KR100592177B1 - 감열식 유량 검출 소자의 제조 방법 - Google Patents

감열식 유량 검출 소자의 제조 방법 Download PDF

Info

Publication number
KR100592177B1
KR100592177B1 KR1020040083109A KR20040083109A KR100592177B1 KR 100592177 B1 KR100592177 B1 KR 100592177B1 KR 1020040083109 A KR1020040083109 A KR 1020040083109A KR 20040083109 A KR20040083109 A KR 20040083109A KR 100592177 B1 KR100592177 B1 KR 100592177B1
Authority
KR
South Korea
Prior art keywords
flow rate
rate detection
dummy pattern
detection element
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020040083109A
Other languages
English (en)
Korean (ko)
Other versions
KR20050107727A (ko
Inventor
카와이마사히로
Original Assignee
미츠비시덴키 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미츠비시덴키 가부시키가이샤 filed Critical 미츠비시덴키 가부시키가이샤
Publication of KR20050107727A publication Critical patent/KR20050107727A/ko
Application granted granted Critical
Publication of KR100592177B1 publication Critical patent/KR100592177B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01FMEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/026Wafer-level processing
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/18Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors

Landscapes

  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Volume Flow (AREA)
  • Thermistors And Varistors (AREA)
KR1020040083109A 2004-05-10 2004-10-18 감열식 유량 검출 소자의 제조 방법 Expired - Fee Related KR100592177B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004139533A JP4515143B2 (ja) 2004-05-10 2004-05-10 感熱式流量検出素子の製造方法
JPJP-P-2004-00139533 2004-05-10

Publications (2)

Publication Number Publication Date
KR20050107727A KR20050107727A (ko) 2005-11-15
KR100592177B1 true KR100592177B1 (ko) 2006-06-26

Family

ID=35239924

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020040083109A Expired - Fee Related KR100592177B1 (ko) 2004-05-10 2004-10-18 감열식 유량 검출 소자의 제조 방법

Country Status (4)

Country Link
US (1) US6995028B2 (https=)
JP (1) JP4515143B2 (https=)
KR (1) KR100592177B1 (https=)
DE (1) DE102004052634B4 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5857032B2 (ja) * 2011-03-02 2016-02-10 日立オートモティブシステムズ株式会社 熱式流量計
WO2013008273A1 (ja) * 2011-07-13 2013-01-17 日立オートモティブシステムズ株式会社 流量計
JP6475198B2 (ja) * 2016-06-29 2019-02-27 太陽誘電株式会社 可変容量デバイス及びアンテナ装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3849872A (en) * 1972-10-24 1974-11-26 Ibm Contacting integrated circuit chip terminal through the wafer kerf
US4426773A (en) * 1981-05-15 1984-01-24 General Electric Ceramics, Inc. Array of electronic packaging substrates
JPS6397237U (https=) * 1986-12-12 1988-06-23
US4855253A (en) * 1988-01-29 1989-08-08 Hewlett-Packard Test method for random defects in electronic microstructures
US5389556A (en) * 1992-07-02 1995-02-14 Lsi Logic Corporation Individually powering-up unsingulated dies on a wafer
US5532174A (en) * 1994-04-22 1996-07-02 Lsi Logic Corporation Wafer level integrated circuit testing with a sacrificial metal layer
JPH10206205A (ja) * 1997-01-22 1998-08-07 Ricoh Co Ltd マイクロブリッジセンサの製造方法
US6744346B1 (en) * 1998-02-27 2004-06-01 Micron Technology, Inc. Electronic device workpieces, methods of semiconductor processing and methods of sensing temperature of an electronic device workpiece
JP3513041B2 (ja) * 1999-01-25 2004-03-31 三菱電機株式会社 流量センサ
JP3455473B2 (ja) * 1999-07-14 2003-10-14 三菱電機株式会社 感熱式流量センサ
JP3461469B2 (ja) * 1999-07-27 2003-10-27 株式会社日立製作所 熱式空気流量センサ及び内燃機関制御装置
US6133054A (en) * 1999-08-02 2000-10-17 Motorola, Inc. Method and apparatus for testing an integrated circuit
JP2001056310A (ja) * 1999-08-20 2001-02-27 Sony Corp 半導体装置の検査方法
US6225141B1 (en) * 1999-09-03 2001-05-01 Johnson Controls Technology Co. Temperature sensor manufacturing process
JP4101518B2 (ja) * 2000-05-02 2008-06-18 株式会社日立製作所 空気流量計
JP5138134B2 (ja) * 2001-07-16 2013-02-06 株式会社デンソー 薄膜式センサの製造方法ならびにフローセンサの製造方法
US6844218B2 (en) * 2001-12-27 2005-01-18 Texas Instruments Incorporated Semiconductor wafer with grouped integrated circuit die having inter-die connections for group testing

Also Published As

Publication number Publication date
KR20050107727A (ko) 2005-11-15
US20050250239A1 (en) 2005-11-10
DE102004052634A1 (de) 2005-12-08
JP4515143B2 (ja) 2010-07-28
DE102004052634B4 (de) 2012-04-19
US6995028B2 (en) 2006-02-07
JP2005321294A (ja) 2005-11-17

Similar Documents

Publication Publication Date Title
US6750152B1 (en) Method and apparatus for electrically testing and characterizing formation of microelectric features
US7180302B2 (en) Method and system for determining cracks and broken components in armor
JP4101518B2 (ja) 空気流量計
US7784173B2 (en) Producing layered structures using printing
US7648269B2 (en) Temperature measuring device for semiconductor manufacturing apparatus, method of measuring temperature in semiconductor manufacturing apparatus, and semiconductor manufacturing apparatus
EP2224232A1 (en) Measurement element
KR100890076B1 (ko) 기판 관통 에칭 프로세스의 모니터링 방법 및 전도성 기판 내의 개구 에칭 방법
US6948361B2 (en) Gasket flow sensing apparatus and method
CN105826216B (zh) 半导体评价装置、检查用半导体装置及卡盘台的检查方法
KR100592177B1 (ko) 감열식 유량 검출 소자의 제조 방법
US20100176819A1 (en) Device for the capacitive measurement of the quality and/or deterioration of a fluid, including a capacitive sensor that is mechanically uncoupled from the element in which it is encapsulated
US6845662B2 (en) Thermosensitive flow rate detecting element and method for the manufacture thereof
KR102878020B1 (ko) 분석 유체의 농도 측정을 위한, 리세스에 의해 개방된 멤브레인을 가진 센서
US7816146B2 (en) Passive electronic devices
CN112114009B (zh) 一种具备自我诊断功能的湿度传感器芯片及湿度传感器芯片的自我诊断方法
JP2011174876A (ja) ダイアフラム部を有する基板を備えたセンサ装置、及び同センサ装置を複数備えたセンサ装置アレイ
TWI445973B (zh) 電氣連接裝置及使用其之測試裝置
CN1129529C (zh) 喷墨印头芯片及喷墨印头寿命与缺陷的检测方法
JP2002198576A (ja) 半導体装置
JP5024170B2 (ja) コネクタの評価方法
JP4912056B2 (ja) プローバ用チャック
CN111430255B (zh) 一种刻蚀深度的检测方法
JP5139833B2 (ja) センサ素子の検査方法
JP6553247B2 (ja) 検査用半導体装置
CN117949813A (zh) 芯片检测电路及方法

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20130524

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20140530

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

FPAY Annual fee payment

Payment date: 20150518

Year of fee payment: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

FPAY Annual fee payment

Payment date: 20160517

Year of fee payment: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

FPAY Annual fee payment

Payment date: 20170522

Year of fee payment: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

FPAY Annual fee payment

Payment date: 20180517

Year of fee payment: 13

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

FPAY Annual fee payment

Payment date: 20190515

Year of fee payment: 14

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 14

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 15

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20210615

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20210615