); 및폴리올(polyol; B)을 포함하는 2성분계(two-component) 경화형 발포 지석용 폴리올 조성물로서,상기 폴리아미노클로로페닐메탄 혼합물(A)은,하기식으로 표시되는 50∼70중량%의 2핵성(binuclear) 폴리아미노클로로페닐메탄 화합물:(여기에서 X는 각각 독립적으로 염소 원자 또는 수소 원자를 나타냄.)하기식으로 표시되는 20∼40중량%의 3핵성(trinuclear) 폴리아미노클로로페닐메탄 화합물:(여기에서 X는 각각 독립적으로 염소 원자 또는 수소 원자를 나타냄.)및 하기식으로 표시되는 5∼10중량%의 4핵성(tetranuclear) 이상의 폴리아미노클로로페닐메탄 화합물:(여기에서 X는 각각 독립적으로 염소 원자 또는 수소 원자를 나타내며, n은 3 이상의 정수를 나타냄.)을 포함하며, 상기 폴리아미노클로로페닐메탄 혼합물(A)은 상기 폴리올(B)에 균일하게 용해되고, (A)와 (B)의 중량비((A)/(B))가 30/70∼60/40인 것을 특징으로 하는 2성분계 경화형 발포 지석용 폴리올 조성물.
- 제1항에 있어서,상기 폴리올(B)은,주쇄(principal chain)에 에테르 결합을 포함하며, 분자량이 100∼1500인 폴리올; 및/또는측쇄(side chain)에 메틸기를 포함하며, 분자량이 50∼500인 폴리올인 것을 특징으로 하는 2성분계 경화형 발포 지석용 폴리올 조성물.
- 제1항에 있어서,상기 폴리올(B)은, 테트라메틸렌클리콜, 폴리프로필렌글리콜 및 이들의 혼합물로 이루어진 군에서 선택되는 것을 특징으로 하는 2성분계 경화형 발포 지석용 폴리올 조성물.
- 제1항에 따른 폴리올 조성물(1);폴리이소시아네이트(2); 및물(3)을 포함하는 2성분계 경화형 발포 지석용 조성물.
- 제4항에 있어서,상기 폴리이소시아네이트(2)는 이소시아네이트기를 함유한 우레탄 프리폴리머(prepolymer)이며, 상기 이소시아네이트기의 당량이 300∼580인 것을 특징으로 하는 2성분계 경화형 발포 지석용 조성물.
- 제4항에 있어서,상기 폴리이소시아네이트(2)는 이소시아네이트 말단기를 함유한 톨루엔디이소시아네이트계 우레탄 프리폴리머인 것을 특징으로 하는 2성분계 경화형 발포 지석용 조성물.
- 제4항에 따른 2성분계 경화형 발포 지석용 조성물을 발포 및 경화시켜 제조한 발포 지석으로서, 비중이 0.3∼1.2인 것을 특징으로 하는 발포 지석.
- 제4항에 따른 2성분계 경화형 발포 지석용 조성물을 금형 내에서 성형하는 단계; 및상기 조성물을 발포 및 경화하는 단계를 포함하는 것을 특징으로 하는 발포 지석의 제조 방법.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002365094 | 2002-12-17 | ||
JPJP-P-2002-00365094 | 2002-12-17 | ||
PCT/JP2003/016099 WO2004055089A1 (ja) | 2002-12-17 | 2003-12-16 | 二液硬化型発泡砥石用ポリオール組成物、二液硬化型発泡砥石用組成物、発泡砥石、及び発泡砥石の製造法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20050085653A KR20050085653A (ko) | 2005-08-29 |
KR100659684B1 true KR100659684B1 (ko) | 2006-12-21 |
Family
ID=32588256
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020057010894A KR100659684B1 (ko) | 2002-12-17 | 2003-12-16 | 2성분계 경화형 발포 지석용 폴리올 조성물, 2성분계 경화형 발포 지석용 조성물, 발포 지석 및 발포 지석의 제조 방법 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7964653B2 (ko) |
JP (1) | JP3637568B2 (ko) |
KR (1) | KR100659684B1 (ko) |
CN (1) | CN100351282C (ko) |
TW (1) | TWI313693B (ko) |
WO (1) | WO2004055089A1 (ko) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8148441B2 (en) | 2005-03-08 | 2012-04-03 | Toyo Tire & Rubber Co., Ltd. | Polishing pad and manufacturing method thereof |
JP5037014B2 (ja) * | 2005-03-08 | 2012-09-26 | 東洋ゴム工業株式会社 | 研磨パッドの製造方法、及び研磨パッド |
US8304467B2 (en) | 2005-05-17 | 2012-11-06 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
JP4897238B2 (ja) * | 2005-05-17 | 2012-03-14 | 東洋ゴム工業株式会社 | 研磨パッド |
JP4979200B2 (ja) * | 2005-05-17 | 2012-07-18 | 東洋ゴム工業株式会社 | 研磨パッド |
JP2006320982A (ja) * | 2005-05-17 | 2006-11-30 | Toyo Tire & Rubber Co Ltd | 研磨パッド |
JP4884725B2 (ja) | 2005-08-30 | 2012-02-29 | 東洋ゴム工業株式会社 | 研磨パッド |
JP5031236B2 (ja) | 2006-01-10 | 2012-09-19 | 東洋ゴム工業株式会社 | 研磨パッド |
US8993648B2 (en) | 2006-08-28 | 2015-03-31 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
JP5008927B2 (ja) | 2006-08-31 | 2012-08-22 | 東洋ゴム工業株式会社 | 研磨パッド |
JP5078000B2 (ja) | 2007-03-28 | 2012-11-21 | 東洋ゴム工業株式会社 | 研磨パッド |
JP5072442B2 (ja) * | 2007-06-07 | 2012-11-14 | 富士紡ホールディングス株式会社 | 研磨パッドの製造方法および研磨パッド |
CN102015812B (zh) * | 2008-04-25 | 2013-03-20 | 东洋高分子股份有限公司 | 聚氨酯发泡体和抛光垫 |
WO2011001755A1 (ja) | 2009-06-29 | 2011-01-06 | Dic株式会社 | 研磨パッド用2液型ウレタン樹脂組成物、ポリウレタン研磨パッド、及びポリウレタン研磨パッドの製造方法 |
JP5661130B2 (ja) * | 2013-01-31 | 2015-01-28 | 東洋ゴム工業株式会社 | 研磨パッド |
JP6498498B2 (ja) * | 2015-04-03 | 2019-04-10 | 富士紡ホールディングス株式会社 | 研磨パッド |
JP6765204B2 (ja) * | 2016-04-01 | 2020-10-07 | 富士紡ホールディングス株式会社 | 研磨方法 |
US10010996B2 (en) * | 2016-04-20 | 2018-07-03 | Seagate Technology Llc | Lapping plate and method of making |
US10105813B2 (en) * | 2016-04-20 | 2018-10-23 | Seagate Technology Llc | Lapping plate and method of making |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1593959C3 (de) * | 1966-05-25 | 1974-09-19 | E.I. Du Pont De Nemours And Co., Wilmington, Del. (V.St.A.) | Verfahren zur Herstellung eines Amin-Härtungsmittels |
FR95608E (fr) * | 1966-05-25 | 1971-03-26 | Du Pont | Agents durcissants aminés ayant une réactivite modérée et destinés aux polyuréthannes, leur procédé de production et leur mode d'utilisation. |
JPS5115149B2 (ko) | 1972-07-29 | 1976-05-14 | ||
JPS4935078A (ko) | 1972-08-02 | 1974-04-01 | ||
JPS4935077A (ko) | 1972-08-03 | 1974-04-01 | ||
JPS5540709A (en) * | 1978-09-14 | 1980-03-22 | Ihara Chem Ind Co Ltd | Curing agent for polyurethane and preparation of polyurethane using thereof |
JPH02232173A (ja) | 1989-03-02 | 1990-09-14 | Rodeele Nitta Kk | 研磨パッド |
JP3772385B2 (ja) | 1996-04-16 | 2006-05-10 | 大日本インキ化学工業株式会社 | 二液硬化型ポリウレタン樹脂組成物及びその製造方法 |
JPH11322877A (ja) * | 1998-05-12 | 1999-11-26 | Dainippon Ink & Chem Inc | 微細泡含有成形物の製造方法及び微細泡含有成形物用ウレタン樹脂組成物 |
TWI228522B (en) * | 1999-06-04 | 2005-03-01 | Fuji Spinning Co Ltd | Urethane molded products for polishing pad and method for making same |
JP3490431B2 (ja) * | 2000-06-13 | 2004-01-26 | 東洋ゴム工業株式会社 | ポリウレタン発泡体の製造方法、ポリウレタン発泡体及び研磨シート |
JP3325016B2 (ja) | 2000-12-27 | 2002-09-17 | 東洋ゴム工業株式会社 | 半導体研磨用ポリウレタン研磨パッドを製造する方法 |
-
2003
- 2003-12-15 JP JP2003416361A patent/JP3637568B2/ja not_active Expired - Lifetime
- 2003-12-15 TW TW092135333A patent/TWI313693B/zh not_active IP Right Cessation
- 2003-12-16 WO PCT/JP2003/016099 patent/WO2004055089A1/ja active Application Filing
- 2003-12-16 CN CNB2003801062024A patent/CN100351282C/zh not_active Expired - Lifetime
- 2003-12-16 US US10/538,873 patent/US7964653B2/en active Active
- 2003-12-16 KR KR1020057010894A patent/KR100659684B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
JP2004211076A (ja) | 2004-07-29 |
CN1726240A (zh) | 2006-01-25 |
CN100351282C (zh) | 2007-11-28 |
US20060122287A1 (en) | 2006-06-08 |
US7964653B2 (en) | 2011-06-21 |
JP3637568B2 (ja) | 2005-04-13 |
KR20050085653A (ko) | 2005-08-29 |
TW200420594A (en) | 2004-10-16 |
WO2004055089A1 (ja) | 2004-07-01 |
TWI313693B (en) | 2009-08-21 |
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