KR100628872B1 - 전자소자 및 그 전자소자를 사용한 전자장치 - Google Patents

전자소자 및 그 전자소자를 사용한 전자장치 Download PDF

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Publication number
KR100628872B1
KR100628872B1 KR1020030029302A KR20030029302A KR100628872B1 KR 100628872 B1 KR100628872 B1 KR 100628872B1 KR 1020030029302 A KR1020030029302 A KR 1020030029302A KR 20030029302 A KR20030029302 A KR 20030029302A KR 100628872 B1 KR100628872 B1 KR 100628872B1
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KR
South Korea
Prior art keywords
semiconductor chip
wiring board
electronic device
semiconductor
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020030029302A
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English (en)
Korean (ko)
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KR20040023483A (ko
Inventor
반도코지
Original Assignee
미쓰비시덴키 가부시키가이샤
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Publication of KR20040023483A publication Critical patent/KR20040023483A/ko
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Publication of KR100628872B1 publication Critical patent/KR100628872B1/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/657—Shapes or dispositions of interconnections on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
KR1020030029302A 2002-09-10 2003-05-09 전자소자 및 그 전자소자를 사용한 전자장치 Expired - Fee Related KR100628872B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002264030A JP2004103843A (ja) 2002-09-10 2002-09-10 電子素子およびその電子素子を用いた電子装置
JPJP-P-2002-00264030 2002-09-10

Publications (2)

Publication Number Publication Date
KR20040023483A KR20040023483A (ko) 2004-03-18
KR100628872B1 true KR100628872B1 (ko) 2006-09-27

Family

ID=31986485

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020030029302A Expired - Fee Related KR100628872B1 (ko) 2002-09-10 2003-05-09 전자소자 및 그 전자소자를 사용한 전자장치

Country Status (5)

Country Link
US (1) US6730855B2 (enExample)
JP (1) JP2004103843A (enExample)
KR (1) KR100628872B1 (enExample)
CN (1) CN1482677A (enExample)
TW (1) TW589722B (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7115986B2 (en) * 2001-05-02 2006-10-03 Micron Technology, Inc. Flexible ball grid array chip scale packages
SG122743A1 (en) * 2001-08-21 2006-06-29 Micron Technology Inc Microelectronic devices and methods of manufacture
SG104293A1 (en) 2002-01-09 2004-06-21 Micron Technology Inc Elimination of rdl using tape base flip chip on flex for die stacking
SG121707A1 (en) * 2002-03-04 2006-05-26 Micron Technology Inc Method and apparatus for flip-chip packaging providing testing capability
SG115455A1 (en) * 2002-03-04 2005-10-28 Micron Technology Inc Methods for assembly and packaging of flip chip configured dice with interposer
SG115459A1 (en) 2002-03-04 2005-10-28 Micron Technology Inc Flip chip packaging using recessed interposer terminals
US6975035B2 (en) * 2002-03-04 2005-12-13 Micron Technology, Inc. Method and apparatus for dielectric filling of flip chip on interposer assembly
SG111935A1 (en) 2002-03-04 2005-06-29 Micron Technology Inc Interposer configured to reduce the profiles of semiconductor device assemblies and packages including the same and methods
SG115456A1 (en) * 2002-03-04 2005-10-28 Micron Technology Inc Semiconductor die packages with recessed interconnecting structures and methods for assembling the same
US20040036170A1 (en) * 2002-08-20 2004-02-26 Lee Teck Kheng Double bumping of flexible substrate for first and second level interconnects
US7112877B2 (en) * 2004-06-28 2006-09-26 General Electric Company High density package with wrap around interconnect
TWI244177B (en) * 2004-10-21 2005-11-21 Chipmos Technologies Inc Method for assembling image sensor and structure of the same
US8411450B2 (en) 2006-01-25 2013-04-02 Nec Corporation Electronic device package, module, and electronic device
JP2007266240A (ja) * 2006-03-28 2007-10-11 Fujitsu Ltd 電子装置及びそれを有する電子機器
US7888185B2 (en) * 2006-08-17 2011-02-15 Micron Technology, Inc. Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device
JP2008078205A (ja) * 2006-09-19 2008-04-03 Fujitsu Ltd 基板組立体及びその製造方法、電子部品組立体及びその製造方法、電子装置
US9023511B1 (en) * 2012-12-18 2015-05-05 Amazon Technologies, Inc. Systems and methods for removably attaching a battery to a user device
CN103997848B (zh) * 2014-05-30 2017-01-11 昆山一邦泰汽车零部件制造有限公司 一种筒式旋转印刷电路筒

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2570628B2 (ja) * 1994-09-21 1997-01-08 日本電気株式会社 半導体パッケージおよびその製造方法
JP3408375B2 (ja) 1995-06-20 2003-05-19 新光電気工業株式会社 半導体装置
US6225688B1 (en) * 1997-12-11 2001-05-01 Tessera, Inc. Stacked microelectronic assembly and method therefor
US6262895B1 (en) * 2000-01-13 2001-07-17 John A. Forthun Stackable chip package with flex carrier

Also Published As

Publication number Publication date
US6730855B2 (en) 2004-05-04
TW200404355A (en) 2004-03-16
US20040047135A1 (en) 2004-03-11
CN1482677A (zh) 2004-03-17
TW589722B (en) 2004-06-01
JP2004103843A (ja) 2004-04-02
KR20040023483A (ko) 2004-03-18

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