KR100592404B1 - 회로기판을 포함하는 물체 표면에의 화상형성방법 - Google Patents

회로기판을 포함하는 물체 표면에의 화상형성방법 Download PDF

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Publication number
KR100592404B1
KR100592404B1 KR1020037016249A KR20037016249A KR100592404B1 KR 100592404 B1 KR100592404 B1 KR 100592404B1 KR 1020037016249 A KR1020037016249 A KR 1020037016249A KR 20037016249 A KR20037016249 A KR 20037016249A KR 100592404 B1 KR100592404 B1 KR 100592404B1
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KR
South Korea
Prior art keywords
pattern
photosensitive paste
circuit
laser beam
paste layer
Prior art date
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KR1020037016249A
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English (en)
Korean (ko)
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KR20040012919A (ko
Inventor
가토마사토시
하라다아키오
Original Assignee
다이켄카가쿠 코교 가부시키가이샤
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Application filed by 다이켄카가쿠 코교 가부시키가이샤 filed Critical 다이켄카가쿠 코교 가부시키가이샤
Publication of KR20040012919A publication Critical patent/KR20040012919A/ko
Application granted granted Critical
Publication of KR100592404B1 publication Critical patent/KR100592404B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/08—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by electric discharge, e.g. by spark erosion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0514—Photodevelopable thick film, e.g. conductive or insulating paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/146—Laser beam

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Materials For Photolithography (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
KR1020037016249A 2001-09-11 2002-07-18 회로기판을 포함하는 물체 표면에의 화상형성방법 KR100592404B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2001-00275061 2001-09-11
JP2001275061 2001-09-11
PCT/JP2002/007291 WO2003026368A1 (fr) 2001-09-11 2002-07-18 Procede permettant de former une image sur la surface d'un objet, notamment un substrat de circuit

Publications (2)

Publication Number Publication Date
KR20040012919A KR20040012919A (ko) 2004-02-11
KR100592404B1 true KR100592404B1 (ko) 2006-06-22

Family

ID=19099993

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020037016249A KR100592404B1 (ko) 2001-09-11 2002-07-18 회로기판을 포함하는 물체 표면에의 화상형성방법

Country Status (6)

Country Link
US (1) US7008754B2 (ja)
EP (1) EP1427266A4 (ja)
JP (1) JPWO2003026368A1 (ja)
KR (1) KR100592404B1 (ja)
CN (1) CN1311720C (ja)
WO (1) WO2003026368A1 (ja)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040170925A1 (en) * 2002-12-06 2004-09-02 Roach David Herbert Positive imageable thick film compositions
US7402373B2 (en) * 2004-02-05 2008-07-22 E.I. Du Pont De Nemours And Company UV radiation blocking protective layers compatible with thick film pastes
JP2011171604A (ja) * 2010-02-19 2011-09-01 Oki Semiconductor Co Ltd 電子部品製造方法、電子部品製造装置及び感光性レジスト
CN101925257B (zh) * 2010-05-07 2012-07-04 竞华电子(深圳)有限公司 印刷线路板的铜窗制作方法
CN102126082B (zh) * 2010-12-24 2013-08-21 陈乃奇 激光曝光刀具及基于激光的立体直接曝光成像方法
US10622244B2 (en) 2013-02-18 2020-04-14 Orbotech Ltd. Pulsed-mode direct-write laser metallization
TWI636717B (zh) 2013-02-18 2018-09-21 奧寶科技有限公司 兩步驟直接寫入之雷射金屬化
US10537027B2 (en) 2013-08-02 2020-01-14 Orbotech Ltd. Method producing a conductive path on a substrate
CN103433619B (zh) * 2013-08-30 2015-10-21 大族激光科技产业集团股份有限公司 激光熔覆打印机及线路板的制作方法
US9474162B2 (en) * 2014-01-10 2016-10-18 Freescale Semiocnductor, Inc. Circuit substrate and method of manufacturing same
EP4380323A3 (en) 2014-10-19 2024-09-25 Orbotech Ltd. Lift printing of conductive traces onto a semiconductor substrate
CN107208256B (zh) 2015-01-19 2020-08-11 奥博泰克有限公司 使用牺牲支持体的三维金属结构体的打印
IL258026B2 (en) 2015-11-22 2023-03-01 Orbotech Ltd Control of surface properties in 3D printed structures
CN105530763B (zh) * 2015-12-30 2019-03-12 江西芯创光电有限公司 Pcb板面保护的制作方法
TW201901887A (zh) 2017-05-24 2019-01-01 以色列商奧寶科技股份有限公司 於未事先圖樣化基板上電器互連電路元件
WO2019032429A1 (en) * 2017-08-09 2019-02-14 Parker-Hannifin Corporation IMPROVED PROCESS FOR PRODUCT MARKING
EP3797026A4 (en) 2018-05-22 2022-03-02 Mantle Inc. METHOD AND SYSTEM FOR AUTOMATIC TOOLWAY GENERATION
CN110824844A (zh) * 2018-08-07 2020-02-21 许铭案 表面具凸纹结构薄膜的曲面基板及其制造方法
KR102511881B1 (ko) 2019-08-14 2023-03-20 세라믹 데이터 솔루션즈 게엠베하 정보의 장기 저장을 위한 방법 및 그를 위한 저장 매체

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59114856A (ja) * 1982-12-21 1984-07-03 Matsushita Electric Ind Co Ltd 厚膜回路パタ−ンの形成方法
JPH05273761A (ja) * 1992-03-25 1993-10-22 Smc Corp パターン形成装置
JPH10104829A (ja) * 1996-06-19 1998-04-24 Printing Dev Inc 改良型フォトレジスト及びプリント基板を作製するための方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4148057A (en) * 1977-10-25 1979-04-03 Solution Sciences, Inc. Direct laser printing and forming apparatus
US4887225A (en) * 1985-05-24 1989-12-12 Danippon Screen Mfg. Co., Ltd. Method and device for controlling exposure beams
GB8531830D0 (en) * 1985-12-30 1986-02-05 Davies H J Photo fabrication
DE3629474A1 (de) * 1986-08-29 1988-03-03 Licentia Gmbh Verfahren zum aufbringen erhabener strukturen und danach hergestellter verzoegerungsleitungstraeger einer lauffeldroehre
JPH0645759A (ja) * 1992-07-22 1994-02-18 Fujitsu Ltd 多層セラミック回路基板の製造方法
JP3360378B2 (ja) * 1993-11-09 2002-12-24 東レ株式会社 セラミックス・グリーンシート上にパターンを形成する方法
DE19517625A1 (de) * 1995-05-13 1996-11-14 Budenheim Rud A Oetker Chemie Verfahren zum musterförmigen Bedrucken fester Substratoberflächen
JP2000138454A (ja) * 1998-10-29 2000-05-16 Kyocera Corp 配線基板の製造方法
FR2788456B1 (fr) * 1999-01-15 2001-02-16 Saint Gobain Vitrage Procede d'obtention d'un motif sur un substrat en materiau verrier
JP2000276945A (ja) * 1999-03-25 2000-10-06 Murata Mfg Co Ltd 導体ペースト及びそれを用いた回路基板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59114856A (ja) * 1982-12-21 1984-07-03 Matsushita Electric Ind Co Ltd 厚膜回路パタ−ンの形成方法
JPH05273761A (ja) * 1992-03-25 1993-10-22 Smc Corp パターン形成装置
JPH10104829A (ja) * 1996-06-19 1998-04-24 Printing Dev Inc 改良型フォトレジスト及びプリント基板を作製するための方法

Also Published As

Publication number Publication date
CN1311720C (zh) 2007-04-18
JPWO2003026368A1 (ja) 2005-01-06
EP1427266A1 (en) 2004-06-09
KR20040012919A (ko) 2004-02-11
US7008754B2 (en) 2006-03-07
US20040241585A1 (en) 2004-12-02
WO2003026368A1 (fr) 2003-03-27
CN1520703A (zh) 2004-08-11
EP1427266A4 (en) 2006-10-04

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