KR100592338B1 - 전자부품 픽업 장치, 전자부품 픽업 방법 및 전자부품픽업 프로그램 - Google Patents
전자부품 픽업 장치, 전자부품 픽업 방법 및 전자부품픽업 프로그램 Download PDFInfo
- Publication number
- KR100592338B1 KR100592338B1 KR1020040052558A KR20040052558A KR100592338B1 KR 100592338 B1 KR100592338 B1 KR 100592338B1 KR 1020040052558 A KR1020040052558 A KR 1020040052558A KR 20040052558 A KR20040052558 A KR 20040052558A KR 100592338 B1 KR100592338 B1 KR 100592338B1
- Authority
- KR
- South Korea
- Prior art keywords
- sheet
- electronic component
- adhesive sheet
- pressing
- peeled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
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- H10P72/50—
-
- H10P72/7414—
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2003-00272072 | 2003-07-08 | ||
| JP2003272072A JP2005033065A (ja) | 2003-07-08 | 2003-07-08 | 電子部品ピックアップ装置、電子部品ピックアップ方法及び電子部品ピックアッププログラム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20050006064A KR20050006064A (ko) | 2005-01-15 |
| KR100592338B1 true KR100592338B1 (ko) | 2006-06-22 |
Family
ID=34209742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020040052558A Expired - Fee Related KR100592338B1 (ko) | 2003-07-08 | 2004-07-07 | 전자부품 픽업 장치, 전자부품 픽업 방법 및 전자부품픽업 프로그램 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2005033065A (enExample) |
| KR (1) | KR100592338B1 (enExample) |
| TW (1) | TW200504917A (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101527184B1 (ko) * | 2013-10-14 | 2015-06-09 | 도레이첨단소재 주식회사 | 전자 부품 공정용 양면 점착 백 테이프 및 이를 이용한 전자 부품의 분리방법 |
| JP6324860B2 (ja) * | 2014-09-26 | 2018-05-16 | ファスフォードテクノロジ株式会社 | 半導体若しくは電子部品実装装置及び半導体若しくは電子部品実装方法 |
| JP6843725B2 (ja) * | 2017-10-11 | 2021-03-17 | 三菱電機株式会社 | 半導体ピックアップ装置 |
| KR102130475B1 (ko) * | 2019-11-21 | 2020-07-06 | 제너셈(주) | 픽커 구조체 및 이를 포함하는 패키지 탈거 장치 |
-
2003
- 2003-07-08 JP JP2003272072A patent/JP2005033065A/ja not_active Withdrawn
-
2004
- 2004-06-01 TW TW093115627A patent/TW200504917A/zh not_active IP Right Cessation
- 2004-07-07 KR KR1020040052558A patent/KR100592338B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TW200504917A (en) | 2005-02-01 |
| KR20050006064A (ko) | 2005-01-15 |
| JP2005033065A (ja) | 2005-02-03 |
| TWI321823B (enExample) | 2010-03-11 |
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