KR100576269B1 - 진동부품의 수지봉지방법 - Google Patents
진동부품의 수지봉지방법Info
- Publication number
- KR100576269B1 KR100576269B1 KR1020040080518A KR20040080518A KR100576269B1 KR 100576269 B1 KR100576269 B1 KR 100576269B1 KR 1020040080518 A KR1020040080518 A KR 1020040080518A KR 20040080518 A KR20040080518 A KR 20040080518A KR 100576269 B1 KR100576269 B1 KR 100576269B1
- Authority
- KR
- South Korea
- Prior art keywords
- resin
- encapsulation
- touch panel
- vibrating part
- metal mask
- Prior art date
Links
Images
Landscapes
- Engineering & Computer Science (AREA)
- Position Input By Displaying (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004112500A JP2005297221A (ja) | 2004-04-06 | 2004-04-06 | 振動部品の樹脂封止方法 |
JPJP-P-2004-00112500 | 2004-04-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20050098756A KR20050098756A (ko) | 2005-10-12 |
KR100576269B1 true KR100576269B1 (ko) | 2006-05-04 |
Family
ID=35067608
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020040080518A KR100576269B1 (ko) | 2004-04-06 | 2004-10-08 | 진동부품의 수지봉지방법 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2005297221A (ja) |
KR (1) | KR100576269B1 (ja) |
CN (1) | CN1681098A (ja) |
TW (1) | TW200534411A (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5093355B2 (ja) * | 2009-09-14 | 2012-12-12 | 株式会社村田製作所 | 水晶発振装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0621122A (ja) * | 1992-07-02 | 1994-01-28 | Toowa Kk | 電子部品の樹脂封止成形方法及び金型 |
JPH0695594B2 (ja) * | 1989-02-03 | 1994-11-24 | 日本レック株式会社 | 電気配線基板の表面実装に於ける電気部品の樹脂封止方法 |
JPH09117931A (ja) * | 1995-10-25 | 1997-05-06 | Towa Kk | 電子部品の樹脂封止成形方法及び装置 |
JP2003100786A (ja) | 2001-09-27 | 2003-04-04 | Towa Corp | 電子部品の樹脂封止成形方法及び金型 |
-
2004
- 2004-04-06 JP JP2004112500A patent/JP2005297221A/ja active Pending
- 2004-09-16 TW TW93128023A patent/TW200534411A/zh not_active IP Right Cessation
- 2004-10-08 KR KR1020040080518A patent/KR100576269B1/ko active IP Right Grant
- 2004-12-30 CN CN 200410082197 patent/CN1681098A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0695594B2 (ja) * | 1989-02-03 | 1994-11-24 | 日本レック株式会社 | 電気配線基板の表面実装に於ける電気部品の樹脂封止方法 |
JPH0621122A (ja) * | 1992-07-02 | 1994-01-28 | Toowa Kk | 電子部品の樹脂封止成形方法及び金型 |
JPH09117931A (ja) * | 1995-10-25 | 1997-05-06 | Towa Kk | 電子部品の樹脂封止成形方法及び装置 |
JP2003100786A (ja) | 2001-09-27 | 2003-04-04 | Towa Corp | 電子部品の樹脂封止成形方法及び金型 |
Also Published As
Publication number | Publication date |
---|---|
TWI328262B (ja) | 2010-08-01 |
CN1681098A (zh) | 2005-10-12 |
JP2005297221A (ja) | 2005-10-27 |
TW200534411A (en) | 2005-10-16 |
KR20050098756A (ko) | 2005-10-12 |
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